CN213150757U - Stable in structure's aluminium system semiconductor housing - Google Patents
Stable in structure's aluminium system semiconductor housing Download PDFInfo
- Publication number
- CN213150757U CN213150757U CN202022690858.9U CN202022690858U CN213150757U CN 213150757 U CN213150757 U CN 213150757U CN 202022690858 U CN202022690858 U CN 202022690858U CN 213150757 U CN213150757 U CN 213150757U
- Authority
- CN
- China
- Prior art keywords
- outer shell
- connecting block
- bottom plate
- fixedly connected
- block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Casings For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a stable-structure aluminum semiconductor shell, which comprises an outer shell and a bottom plate, wherein the top of the bottom plate is provided with a connecting block, four corners of the inner side of the connecting block are fixedly connected with first connecting blocks, the inner cavity of the outer shell is provided with a positioning block, four sides of the positioning block are fixedly connected with the inner wall of the outer shell, the top of the connecting block and the bottom of the positioning block are respectively provided with a plurality of connecting posts and connecting holes, the outer shell and the bottom plate are clamped and connected with the connecting holes through the connecting posts, the front side surface and the two ends of the rear side door of the outer shell are respectively provided with a heat dissipation port, a dust guard is arranged inside the heat dissipation port, four sides of the dust guard are respectively and fixedly connected with a plurality of clamping blocks, the inner wall of the heat dissipation port is provided with a plurality of clamping grooves, the clamping blocks are clamped and connected with the clamping grooves, and the top and the bottom, stable in structure, the installation of being convenient for, the excellent in connection effect, and the radiating effect is good, and is strong through the dirt proofness.
Description
Technical Field
The utility model relates to a semiconductor housing technical field specifically is a stable in structure's aluminium system semiconductor shell.
Background
The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, and is applied to the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, for example, a diode is a device manufactured by adopting the semiconductor, the importance of the semiconductor is very huge no matter from the aspects of science and technology or economic development, most electronic products, such as a computer, a mobile phone or a digital recorder, have close association with the semiconductor, the existing aluminum shell structure of the semiconductor is not stable enough, the protection effect is poor, and thus the requirements of people on the product at present can not be met far.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a stable in structure's aluminium system semiconductor shell, stable in structure, the installation of being convenient for, the linking effect is good, and the radiating effect is good, and is strong through the dirt proofness to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a stable in structure's aluminium system semiconductor housing, includes shell body and bottom plate, the bottom plate top is equipped with links up the piece, link up the first connecting block of the equal fixedly connected with in the inboard four corners of piece, shell body inner chamber is equipped with the locating piece, the locating piece four sides all links to each other with shell body inner wall is fixed, just link up the piece top and all be equipped with a plurality of linking posts and linking hole bottom the locating piece, the shell body is connected with the bottom plate through linking post and linking hole card, shell body leading flank all is equipped with the thermovent with back side door both ends, the inside dust guard that all is equipped with of thermovent, a plurality of fixture blocks of the equal fixedly connected with of dust guard four sides, the thermovent inner wall is equipped with a plurality of draw-in grooves, fixture block and draw-in groove card and be connected, just shell body leading flank all is.
Furthermore, the strengthening rib all establishes to the cylinder structure, just the strengthening rib all inlays and establishes on the surface of outer casing.
Furthermore, all be equipped with the second connecting block in shell body inner chamber four corners, the second connecting block all links to each other with the locating piece inner wall is fixed, and all is equipped with the mounting hole on first connecting block and the second connecting block.
Furthermore, the inner wall of the clamping groove is fixedly connected with a sealing gasket.
Further, the top of the bottom plate is fixedly connected with a sealing strip, and the sealing strip is movably connected with the outer shell.
Further, the outer shell and the positioning block are integrated, and the bottom plate and the connecting block are integrated.
Compared with the prior art, the beneficial effects of the utility model are that:
through setting up linking piece and locating piece, inject semiconductor mounted position, prevent that the semiconductor from rocking in the removal process, increase its stability, through setting up linking post and linking hole, be convenient for connect locating piece and linking piece, easy to assemble and dismantlement, through setting up the thermovent, the semiconductor of being convenient for dispels the heat, through setting up the dust guard, prevent the inside entering dust of shell body, increase dustproof effect, through setting up fixture block and draw-in groove, be convenient for install and dismantle the dust guard, through setting up the strengthening rib, increase the stability of shell body, through setting up the mounting hole, be convenient for fix shell body and bottom plate, through setting up sealed pad and sealing strip, increase the sealed effect of this shell.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention.
Fig. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the top structure of the bottom plate of the present invention;
fig. 3 is a schematic view of the internal structure of the outer casing of the present invention;
fig. 4 is an enlarged view of a of the present invention;
reference numbers in the figures: 1. an outer housing; 2. a base plate; 3. a joining block; 4. a first connection block; 5. positioning blocks; 6. connecting the column; 7. an engagement hole; 8. a heat dissipation port; 9. a dust-proof plate; 10. a clamping block; 11. a card slot; 12. reinforcing ribs; 13. a second connecting block; 14. mounting holes; 15. a gasket; 16. a sealing strip.
Detailed Description
The present invention will be further described with reference to the following embodiments, wherein the drawings are for illustrative purposes only and are not intended to be limiting, and in order to better illustrate the embodiments of the present invention, some components of the drawings may be omitted, enlarged or reduced and do not represent the size of an actual product.
As shown in fig. 1-4, an aluminum semiconductor housing with stable structure comprises an outer housing 1 and a bottom plate 2, wherein a connection block 3 is arranged at the top of the bottom plate 2, four corners of the inner side of the connection block 3 are fixedly connected with first connection blocks 4, a positioning block 5 is arranged in an inner cavity of the outer housing 1 to limit the installation position of a semiconductor, so as to prevent the semiconductor from shaking during moving and increase the stability of the semiconductor, four sides of the positioning block 5 are fixedly connected with the inner wall of the outer housing 1, a plurality of connection columns 6 and connection holes 7 are arranged at the top of the connection block 3 and the bottom of the positioning block 5, the outer housing 1 and the bottom plate 2 are clamped and connected with the connection holes 7 through the connection columns 6, so as to connect the positioning block 5 and the connection block 3, so as to facilitate installation and disassembly, heat dissipation ports 8 are arranged at both ends of the front side face and the rear side door of the outer housing 1, so as to facilitate heat dissipation of the, prevent that 1 inside entering dust of shell body from increasing dustproof effect, a plurality of fixture blocks 10 of the equal fixedly connected with in dust guard 9 four sides, 8 inner walls of thermovent are equipped with a plurality of draw-in grooves 11, fixture block 10 blocks and draw-in groove 11 card and be connected, be convenient for install with dismantle dust guard 9, just 1 leading flank of shell body and trailing flank top all are equipped with strengthening rib 12 with the bottom, increase shell body 1's stability.
More specifically, the strengthening rib 12 all establishes to the cylinder structure, just strengthening rib 12 all inlays and establishes 1 surface at the shell body, 1 inner chamber four corners of shell body all is equipped with second connecting block 13, second connecting block 13 all links to each other with 5 inner wall fixings of locating piece, and all is equipped with mounting hole 14 on first connecting block 4 and the second connecting block 13, is convenient for fix shell body 1 and bottom plate 2, the sealed pad 15 of the equal fixedly connected with of draw-in groove 11 inner wall increases the sealed effect of this shell, 2 top fixedly connected with sealing strips 16 of bottom plate increase the sealed effect of this shell, sealing strips 16 links to each other with 1 activity of shell body, shell body 1 establishes structure as an organic whole with locating piece 5, bottom plate 2 establishes structure as an organic whole with linking piece 3.
The working principle is as follows: this kind of stable in structure's aluminium system semiconductor housing, through setting up linking piece 3 and locating piece 5, inject semiconductor mounted position, prevent that the semiconductor from rocking in the removal process, increase its stability, through setting up linking post 6 and linking hole 7, be convenient for connect locating piece 5 and linking piece 3, easy to assemble and dismantlement, through setting up thermovent 8, be convenient for the semiconductor dispel the heat, through setting up dust guard 9, prevent the inside dust that gets into of shell body 1, increase dustproof effect, through setting up fixture block 10 and draw-in groove 11, be convenient for install and dismantle dust guard 9, through setting up strengthening rib 12, increase shell body 1's stability, through setting up mounting hole 14, be convenient for fix shell body 1 and bottom plate 2, through setting up sealed 15 and sealing strip 16, increase the sealed effect of this shell.
Although particular embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a stable in structure's aluminium system semiconductor shell, includes shell body (1) and bottom plate (2), its characterized in that: the connecting block (3) is arranged at the top of the bottom plate (2), the four inner sides of the connecting block (3) are fixedly connected with first connecting blocks (4), the inner cavity of the outer shell (1) is provided with a positioning block (5), the four sides of the positioning block (5) are fixedly connected with the inner wall of the outer shell (1), the top of the connecting block (3) and the bottom of the positioning block (5) are respectively provided with a plurality of connecting columns (6) and connecting holes (7), the outer shell (1) and the bottom plate (2) are clamped and connected with the connecting holes (7) through the connecting columns (6), the front side face and the rear side door of the outer shell (1) are respectively provided with a heat dissipation port (8), a dustproof plate (9) is arranged inside the heat dissipation port (8), the four sides of the dustproof plate (9) are respectively and fixedly connected with a plurality of clamping blocks (10), the inner wall of the heat dissipation port (8) is provided with a plurality of clamping grooves (11), and the clamping blocks (10) are clamped and, and reinforcing ribs (12) are arranged at the top end and the bottom end of the front side surface and the back side surface of the outer shell (1).
2. A structurally stable aluminum semiconductor can according to claim 1, wherein: the reinforcing ribs (12) are all arranged in a cylindrical structure, and the reinforcing ribs (12) are all embedded in the surface of the outer shell (1).
3. A structurally stable aluminum semiconductor can according to claim 1, wherein: the outer shell (1) inner chamber four corners all is equipped with second connecting block (13), second connecting block (13) all links to each other with locating piece (5) inner wall is fixed, and all is equipped with mounting hole (14) on first connecting block (4) and second connecting block (13).
4. A structurally stable aluminum semiconductor can according to claim 1, wherein: the inner wall of the clamping groove (11) is fixedly connected with a sealing gasket (15).
5. A structurally stable aluminum semiconductor can according to claim 1, wherein: the top of the bottom plate (2) is fixedly connected with a sealing strip (16), and the sealing strip (16) is movably connected with the outer shell (1).
6. A structurally stable aluminum semiconductor can according to claim 1, wherein: the outer shell (1) and the positioning block (5) are integrated, and the bottom plate (2) and the connecting block (3) are integrated.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202022690858.9U CN213150757U (en) | 2020-11-19 | 2020-11-19 | Stable in structure's aluminium system semiconductor housing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202022690858.9U CN213150757U (en) | 2020-11-19 | 2020-11-19 | Stable in structure's aluminium system semiconductor housing |
Publications (1)
Publication Number | Publication Date |
---|---|
CN213150757U true CN213150757U (en) | 2021-05-07 |
Family
ID=75722889
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202022690858.9U Active CN213150757U (en) | 2020-11-19 | 2020-11-19 | Stable in structure's aluminium system semiconductor housing |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN213150757U (en) |
-
2020
- 2020-11-19 CN CN202022690858.9U patent/CN213150757U/en active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN213150757U (en) | Stable in structure's aluminium system semiconductor housing | |
CN210840448U (en) | Special high heat dissipation copper base support plate of 5G communication | |
CN216451721U (en) | Digital video converter convenient to heat dissipation | |
CN116048213A (en) | Machine case with diversified parcel formula buffering protective structure | |
CN210692519U (en) | Dustproof heat dissipation protection casing for semiconductor | |
CN214957175U (en) | Energy storage charging module | |
CN210725684U (en) | Aluminum shell with studs at outer bottom and capable of directly fixing circuit board | |
CN215646787U (en) | Bluetooth module with waterproof construction | |
CN219876681U (en) | Vehicle-mounted terminal equipment | |
CN220823099U (en) | Electronic communication equipment for information engineering | |
CN220510004U (en) | Semiconductor shell with good waterproof performance | |
CN212967672U (en) | Power supply IC chip | |
CN215301336U (en) | Mobile phone motherboard shield cover assembly device | |
CN221381514U (en) | Power module with strong anti-interference capability | |
CN219802365U (en) | Protective type industrial switch | |
CN220858799U (en) | Multiplexing-based wireless communication module | |
CN220732298U (en) | Explosion-proof junction box | |
CN221748426U (en) | Dustproof gateway equipment matched with computer | |
CN216463426U (en) | Cooling device for machining | |
CN219371014U (en) | IGBT single tube integrated module | |
CN215378956U (en) | Intelligent expandable control unit | |
CN211980203U (en) | Solid state hard drives shell | |
CN216644051U (en) | Solar energy plane lamp | |
CN220419889U (en) | Network server protective housing | |
CN221407439U (en) | Communication energy storage device capable of rapidly radiating |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |