CN214672565U - Clamp suitable for wafer cover plate pasting - Google Patents

Abstract

The utility model provides a be applicable to wafer subsides apron anchor clamps, the on-line screen storage device comprises a base, the setting is used for laminating the first base of wafer work piece on the base, can dismantle the second base that sets up and be used for laminating glass apron above first base and set up the biasing means who is used for exerting pressure for the second base on the base, first base and second base are located the work piece one side and all are equipped with locating part, this application has adopted the mode of laminating once of chip substrate and apron, has reduced because of pasting the processing risk of apron again after cutting into Bar strip. The vacuum chuck of the clamp firmly fixes the workpiece, so that damage to the chip or uneven thickness of the adhesive layer caused by displacement of the cover plate in operation is avoided, the wafer and the cover plate are ensured to be relatively parallel, and the uniform thickness of the adhesive layer is ensured. Four fixing pins are arranged at the corners for matching, so that the wafer and the cover plate binding surface are always kept parallel when the workpiece is taken and placed, and the workpiece is protected. The screw rod spinning passes through the briquetting transmission overdraft, makes anchor clamps atress more even, finally realizes effectively controlling the work piece glue film.

Description

Clamp suitable for wafer cover plate pasting

Technical Field

The utility model relates to a light leads to the chip and makes the field, especially relates to a be applicable to wafer subsides apron anchor clamps.

Background

In the existing chip cover plate pasting process, a wafer and a cover plate need to be cut into Bar-shaped workpieces with the same size, and then the Bar-shaped workpieces are pasted respectively.

SUMMERY OF THE UTILITY MODEL

In order to solve the problems, the technical scheme provides the clamp suitable for the wafer cover plate, the glue thickness between each chip of the whole wafer and the cover plate is controlled, the existing cover plate attaching process is improved, the whole wafer is attached to the cover plate once from the chip Bar strip and the cover plate, the glue layer thickness is effectively controlled, the production efficiency is improved, and the workpiece is formed once.

In order to achieve the purpose, the technical scheme is as follows:

the utility model provides a be applicable to wafer subsides apron anchor clamps, is in including base, setting be used for laminating the first base of wafer work piece, can dismantle the setting and be in first base top is used for laminating the second base of glass apron and sets up be used for on the base for the pressure device that the second base applyed pressure, first base all is equipped with positioning element with the second base position work piece one side.

In some embodiments, the pressing device includes a pressing block provided on the second base.

In some embodiments, the pressing block is further provided with a through hole, the pressing device further comprises a fixing arm, a screw rod with one end capable of being close to or far away from the pressing block is arranged on the fixing arm, and an insertion part inserted into the through hole and used for positioning the pressing block is arranged at the end of the screw rod.

In some embodiments, the end of the insertion portion is in the shape of a guide arc.

In some embodiments, a spring and a guide core are further disposed between the screw and the insertion portion, and two ends of the spring are further respectively provided with a locker.

In some embodiments, the first base and the second base are provided with a raised step on one side of the workpiece, and the positioning part is arranged on the raised step.

In some embodiments, the positioning member is a suction cup or a gripper jaw.

In some embodiments, the first base and the second base are respectively provided with corresponding insertion holes and locking pins.

In some embodiments, the side wall of the second base is provided with a positioning block which can extend into the first base, and the positioning block is provided with a positioning pin which can penetrate through the first base and the second base.

In some embodiments, a handle is provided above the second base for easy removal.

The beneficial effect of this application does:

1. the method is suitable for the cover plate pasting process of the whole wafer of the 8-inch smooth chip at one time;

2. the flatness of the surface contacted with the workpiece is high, so that the thickness of a glue layer between the wafer and the cover plate is ensured to be stable;

3. processing a workpiece by adopting a spinning spring and pressing block structure;

4. the base and the upper cover are matched by using a linear bearing, so that the precision is high, and the workpiece is prevented from being damaged by misoperation during feeding;

5. the tooling clamp is suitable for the cover plate pasting process of the whole wafer of the 8-inch light-transmitting chip at one time;

6. the clamp has high precision, and the flatness of the contact surface of the clamp and a workpiece reaches 0.01 mm;

7. the positioning block and the vacuum chuck are used for fixing the workpiece, so that the position of the workpiece is ensured during feeding, and the product precision is improved;

8. the clamp base and the upper cover are connected with the linear bearing by positioning pins, and locking pins are arranged at four corners, so that the surfaces in contact with the workpiece are high in parallelism, and the thickness of a processed product glue layer is stable;

9. the clamp pressing mechanism adopts a spinning spring and pressing block structure, so that the stress of the upper cover is more uniform, and the glue layer of a processed product is uniform in thickness.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below.

Fig. 1 is an exploded view of an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a second base according to an embodiment of the present invention.

Detailed Description

In order to make the technical problem, technical solution and advantageous effects solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to further explain the present invention in detail. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Referring to fig. 1-2, a clamp for attaching a cover plate to a wafer includes a base 1, a first base 2 disposed on the base 1 for attaching a wafer workpiece, a second base 3 detachably disposed above the first base 2 for attaching a glass cover plate, and a pressing device 4 disposed on the base 1 for applying pressure to the second base 3, wherein positioning members are disposed on both sides of the first base 2 and the second base 3 on the workpiece.

During implementation, firstly, a wafer workpiece is fixed on a sucker on a first base, glue solution is coated on the workpiece, a glass cover plate is fixed on the sucker below a second base, then the second base is placed above the first base, the wafer workpiece and the glass cover plate are attached, finally, pressure is applied to a second base plate through a pressure applying device, the wafer workpiece and the glass cover plate are attached better, and the formed workpiece is taken out after ultraviolet irradiation and curing.

In a preferred embodiment, the pressing device 4 includes a pressing block 5 disposed on the second base 3, and the second base is more uniformly stressed by the pressure of the pressing block.

As a preferred embodiment, the pressing block 5 is further provided with a through hole 6, the pressing device 4 further comprises a fixed arm 7, the fixed arm 7 is provided with a screw 8, one end of the screw 8 can be close to or far away from the pressing block 5, the end of the screw 8 is provided with an insertion portion 9 inserted into the through hole 6 for positioning the pressing block 5, the other end of the screw can be provided with a knob, after the knob is rotated, the screw can move up and down at the connection position of the screw and the fixed arm, and the screw can drive the insertion portion to move into the through hole of the pressing block when moving down until the insertion portion is inserted into the through hole to position the pressing block, so that the position of the pressing block is not changed.

In a preferred embodiment, the end of the insertion portion 9 is in the shape of a guiding arc, and the guiding arc cooperates with the inner wall of the through hole to effectively make the insertion portion enter the through hole more easily.

As a preferred embodiment, a spring 10 and a guide core 12 are further arranged between the screw 8 and the insertion portion 9, two ends of the spring 10 are respectively provided with a locker 11, the knob continues to rotate after the insertion portion completely enters the through hole, the spring is compressed, and the restoring force of the spring applies a pressure to the pressing block, so that the force applied by the pressing block to the second base is increased, and the force application size can be adjusted according to the structure to meet different molding requirements.

In a preferred embodiment, the first base 2 and the second base 3 are provided with a raised step 13 on one side of the workpiece, and the positioning member is provided on the raised step 13, and the diameter of the raised step is 8 inches, so that a user can determine whether the workpiece is aligned on the raised step, and misalignment during fitting can be prevented.

In the preferred embodiment, the positioning member is a suction cup 14, which holds the workpiece firmly.

As a preferred embodiment, the first base 2 and the second base 3 are respectively provided with corresponding insertion holes 15 and locking pins 16, the insertion holes are respectively arranged at four corners of the first base, the locking pins are respectively arranged at four corners of the second base, and when the second base is installed, the two bases can be positioned and combined through the matching of the locking pins, so that the workpiece is prevented from shifting.

Preferably, a linear bearing is arranged in the jack.

As a preferred embodiment, the side wall of the second base 3 is provided with a positioning block 17 capable of extending into the first base 2, the positioning block 17 is provided with a positioning pin 18 capable of penetrating through the first base 2 and the second base 3, the positioning block extends into the first base, the positioning pin penetrates through the first base and then penetrates through the positioning block, the gap between the first base and the second base is controlled, and the forming thickness of the workpiece is ensured.

In a preferred embodiment, a handle 19 is provided above the second base 3 for easy removal.

Through the operation, this application has adopted the mode of chip substrate and apron once laminating, has reduced because of pasting the processing risk of apron again behind the cutting Bar. The vacuum chuck through the clamp firmly fixes the workpiece, and damage to the chip or uneven glue layer thickness caused by cover plate displacement in operation are avoided. Through the face that each and chip contact that the plane degree is 0.01mm, ensure that wafer and apron are parallel relatively, ensure that glue film thickness is even. Four fixing pins are arranged at the corners for matching, so that the wafer and the cover plate binding surface are always kept parallel when the workpiece is taken and placed, and the workpiece is protected. The screw rod spinning passes through the briquetting transmission overdraft, makes anchor clamps atress more even, finally realizes effectively controlling the work piece glue film.

The above description is only for the purpose of illustrating the preferred embodiments of the present application and is not intended to limit the scope of the present application, which is within the scope of the present application, except that the same or similar principles and basic structures as the present application may be used.

Claims (10)

1. The utility model provides a be applicable to wafer subsides apron anchor clamps, characterized in that includes base (1), sets up first base (2) that are used for laminating the wafer work piece on base (1), can dismantle the setting and be in second base (3) that first base (2) top is used for laminating the glass apron and set up be used for on base (1) for giving pressure applying device (4) of second base (3), first base (2) and second base (3) are located the work piece one side and all are equipped with positioning element.

2. The wafer cover plate clamp suitable for the wafer as claimed in claim 1, wherein: the pressing device (4) comprises a pressing block (5) arranged on the second base (3).

3. The wafer cover plate clamp as claimed in claim 2, wherein: the pressing block (5) is further provided with a through hole (6), the pressing device (4) further comprises a fixed arm (7), one end of the fixed arm (7) is provided with a screw rod (8) which can be close to or far away from the pressing block (5), and the end of the screw rod (8) is provided with an insertion part (9) which is inserted into the through hole (6) and used for positioning the pressing block (5).

4. The wafer cover plate clamp suitable for the wafer as claimed in claim 3, wherein: the end of the insertion part (9) is in a guide arc shape.

5. The wafer cover plate clamp suitable for the wafer as claimed in claim 3, wherein: a spring (10) and a guide core (12) are further arranged between the screw rod (8) and the insertion part (9), and locking devices (11) are further respectively arranged at two ends of the spring (10).

6. The wafer cover plate clamp suitable for the wafer as claimed in claim 1, wherein: the first base (2) and the second base (3) are located on one side of a workpiece and are provided with protruding steps (13), and the positioning component is arranged on the protruding steps (13).

7. The wafer cover plate clamp as claimed in claim 1 or 6, wherein: the positioning component is a suction cup (14) or a clamping claw.

8. The wafer cover plate clamp suitable for the wafer as claimed in claim 1, wherein: the first base (2) and the second base (3) are respectively provided with corresponding jacks (15) and locking pins (16).

9. The wafer cover plate clamp as claimed in claim 1 or 8, wherein: the side wall of the second base (3) is provided with a positioning block (17) which can extend into the first base (2), and the positioning block (17) is provided with a positioning pin (18) which can penetrate through the first base (2) and the second base (3).

10. The wafer cover plate clamp suitable for the wafer as claimed in claim 1, wherein: a handle (19) which is used for being conveniently taken out is arranged above the second base (3).

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