CN214757457U - Circuit case assembly structure with heat dissipation and dust prevention functions - Google Patents
Circuit case assembly structure with heat dissipation and dust prevention functions Download PDFInfo
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- CN214757457U CN214757457U CN202120722042.1U CN202120722042U CN214757457U CN 214757457 U CN214757457 U CN 214757457U CN 202120722042 U CN202120722042 U CN 202120722042U CN 214757457 U CN214757457 U CN 214757457U
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- circuit board
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Abstract
The utility model provides a circuit machine case subassembly structure with dustproof function of heat dissipation, what machine case subassembly and circuit assembly adopted is the mode of modular assembly, independently assemble separately at machine case subassembly and circuit assembly promptly, assemble together again at last, wherein circuit assembly comprises radiator and printed circuit board and apron, the printed circuit board facial make-up is in the inside of support frame, encapsulate by the apron again, the heat is taken away through the air on the radiator surface during the heat dissipation, printed circuit board installs in the inside of support frame, play the effect of keeping apart the dust. This structural design has following advantage compared with traditional structural design: the case component and the circuit component are designed separately, so that efficient assembly can be realized, the case component can be conveniently matched and used randomly if the appearance of the case component is changed or the circuit component is changed, and diversified low-cost development of products is met. The printed circuit board is arranged in the circuit assembly, so that high heat conduction can be realized, dust can be prevented absolutely, and the heat dissipation requirement of a high-power circuit is met. The whole sealing package has good reliability.
Description
Technical Field
The utility model belongs to the technical field of quick-witted case field and specifically relates to a circuit machine case subassembly structure with dustproof function of heat dissipation.
Background
The rapid development of the contemporary electronic information industry has increasingly high requirements on the structural design of power modules, requiring higher performance while also requiring more convenient, efficient use and lower cost. At present, power supply module adopts quick-witted incasement direct-mounting radiator more, install PCB module component's mode on the radiator, the radiating principle of product is through the inside of blowing in quick-witted case with the air of outside directly in the one side of quick-witted case, inside radiator blows out hot-air to quick-witted case another side again, thereby make quick-witted incasement portion's heat taken out quick-witted case outside, but very obviously, quick-witted case outside dust can be directly taken to the product inside along with the air of outside, the reliability and the condition of life-span of seriously threatening the product appear, simultaneously because quick-witted incasement portion direct mount radiator, PCB module etc., so every quick-witted case all will customize the supporting use, thereby cause the upgrading difficulty of product diversity, greatly increased development cost. Thus, there is a need for a full seal, dustproof heat dissipation, modular assembly, and the like. Under the circumstances, designing a fully-sealed power supply assembly with modular components and dustproof heat dissipation constitutes the research and development direction of researchers in the field.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem, the utility model provides a circuit machine case subassembly structure with dustproof function of heat dissipation.
The utility model discloses a following technical scheme realizes: the utility model provides a circuit machine case subassembly structure with dustproof function of heat dissipation, includes quick-witted case subassembly and circuit assembly, circuit assembly includes printed circuit board and radiator, circuit assembly partially accept in quick-witted case subassembly, circuit assembly still includes support frame and apron, the support frame set firmly in directly over the radiator, printed circuit board locate the support frame with between the apron.
Furthermore, the printed circuit board, the support frame and the cover plate have the same outer contour shape, the printed circuit board, the support frame and the cover plate jointly form a matching part, and the matching part is contained in the case assembly.
Furthermore, the support frame comprises a plurality of support plates vertically arranged on the upper surface of the radiator, and the support plates enclose an accommodating cavity for accommodating the printed circuit board.
Furthermore, a plurality of partition plates are further arranged inside the accommodating cavity.
The utility model has the advantages that: the utility model discloses a circuit machine case subassembly structure with dustproof function of heat dissipation, including machine case subassembly and circuit assembly, circuit assembly includes printed circuit board and radiator, circuit assembly partially accept in machine case subassembly, circuit assembly still includes support frame and apron, the support frame set firmly in directly over the radiator, printed circuit board locates the support frame with between the apron. The case assembly and the circuit assembly are assembled in a modularized assembly mode, namely, the case assembly and the circuit assembly are assembled together after being assembled independently, wherein the circuit assembly is composed of a radiator, a printed circuit board and a cover plate, the printed circuit board is arranged in the supporting frame and is packaged by the cover plate, heat is taken away from the surface of the radiator through air during heat dissipation, and the printed circuit board is arranged in the supporting frame so as to play a role in isolating dust. This structural design has following advantage compared with traditional structural design: 1. the case component and the circuit component are separately designed, so that the simultaneous efficient assembly can be realized, the case component can be conveniently matched and used at will if the appearance of the case component is changed or the circuit component is changed, and the diversified low-cost development of products is met. 2. The printed circuit board is arranged in the circuit assembly, so that high heat conduction can be realized, meanwhile, absolute dust prevention can be realized, and the heat dissipation requirement of a high-power circuit is met. 3. The whole sealing package has good reliability. 4. The processing technology and the assembly technology of the power supply module structure are mature, and the power supply module is suitable for popularization.
Drawings
Fig. 1 is a schematic view of a part of the structure of a circuit chassis assembly with heat dissipation and dust prevention functions of the present invention;
fig. 2 is an exploded schematic view of the circuit chassis assembly with heat dissipation and dust prevention functions of the present invention.
Detailed Description
For a more clear and complete description of the technical solution of the present invention, the following description is made with reference to the accompanying drawings.
Referring to fig. 1-2, the present invention relates to a circuit chassis assembly structure with heat dissipation and dust prevention functions, including a chassis assembly 1 and a circuit assembly 2, where the circuit assembly 2 includes a printed circuit board 22 and a heat sink 21, the circuit assembly 2 is partially accommodated in the chassis assembly 1, the circuit assembly 2 further includes a support frame 24 and a cover plate 23, the support frame 24 is fixedly disposed over the heat sink 21, and the printed circuit board 22 is disposed between the support frame 24 and the cover plate 23.
In the present embodiment, the chassis assembly 1 and the circuit assembly 2 are assembled in a modular manner, that is, after the chassis assembly 1 and the circuit assembly 2 are assembled separately, they are assembled together, in the present embodiment, the chassis assembly 1 and the circuit assembly 2 are assembled together by using threads, or other detachable mounting manners may be adopted, wherein the circuit assembly 2 is composed of a heat sink 21, a printed circuit board 22 and a cover plate 23, the printed circuit board 22 is installed inside a support frame 24, and is finally encapsulated by the cover plate 23, and heat is taken away from the surface of the heat sink 21 through air during heat dissipation, and the printed circuit board 22 is installed inside the support frame 24, thereby playing a role of isolating dust. This structural design has following advantage compared with traditional structural design: 1. the case component 1 and the circuit component 2 are separately designed, so that efficient assembly can be achieved, and the case component 1 can be conveniently changed in appearance or the circuit component 2 can be conveniently changed and can be optionally matched for use, and diversified low-cost development of products is met. 2. The printed circuit board 22 is arranged in the circuit component 2, so that high heat conduction can be realized, meanwhile, dust can be prevented absolutely, and the heat dissipation requirement of a high-power circuit is met. 3. The whole sealing package has good reliability. 4. The processing technology and the assembly technology of the power supply module structure are mature, and the power supply module is suitable for popularization.
Further, the outer profiles of the printed circuit board 22, the supporting frame 24 and the cover plate 23 are the same, the printed circuit board 22, the supporting frame 24 and the cover plate 23 together form a matching portion a, and the matching portion a is accommodated in the chassis assembly 1.
In the present embodiment, the reason why the outer contour shapes of the printed circuit board 22, the supporting frame 24 and the cover plate 23 are the same is to make the fixing of the printed circuit board 22 simpler and to make the assembly convenient, and the matching portion a is accommodated in the case so that the circuit board is not exposed to the case and is not affected by dust.
Further, the supporting frame 24 includes a plurality of supporting plates 26 vertically disposed on the upper surface of the heat sink 21, and a plurality of supporting plates 26 enclose a receiving cavity 27 for receiving the printed circuit board 22.
In the present embodiment, the supporting plate 26 serves to enlarge the volume of the accommodating cavity 27 enclosed for accommodating the printed circuit board 22 as much as possible, so that the heat dissipation space is larger, and the heat dissipation effect is increased.
Further, a plurality of partition plates 25 are arranged inside the accommodating cavity 27.
In the present embodiment, the partition plate 25 separates different units on the printed circuit board 22 to independently dissipate heat, and also increases the heat dissipation area and the heat dissipation effect.
Of course, the present invention can also have other various embodiments, and based on the embodiments, those skilled in the art can obtain other embodiments without any creative work, and all of them belong to the protection scope of the present invention.
Claims (4)
1. The utility model provides a circuit machine case subassembly structure with dustproof function of heat dissipation, includes quick-witted case subassembly and circuit subassembly, the circuit subassembly includes printed circuit board and radiator, its characterized in that, the circuit subassembly partially accept in quick-witted case subassembly, the circuit subassembly still includes support frame and apron, the support frame set firmly in directly over the radiator, printed circuit board locate the support frame with between the apron.
2. The circuit case assembly structure with heat dissipation and dust prevention functions of claim 1, wherein the printed circuit board, the supporting frame and the cover plate have the same outer contour shape, and the printed circuit board, the supporting frame and the cover plate together form a matching portion, and the matching portion is accommodated in the case assembly.
3. The circuit case assembly structure with heat dissipation and dust prevention functions of claim 1, wherein the supporting frame comprises a plurality of supporting plates vertically disposed on an upper surface of the heat sink, and the plurality of supporting plates enclose an accommodating cavity for accommodating the printed circuit board.
4. The circuit case assembly structure with heat dissipation and dust prevention functions of claim 3, wherein a plurality of partition plates are further arranged inside the accommodating cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120722042.1U CN214757457U (en) | 2021-04-08 | 2021-04-08 | Circuit case assembly structure with heat dissipation and dust prevention functions |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120722042.1U CN214757457U (en) | 2021-04-08 | 2021-04-08 | Circuit case assembly structure with heat dissipation and dust prevention functions |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214757457U true CN214757457U (en) | 2021-11-16 |
Family
ID=78601506
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120722042.1U Active CN214757457U (en) | 2021-04-08 | 2021-04-08 | Circuit case assembly structure with heat dissipation and dust prevention functions |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214757457U (en) |
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2021
- 2021-04-08 CN CN202120722042.1U patent/CN214757457U/en active Active
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