CN214666240U - A printed circuit board heat exchanger and core body for heat exchange of changeable fluid - Google Patents
A printed circuit board heat exchanger and core body for heat exchange of changeable fluid Download PDFInfo
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- CN214666240U CN214666240U CN202120662790.5U CN202120662790U CN214666240U CN 214666240 U CN214666240 U CN 214666240U CN 202120662790 U CN202120662790 U CN 202120662790U CN 214666240 U CN214666240 U CN 214666240U
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- 238000003466 welding Methods 0.000 claims description 5
- UJCHIZDEQZMODR-BYPYZUCNSA-N (2r)-2-acetamido-3-sulfanylpropanamide Chemical class CC(=O)N[C@@H](CS)C(N)=O UJCHIZDEQZMODR-BYPYZUCNSA-N 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 230000000737 periodic effect Effects 0.000 claims description 4
- 238000003486 chemical etching Methods 0.000 claims description 3
- 238000003475 lamination Methods 0.000 claims 2
- 238000005530 etching Methods 0.000 claims 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
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Abstract
本实用新型提供一种用于变物性流体换热的印刷电路板换热器及芯体，结构简单，设计合理，避免了因密度减小，流速增大而出现的局部回流或倒流的现象。所述芯体，包括层叠设置的高温流体板片和低温流体板片；所述的高温流体板片包括高温流道本体，以及沿高温流体流动方向逐列设置在高温流道本体内的若干高温流线型肋片；所述高温流线型肋片等厚度设置；所述的低温流体板片包括低温流道本体，以及沿低温流体流动方向逐列设置在低温流道本体内的若干低温流线型肋片；所述低温流线型肋片沿流动方向厚度逐渐减小。
The utility model provides a printed circuit board heat exchanger and a core body for heat exchange of fluid with variable physical properties, which has simple structure and reasonable design, and avoids the phenomenon of partial backflow or reverse flow due to the decrease of density and the increase of flow velocity. The core body includes high-temperature fluid plates and low-temperature fluid plates that are stacked in layers; the high-temperature fluid plates include a high-temperature flow channel body, and a plurality of high-temperature fluid plates arranged in the high-temperature flow channel body one by one along the flow direction of the high-temperature fluid. streamlined fins; the high-temperature streamlined fins are provided with equal thickness; the low-temperature fluid plate includes a low-temperature flow channel body, and a plurality of low-temperature streamlined fins arranged in the low-temperature flow channel body one by one along the flow direction of the low-temperature fluid; The low temperature streamlined fins gradually decrease in thickness along the flow direction.
Description
Technical Field
The utility model relates to a heat transfer device technical field, concretely relates to a printed circuit board heat exchanger and core for becoming rerum natura fluid heat transfer.
Background
The printed circuit board heat exchanger (PCHE) is a plate heat exchanger with compact structure, high temperature and high pressure resistance and high structural strength, is particularly suitable for Brayton power cycle using supercritical fluid as working medium, and has a main structure comprising an inlet pipe and an outlet pipe of heat exchange fluid, a seal head and a core body, wherein the core body is formed by diffusion welding of heat exchange plates comprising a plurality of micro heat exchange channels with equal cross sections.
When the heat exchange fluid in the PCHE core is a metamorphic fluid, such as a supercritical fluid, the flowing heat exchange process of the high and low temperature fluids is a double-side supercritical metamorphic coupling flowing heat transfer process, the density, specific heat capacity, viscosity and other physical properties of the high and low temperature fluids are continuously changed, and the flow rate is also continuously changed. In the existing uniform-section heat exchange channel, for a fluid heated at low temperature, the density is gradually reduced due to continuous heat absorption and temperature rise, particularly near a pseudo-critical point, the density is rapidly reduced, so that the flow speed is rapidly increased, the local flow resistance is increased, local backflow and even backflow can be caused, the flow resistance is further increased, the low-temperature fluid cannot be effectively heated, and the heat exchange efficiency is greatly reduced.
SUMMERY OF THE UTILITY MODEL
To the problem that exists among the prior art, the utility model provides a printed circuit board heat exchanger and core for becoming rerum natura fluid heat transfer, simple structure, reasonable in design has avoided because of density reduces, the phenomenon of the local backward flow or the refluence that the velocity of flow increase goes out.
The utility model discloses a realize through following technical scheme:
a printed circuit board heat exchanger core for heat exchange of metamorphic fluid comprises a high-temperature fluid plate and a low-temperature fluid plate which are arranged in a stacked mode;
the high-temperature fluid plate comprises a high-temperature flow channel body and a plurality of high-temperature streamline fins arranged in the high-temperature flow channel body row by row along the flowing direction of the high-temperature fluid; the high-temperature streamline fins are arranged in equal thickness;
the low-temperature fluid sheet comprises a low-temperature flow channel body and a plurality of low-temperature streamline fins arranged in the low-temperature flow channel body row by row along the flowing direction of the low-temperature fluid; the low temperature streamline fins are gradually reduced in thickness along the flow direction.
Preferably, the high temperature fluid sheets and the low temperature fluid sheets arranged in a stack form a periodically stacked unit; the periodical laminated unit comprises a layer of high-temperature fluid plate and a layer of low-temperature fluid plate which are connected in sequence through diffusion welding, or two layers of high-temperature fluid plates and a middle layer of low-temperature fluid plate.
Preferably, the high-temperature streamline fins are distributed in the same row or staggered along the flowing direction of the high-temperature fluid to form uniform-section channels.
Preferably, the cryogenic streamline fins are distributed along the flowing direction of the cryogenic fluid in a staggered way to form gradually-widening non-uniform section channels.
Preferably, the high-temperature streamline fins and the low-temperature streamline fins adopt NACA series symmetrical or asymmetrical airfoil shapes.
Further, the maximum thickness of the low-temperature streamline fins is reduced row by row in sequence.
Preferably, a plurality of high-temperature streamline ribs and low-temperature streamline ribs which are not arranged at the same thickness are correspondingly etched on the high-temperature fluid plate and the low-temperature fluid plate in the flowing direction by a photoetching or chemical etching method.
A printed circuit board heat exchanger for heat exchange of variable-property fluid is provided with the core body.
Compared with the prior art, the utility model discloses following profitable technological effect has:
the utility model discloses a printed circuit board heat exchanger core body for heat exchange of variable physical property fluid, which adopts streamline fins to strengthen the heat exchange of high temperature fluid and simultaneously reduce the increase of flow resistance as much as possible; the thickness of the fins is gradually reduced along the flowing direction to form gradually-widened non-uniform-section channels, so that the low-temperature fluid can keep flowing at a nearly constant speed when the low-temperature fluid absorbs heat and the temperature rise density is reduced along the flowing direction, and the phenomenon of local backflow or backflow caused by the fact that the density of the low-temperature fluid is reduced, the flowing speed is increased, and the local flowing resistance is increased is avoided.
Drawings
Figure 1 is a schematic cross-sectional view of a cryogenic fluid sheet fin arrangement as described in an example of the present invention.
Fig. 2 is a schematic cross-sectional view of a high temperature fluid sheet rib arrangement according to an embodiment of the present invention.
Figure 3 is a schematic representation of a cryogenic fluid slab as described in an example of the invention.
Fig. 4 is a schematic view of a high temperature fluid sheet according to an embodiment of the present invention.
In the figure: the high-temperature fluid plate comprises a high-temperature fluid plate 1, a high-temperature flow channel body 101 and high-temperature streamline ribs 102; the cryogenic fluid plate 2, the cryogenic fluid channel body 201 and the cryogenic streamline rib 202.
Detailed Description
The present invention will now be described in further detail with reference to specific examples, which are intended to be illustrative, but not limiting, of the invention.
The utility model relates to a printed circuit board heat exchanger core body for heat exchange of metamorphic fluid, which comprises a high-temperature fluid sheet 1 and a low-temperature fluid sheet 2 which are arranged in a stacking way;
as shown in fig. 3, the cryogenic fluid slab 2 includes a cryogenic fluid channel body 201, and a plurality of cryogenic streamline ribs 202 arranged in the cryogenic fluid channel body 201 in a line by line along the flow direction of the cryogenic fluid; the cryostreamlined rib 202 tapers in thickness in the direction of flow. The thickness of the film is reduced in the preferred embodiment column by column, and the thickness of the film can be reduced again in every two columns, so that the film tends to be gradually reduced.
As shown in fig. 4, the high-temperature fluid plate 1 includes a high-temperature flow channel body 101, and a plurality of high-temperature streamline fins 102 arranged in the high-temperature flow channel body 101 in a row by row along a flow direction of the high-temperature fluid; the high-temperature streamline ribs 102 are arranged in equal thickness;
the thickness limited by the thickness is the size of the high-temperature streamline rib 102 and the low-temperature streamline rib 202 in the width direction of the high-temperature runner body 101 and the low-temperature runner body 201, and the upper side and the lower side of the two types of ribs are respectively connected with the bottom of the inner side of the runner body where the two types of ribs are located and the bottom of the outer side of the runner body adjacent to the two types of ribs.
It is essential that, as shown in fig. 1 and 2, the core comprises a plurality of high temperature fluid plates 1 formed by streamline ribs with equal thickness along the flow direction and a plurality of low temperature fluid plates 2 formed by streamline ribs with gradually decreasing thickness along the flow direction.
Wherein the high temperature fluid sheets 1 and the low temperature fluid sheets 2 which are arranged in a stacked manner form a periodic stacked unit; the heat exchange core body of the printed circuit board heat exchanger is formed by laminating a plurality of periodically laminated units; the periodical laminated unit comprises a layer of high-temperature fluid plate 1 and a layer of low-temperature fluid plate 2 which are connected in sequence through diffusion welding, or two layers of high-temperature fluid plates 1 and an intermediate layer of low-temperature fluid plate 2.
Specifically, a high-temperature fluid plate 1 and a low-temperature fluid plate 2 are connected in sequence through diffusion welding or a layer of low-temperature fluid plate 2 is sandwiched between two layers of high-temperature fluid plates 1 to form a high-temperature-low-temperature and high-temperature-low-temperature periodic distribution mode.
The high temperature streamline fin 102 and the low temperature streamline fin 202 are etched by light or chemical etching on the metal plate to form streamline fins with equal thickness and unequal thickness along the flow direction, as shown in fig. 4 and 3.
The streamline fins can adopt but are not limited to NACA series symmetrical or asymmetrical airfoil.
Specifically, as shown in fig. 1, NACA series of low-speed symmetrical airfoil profiles NACA0025, NACA0020, NACA0015, NACA0010 and NACA0005 airfoil profiles are selected as low-temperature streamline fins 202 of each row, the maximum thickness of the airfoil profiles is gradually reduced in sequence, the airfoil profiles are distributed along the flowing direction of the low-temperature fluid in a staggered manner, a gradually-widened non-uniform-section channel is formed, and the low-temperature streamline fins are suitable for heat exchange media with gradually-reduced density along the flowing direction.
Specifically, as shown in fig. 2, in the high-temperature fluid plate 1, a streamlined rib NACA0010 is selected, and the thickness of the rib is kept constant, so that the rib NACA0010 is distributed along the flow direction of the high-temperature fluid in a staggered manner to form a uniform-section channel.
The utility model discloses a theory of operation:
the utility model provides a pair of PCHE heat exchange core body for becoming rerum natura fluid heat transfer, include the high temperature fluid slab 1 that comprises a plurality of uniform thickness streamline fins along flow direction and the low temperature fluid slab 2 that the streamline fin constitutes is reduced gradually along flow direction thickness. The plate adopts streamline fins to strengthen heat exchange and simultaneously reduce the increase of flow resistance as much as possible; the thickness of the fins is gradually reduced along the flowing direction to form a gradually-widened channel with a non-uniform section, so that the low-temperature fluid can keep flowing at a nearly constant speed when the low-temperature fluid absorbs heat and the temperature is increased along the flowing direction, and the phenomenon of local backflow or backflow caused by the fact that the density is reduced and the flow speed is increased is avoided.
The above description is only a preferred example of the present invention, and the present invention is not limited thereto, and any modification, equivalent replacement, improvement, etc. within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120662790.5U CN214666240U (en) | 2021-03-31 | 2021-03-31 | A printed circuit board heat exchanger and core body for heat exchange of changeable fluid |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120662790.5U CN214666240U (en) | 2021-03-31 | 2021-03-31 | A printed circuit board heat exchanger and core body for heat exchange of changeable fluid |
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| CN214666240U true CN214666240U (en) | 2021-11-09 |
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| CN202120662790.5U Active CN214666240U (en) | 2021-03-31 | 2021-03-31 | A printed circuit board heat exchanger and core body for heat exchange of changeable fluid |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112880444A (en) * | 2021-03-31 | 2021-06-01 | 西安热工研究院有限公司 | Printed circuit board heat exchanger and core for heat exchange of variable-property fluid |
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2021
- 2021-03-31 CN CN202120662790.5U patent/CN214666240U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112880444A (en) * | 2021-03-31 | 2021-06-01 | 西安热工研究院有限公司 | Printed circuit board heat exchanger and core for heat exchange of variable-property fluid |
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