CN214701875U - Capillary structure and temperature-uniforming plate - Google Patents
Capillary structure and temperature-uniforming plate Download PDFInfo
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- CN214701875U CN214701875U CN202120745594.4U CN202120745594U CN214701875U CN 214701875 U CN214701875 U CN 214701875U CN 202120745594 U CN202120745594 U CN 202120745594U CN 214701875 U CN214701875 U CN 214701875U
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Abstract
The utility model belongs to the technical field of the electronic equipment heat dissipation, a capillary structure and samming board is disclosed. The capillary structure comprises a first supporting part, a second supporting part, a first connecting part and a second connecting part, wherein the first supporting part and the second supporting part are arranged in parallel at intervals, the first connecting part is connected between the first end of the first supporting part and the first end of the second supporting part, the second connecting part is connected between the second end of the first supporting part and the second end of the second supporting part, the first supporting part, the second supporting part, the first connecting part and the second connecting part are arranged in an enclosing mode to form an inner cavity, and when the first supporting part and the second supporting part are stressed, the first connecting part and the second connecting part generate elastic deformation. The temperature-uniforming plate comprises a first cover plate, a second cover plate and the capillary structures, wherein the first cover plate is compressed when contacting with a heat source device through the elastic capillary structures and the elastic first cover plate structures, the internal capillary structures are also compressed, namely the thickness of the temperature-uniforming plate is changed, and the temperature-uniforming plate is suitable for use of various heat source devices.
Description
Technical Field
The utility model relates to an electronic equipment heat dissipation technical field especially relates to a capillary structure and samming board.
Background
The existing temperature equalizing plate is a cavity structure formed by an upper cover plate and a lower cover plate, a rigid limiting column is supported in the cavity, a liquid working medium is heated in the cavity to change phase and transfer heat, and a capillary structure (such as sintered powder, a metal mesh, a fibrous body, a foam body or a groove) is required to be arranged on part or all supporting columns to accelerate the backflow of the liquid working medium so as to improve the working efficiency, so that the high-efficiency heat radiating device is formed. However, when the common temperature-equalizing plate is applied to a multi-heat-source shared refrigerating end, the requirements on the height tolerance of a heat source device and the machining tolerance of related assembly parts are high, the machining difficulty is increased, the cost is high, and one temperature-equalizing plate cannot be suitable for being shared by multiple heat source devices.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a capillary structure and temperature-uniforming plate can be adapted to the heat dissipation of multiple heat source device.
To achieve the purpose, the utility model adopts the following technical proposal:
a capillary structure comprising:
a first support section;
the first supporting part and the second supporting part are arranged in parallel at intervals;
a first connecting portion connected between a first end of the first support portion and a first end of the second support portion;
the second connecting portion, the second connecting portion connect in the second end of first supporting portion with between the second end of second supporting portion, first supporting portion the second supporting portion first connecting portion with the second connecting portion enclose and establish and form an inner chamber, work as first supporting portion with when the second supporting portion atress is close to each other, first connecting portion with the second connecting portion produce elastic deformation.
Preferably, the first connecting portion has a semicircular, V-shaped or W-shaped cross section and the second connecting portion has a semicircular, V-shaped or W-shaped cross section in a direction perpendicular to the lumen axis.
A vapor chamber, comprising:
the first cover plate comprises a first support part, a connecting part and a second support part, wherein the connecting part surrounds the second support part to form an accommodating groove, when the first support part and the second support part are stressed to be close to each other, the connecting part and/or the second support part generate elastic deformation, and one side of the connecting part and one side of the second support part, which face the accommodating groove, are provided with liquid absorption capillary structure layers;
the second cover plate is connected to the first support part and covers the accommodating groove to form an accommodating cavity; and
the capillary structure according to any one of the above claims, wherein the capillary structure is disposed in the accommodating cavity and is fixedly connected to the second cover plate.
Preferably, the connecting portion is disposed perpendicular to the first support portion, and the second support portion is disposed parallel to the first support portion.
Preferably, the connecting part and the first supporting part are arranged at an included angle, and the second supporting part and the first supporting part are arranged at an included angle.
Preferably, the second support part is provided with a metal block.
Preferably, the second support part is provided with a groove, and the metal block is arranged in the groove.
Preferably, one side of the second cover plate facing the accommodating cavity is provided with the liquid absorbing capillary structure layer.
Preferably, a support limiting column is arranged in the accommodating cavity, is fixedly connected to the second cover plate, is spaced from the first cover plate, and is lower than the capillary structure.
Preferably, the supporting and limiting column is a porous column.
The utility model has the advantages that:
the utility model provides a capillary structure can elastic deformation when the pressurized results in the appearance to change, has played the effect of elastic support, and is lower to the machining tolerance requirement of heat source device height, relevant assembly part, has reduced the manufacturing degree of difficulty and processing cost, is applicable to the heat dissipation of multiple heat source device.
The utility model provides a temperature-uniforming plate, through adopting the capillary structure and the first apron structure that can elastically compress, make first apron can be compressed when contacting with the heat source device, inside capillary structure also compresses thereupon, the thickness of temperature-uniforming plate can change promptly, so as to adapt to the use of multiple heat source device, thereby also correspondingly reduced the requirement of heat source device to temperature-uniforming plate thickness tolerance, the precision of the processing precision and the assembly of the relevant part of temperature-uniforming plate has promptly been reduced, the processing degree of difficulty has been reduced, the cost is reduced; in addition, when the temperature-uniforming plate is stressed, the first cover plate and the second cover plate simultaneously press the capillary structure, and the first support part and the second support part are in surface-to-surface contact with the first cover plate and the second cover plate, so that sliding friction cannot be generated, and the service life of the temperature-uniforming plate can be prolonged.
Drawings
Fig. 1 is a schematic structural view illustrating a first connection portion and a second connection portion of a capillary structure according to an embodiment of the present invention, which are semi-circular in cross section;
fig. 2 is a schematic structural view illustrating a cross section of a first connecting portion and a cross section of a second connecting portion of a capillary structure according to an embodiment of the present invention in a V shape;
fig. 3 is a schematic structural diagram of a capillary structure according to an embodiment of the present invention, in which a cross section of a first connecting portion and a cross section of a second connecting portion are W-shaped;
fig. 4 is a schematic structural diagram of a vapor chamber according to an embodiment of the present invention;
fig. 5 is a top view of a first cover plate according to an embodiment of the present invention;
fig. 6 is a cross-sectional view of a top view of a first cover plate according to an embodiment of the present invention.
In the figure:
1-a first cover plate; 11-a support part; 12-a connecting part; 13-support two; 14-a receiving groove; 15-a groove;
2-a second cover plate;
3-a capillary structure; 31-a first support part; 32-a second support; 33-a first connection; 34-a second connection;
4-a holding cavity;
5-a metal block;
6-supporting a limit column;
7-water injection hole groove.
Detailed Description
Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar parts throughout, or parts having the same or similar functions. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, unless otherwise expressly specified or limited, the terms "connected," "connected," and "fixed" are to be construed broadly and can include, for example, fixed or removable connections, mechanical or electrical connections, direct connections, indirect connections through an intermediary, communication between two elements, or an interaction between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the description of the present invention, unless otherwise expressly specified or limited, the first feature "on" or "under" the second feature may include both the first and second features being in direct contact, and may also include the first and second features being in contact, not in direct contact, but with another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.
As shown in fig. 1-3, the present invention provides a capillary structure, which includes a first supporting portion 31, a second supporting portion 32, a first connecting portion 33 and a second connecting portion 34, wherein the first supporting portion 31 and the second supporting portion 32 are parallel and spaced; the first connecting portion 33 is connected between the first end of the first supporting portion 31 and the first end of the second supporting portion 32; the second connecting portion 34 is connected between the second end of the first supporting portion 31 and the second end of the second supporting portion 32; the first supporting portion 31, the second supporting portion 32, the first connecting portion 33 and the second connecting portion 34 are defined to form an inner cavity 35, and when the first supporting portion 31 and the second supporting portion 32 are forced to approach each other, the first connecting portion 33 and the second connecting portion 34 are elastically deformed.
The utility model provides a capillary structure can elastic deformation when the pressurized results in the appearance to change, has played the effect of elastic support, and is lower to the machining tolerance requirement of heat source device height, relevant assembly part, has reduced the manufacturing degree of difficulty and processing cost, is applicable to the heat dissipation of multiple heat source device.
Specifically, the first connection portion 33 has a semicircular, V-shaped, or W-shaped cross section, and the second connection portion 34 has a semicircular, V-shaped, or W-shaped cross section in a direction perpendicular to the axis of the cavity 35. Further, through holes are formed in the first support portion 31 and the second support portion 32 to prevent liquid from being collected, so that a quick backflow effect is achieved.
In this embodiment, as shown in fig. 1-3, a round tube or a square tube may be used as a substrate, the material is stainless steel, copper, titanium, aluminum, nickel, or an alloy thereof, the round tube or the square tube is first cut into a circular ring shape, the wall thickness is more than 0.05mm, the thickness of the ring is more than 0.3mm, then the ring is subjected to surface treatment such as electroplating and passivation, a layer of sintering powder, woven mesh (sinterable) or fiber (sinterable) is coated on the inner and outer surfaces of the ring, and finally the ring is pressed into a ring shape, and the square ring is pressed into a flat V shape or a W shape.
In other embodiments, as shown in fig. 1-3, a sheet material may be used as a substrate, the material is stainless steel, copper, titanium, aluminum, nickel, or their alloys, and the surface treatment such as electroplating and passivation is performed on the sheet material, the sheet material has a thickness of 0.03mm or more and a width of 0.5mm or more (preferably 1.8-3.5mm), the front and back surfaces may be etched with capillary grooves or coated with a layer of sintering powder, woven mesh (sinterable) or fibers (sinterable), the material is stainless steel, copper, titanium, aluminum, nickel, or their alloys, or the grooves, powder, mesh, and fibers may also be used in combination. Then the ring is made into an open circular ring shape or a square ring shape, finally the circular ring is pressed into a flat ring shape, and the square ring is pressed into a V shape or a W shape. The opening can be welded or not welded.
In other embodiments, as shown in fig. 1-3, a single (multi) layer woven mesh or fiber may be used as the substrate, which may be stainless steel or copper, titanium, aluminum, nickel, etc. or alloys thereof, and the surface thereof may be subjected to surface treatment, such as electroplating, passivation, etc. The fiber is processed into a strip shape, the width is more than 1.5mm, when the fiber is a multilayer woven net or fiber, the fiber can be sintered to increase the strength and easy processing property, then the fiber is made into an open circular ring or a square ring, finally the circular ring is pressed into a flat ring, and the square ring is pressed into a V shape or a W shape. The opening can be welded or not welded.
As shown in fig. 4-6, the utility model provides a vapor chamber, include: a first cover plate 1, a second cover plate 2 and a capillary structure 3. First apron 1 is including supporting one portion 11, connecting portion 12 and support two 13, connecting portion 12 encloses to establish on supporting two 13 and forms storage tank 14, produce elastic deformation for supporting two 13 and provide sufficient space, connecting portion 12 and support two 13 in first apron 1 are provided with imbibition capillary structure layer towards one side of storage tank 14, liquid working medium attaches to imbibition capillary structure layer rapidly, it is more even to make the heat dissipation, second apron 2 is connected and is supported one 11 and closing cap storage tank 14 and constitute sealed holding chamber 4, capillary structure 3 sets up in holding chamber 4, and fixed connection is on second apron 2.
The utility model provides a temperature-uniforming plate, through adopting the capillary structure 3 and the first apron 1 structure that can elastically compress, make first apron 1 can be compressed when contacting with the heat source device, inside capillary structure 3 also compresses thereupon, the thickness of temperature-uniforming plate can change promptly, in order to adapt to the use of multiple heat source device, thereby also correspondingly reduced the requirement of heat source device to temperature-uniforming plate thickness tolerance, the precision of the processing precision and the assembly of the relevant part of temperature-uniforming plate has been reduced promptly, the processing degree of difficulty has been reduced, the cost is reduced; in addition, when the temperature equalization plate is stressed, the first cover plate 1 and the second cover plate 2 simultaneously press the capillary structure 3, and the first supporting part 31 and the second supporting part 32 are in surface-to-surface contact with the first cover plate 1 and the second cover plate 2, so that sliding abrasion is not generated, and the service life of the temperature equalization plate can be prolonged.
Specifically, a certain position of the first support part 11 is provided with a water injection hole groove 7, so that the liquid working medium can be injected and attached to the liquid absorption capillary structure layer, and the heat dissipation efficiency is high. Further, the second cover plate 2 can be provided with a water injection hole groove 7 at a position corresponding to the position of the first cover plate 1, so that water inflow is smoother. Before use, the temperature-equalizing plate is vacuumized and injected with liquid working medium, and then the water injection hole groove 7 is plugged.
Specifically, capillary structure 3 is the connecting water course of first apron 1 and second apron 2, for preventing that connecting water course from shifting, can fix on second apron 2 its modes such as resistance spot welding, laser welding, brazing, diffusion welding to make liquid working medium can follow capillary structure 3 and follow first apron 1 of 2 flow direction of second apron, in order to reach the effect of liquid rapid reflux, the radiating efficiency promotes.
Specifically, the connecting portion 12 is disposed perpendicular to the first supporting portion 11, and the second supporting portion 13 is disposed parallel to the first supporting portion 11, so as to form the receiving groove 14, which enables the first cover plate 1 and the second cover plate 2 to bear relatively large pressure;
in another embodiment, the connecting part 12 and the first supporting part 11 form an included angle, the angle α is between 0 ° and 25 °, the second supporting part 13 and the first supporting part 11 also form an included angle, and the angle β is between 0 ° and 15 °, and the angle can meet the requirement of elasticity, and can also change the thickness of the uniform temperature plate to adapt to the use requirement when the force applied to the first cover plate 1 and the second cover plate 2 is relatively small.
Specifically, the metal block 5 is arranged on the second supporting portion 13, is made of stainless steel, copper, titanium, aluminum, nickel or the like or alloy thereof, and is welded by brazing or diffusion welding, so that the first cover plate 1 is prevented from being pressed by the second supporting portion 13 to generate invagination when being pressed, and further the influence on the contact with a heat source device is avoided, and the heat dissipation of the heat source device is further influenced. The metal block 5 may be disposed inside the receiving groove 14 or outside the receiving groove 14.
Specifically, for the convenience of metal block 5 location when the welding, when metal block 5 sets up in the samming board outside, support two 13 and set up recess 15, recess 15 notch deviates from second apron 2, and metal block 5 sets up in recess 15. In another embodiment, when the metal block 5 is disposed inside the vapor chamber, the supporting portions 13 are provided with a groove, the notch of the groove faces the second cover plate, and the metal block 5 is disposed on the groove.
Specifically, the second cover plate 2 is made of stainless steel, copper, titanium, aluminum, nickel, or an alloy thereof, and may be subjected to surface treatment such as electroplating and passivation, or may be a composite of the two materials. The second cover plate 2 can be a plane plate, a concave plane can be arranged on one side facing the holding cavity 4, and a liquid absorption capillary structure layer is arranged on one side facing the holding cavity 4 so as to increase the flowing speed of liquid working media in the holding cavity 4, so that the heat dissipation effect is more uniform, and the heat dissipation capacity of the uniform temperature plate is further increased.
Specifically, be provided with in the holding chamber 4 and support spacing post 6, and support spacing post 6 fixed connection in second apron 2, support spacing post 6 and first apron 1 interval setting, its highly be less than capillary structure 3, after carrying out the evacuation to holding chamber 4, the temperature-uniforming plate atress is atmospheric pressure this moment, compress a part of cavity, first apron 1 does not have the contact with the spacing post 6 of support that is fixed in on the second apron 2, when the temperature-uniforming plate installation was used, first apron 1 receives the installation force and continues to push down, the maximum compression volume of temperature-uniforming plate is first apron 1 and the spacing post 6 contact of support that is fixed in on second apron 2, guarantee that the temperature-uniforming plate elasticity is not destroyed.
Specifically, the support and position-limiting column 6 is selected to be a porous column, such as: sintering powder post, foam copper post etc. when the samming board reaches the maximum compression volume, support spacing post 6 and can play the effect of connecting first apron 1 and second apron 2, liquid working medium can be along supporting spacing post 6 backward flows, further increases the heat-sinking capability of samming board.
It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (10)
1. A capillary structure, comprising:
a first support section (31);
a second support part (32), wherein the first support part (31) and the second support part (32) are arranged in parallel and at intervals;
a first connection portion (33), the first connection portion (33) being connected between a first end of the first support portion (31) and a first end of the second support portion (32);
second connecting portion (34), second connecting portion (34) connect in the second end of first supporting portion (31) with between the second end of second supporting portion (32), first supporting portion (31), second supporting portion (32), first connecting portion (33) with second connecting portion (34) enclose and establish and form an inner chamber (35), work as when first supporting portion (31) with second supporting portion (32) atress is close to each other, first connecting portion (33) with second connecting portion (34) produce elastic deformation.
2. Capillary structure according to claim 1, wherein the first connection (33) has a semicircular, V-shaped or W-shaped cross-section and the second connection (34) has a semicircular, V-shaped or W-shaped cross-section in a direction perpendicular to the axis of the lumen (35).
3. A vapor chamber, comprising:
the first cover plate (1) comprises a first supporting part (11), a connecting part (12) and a second supporting part (13), wherein the connecting part (12) surrounds the second supporting part (13) to form a containing groove (14), when the first supporting part (11) and the second supporting part (13) are stressed to be close to each other, the connecting part (12) and/or the second supporting part (13) generate elastic deformation, and one side, facing the containing groove (14), of the connecting part (12) and the second supporting part (13) is provided with a liquid absorption capillary structure layer;
the second cover plate (2) is connected to the first supporting part (11) and covers the accommodating groove (14) to form an accommodating cavity (4); and
a capillary structure according to any one of claims 1-2, wherein said capillary structure is arranged in said receiving cavity (4) and is fixedly connected to said second cover plate (2).
4. A temperature-uniforming plate according to claim 3, wherein the connecting portion (12) is disposed perpendicularly to the first supporting portion (11), and the second supporting portion (13) is disposed in parallel with the first supporting portion (11).
5. A temperature-uniforming plate according to claim 3, wherein the connecting portion (12) is arranged at an angle to the first supporting portion (11), and the second supporting portion (13) is arranged at an angle to the first supporting portion (11).
6. A temperature-uniforming plate according to claim 3, wherein a metal block (5) is provided on the supporting second portion (13).
7. Temperature-uniforming plate according to claim 6, characterized in that said two supporting portions (13) have grooves (15), said metal blocks (5) being arranged in said grooves (15).
8. A temperature-uniforming plate according to claim 3, wherein the side of the second cover plate (2) facing the receiving cavity (4) is provided with the wicking capillary structure layer.
9. The temperature equalization plate according to claim 3, wherein a support and limit column (6) is arranged in the accommodating cavity (4), the support and limit column (6) is fixedly connected to the second cover plate (2), is arranged at a distance from the first cover plate (1), and has a height lower than the capillary structure.
10. The vapor-deposition plate according to claim 9, wherein the support-limiting pillars (6) are porous pillars.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120745594.4U CN214701875U (en) | 2021-04-13 | 2021-04-13 | Capillary structure and temperature-uniforming plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120745594.4U CN214701875U (en) | 2021-04-13 | 2021-04-13 | Capillary structure and temperature-uniforming plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214701875U true CN214701875U (en) | 2021-11-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120745594.4U Active CN214701875U (en) | 2021-04-13 | 2021-04-13 | Capillary structure and temperature-uniforming plate |
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| CN (1) | CN214701875U (en) |
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- 2021-04-13 CN CN202120745594.4U patent/CN214701875U/en active Active
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| CP01 | Change in the name or title of a patent holder |
Address after: 510623 floors 1-4 of building a and 1-4 of building B in aimeda hi tech Industrial Park, Xinshi community, Dalang street, Longhua District, Shenzhen City, Guangdong Province Patentee after: Baode South China (Shenzhen) thermal energy system Co.,Ltd. Address before: 510623 floors 1-4 of building a and 1-4 of building B in aimeda hi tech Industrial Park, Xinshi community, Dalang street, Longhua District, Shenzhen City, Guangdong Province Patentee before: Aavid Shenzen Thermal Energy System Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder |