CN111721151A - Core body of printed circuit board type heat exchanger with sinusoidal channel structure - Google Patents
Core body of printed circuit board type heat exchanger with sinusoidal channel structure Download PDFInfo
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- CN111721151A CN111721151A CN202010735569.8A CN202010735569A CN111721151A CN 111721151 A CN111721151 A CN 111721151A CN 202010735569 A CN202010735569 A CN 202010735569A CN 111721151 A CN111721151 A CN 111721151A
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- temperature medium
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- channel
- core body
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
- F28D9/0031—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by paired plates touching each other
- F28D9/0037—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by paired plates touching each other the conduits for the other heat-exchange medium also being formed by paired plates touching each other
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
- F28F3/042—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of local deformations of the element
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
The invention discloses a core body of a printed circuit board type heat exchanger with a sinusoidal channel structure, which is formed by welding a plurality of high-temperature medium heat exchange plates and a plurality of low-temperature medium heat exchange plates in a stacking manner. A plurality of high-temperature medium flow channels are arranged on the high-temperature medium heat exchange plate along the width direction, a plurality of low-temperature medium flow channels are arranged on the low-temperature medium heat exchange plate along the width direction, and the channels on the same plate are parallel to each other and have equal intervals. The high-temperature medium channel and the low-temperature medium channel are in sine-shaped structures along the shape line of the medium flowing direction, and the amplitude and the angular speed of the sine-shaped structures can be selected to be different values according to requirements. The core body structure provided by the invention has the advantages of obvious enhanced heat transfer effect, low flow resistance loss, wide application range, various fluid contact forms and flexible distribution of the flow cross-sectional area of cold and hot media.
Description
Technical Field
The invention relates to the technical field of heat exchange devices, in particular to a core body of a printed circuit board type heat exchanger with a sinusoidal channel structure.
Background
A printed circuit board heat exchanger (PCHE) is a new concept micro-channel heat exchanger, belonging to the field of efficient compact plate heat exchangers. PCHE is generally composed of three parts, a microchannel core, a header, and a nozzle, where the core is the core component of the PCHE. The PCHE core is formed by overlapping and combining metal plates: firstly, fluid channels with the size of 0.1 mm are engraved on the surface of a plate by adopting a (photo) chemical etching method, and then flat plates are tightly stacked for diffusion welding. PCHE is so named because the process of etching the fluid channels during fabrication is similar to the process of fabricating printed circuit boards.
The PCHE has the advantages of compact structure, high temperature and high pressure resistance, small temperature difference heat transfer, high heat efficiency, safety, reliability and the like, and is widely applied in the fields of refrigeration air conditioners, petroleum and natural gas, nuclear industry, chemical industry, power industry, ship power equipment and the like. The PCHE core structure developed in the prior art and put into practical application has two types: straight channel and Z-channel configurations. The straight channel is a linear structure along the flow direction, and the straight channel PCHE has the advantages of simple structure and small resistance loss, but has the disadvantages of low heat transfer coefficient and poor heat transfer capability. The Z-shaped channel is of a broken line structure along the flow direction, and the Z-shaped channel PCHE has the advantages of high heat transfer coefficient and strong heat transfer capacity, but has the defect of large resistance loss.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention provides the printed circuit board type heat exchanger core with the sine-shaped channel structure, which can ensure the high heat transfer capacity of the PCHE and control the resistance loss in a reasonable and moderate range.
In order to achieve the purpose, the invention adopts the technical scheme that:
the utility model provides a sinusoidal channel structure printed circuit board heat exchanger core, includes a plurality of high temperature medium heat transfer board and a plurality of low temperature medium heat transfer board, and high temperature medium heat transfer board and low temperature medium heat transfer board interval stitch welding in proper order form, be provided with a plurality of high temperature medium flow channel 1 along width direction on the high temperature medium heat transfer board, be provided with a plurality of low temperature medium flow channel 2 along width direction on the low temperature medium heat transfer board, the passageway on the same slab is parallel to each other and the interval equals.
The high-temperature medium flow channel 1 and the low-temperature medium flow channel 2 are in sine structures along the shape lines of the medium flow direction, the amplitude and the angular speed of the sine structures can adopt different values according to requirements, the heat exchange area of the core body is increased and the flow resistance of the medium in the core body is increased when the amplitude is increased, and the heat transfer coefficient of the core body is increased and the flow resistance of the medium in the core body is increased when the angular speed is increased.
The high-temperature medium flow channel 1 and the low-temperature medium flow channel 2 are arranged in a sequential or staggered manner.
The high temperature medium flow channel 1 and the low temperature medium flow channel 2 are arranged in parallel or perpendicular.
One or more low-temperature medium channels 2 can be arranged between two adjacent high-temperature medium channels 1; one or more high-temperature medium channels 1 may be arranged between two adjacent low-temperature medium channels 2.
The cross sections of the high-temperature medium flow channel 1 and the low-temperature medium flow channel 2 are any one of triangular, trapezoidal, rectangular, semicircular, circular, semi-elliptical and elliptical.
The invention has the beneficial effects that:
(1) the sinusoidal channel periodically changes the medium flow direction, the impact and disturbance action on the boundary layer is obvious, the heat transfer strengthening effect is obvious, and the heat transfer performance is greatly improved (30-300%) compared with that of a straight channel; the smooth corner configuration of the sinusoidal channels inhibits the development of flow separation zones, reducing turbulence intensity with significantly lower drag losses (up to 60%) than the zigzag channels.
(2) The application range is wide: the high-temperature medium channel and the low-temperature medium channel can be smoothly or staggeredly arranged, the cross section of the channel can be any one of a triangle, a trapezoid, a rectangle, a semicircle, a circle, a semiellipse and an ellipse, and the heat transfer resistance, the structural strength and the processing cost corresponding to different arrangement forms and cross section shapes are different, so that the heat transfer resistance, the structural strength and the processing cost are suitable for different application occasions.
(3) The fluid contact forms are various: by arranging the high-temperature medium channel and the low-temperature medium channel in parallel or vertically, the fluid can be contacted in a downstream, countercurrent, cross-flow or combined form, and the requirements of different heat exchange processes are met.
(4) The distribution of the flow cross sections of the high-temperature medium and the low-temperature medium is flexible: the flow section area ratio of the high-temperature medium and the low-temperature medium is adjusted by adjusting the number of the low-temperature medium channels between two adjacent high-temperature medium channels (or adjusting the number of the high-temperature medium channels between two adjacent low-temperature medium channels) so as to adapt to different flow ratios of the high-temperature medium and the low-temperature medium and ensure that the heat transfer performances of the media in the high-temperature channel and the low-temperature channel are reasonably matched.
Drawings
FIG. 1 is a schematic cross-sectional view of a channel of the present invention.
FIG. 2 is a schematic view of a channel line of the present invention.
Fig. 3 is a schematic view of the core structure of the present invention.
FIG. 4 is a schematic cross-sectional view of a media channel according to the present invention.
FIG. 5 is a schematic diagram of the arrangement of high and low temperature medium channels in line.
FIG. 6 is a schematic diagram of the staggered arrangement of the high-temperature medium channel and the low-temperature medium channel in the invention.
FIG. 7 is a schematic diagram of the parallel arrangement of the high-temperature medium channel and the low-temperature medium channel in the invention.
FIG. 8 is a schematic view showing the vertical arrangement of the high-temperature medium channel and the low-temperature medium channel in the present invention.
FIG. 9 is a schematic view showing the sectional area ratio of 1:1 of the high-temperature medium channel and the low-temperature medium channel in the invention.
Fig. 10 shows the high and low temperature medium passages 1 of the present invention: 2 sectional area proportion.
Fig. 11 shows the high and low temperature medium channels 1: 3 sectional area proportion.
Fig. 12 shows the high and low temperature medium passages 1: 4 sectional area proportion.
In the figure, 1 is a high temperature medium channel, and 2 is a low temperature medium channel.
Detailed Description
The present invention will be described in further detail with reference to examples.
As shown in fig. 1, fig. 2 and fig. 3, the core body of the printed circuit board type heat exchanger with the sine-shaped channel structure is formed by welding a plurality of high-temperature medium heat exchange plates and a plurality of low-temperature medium heat exchange plates in a stacking manner. A plurality of high-temperature medium flow channels 1 are arranged on the high-temperature medium heat exchange plate in the width direction, a plurality of low-temperature medium flow channels 2 are arranged on the low-temperature medium heat exchange plate in the width direction, and the channels on the same plate are parallel to each other and have equal intervals. The shape lines of the high-temperature medium channel 1 and the low-temperature medium channel 2 along the medium flowing direction are in a sine structure, the amplitude and the angular speed of the sine structure can adopt different values according to requirements, the heat exchange area of the core body is increased and the flowing resistance of the medium in the core body is increased when the amplitude is increased, and the heat transfer coefficient of the core body and the flowing resistance of the medium in the core body are increased when the angular speed is increased.
As shown in fig. 5 and 6: the high-temperature medium channel 1 and the low-temperature medium channel 2 are arranged in a row or in a staggered manner, and the heat conduction distances of the two arrangement forms are different, so that the heat conduction coefficients are different in size, and the heat conduction performance is different.
As shown in fig. 7 and 8: the high-temperature medium channel 1 and the low-temperature medium channel 2 can be arranged in parallel or vertically, high-temperature and low-temperature media perform countercurrent or cocurrent heat exchange when the high-temperature medium channel and the low-temperature medium channel are arranged in parallel, and high-temperature and low-temperature media perform cross flow heat exchange when the high-temperature and low-temperature media are arranged vertically.
As shown in fig. 9, fig. 10, fig. 11, fig. 12: one or more low-temperature medium channels 2 can be arranged between two adjacent high-temperature medium channels 1, and the arrangement mode is suitable for the condition that the flow rate of a low-temperature medium is larger than that of a high-temperature medium and the flow rates of the two media in the core body are required to be similar; one or more high-temperature medium channels 1 can be arranged between two adjacent low-temperature medium channels 2, and the arrangement mode is suitable for the condition that the flow of the high-temperature medium is larger than that of the low-temperature medium and the flow velocity of the two media in the core body is similar.
As shown in fig. 4: the cross sections of the high-temperature medium channel 1 and the low-temperature medium channel 2 are any one of triangular, trapezoidal, rectangular, semicircular, circular, semi-elliptical and elliptical, the cross sections of the high-temperature medium channel and the low-temperature medium channel have different processing costs, heat transfer resistances and structural strengths, and the cross sections can be flexibly selected according to the requirements of different heat exchange processes.
The core body structure provided by the invention has the advantages of obvious enhanced heat transfer effect, low flow resistance loss, wide application range, various fluid contact forms and flexible distribution of the flow cross-sectional area of cold and hot media.
The working principle of the invention is as follows:
as shown in fig. 3, the high temperature medium flows from bottom to top in the high temperature medium channel 1, and the heat is transferred to the metal wall surface of the high temperature medium channel 1 by convection and radiation; then, heat is transferred from the metal wall surface of the high-temperature medium channel 1 to the metal wall surface of the low-temperature medium channel 2 through heat conduction; finally, heat is transferred from the metal wall surface of the low-temperature medium channel 2 to the low-temperature medium flowing from top to bottom in the low-temperature medium channel 2 through convection and radiation. The heat exchange process of the high-temperature medium and the low-temperature medium in the invention has the characteristic of typical dividing wall type countercurrent heat transfer.
The above detailed description is only a preferred embodiment of the present invention, and should not be taken as limiting the scope of the present invention. All equivalent changes and modifications made according to the claims of the present invention should fall within the scope of the present invention.
Claims (6)
1. The utility model provides a sinusoidal channel structure printed circuit board heat exchanger core, its characterized in that includes a plurality of high temperature medium heat transfer boards and a plurality of low temperature medium heat transfer board, and high temperature medium heat transfer board and low temperature medium heat transfer board interval stitch welding in proper order form, be provided with a plurality of high temperature medium flow channel (1) along width direction on the high temperature medium heat transfer board, be provided with a plurality of low temperature medium flow channel (2) along width direction on the low temperature medium heat transfer board, the passageway on the same slab is parallel to each other and the interval equals.
2. The core body of a sinusoidal channel structure printed circuit board heat exchanger according to claim 1, wherein the shape line of the high temperature medium flow channel (1) and the low temperature medium flow channel (2) along the medium flow direction is a sinusoidal structure, the amplitude and the angular velocity of the sinusoidal structure can adopt different values as required, the increase of the amplitude increases the heat exchange area of the core body, the increase of the flow resistance of the medium in the core body, and the increase of the angular velocity increases the heat transfer coefficient of the core body and the increase of the flow resistance of the medium in the core body.
3. A sinusoidal channel structure printed circuit board heat exchanger core according to claim 1, characterised in that the high temperature medium flow channels (1) and the low temperature medium flow channels (2) are in a row or staggered arrangement.
4. A sinusoidal channel structure printed circuit plate heat exchanger core according to claim 1, characterised in that the high temperature medium flow channels (1) are arranged parallel or perpendicular to the low temperature medium flow channels (2).
5. A sinusoidal channel structure printed circuit plate heat exchanger core according to claim 1, characterized in that between two adjacent channels of the high temperature medium channels (1) one or more low temperature medium channels (2) may be arranged; one or more high-temperature medium channels (1) can be arranged between two adjacent low-temperature medium channels (2).
6. A sinusoidal channel structure printed circuit plate heat exchanger core according to claim 1, characterised in that the high temperature medium flow channels (1) and the low temperature medium flow channels (2) have any one of a triangular, trapezoidal, rectangular, semicircular, circular, semi-elliptical, elliptical cross-sectional shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010735569.8A CN111721151A (en) | 2020-07-28 | 2020-07-28 | Core body of printed circuit board type heat exchanger with sinusoidal channel structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010735569.8A CN111721151A (en) | 2020-07-28 | 2020-07-28 | Core body of printed circuit board type heat exchanger with sinusoidal channel structure |
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| Publication Number | Publication Date |
|---|---|
| CN111721151A true CN111721151A (en) | 2020-09-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010735569.8A Pending CN111721151A (en) | 2020-07-28 | 2020-07-28 | Core body of printed circuit board type heat exchanger with sinusoidal channel structure |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112629294A (en) * | 2020-12-30 | 2021-04-09 | 大连海事大学 | Three-strand spiral winding printed circuit board type heat exchanger core |
| CN112857114A (en) * | 2021-01-25 | 2021-05-28 | 江苏科技大学 | Variable cross section adds dimpled structural microchannel heat exchanger core |
| CN115388688A (en) * | 2022-07-07 | 2022-11-25 | 中国科学院上海技术物理研究所 | Integrated low-temperature optical element with internal flow channel and throttling refrigeration equipment thereof |
-
2020
- 2020-07-28 CN CN202010735569.8A patent/CN111721151A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112629294A (en) * | 2020-12-30 | 2021-04-09 | 大连海事大学 | Three-strand spiral winding printed circuit board type heat exchanger core |
| CN112629294B (en) * | 2020-12-30 | 2022-04-08 | 大连海事大学 | Three-strand spiral winding printed circuit board type heat exchanger core |
| CN112857114A (en) * | 2021-01-25 | 2021-05-28 | 江苏科技大学 | Variable cross section adds dimpled structural microchannel heat exchanger core |
| CN115388688A (en) * | 2022-07-07 | 2022-11-25 | 中国科学院上海技术物理研究所 | Integrated low-temperature optical element with internal flow channel and throttling refrigeration equipment thereof |
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