CN116817646A - Cross flow mixed type printed circuit board type heat exchanger - Google Patents
Cross flow mixed type printed circuit board type heat exchanger Download PDFInfo
- Publication number
- CN116817646A CN116817646A CN202310779752.1A CN202310779752A CN116817646A CN 116817646 A CN116817646 A CN 116817646A CN 202310779752 A CN202310779752 A CN 202310779752A CN 116817646 A CN116817646 A CN 116817646A
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- Prior art keywords
- plate
- heat exchanger
- fins
- hot side
- flow
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- 239000012530 fluid Substances 0.000 claims description 14
- 238000005452 bending Methods 0.000 claims description 6
- 230000007935 neutral effect Effects 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 3
- 238000003466 welding Methods 0.000 abstract description 3
- 238000009792 diffusion process Methods 0.000 abstract description 2
- 238000005259 measurement Methods 0.000 abstract description 2
- 238000004364 calculation method Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
- F28D9/04—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits being formed by spirally-wound plates or laminae
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/02—Header boxes; End plates
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/26—Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators
Abstract
A cross-flow hybrid printed circuit board heat exchanger comprising: the invention adjusts the flow directions of the cold side and hot side to be mutually perpendicular, the hot side micro-channel plates and the cold side fins with the micro-fins are overlapped in a staggered way, a precise diffusion welding process is used for welding, the plate fins with the micro-fins are used for cold measurement, the flow pressure drop of a cold side working medium is obviously reduced on the premise of ensuring heat exchange performance and compact structure, thereby greatly reducing the power of a driving fan and improving the net output work of a Brayton cycle and the maneuverability of a small movable reactor.
Description
Technical Field
The invention relates to a technology in the field of nuclear reactor cooling, in particular to a cross flow hybrid printed circuit board heat exchanger (PCHE).
Background
The heat exchanger in brayton cycle system of miniature nuclear reactor generally adopts printed circuit board type heat exchanger (PCHE), the process of making plate sheets composing the heat exchanger is similar to circuit board, semi-circular flow channels are etched on the heat exchange plate sheets through chemical corrosion, and then the multi-layer heat exchange plates are stacked together through diffusion welding technology. However, for an air-cooled brayton cycle system, the use of such a heat exchanger as a precooler has the problem of excessive air flow pressure drop, requiring a large fan power to drive the air, which is not beneficial to improving the net work output of the nuclear power supply nor to the transportation of the nuclear power supply.
Disclosure of Invention
The invention provides a cross flow mixed printed circuit board type heat exchanger, which aims at the defects that the flow pressure drop of the air side of the existing counter flow type precooler is overlarge and the power requirement of a driving fan is high, and the existing plate type heat exchange technology aims at the problems that the existing plate type heat exchange technology cannot be suitable for liquid working media, the specific heat exchange problems of working media at two sides are different, and the pressure loss caused by cold side air resistance cannot be improved, and the defects that the flow resistance characteristics of the air cannot be improved.
The invention is realized by the following technical scheme:
the invention relates to a cross-flow hybrid printed circuit board heat exchanger, comprising: top support plate, at least two sets of hot side microchannel plates, cold side plate fins with micro fins and bottom support plate set in order from top to bottom, wherein: the hot side fluid flows through the hot side microchannel plate along the length direction of the heat exchanger, and cold side air is driven by an external fan to flow through the micro fins on the cold side plate fins along the width direction of the heat exchanger.
The circulation path of the hot side fluid in the hot side micro-channel plate sheet is multi-pass.
The at least two groups of hot-side microchannel plates and the cold-side plate fins with the micro fins are as follows: the hot side micro-channel plates and the cold side plate fins which are arranged in a staggered mode are arranged in a group, N groups are arranged in a total mode, and N is a natural constant.
Technical effects
The PCHE microchannel plate is combined with the plate fins, a micro fin structure is introduced into the channels at the side of the plate fins, cross flow arrangement is adopted, cold side flow is along the width direction with shorter distance, and hot side flow is along the length direction of the heat exchanger.
Compared with the prior art, the PHCE heat exchanger has the advantages that the compact structure of the PHCE is reserved, the heat exchange in the plate-exchanging fin channels is enhanced, the heat exchange volume is prevented from being obviously increased, the cold-side air flow resistance characteristic is improved, and the air flow pressure drop and the driving power required by a fan are greatly reduced.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a schematic diagram of the overall structural configuration of the present invention, (a) two sets of plate configurations; (b) Four-group board arrangement
FIG. 3 is a schematic view of a hot side plate, (a) one pass; (b) multiple passes;
FIG. 4 is a schematic diagram of a hot side channel geometry;
FIG. 5 is a schematic view of a cold side plate;
FIG. 6 is a schematic diagram of a cold side channel geometry;
FIG. 7 is a schematic diagram of a two-dimensional discrete model;
FIG. 8 is a schematic diagram of a temperature field profile, (a) hot side fluid; (b) an air side;
in the figure: top support plate 1, first hot side microchannel plate 2, first cold side plate fin 3, second hot side microchannel plate 4, second cold side plate fin 5, bottom support plate 6, hot side inlet head 7, hot side outlet head 8, forming plate 9, support plate 10, micro fins 11.
Detailed Description
As shown in fig. 1 and 2a, this embodiment relates to a printed circuit board type heat exchanger for a cross flow hybrid heat exchanger, comprising: top support plate 1, first hot side microchannel plate 2, first cold side plate fin 3 with micro fins, second hot side microchannel plate 4, second cold side plate fin 5 with micro fins and bottom support plate 6 set up in order from top to bottom, wherein: a hot side inlet head 7 and a hot side outlet head 8 are provided perpendicular to both ends of the hot and cold side microchannel plates for connection to a brayton cycle, hot side fluid flowing through the first and second hot side microchannel plates 2, 4 in the length direction of the heat exchanger, and cold side air flowing through the first and second cold side plate fins 3, 5 in the width direction of the heat exchanger driven by an external fan.
In other cases, four sets of hot side microchannel plates and cold side plate fins may be provided, as shown in FIG. 2 b.
As shown in fig. 3, the structure of the hot-side microchannel plate adopts an exemplary straight-channel semicircular plate, which adopts, but is not limited to, a shape of a flow channel etched on the heat exchange plate by chemical corrosion, and can be replaced by other common PCHE flow channel forms such as zigbee, S-type and the like in specific other occasions.
As shown in fig. 4, the flow path of the hot-side fluid in the hot-side microchannel plate is one-pass or multi-pass, and the multi-pass structure is more compact but adds additional pressure drop, which is suitable for the situation that the viscosity of the hot-side fluid is smaller, and the hot-side fluid turning needs to be realized by means of additional sealing heads or plates, and in this embodiment, the three-pass structure is preferable.
As shown in FIG. 4, the hot-side microchannel plate is provided with a plurality of microchannel structures arranged in parallel, and the total stress of any position in the microchannel structures is smaller than the allowable stress sigma of the material at the pressure and the temperature t ＜σ max At the wall surface, the total stress is the sum of the film stress and the bending stressWherein: p is the working pressure of the hot side fluid, D c Distance c from neutral axis to outermost layer, which is channel diameter w ＝t w 2, moment of inertia->t w The thickness of the plate at the passage is the thickness of the plate.
Diameter D of the micro-channel c Is 1.5-2 mm.
At the ridge line between two adjacent micro-channel structures, the bending stress is 0 due to the symmetry of the structures, and the total stress is equal to the film stressWherein: t is t r Is the ridge thickness.
At the edge of the hot side microchannel plate, the total stress is the sum of the film stress and the bending stressWherein: c e I is the distance from the neutral axis to the outermost layer e Is the moment of inertia.
The stress checking calculation of the hot side microchannel plate is implemented by a technique described in, but not limited to, ZHU, qingzi, et al, design ofa 2MW ZrC/W-based molten-salt-to-sCO2 PCHE for concentrated solar power (Applied Energy,2021, 300:117313).
As shown in fig. 5, the cold-side plate fin includes: a forming plate 9 and a support plate 10, wherein: the forming plate 9 is provided with a plurality of micro fins 11 which are perpendicular to the supporting plate 10 in parallel, so that the heat exchange area of the cold side plate fins is remarkably increased, and the compactness of the heat exchanger is further improved.
The forming plate 9 and the supporting plate 10 are sealed by using measures such as sealing strips at the edges of two sides, preferably, a one-pass type heat exchanger is adopted, the flow direction is along the width direction of the heat exchanger and is perpendicular to the flow direction of the hot side, and the flow pressure drop of cold side air is further reduced due to the shorter width direction of the heat exchanger.
The forming plate 9 has a rectangular channel structure, and the width S and the height H of the rectangular channel structure are respectively 6mm and 4mm.
As shown in FIG. 6, the normal stress on the section of the support plate 10 in the cold-side plate fin is linearly distributed along the height of the section, the normal stress on the neutral axis is 0, and the maximum stress is located at the upper and lower edges of the section of the support plate 10Wherein: the inter-fin spacing a is equal to the width S of the rectangular channel of the forming plate 9 and the thickness t of the forming plate 9 f Sum of twice, t s The thickness of the support plate is the thickness of the support plate.
The stress checking calculation of the cold-side plate fin is realized by adopting, but not limited to, the technology described in the plate-fin structure stress analysis (J. Petrochemical equipment, 2010, 39 (B08): 4.DOI: 10.3969/j.issn.1000-7466.2010.z1.002) of Sun Weisong, gao Song, dan Fengtao and the like.
Because the hot side fluid of the cross flow heat exchanger encounters cold side fluid with different temperatures at the inlet position and the average temperature encountered when the hot side fluid is positioned at the downstream position of the cold side is lower, the assumption that the heat exchange amount of different heat exchange channels is equal is no longer applicable, but the heat exchange amount can still be considered to be equal among different heat exchange plates, so the heat design calculation is carried out on a pair of cold and hot plates by using a two-dimensional temperature field.
As shown in fig. 7, in order to calculate a two-dimensional discrete model used in calculating the temperature-pressure distribution of the cross-flow heat exchanger, the calculation is performed for only a pair of cold and hot plates assuming that the heat exchange amount of each heat transfer plate is equal. For microchannel plates, N computing units are discrete in the flow direction, with the number of discrete units for plate fins being determined by the number of hot side channels. For each heat transfer unit, calculations were performed using the average physical properties of the nodes until the full-field calculations converged.
As shown in table 1, the inlet condition parameters of the present embodiment are calculated using a two-dimensional discrete model, wherein the hot side working medium is supercritical carbon dioxide and the cold side working medium is air.
Table 1 entry simulation parameters
| Temperature [ DEGC] | Pressure [ MPa ]] | |
| Hot side microchannel plate inlet | 89.6 | 7.635 |
| Cold side plate fin inlet | 30 | 0.103 |
As shown in fig. 8, for the temperature field distribution of the hot side and the cold side, the hot side is designed as a three-channel in the calculation example, and it can be seen that the temperature decrease amplitude is greatest in the first channel of the inlet.
As shown in table 2, the information of the present invention in terms of size and pressure drop is presented to the existing PCHE and fin tube heat exchanger.
Table 2 heat exchanger parameter comparison table
| Existing PCHE | Existing finned tube heat exchanger | The invention is that | |
| Thermal power | 11.4MW | 11.4MW | 11.4MW |
| Single module size | 0.53×1.54×1.54m | 7.18×4.572×0.72m | 2.44×0.2×0.6m |
| Number of parallel modules | 1 | 3 | 30 |
| Floor area | 0.8123m 2 | 98.55m 2 | 14.62m 2 |
| Volume of heat exchanger | 1.25m 3 | 70.95m 3 | 8.77m 3 |
| Air side pressure drop | 9.94kPa | 129Pa | 190Pa |
| Driving fan power | 571.5kWe | 31.0kWe | 48.8kWe |
As shown in the table above, for the same heat load design, the existing PCHE can achieve the most compact structural design, but for an air-cooled precooler, the cold side pressure drop is close to 10kPa, corresponding to the required fan power up to 571.5kWe; for the existing finned tube heat exchanger, although the pressure drop of air is greatly reduced, the power of a driving fan is only 31.0 and kWe, but the volume of the heat exchanger is huge and reaches 70.95m 3 The occupied area is 98.55m 2 Clearly, the design requirements of mobile micro-reactor power supplies are not met. The invention greatly reduces the air side pressure drop while maintaining the compact structure of the prior PCHE, and the volume of the heat exchanger is 8.77m under the heat load of 11.4MW 3 The driving fan power was 48.8kWe.
Compared with the traditional PCHE, the invention adopts the plate fin structure on the cold side, increases the flow area of air on the cold side, and adopts cross flow arrangement at the same time, so that the air flows along the width direction of the heat exchanger with shorter distance, the pressure drop performance of the heat exchanger is greatly improved, and the pressure drop performance is reduced from 9.94kPa of the traditional PCHE to 190Pa of the invention, which is equivalent to the pressure drop level of the traditional finned tube heat exchanger. Compared with the existing finned tube heat exchanger, the compact heat exchange structure of the PCHE is reserved on the whole, although the plate fin structure is adopted in cold measurement for reducing the pressure drop of air, the micro fin structure is introduced into the channels of the heat exchange structure, and the heat exchange performance is enhanced, so that the compactness of the heat exchange structure of the invention is reduced compared with that of the existing PCHE, and the volume of the heat exchange structure is reduced from 1.25m of that of the PCHE under the same heat exchange power 3 To 8.77m of the invention 3 But still significantly lower than the volume of the existing conventional finned tube heat exchanger by 70.95m 3 . Therefore, the novel structural design provided by the invention greatly improves the resistance characteristic of air side flow and reduces the pressure loss and the responsive driving fan power on the premise of not obviously sacrificing the structural compactness of the PCHE heat exchanger.
The foregoing embodiments may be partially modified in numerous ways by those skilled in the art without departing from the principles and spirit of the invention, the scope of which is defined in the claims and not by the foregoing embodiments, and all such implementations are within the scope of the invention.
Claims (7)
1. A cross-flow hybrid printed circuit board heat exchanger comprising: top support plate, at least two sets of hot side microchannel plates, cold side plate fins with micro fins and bottom support plate set in order from top to bottom, wherein: the hot side fluid flows through the hot side microchannel plate along the length direction of the heat exchanger, and cold side air is driven by an external fan to flow through the micro fins on the cold side plate fins along the width direction of the heat exchanger.
2. The cross-flow hybrid printed circuit board heat exchanger of claim 1 wherein the hot side fluid flow path in the hot side microchannel plate sheet is multi-pass.
3. The cross-flow hybrid printed circuit board heat exchanger of claim 1, wherein the at least two sets of hot side microchannel plates and cold side plate fins with micro fins are: the hot side micro-channel plates and the cold side plate fins which are arranged in a staggered mode are arranged in a group, N groups are arranged in a total mode, and N is a natural constant.
4. A crossflow hybrid printed circuit board heat exchanger as claimed in any one of claims 1 to 3 wherein the cold side plate fins comprise: forming plate and backup pad, wherein: the forming plate is provided with a plurality of miniature fins which are perpendicular to the supporting plate in parallel, so that the heat exchange area of the cold side plate fins is remarkably increased, and the compactness of the heat exchanger is further improved.
5. A cross-flow hybrid printed circuit board heat exchanger according to any of claims 1-3, characterized in that the hot side microchannel plate is provided with a number of parallel microchannel structures, the total stress at any position in the microchannel structure being smaller than the allowable stress σ of the material at the pressure and temperature t <σ max At the wall surface, the total stress is the sum of the film stress and the bending stressWherein: p is the working pressure of the hot side fluid, D c Distance c from neutral axis to outermost layer, which is channel diameter w ＝t w 2, moment of inertia->t w The thickness of the plate at the channel is the thickness;
at the ridge line between two adjacent micro-channel structures, the bending stress is 0 due to the symmetry of the structures, and the total stress is equal to the film stressWherein: t is t r Is ridge thickness;
at the edge of the hot side microchannel plate, the total stress is the sum of the film stress and the bending stress Wherein: c e I is the distance from the neutral axis to the outermost layer e Is of the type ofMoment of sex.
6. The cross-flow hybrid printed circuit board heat exchanger of claim 4, wherein the forming plate and the support plate are sealed at both side edges by means of sealing strips or the like, and the flow direction is along the width direction of the heat exchanger and perpendicular to the flow direction of the hot side, so that the flow pressure drop of the cold side air is further reduced due to the shorter width direction of the heat exchanger.
7. The heat exchanger of claim 4, wherein the normal stresses on the cross section of the support plate in the cold side plate fin are distributed along the cross section with a high linearity, the normal stresses on the neutral axis being 0, the maximum stresses being at the upper and lower edges of the cross section of the support plateWherein: the inter-fin distance a is equal to the width W of the rectangular channel of the forming plate and the thickness t of the forming plate f Sum of twice, t s The thickness of the support plate is the thickness of the support plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310779752.1A CN116817646A (en) | 2023-06-29 | 2023-06-29 | Cross flow mixed type printed circuit board type heat exchanger |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310779752.1A CN116817646A (en) | 2023-06-29 | 2023-06-29 | Cross flow mixed type printed circuit board type heat exchanger |
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| CN116817646A true CN116817646A (en) | 2023-09-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310779752.1A Pending CN116817646A (en) | 2023-06-29 | 2023-06-29 | Cross flow mixed type printed circuit board type heat exchanger |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117479420A (en) * | 2023-12-28 | 2024-01-30 | 西安交通大学 | Printed circuit board heat exchanger core body with cold and hot runners arranged in same layer |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100000722A1 (en) * | 2008-07-03 | 2010-01-07 | Arun Muley | heat exchanger fin containing notches |
| CN201532138U (en) * | 2009-05-07 | 2010-07-21 | 浙江银轮机械股份有限公司 | Strip seal type charge intercooler with corrugated structural radiating ribbons |
| CN109724437A (en) * | 2019-01-29 | 2019-05-07 | 北京首航艾启威节能技术股份有限公司 | Direct air cooling heat exchanger based on PCHE combines brazing technique |
| CN110701929A (en) * | 2019-11-18 | 2020-01-17 | 西安热工研究院有限公司 | Printed circuit board air cooling heat exchanger core |
| CN111707115A (en) * | 2020-06-03 | 2020-09-25 | 中国船舶重工集团公司第七二五研究所 | Diffusion welding compact heat exchanger with combined heat exchange plate |
| CN112696950A (en) * | 2021-01-14 | 2021-04-23 | 高拓石油天然气技术（上海）有限责任公司 | Micro-fin heat exchange device |
| CN114353564A (en) * | 2022-01-12 | 2022-04-15 | 西安交通大学 | Slotted spindle-shaped fin printed circuit board heat exchanger core |
| CN114623707A (en) * | 2022-04-02 | 2022-06-14 | 西安热工研究院有限公司 | Compact heat exchanger for multi-fluid heat exchange and heat exchange method |
-
2023
- 2023-06-29 CN CN202310779752.1A patent/CN116817646A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100000722A1 (en) * | 2008-07-03 | 2010-01-07 | Arun Muley | heat exchanger fin containing notches |
| CN201532138U (en) * | 2009-05-07 | 2010-07-21 | 浙江银轮机械股份有限公司 | Strip seal type charge intercooler with corrugated structural radiating ribbons |
| CN109724437A (en) * | 2019-01-29 | 2019-05-07 | 北京首航艾启威节能技术股份有限公司 | Direct air cooling heat exchanger based on PCHE combines brazing technique |
| CN110701929A (en) * | 2019-11-18 | 2020-01-17 | 西安热工研究院有限公司 | Printed circuit board air cooling heat exchanger core |
| CN111707115A (en) * | 2020-06-03 | 2020-09-25 | 中国船舶重工集团公司第七二五研究所 | Diffusion welding compact heat exchanger with combined heat exchange plate |
| CN112696950A (en) * | 2021-01-14 | 2021-04-23 | 高拓石油天然气技术（上海）有限责任公司 | Micro-fin heat exchange device |
| CN114353564A (en) * | 2022-01-12 | 2022-04-15 | 西安交通大学 | Slotted spindle-shaped fin printed circuit board heat exchanger core |
| CN114623707A (en) * | 2022-04-02 | 2022-06-14 | 西安热工研究院有限公司 | Compact heat exchanger for multi-fluid heat exchange and heat exchange method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117479420A (en) * | 2023-12-28 | 2024-01-30 | 西安交通大学 | Printed circuit board heat exchanger core body with cold and hot runners arranged in same layer |
| CN117479420B (en) * | 2023-12-28 | 2024-04-05 | 西安交通大学 | Printed circuit board heat exchanger core body with cold and hot runners arranged in same layer |
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