CN112696950A - Micro-fin heat exchange device - Google Patents
Micro-fin heat exchange device Download PDFInfo
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- CN112696950A CN112696950A CN202110045811.3A CN202110045811A CN112696950A CN 112696950 A CN112696950 A CN 112696950A CN 202110045811 A CN202110045811 A CN 202110045811A CN 112696950 A CN112696950 A CN 112696950A
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- Prior art keywords
- heat exchange
- micro
- fluid
- heat transfer
- fin
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
- F28D9/0031—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by paired plates touching each other
- F28D9/0037—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by paired plates touching each other the conduits for the other heat-exchange medium also being formed by paired plates touching each other
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures
- F28F2260/02—Heat exchangers or heat exchange elements having special size, e.g. microstructures having microchannels
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Abstract
The invention relates to the technical field of heat exchangers, in particular to a micro-fin heat exchange device. The heat exchange core comprises a microchannel plane plate and a sealing panel arranged on the microchannel plane plate, a plurality of flow channels are arranged on the microchannel plane plate at intervals, and at least one group of heat transfer mechanisms connected with the side wall is arranged on the outer side wall of the heat exchange core. The flow channel has reasonable structural design, not only increases the size of the flow channel and effectively reduces the flowing resistance of the fluid, but also ensures that the fluid has better fluidity, and avoids the situation that the fluid is adhered in the flow channel of the micro-channel plane plate due to high viscosity of the fluid or the situation that the blockage or the pressure loss is increased due to ash, impurities, particles and the like contained in the fluid, thereby ensuring that the fluid flows smoothly; in addition, on the basis of ensuring that the micro-channel plane plate meets the requirement of pressure-bearing strength, the utilization rate of the heat transfer surface area is improved, the heat transfer efficiency is improved, and the problems in the prior art are solved.
Description
The technical field is as follows:
the invention relates to the technical field of heat exchangers, in particular to a micro-fin heat exchange device.
Background art:
a micro-channel heat exchanger (MCHE for short) is a novel high-efficiency heat exchanger formed by combining a heat exchange core, an end socket, a connecting pipe and a flange, and has the characteristics of high compactness, small volume, high structural strength, high heat exchanger efficiency, high temperature and pressure bearing capacity (up to more than 100 MPa), designable heat exchange channels and the like. The heat exchange cores of the MCHE are packaged integrally by alternately placing cold and hot plate sheets with flow channels and fixedly connecting the cold and hot plate sheets together through diffusion welding, and a single heat exchanger can meet different heat exchange requirements by connecting a plurality of heat exchange cores in parallel. MCHEs were first used in the aerospace and aeronautical fields for cooling the surface of aircraft or engine parts. With the maturity of processing technology, MCHE also has a huge market in the civil energy-saving field. MCHE is therefore receiving increasing attention from the energy and power industry.
However, the heat exchange core of an MCHE is generally composed of a sealing face plate and a microchannel flat plate, and the microchannel flat plate is composed of a plurality of flow channels with semicircular, triangular, rectangular, trapezoidal and other polygonal cross sections, and the flow channels are arranged in a linear, herringbone, sinusoidal or other pattern. However, in order to ensure a certain pressure-bearing strength of the microchannel flat plate, the aperture of each flow channel is designed to be thin, so that the flow resistance of the fluid is increased, the fluidity of the fluid is poor, the fluid is easily adhered to the flow channel of the microchannel flat plate after a long time, and even the fluid is blocked when the fluid is serious; and heat transfer among all runners is realized through the microchannel plane plate, and the microchannel plane plate is thick, so that although better bearing strength can be ensured, the utilization rate of the heat transfer surface area is low, the whole heat transfer effect is wasted on the thickness of the microchannel plane plate, and the heat transfer efficiency is low.
The invention content is as follows:
the invention provides a micro-fin heat exchange device which has reasonable structural design, not only increases the size of a flow channel and effectively reduces the flowing resistance of fluid, so that the fluid has better fluidity, and the situation that the fluid is adhered in the flow channel of a micro-channel plane plate due to high viscosity of the fluid or is blocked or the pressure loss is increased due to ash, impurities, particles and the like contained in the fluid is avoided, so that the fluid flows smoothly; in addition, on the basis of ensuring that the micro-channel plane plate meets the requirement of pressure-bearing strength, the utilization rate of the heat transfer surface area is improved, the heat transfer efficiency is improved, and the problems in the prior art are solved.
The technical scheme adopted by the invention for solving the technical problems is as follows:
the micro-fin heat exchange device comprises at least one group of heat exchange cores, wherein each heat exchange core comprises a micro-channel plane plate and a sealing panel arranged on the micro-channel plane plate, a plurality of flow channels are arranged on the micro-channel plane plate at intervals, and at least one group of heat transfer mechanisms connected with the side wall of the micro-channel plane plate is arranged on the outer side wall of each heat exchange core.
Preferably, the number of the heat exchange cores is two or more, and two adjacent heat exchange cores are connected through a heat transfer mechanism.
Preferably, the number of the heat exchange cores is two or more, the two adjacent heat exchange cores are connected through a heat transfer mechanism, and the heat transfer mechanism is arranged on the outer heat exchange core.
Preferably, the heat transfer mechanism comprises a plurality of fins connected with the side wall of the heat exchange core, and two adjacent fins form a heat exchange channel.
Preferably, the fins have a thickness of no more than 5 mm.
Preferably, at least one spoiler is arranged between two adjacent fins, and the spoilers are respectively connected with the fins on the corresponding side.
Preferably, there are two spoilers provided between the adjacent two fins.
Preferably, the two adjacent groups of heat exchange cores are arranged in a staggered manner, and the flow channel direction of the upper-layer heat exchange core is perpendicular to the flow channel direction of the lower-layer heat exchange core.
Preferably, the heat exchange core is a microchannel plane plate, and the flow channels are arranged in the microchannel plane plate at intervals.
By adopting the structure, the structure is reasonable in design, the size of the flow channel is increased, the flowing resistance of the fluid is effectively reduced, the fluid has better fluidity, and the situation that the fluid is adhered in the flow channel of the micro-channel plane plate due to high viscosity of the fluid or is blocked or the pressure loss is increased due to ash, impurities, particles and the like in the fluid is avoided, so that the fluid flows smoothly; in addition, on the basis of ensuring that the micro-channel plane plate meets the requirement of pressure-bearing strength, the utilization rate of the heat transfer surface area is improved, and the heat transfer efficiency is improved.
Description of the drawings:
fig. 1 is a schematic perspective view of a single-unit heat exchange core structure of the present invention.
Fig. 2 is a cross-sectional structural view of fig. 1.
Fig. 3 is a schematic perspective view of the double-layer heat transfer mechanism of the present invention.
Fig. 4 is a cross-sectional structural view of fig. 3.
FIG. 5 is a schematic perspective view of a dual-layer heat transfer mechanism with a single-layer spoiler according to the present invention.
Fig. 6 is a cross-sectional structural view of fig. 5.
FIG. 7 is a schematic perspective view of a dual-layer heat transfer mechanism with dual-layer spoilers according to the present invention.
Fig. 8 is a cross-sectional structural view of fig. 7.
Fig. 9 is a schematic perspective view of a cross-flow heat exchange core of the present invention.
Fig. 10 is a cross-sectional structural view of fig. 9.
FIG. 11 is a cross-sectional structural schematic view of a monolithic microchannel planar plate.
FIG. 12 is a schematic view of a semicircular flow channel of a conventional microchannel flat plate.
FIG. 13 is a schematic view of a rectangular flow channel of a conventional microchannel planar plate.
FIG. 14 is a schematic view of a triangular flow channel structure of a conventional microchannel flat plate.
FIG. 15 is a schematic view of a trapezoidal flow channel of a conventional microchannel flat plate.
In the figure, 1, a heat exchange core; 101. a microchannel planar plate; 102. sealing the panel; 103. a flow channel; 2. a fin; 3. a heat exchange channel; 4. a spoiler.
The specific implementation mode is as follows:
in order to clearly explain the technical features of the present invention, the following detailed description of the present invention is provided with reference to the accompanying drawings.
As shown in fig. 1-15, the heat exchange device with micro-fins comprises at least one group of heat exchange cores 1, wherein the heat exchange cores comprise a microchannel plane plate 101 and a sealing face plate 102 arranged thereon, a plurality of flow channels 103 are arranged on the microchannel plane plate 101 at intervals, and at least one group of heat transfer mechanisms connected with the side wall is arranged on the outer side wall of the heat exchange core 1.
Preferably, the number of the heat exchange cores 1 is two or more, and two adjacent heat exchange cores 1 are connected through a heat transfer mechanism. The structure is suitable for the heat exchange mode that the heat exchange core 1 is arranged outside and the heat transfer mechanism is arranged inside.
Preferably, the number of the heat exchange cores 1 is two or more, two adjacent heat exchange cores 1 are connected through a heat transfer mechanism, and the heat transfer mechanism is arranged on the outer heat exchange core 1. The structure is suitable for the heat exchange mode that the heat transfer mechanism is arranged outside and the heat exchange core 1 is arranged inside.
Preferably, the heat transfer mechanism comprises a plurality of fins 2 connected with the side wall of the heat exchange core 1, and two adjacent fins 2 form a heat exchange channel 3. Note that the shape of the fins 2 is not only a sheet shape, but may be any shape having an S-shape, a V-shape, or the like in cross section, and the fins 2 may be arranged at regular intervals or may not be arranged at equal intervals.
Preferably, the thickness of the fins 2 does not exceed 5 mm. In the field of micro-channel heat exchangers, the heat transfer efficiency of the fin 2 is greatly reduced after the thickness of the fin exceeds 5mm, which is not beneficial to efficient heat transfer.
Preferably, at least one spoiler 4 is arranged between two adjacent fins 2, and the spoilers 4 are respectively connected with the corresponding fin 2 on one side. Set up spoiler 4, be used for improving the intensity of fin 2 on the one hand, make heat transfer mechanism more stable, on the other hand plays the vortex effect to the fluid that gets into in the heat transfer passageway 3, makes the fluid more steady. It should be noted that two adjacent spoilers 4 can be staggered up and down, or can be on the same horizontal plane, and the connecting position is not limited.
Preferably, there are two spoilers 4 disposed between the adjacent two fins 2. When high-pressure fluid in the heat exchange core 1 needs to efficiently and quickly complete heat exchange, the height of the fins 2 can be increased, so that the flow of the fluid entering the heat exchange channel 3 is increased, and the purpose of efficient heat exchange is finally achieved. In order to ensure the stability of the fin 2 and the smooth flow of the fluid, the strength of the fin 2 is further increased by the upper spoiler 4 and the lower spoiler 4.
Preferably, the two adjacent groups of heat exchange cores 1 are arranged in a staggered manner, and the direction of the flow channel 103 of the upper layer of heat exchange core 1 is perpendicular to the direction of the flow channel 103 of the lower layer of heat exchange core 1. The heat exchanger is suitable for a cross-flow type micro-channel heat exchanger.
Preferably, the heat exchange core 1 is a microchannel plane plate 101, and the flow channels 103 are arranged in the microchannel plane plate 101 at intervals. The microchannel plane plate 101 adopts an integrated design mode, so that the sealing panel 102 is omitted, and the overall stability of the heat exchange core 1 is greatly improved.
When the device is used, the sealing panel 102 is used for sealing each flow channel 103 on the microchannel plane plate 101, the flow channel 103 of the heat exchange core 1 is suitable for high-pressure fluid, and the heat exchange channel 3 formed by each fin 2 of the heat transfer mechanism is suitable for fluid with weaker flowability and higher viscosity. Each fin 2 is respectively connected with two adjacent groups of heat exchange cores 1, on the premise of ensuring the pressure-bearing strength of the device, fluid exchanges heat with the two groups of heat exchange cores 1 through each fin 2, and the utilization rate of the heat transfer surface area is greatly improved. It should be noted that the heat transfer mechanism can also be applied to gas, thereby achieving the effect of gas-liquid heat exchange.
The micro-fin heat exchange is a brand new heat exchange mode, has obvious advantages compared with the common tube-fin heat exchanger in the current market, changes indirect heat exchange into direct heat exchange, greatly increases the heat exchange area of unit volume, has higher heat exchange efficiency and higher strength, and is an important innovative and upgrading product. The pore diameter is enlarged to the maximum extent, so that the fluid flows smoothly, the phenomenon that the fluid is adhered in the flow channel 103 of the micro-channel plane plate 101 due to high viscosity of the fluid or the fluid contains ash, impurities, particles and the like is avoided, the situation that the blockage or the pressure loss is increased is prevented, the fluid has better fluidity, the heat transfer efficiency is greatly improved, and the problems in the prior art are solved.
The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; the modifications or the substitutions do not cause the essence of the corresponding technical solutions to depart from the scope of the technical solutions of the embodiments of the present invention, and the technical solutions are all covered in the scope of the claims and the specification of the present invention; it will be apparent to those skilled in the art that any alternative modifications or variations to the embodiments of the present invention may be made within the scope of the present invention.
The present invention is not described in detail, but is known to those skilled in the art.
Claims (9)
1. Little fin formula heat transfer device, including at least a set of heat transfer core, the heat transfer core includes microchannel plane board and sets up the sealed panel above that, and the interval is equipped with a plurality of runner, its characterized in that on the microchannel plane board: at least one group of heat transfer mechanisms connected with the side wall is arranged on the outer side wall of the heat exchange core.
2. The micro-fin heat exchange device of claim 1, wherein: the heat exchange cores are two or more groups, and the two adjacent groups of heat exchange cores are connected through a heat transfer mechanism.
3. The micro-fin heat exchange device of claim 1, wherein: the heat exchange cores are two or more groups, the two adjacent groups of heat exchange cores are connected through a heat transfer mechanism, and the heat transfer mechanism is arranged on the outer layer of the heat exchange cores.
4. The micro-fin heat exchange device of claim 1, 2 or 3, wherein: the heat transfer mechanism comprises a plurality of fins connected with the side wall of the heat exchange core, and two adjacent fins form a heat exchange channel.
5. The micro-fin heat exchange device of claim 4, wherein: the thickness of the fin does not exceed 5 mm.
6. The micro-fin heat exchange device of claim 4, wherein: at least one spoiler is arranged between every two adjacent fins and connected with the corresponding fin on one side.
7. The micro-fin heat exchange device of claim 6, wherein: the number of the spoilers arranged between the adjacent two fins is two.
8. The micro-fin heat exchange device of claim 2 or 3, wherein: the two adjacent groups of heat exchange cores are arranged in a staggered mode, and the flow channel direction of the upper-layer heat exchange core is perpendicular to the flow channel direction of the lower-layer heat exchange core.
9. The micro-fin heat exchange device of claim 1, wherein: the heat exchange core is a microchannel plane plate, and the flow channels are arranged in the microchannel plane plate at intervals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110045811.3A CN112696950A (en) | 2021-01-14 | 2021-01-14 | Micro-fin heat exchange device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110045811.3A CN112696950A (en) | 2021-01-14 | 2021-01-14 | Micro-fin heat exchange device |
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| Publication Number | Publication Date |
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| CN112696950A true CN112696950A (en) | 2021-04-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110045811.3A Pending CN112696950A (en) | 2021-01-14 | 2021-01-14 | Micro-fin heat exchange device |
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| CN (1) | CN112696950A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113720176A (en) * | 2021-08-12 | 2021-11-30 | 北京航空航天大学 | Micro-channel heat exchanger with secondary fins |
| CN114935108A (en) * | 2022-05-12 | 2022-08-23 | 高拓微通传热技术(北京)有限公司 | Hydrogenation station is with companion cold type high pressure hydrogen cooler |
| CN116817646A (en) * | 2023-06-29 | 2023-09-29 | 上海交通大学 | Cross flow mixed type printed circuit board type heat exchanger |
-
2021
- 2021-01-14 CN CN202110045811.3A patent/CN112696950A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113720176A (en) * | 2021-08-12 | 2021-11-30 | 北京航空航天大学 | Micro-channel heat exchanger with secondary fins |
| CN114935108A (en) * | 2022-05-12 | 2022-08-23 | 高拓微通传热技术(北京)有限公司 | Hydrogenation station is with companion cold type high pressure hydrogen cooler |
| CN114935108B (en) * | 2022-05-12 | 2024-03-08 | 高拓微通传热技术(北京)有限公司 | Cold-tracing type high-pressure hydrogen cooler for hydrogenation station |
| CN116817646A (en) * | 2023-06-29 | 2023-09-29 | 上海交通大学 | Cross flow mixed type printed circuit board type heat exchanger |
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