CN214672671U - Quantum dot sheet, quantum dot sheet master plate and quantum dot LED - Google Patents
Quantum dot sheet, quantum dot sheet master plate and quantum dot LED Download PDFInfo
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- CN214672671U CN214672671U CN202120686377.2U CN202120686377U CN214672671U CN 214672671 U CN214672671 U CN 214672671U CN 202120686377 U CN202120686377 U CN 202120686377U CN 214672671 U CN214672671 U CN 214672671U
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Abstract
The utility model discloses a quantum dot thin slice, quantum dot thin slice master and quantum dot LED, wherein, the quantum dot thin slice includes: the quantum dot display comprises a substrate, a cover plate, a quantum dot material and frame glue, wherein the cover plate and the substrate are arranged in a box pair; the quantum dot material is arranged between the cover plate and the substrate; the cover plate and the substrate are bonded through the frame glue, and the frame glue is arranged around the quantum dot material. The utility model discloses technical scheme can save separation agent material, reduction in production cost in separation water oxygen.
Description
Technical Field
The utility model relates to a LED technical field, in particular to quantum dot thin slice, quantum dot thin slice master plate and quantum dot LED.
Background
The lcd screen cannot actively emit light, so that an LED backlight is required as a light emitting element, and the quantum dots are widely applied to a high-color-gamut lcd tv due to the advantages of narrow half-wave width, continuously adjustable wavelength, high light emitting efficiency, and the like. The principle of quantum dot light emission is quantum confinement effect, the light emission wavelength changes with the size change, the specific surface area is rapidly increased with the size reduction due to the fact that the size of the quantum dot is in the nanometer level, and the proportion of surface atoms in the whole crystal atoms of the quantum dot can reach more than 20%, so that the effect of surface defects in the quantum dot becomes very obvious. Due to the surface effect of the quantum dots, the quantum dots have high activity, are extremely sensitive to corrosion of water, oxygen and air, and particularly aggravate the corrosion of the quantum dots under the action of heat, so that the quantum dots in the liquid crystal display television with mass production are mainly used as quantum films, namely the quantum dots are far away from a heat source to enhance the reliability and application feasibility of the quantum films, but the barrier agent material has high price, so that the cost of the whole quantum film is high during application, and the application prospect of the quantum dot material in the TV is limited.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a quantum dot thin slice, quantum dot thin slice master mask and quantum dot LED, when aiming at separation water oxygen, save separation agent material, reduction in production cost.
To achieve the above object, the present invention provides a quantum dot sheet, including: the quantum dot display comprises a substrate, a cover plate, a quantum dot material and frame glue, wherein the cover plate and the substrate are arranged in a box pair; the quantum dot material is arranged between the cover plate and the substrate; the cover plate and the substrate are bonded through frame glue, and the frame glue is arranged around the quantum dot material.
Optionally, the surfaces of the substrate and the cover plate, which face the sides of the quantum dot materials, are coated with a layer of a barrier agent material.
Optionally, the quantum dot sheet further comprises: the surfaces of the base plate and the cover plate which are deviated from each other are respectively pasted with a heat insulation layer.
Optionally, the thermal insulation layer is composed of an optical resin and a plurality of thermal insulation bubbles, the thermal insulation bubbles are composed of a wrapping layer and a gas layer filled in the wrapping layer, and the plurality of thermal insulation bubbles are arranged in the optical resin at intervals.
In order to achieve the above object, the present invention further provides a quantum dot thin slice master plate, including: the substrate, the cover plate and the frame glue are respectively connected in a one-to-one correspondence manner in two adjacent quantum dot sheets.
In order to achieve the above object, the present invention further provides a quantum dot LED, including: the LED chip comprises a support, a first blue light chip, a second blue light chip, a third blue light chip, a first quantum dot sheet and a second quantum dot sheet, wherein the support is provided with a mounting cavity, and a light outlet is formed in the surface of the support by the mounting cavity; the first blue light chip, the second blue light chip and the third blue light chip are arranged in the mounting cavity at intervals; the first quantum dot sheet is arranged on one side, facing the light outlet, of the first blue light chip, the second quantum dot sheet is arranged on one side, facing the light outlet, of the second blue light chip, the first quantum dot sheet is a red quantum dot sheet, and the second quantum dot sheet is a green quantum dot sheet; wherein the first quantum dot sheet and the second quantum dot sheet are each independently a quantum dot sheet as described above.
Optionally, the mounting cavity is filled with an encapsulation adhesive, and the encapsulation adhesive fixes the first quantum dot sheet and the second quantum dot sheet in the mounting cavity.
Optionally, the third blue light chip is arranged at the bottom of the installation cavity, the first installation groove and the second installation groove are further formed in the bottom of the installation cavity, the first installation groove and the second installation groove are respectively formed in two sides of the third blue light chip, the first blue light chip and the first quantum dot sheet are arranged in the first installation groove, and the second blue light chip and the second quantum dot sheet are arranged in the second installation groove.
Optionally, the quantum dot LED further comprises: the first substrate, the second substrate and the third substrate are all arranged in the support and extend to the surface of the support, which is far away from the light outlet; the first blue light chip is connected with the first substrate, the second blue light chip is connected with the second substrate, and the third blue light chip is connected with the third substrate.
Optionally, the first substrate, the second substrate, and the third substrate each independently include a positive electrode portion and a negative electrode portion; the positive pole parts of the first substrate, the second substrate and the third substrate are connected into a whole, and the negative pole parts of the first substrate, the second substrate and the third substrate are arranged at intervals; alternatively, the negative electrode portions of the first substrate, the second substrate, and the third substrate are integrally connected, and the positive electrode portions of the first substrate, the second substrate, and the third substrate are provided at intervals.
The utility model discloses among the technical scheme, through base plate, apron and frame glue with the encapsulation of quantum dot material, replace the separation agent material in the traditional quantum membrane, can reach the purpose of separation water oxygen equally, guarantee the performance of quantum dot to can save separation agent material, reduction in production cost has expanded the application prospect of quantum dot material in the display screen field.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an embodiment of the quantum dot sheet of the present invention;
fig. 2 is a schematic structural diagram of an embodiment of the quantum dot sheet master of the present invention;
fig. 3 is a schematic structural diagram of an embodiment of the quantum dot LED of the present invention;
FIG. 4 is a top view of the quantum dot LED of FIG. 3;
fig. 5 is a bottom view of the quantum dot LED of fig. 3.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | Quantum dot |
211 | |
| 10 | |
212 | |
| 11 | |
31 | First blue light chip |
| 12 | |
32 | Second |
| 13 | |
33 | Third |
| 14 | Frame glue | 41 | A |
| 15 | |
411 | Positive electrode part of |
| 151 | |
412 | Negative electrode part of |
| 152 | Optical resin | 42 | A |
| 1000 | |
421 | Positive electrode part of |
| 10a | First |
422 | Negative electrode part of |
| 10b | Second quantum dot sheet | 43 | A |
| 20 | |
431 | Positive electrode part of |
| 21 | |
432 | Negative electrode part of third substrate |
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that, if directional indications (such as upper, lower, left, right, front and rear … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The utility model provides a quantum dot thin slice 10.
In the embodiment of the present invention, as shown in fig. 1, the quantum dot sheet 10 includes: the device comprises a substrate 11, a cover plate 12, a quantum dot material 13 and frame glue 14, wherein the cover plate 12 and the substrate 11 are arranged in a box pair; the quantum dot material 13 is arranged between the cover plate 12 and the substrate 11; the cover plate 12 and the substrate 11 are bonded by the sealant 14, and the sealant 14 is disposed around the quantum dot material 13.
It should be noted that Quantum Dots (QDs) are extremely minute inorganic nanocrystals invisible to the naked eye, the quantum dot material 13 may be a first compound of a group iii-v element including one of CdSe, SrSe, ZnSe, CdTe, CaSe, ZnS, CaS, MgS, SrS, BaS, MgTe, ZnTe, SrTe, MgSe, cace, BaSe, BaTe, and CdS, or a second compound of a group ii-vi element including one of GaAs, GaP, InP, InN, GaN, and InAs, or a third compound including an organic-inorganic hybrid perovskite (CH — o)3NH3PbX3X ═ Cl, Br, I) material, or a fourth compound comprising all-inorganic perovskite cesium lead halide quantum dots (CsPbX)3X ═ Cl, Br, I), or a core-shell structure compound or a doped nanocrystal formed by coating with a plurality of the first compound and/or the second compound and/or the third compound and/or the fourth compound, preferably a CdSe quantum dot material 13. After the quantum dot material 13 is filled into the substrate 11 and the cover plate 12, the quantum dot material 13 usually needs to be cured by using thermosetting glue, so that the thickness of the mixture material of the quantum dot material 13 and the thermosetting glue, which is finally formed in the sealant 14, is preferably 50-1000 μm.
Specifically, the substrate 11 and the cover plate 12 are stacked and spaced apart from each other, the substrate 11 and the cover plate 12 may be glass plates, the glass plate is preferably borosilicate glass containing alkali metal ions and having a small amount of impurities, and the thickness is preferably 20 to 500 μm. The sealant 14 mainly functions to enable the upper and lower substrates 11 and the cover plate 12 to be tightly adhered, and to confine the quantum dot material 13 within the sealant 14, so as to implement encapsulation of the quantum dot material 13, and the sealant 14 is preferably an ultraviolet-cured sealant 14.
In the technical scheme of this embodiment, the quantum dot material 13 is encapsulated by the substrate 11, the cover plate 12 and the sealant 14, instead of the blocking agent material in the conventional quantum film, so that the purpose of blocking water and oxygen can be achieved, the performance of the quantum dot is ensured, the blocking agent material can be saved, the production cost is reduced, and the application prospect of the quantum dot material 13 in the field of display screens is expanded.
Further, the surfaces of the substrate 11 and the cover plate 12 on the sides facing the quantum dot material 13 are respectively coated with a layer of a spacer material (not shown).
In this embodiment, the blocking agent material is preferably a high temperature resistant modified silicone material, and may also be SiC or Al2O3The water vapor transmission rate of the polymer of the material, preferably the barrier agent material layer is less than or equal to 0.1g.m-2.day-1The thickness of the layer of barrier material is preferably between 1 and 50 nm. Due to the application of the blocking agent material layer, the heat resistance problem of the quantum dots can be further solved while the quantum dots block water and oxygen, so that the feasibility of mass production of the quantum dot LED1000 is improved.
In an embodiment of the present invention, referring to fig. 1, the quantum dot sheet 10 further includes: the surfaces of the heat insulation layer 15, the base plate 11 and the cover plate 12 which are away from each other are respectively stuck with the heat insulation layer 15.
In this embodiment, the heat resistance of the quantum dot material 13 can be solved by providing the heat insulating layer 15 on both the outer sides of the substrate 11 and the cover plate 12.
Further, referring to fig. 1, the thermal insulation layer 15 is composed of an optical resin 152 and a plurality of thermal insulation bubbles 151, and the thermal insulation bubbles 151 are composed of a wrapping layer and a gas layer filled in the wrapping layer; a plurality of heat insulating bubbles 151 are provided at intervals in the optical resin 152.
In this embodiment, the wrapping layer of the thermal insulation bubble 151 is made of a polymer of some high polymer material, such as Methyl Methacrylate (MMA), dioctyl sodium sulfosuccinate, polyvinylpyrrolidone (PVP), etc., the gas layer in the wrapping layer is air, or contains other inactive gas with low thermal conductivity, such as argon, krypton, etc., and the size diameter is preferably 1-50 μm, and the thermal insulation bubble 151 can be made by blowing gas into the high polymer molten material, or by other methods. The optical resin 152 is a polymer organic compound, and specifically may be acryl diglycol carbonate, polymethyl methacrylate, polycarbonate, or the like. The plurality of thermal insulation bubbles 151 are densely arranged in the optical resin 152, and can provide a good thermal insulation effect, thereby more effectively protecting the quantum dot material 13 between the substrate 11 and the cover plate 12. The optical resin 152 and the heat insulation bubbles 151 may pass light of the backlight.
In order to achieve the above object, the present invention further provides a quantum dot sheet mother set 100, please refer to fig. 2, the quantum dot sheet mother set 100 includes a plurality of quantum dot sheets 10, the specific structure of the quantum dot sheets 10 refers to the above embodiments, and since the quantum dot sheet mother set 100 adopts all the technical solutions of all the above embodiments, all the beneficial effects brought by the technical solutions of the above embodiments are at least provided, which is not repeated herein. The quantum dot sheets 10 are arranged in an array, and in two adjacent quantum dot sheets 10, the substrate 11, the cover plate 12 and the sealant 14 are respectively connected in a one-to-one correspondence manner.
Further, the quantum dot sheet master 100 may further include a thermal insulation layer 15, the surfaces of the substrate 11 and the cover plate 12 facing away from each other are respectively attached with the thermal insulation layer 15, and in two adjacent quantum dot sheets 10, the thermal insulation layers 15 are also connected in a one-to-one correspondence manner.
In this embodiment, the quantum dot sheet 10 of the above embodiment can be obtained by performing a cutting process on the quantum dot sheet master 100. The specific manufacturing process of the quantum dot sheet 10 is as follows: cleaning the substrate 11 → coating the frame glue 14 material on the substrate 11, optionally selecting a rectangular frame glue 14 → dripping the quantum dot solution into the frame glue 14 coated, the operation is preferably carried out in a vacuum environment → covering the cover plate 12 → UV curing, mainly curing the frame glue 14, the curing time is related to the UV light intensity and the thickness of the frame glue 14, for example, the frame glue 14 and the quantum dot glue are further cured within 1-10s → the curing is mainly carried out, the curing temperature is selected below 100 ℃, the curing time is preferably between 5-30 minutes, the quantum dot sheet master 100 is prepared according to the comprehensive experiment selection of the frame glue 14 thickness, the quantum dot glue thickness and the glass sheet thickness, and the quantum dot sheet master 100 is cut, preferably laser cutting, and the quantum dot sheet master 100 is cut into a single sheet form of the quantum dot sheet 10. Therefore, by integrally manufacturing the quantum dot sheet master 100 and then cutting the quantum dot sheet master to form a single quantum dot sheet 10, mass production can be realized, and the production efficiency of the quantum dot sheet 10 can be improved.
To achieve the above object, the present invention further provides a quantum dot LED1000, please refer to fig. 3, in which the quantum dot LED1000 includes: the support 20, the first blue chip 31, the second blue chip 32, the third blue chip 33, the first quantum dot sheet 10, and the second quantum dot sheet 10 refer to the above embodiments for specific structures of the first quantum dot sheet 10 and the second quantum dot sheet 10, and since the quantum dot LED1000 adopts all the technical solutions of all the above embodiments, all the beneficial effects brought by the technical solutions of the above embodiments are at least achieved, and are not repeated here. The bracket 20 is provided with a mounting cavity 21, the mounting cavity 21 is provided with a light outlet on the surface of the bracket 20, and the first blue light chip 31, the second blue light chip 32 and the third blue light chip 33 are arranged in the mounting cavity 21 at intervals; the first quantum dot sheet 10 is disposed on a side of the first blue chip 31 facing the light exit, the second quantum dot sheet 10 is disposed on a side of the second blue chip 32 facing the light exit, and the first quantum dot sheet 10 is a red quantum dot sheet 10 and the second quantum dot sheet 10 is a green quantum dot sheet 10.
As is well known in the art, OLEDs are active light emitting, i.e., each pixel sub-unit can be individually controlled, brightness and color control of a single pixel can be achieved, and the brightness contrast and color contrast are very high. Since the backlight of the LCD is normally bright and cannot be completely turned off, one of the directions of the high-end LCD tvs is to use the backlight partition to implement local dimming (local dimming) to make up the difference from the OLED. If the dynamic control function of color is to be realized, RGB emitted by each LED must be controlled by a single circuit, and the conventional method is realized by LEDs packaged by three RGB chips, but because the material difference of the RGB chips, especially the luminescent materials of the red light chip and the blue-green light chip are completely different, great temperature characteristic difference and current characteristic difference are brought, thereby affecting the final display effect. When the red light chip is a flip chip, the application cost is high due to the complex process and low yield of the red light flip chip.
In the present embodiment, the material of the bracket 20 is preferably the EMC bracket 20, and may be PPA, PCT, SMC bracket 20, or the like. The three light emitting chips of the first blue light chip 31, the second blue light chip 32 and the third blue light chip 33 can be GaN blue light chips, and the light emitting wavelength is between 440 and 470 nm. The quantum dot size in the first quantum dot sheet 10 is preferably between 4-9nm, the peak wavelength of the excited red light is between 620-650nm, the quantum dot size in the second quantum dot sheet 10 is preferably between 2-6nm, and the peak wavelength of the excited green light is between 520-550 nm.
The utility model discloses an among the quantum dot LED1000, first blue light chip 31 arouses first quantum dot thin slice 10 to send ruddiness, and second blue light chip 32 arouses second quantum dot thin slice 10 to send the green glow, and third blue light chip 33 directly sends the blue light, through the different intensity combinations of three kinds of different colour frequencies of red, green and blue, can realize the demonstration of different colours. Because these three luminescent chip of first blue light chip 31, second blue light chip 32 and third blue light chip 33 are the blue light chip, consequently can solve the difference that the three-colour chip gives out light under the different current that leads to because the material is different to guarantee good display effect, and, because quantum dot thin slice 10 area is little, the quantity is few, can realize that low-cost quantum dot uses.
In one embodiment, the mounting cavity 21 is filled with a sealing compound, and the sealing compound fixes the first quantum dot sheet 10 and the second quantum dot sheet 10 in the mounting cavity 21.
In this embodiment, the encapsulation adhesive is preferably a silicon adhesive, and may also be an epoxy adhesive. The glue sealing glue mainly realizes the fixation of the first quantum dot sheet 10 and the second quantum dot sheet 10, can cover the first blue light chip 31, the second blue light chip 32 and the third blue light chip 33, and has a protection effect on the first blue light chip 31, the second blue light chip 32 and the third blue light chip 33. When the sealing glue is filled in the mounting cavity 21, the first quantum dot sheet 10 and the second quantum dot sheet 10 are separated into an upper part and a lower part.
In an embodiment of the present invention, please refer to fig. 3, the third blue chip 33 is disposed at the bottom of the mounting cavity 21, the first mounting groove 211 and the second mounting groove 212 are further disposed at the bottom of the mounting cavity 21, the first mounting groove 211 and the second mounting groove 212 are respectively disposed at two sides of the third blue chip 33, the first blue chip 31 and the first quantum dot sheet 10 are disposed in the first mounting groove 211, and the second blue chip 32 and the second quantum dot sheet 10 are disposed in the second mounting groove 212.
In this embodiment, the structure of the mounting cavity 21 inside the bracket 20 is preferably a W structure with a convex middle and two concave sides, that is, the first mounting groove 211 and the second mounting groove 212 are arranged at intervals and symmetrically arranged with respect to the middle of the mounting cavity 21, the first mounting groove 211 and the second mounting groove 212 are the mounting positions of the first blue light chip 31 and the second blue light chip 32, and the part of the mounting cavity 21 between the first mounting groove 211 and the second mounting groove 212 forms the mounting position of the third blue light chip 33, so that the first blue light chip 31 and the second blue light chip 32 are at a lower height than the third blue light chip 33, that is, the three blue light chips are respectively located at different planes and have a convex middle part, so that the bowls for placing the quantum dot sheets 10 on the left and right sides are deepened, and because of the W-type design, the bowls for placing the first quantum dot sheet 10 and the second quantum dot sheet 10 on the left and right sides are respectively provided with separate bowls, the respective colloid encapsulation of the left bowl and the right bowl, namely the respective encapsulation of the first quantum dot sheet 10 and the second quantum dot sheet 10, is more easily realized.
In an embodiment of the present invention, please refer to fig. 3, the quantum dot LED1000 further includes: the light source comprises a first substrate 41, a second substrate 42 and a third substrate 43, wherein the first substrate 41, the second substrate 42 and the third substrate 43 are all arranged in a support 20, and the first substrate 41, the second substrate 42 and the third substrate 43 all extend to the surface of the support 20, which faces away from a light outlet; the first blue chip 31 is connected to the first substrate 41, the second blue chip 32 is connected to the second substrate 42, and the third blue chip 33 is connected to the third substrate 43.
In this embodiment, the first blue light chip 31, the second blue light chip 32, and the third blue light chip 33 are all flip chips, and the first substrate 41, the second substrate 42, and the third substrate 43 are all copper substrates, which mainly play roles of heat dissipation and electric conduction. It is easy to understand that if the blue chip is a normal chip, the placement position of the blue chip needs to be changed, such as to be placed on the upper large pad, and gold wires are needed for electrical connection. In the embodiment, the blue light chip and the copper substrate are connected to form the inverted structure, so that the simplified structure can be mounted, the thermal resistance is low, and the heat dissipation effect is good.
Further, referring to fig. 4 to 5, the first substrate 41, the second substrate 42, and the third substrate 43 each independently include a positive electrode portion and a negative electrode portion; the positive electrode portions of the first substrate 41, the second substrate 42, and the third substrate 43 are integrally connected, and the negative electrode portions of the first substrate 41, the second substrate 42, and the third substrate 43 are provided at intervals; alternatively, the negative electrode portions of the first substrate 41, the second substrate 42, and the third substrate 43 may be integrally connected, and the positive electrode portions of the first substrate 41, the second substrate 42, and the third substrate 43 may be provided at intervals.
In this embodiment, two ends of the first blue chip 31 are respectively connected to the positive electrode portion and the negative electrode portion of the first substrate 41, two ends of the second blue chip 32 are respectively connected to the positive electrode portion and the negative electrode portion of the second substrate 42, two ends of the third blue chip 33 are respectively connected to the positive electrode portion and the negative electrode portion of the third substrate 43, and the first substrate 41, the second substrate 42, and the third substrate 43 are all connected to a control circuit of the display panel, so as to control the first blue chip 31, the second blue chip 32, and the third blue chip 33 to emit light. Since the first blue chip 31, the second blue chip 32 and the third blue chip 33 need to be separately and independently controlled, it is necessary to ensure that one of the positive electrode portion and the negative electrode portion of the first substrate 41, the second substrate 42 and the third substrate 43 is disposed at an interval from the other, and the other is disposed in an integrated structure for the purpose of convenient manufacturing.
The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structure changes made by the contents of the specification and the drawings under the inventive concept of the present invention, or the direct/indirect application in other related technical fields are included in the patent protection scope of the present invention.
Claims (10)
1. A quantum dot sheet, comprising:
a substrate;
a cover plate, the cover plate and the substrate pair box being arranged;
the quantum dot material is arranged between the cover plate and the substrate;
the cover plate and the substrate are bonded through the frame glue, and the frame glue surrounds the quantum dot material.
2. The quantum dot sheet of claim 1, wherein the surfaces of the substrate and the cover plate, each facing the side of the quantum dot material, are coated with a layer of a barrier material.
3. The quantum dot sheet of claim 1, further comprising:
the surfaces of the base plate and the cover plate, which are deviated from each other, are respectively pasted with the heat insulation layers.
4. The quantum dot sheet according to claim 3, wherein the thermal insulation layer is composed of an optical resin and a plurality of thermal insulation bubbles, the thermal insulation bubbles are composed of a cladding layer and a gas layer filled in the cladding layer, and the plurality of thermal insulation bubbles are arranged at intervals in the optical resin.
5. A quantum dot master sheet, comprising:
a plurality of quantum dot sheets of any one of claims 1 to 4;
the quantum dot sheets are arranged in an array mode, and in two adjacent quantum dot sheets, the substrate, the cover plate and the frame glue are connected in a one-to-one corresponding mode respectively.
6. A quantum dot LED, comprising:
the light source comprises a bracket, a light source and a light source, wherein the bracket is provided with a mounting cavity, and the surface of the bracket is provided with a light outlet in the mounting cavity;
the first blue light chip, the second blue light chip and the third blue light chip are arranged in the mounting cavity at intervals;
the first quantum dot sheet is arranged on one side, facing the light outlet, of the first blue light chip, the second quantum dot sheet is arranged on one side, facing the light outlet, of the second blue light chip, the first quantum dot sheet is a red quantum dot sheet, and the second quantum dot sheet is a green quantum dot sheet;
wherein the first quantum dot sheet and the second quantum dot sheet are each independently the quantum dot sheet of any one of claims 1 to 4.
7. The quantum dot LED of claim 6, wherein the mounting cavity is filled with an encapsulant that secures the first quantum dot sheet and the second quantum dot sheet within the mounting cavity.
8. The quantum dot LED of claim 6, wherein the third blue chip is disposed on the bottom of the mounting cavity, the bottom of the mounting cavity further defines a first mounting groove and a second mounting groove, the first mounting groove and the second mounting groove are respectively disposed on two sides of the third blue chip, the first blue chip and the first quantum dot sheet are both disposed in the first mounting groove, and the second blue chip and the second quantum dot sheet are both disposed in the second mounting groove.
9. The quantum-dot LED of any one of claims 6 to 8, further comprising:
the first substrate, the second substrate and the third substrate are all arranged in the support, and extend to the surface of the support, which is far away from the light outlet;
the first blue light chip is connected with the first substrate, the second blue light chip is connected with the second substrate, and the third blue light chip is connected with the third substrate.
10. The quantum dot LED of claim 9, wherein the first substrate, the second substrate, and the third substrate each independently comprise a positive electrode portion and a negative electrode portion;
positive electrode parts of the first substrate, the second substrate and the third substrate are connected into a whole, and negative electrode parts of the first substrate, the second substrate and the third substrate are arranged at intervals;
alternatively, the respective negative electrode portions of the first substrate, the second substrate, and the third substrate may be integrally connected, and the respective positive electrode portions of the first substrate, the second substrate, and the third substrate may be disposed at intervals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120686377.2U CN214672671U (en) | 2021-04-02 | 2021-04-02 | Quantum dot sheet, quantum dot sheet master plate and quantum dot LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120686377.2U CN214672671U (en) | 2021-04-02 | 2021-04-02 | Quantum dot sheet, quantum dot sheet master plate and quantum dot LED |
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| Publication Number | Publication Date |
|---|---|
| CN214672671U true CN214672671U (en) | 2021-11-09 |
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|---|---|---|---|
| CN202120686377.2U Active CN214672671U (en) | 2021-04-02 | 2021-04-02 | Quantum dot sheet, quantum dot sheet master plate and quantum dot LED |
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| Country | Link |
|---|---|
| CN (1) | CN214672671U (en) |
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2021
- 2021-04-02 CN CN202120686377.2U patent/CN214672671U/en active Active
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