CN214644905U - Viscose closing device and automatic viscose production line - Google Patents

Abstract

The utility model discloses a viscose closing device and automatic viscose production line relates to solar cell and makes technical field to improve the degree of automation of viscose process, make the viscose process be applicable to automatic viscose technology. The viscose closing device includes the clamp plate and establishes the limit structure on the clamp plate. The limiting structure and the pressing block plate jointly form a containing space for containing the crystal support and the viscose object. The limiting structure is used for positioning the crystal support and the viscose object in the accommodating space. The pressing block plate is used for applying acting force to the adhesive object when the adhesive object is positioned in the accommodating space. The automatic viscose production line comprises the viscose pressing device provided by the technical scheme. The utility model provides a viscose closing device is used for the viscose process.

Description

Viscose closing device and automatic viscose production line

Technical Field

The utility model relates to a solar cell makes technical field, especially relates to a viscose closing device and automatic viscose production line.

Background

In the manufacturing process of the crystalline silicon solar cell, a crystal bar needs to be bonded on a crystal support through a gluing process, and the crystal bar is sliced by a diamond wire cutting machine, so that a silicon wafer required for manufacturing the crystalline silicon solar cell is obtained.

In the gluing process, the crystal bar can be subjected to temperature return treatment, plate glue is coated on the crystal support, the glue plate is placed on the surface of the crystal support coated with the plate glue, and a heavy hammer is placed on the glue plate; standing until the glue of the glue board is solidified, so that the glue board is stuck on the crystal support; then removing a heavy hammer on the viscose plate, coating the viscose plate with the rod glue, placing the temperature-returning crystal bar on the surface of the viscose plate coated with the rod glue, and finally standing until the rod glue is solidified, thereby adhering the crystal bar on the crystal support. However, the whole gluing process is mostly operated manually, the automation degree is not high, and the gluing process is difficult to be applied to an automatic gluing process.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a viscose closing device and automatic viscose production line to improve the degree of automation of viscose process, make the viscose process be applicable to automatic viscose technology.

In a first aspect, the present invention provides a viscose hold-down device for bonding a viscose object to a crystal support. The viscose pressing device comprises a pressure plate and a limiting structure arranged on the pressure plate. The limiting structure and the pressing block plate jointly form a containing space for containing the crystal support and the viscose object. The limiting structure is used for positioning the crystal support and the viscose object in the accommodating space. The briquetting board is used for applying effort to the viscose object when the viscose object is positioned in accommodation space.

Adopt under the condition of above-mentioned technical scheme, limit structure and briquetting board form the accommodation space who holds brilliant support and viscose object jointly, make in the viscose process, can utilize automatic grabbing device to transfer viscose closing device to viscose object position, and control the accommodation space that limit structure has and the brilliant surface counterpoint that holds in the palm formation viscose object, make the brilliant viscose object that holds in the palm and form on brilliant support hold in the accommodation space, and be fixed a position in accommodation space by limit structure. On this basis, limit structure establishes on the briquetting board for the brilliant holds in the palm and forms the viscose object on the brilliant support and hold in the accommodation space, the briquetting board can contact with the viscose object, thereby guarantees that the briquetting board can exert pressure to the viscose object, compresses tightly the viscose object on the brilliant support. And, because limit structure is used for holding in the palm and the viscose object location of brilliant in accommodation space, consequently, limit structure holds in the palm with brilliant and the viscose object location in accommodation space simultaneously, can also utilize accommodation space to restrain the central line of viscose object and the central line deviation that the brilliant held in the palm, and then holds in the palm the viscose object accurate pressure on brilliant. Therefore, the utility model provides a viscose closing device can replace artifical operation of placing the weight at the viscose object that is formed on brilliant support, compresses tightly the viscose object that forms on brilliant support for the viscose object can pinpoint on brilliant support, consequently, the utility model provides a viscose closing device can improve the automation level and the production efficiency of viscose process, reduces workman intensity of labour and manufacturing cost.

In one possible implementation, the wafer support has two lug parts distributed along the length direction of the wafer support. This limit structure includes locating component and two installation departments. The positioning component is arranged on the pressure plate, and each mounting part is arranged on the surface of the positioning component contacting the corresponding ear part. At this time, the positioning assembly and the pressing block plate together form an accommodating space.

Adopt above-mentioned technical scheme's the condition, hold in the accommodation space when brilliant support and place the viscose object on brilliant support, every ear that brilliant held in the palm can be installed at corresponding installation department to make the brilliant support pass through locating component and install on the pressure board. Based on this, when the briquetting board applyed the effort to the viscose object, the viscose object not only received the pushing down effort of briquetting board, still received the brilliant support and pass through locating component and briquetting board and transmit the pushing down effort on the viscose object to make viscose object and brilliant support can be more closely firm pressfitting together.

In one possible implementation, the two mounting portions and the positioning assembly are used for restraining the deviation of the central line of the wafer support and the central line of the gluing object. For example: the arrangement positions of the two installation parts on the positioning assembly can be regulated, so that the geometric center connecting line of the two installation parts is aligned with the center line of the crystal support. Another example is: the position, shape, size and the like of the accommodating space in the positioning assembly can be adjusted, so that the deviation between the center line of the viscose object in the accommodating space and the center line of the crystal support is small.

In one possible implementation, each mounting portion is a detent.

Adopt under the circumstances of above-mentioned technical scheme, can utilize automatic grabbing device to hang the brilliant support ear that forms the viscose object in the constant head tank, the brilliant support of utilization viscose closing device installation that can be convenient.

In a possible implementation manner, the limiting structure further includes at least one elastic buffer. At least one elastic buffer piece is formed on the inner side wall of each positioning groove. The elastic buffer part is a clamp spring, a spring piece or an elastic body made of elastic materials.

Under the condition of adopting above-mentioned technical scheme, the brilliant in-process that holds in the palm the ear and stretch into the constant head tank, the ear that the brilliant held in the palm can apply the effort to at least one elastic buffer spare of corresponding constant head tank inside wall for elastic buffer spare is to the inside wall direction shrink that is close to the constant head tank. When brilliant support ear stretches into the constant head tank completely, with the help of the elastic buffer spare reaction force of this constant head tank inside wall, with brilliant support ear pinpoint in the constant head tank, reduce brilliant support because the good produced risk that drops of constant head tank location effect.

In a possible implementation manner, the positioning assembly comprises two end positioning plates arranged on the pressure plate and two lateral positioning structures. The pressure plate, the two end positioning plates and the two lateral positioning structures enclose an accommodating space. The surface of each end positioning plate facing the containing space is provided with a positioning groove used as a corresponding mounting part.

In one possible implementation, two end positioning plates are provided on the pressure plate at intervals along the first direction. The first direction is the same as the length direction of the crystal support. Two lateral positioning structures are arranged on the pressure plate at intervals along the second direction. The second direction is perpendicular to the first direction.

In a possible implementation manner, two sets of mounting through holes distributed along the second direction are formed in the pressure plate. Each set of the mounting through holes comprises at least one mounting through hole. Each lateral locating feature includes at least one mounting through-hole therein. Each limiting piece extends out of one end, facing the containing space, of the corresponding mounting through hole.

Under the condition of adopting above-mentioned technical scheme, can utilize the position that the locating part stretches out the installation through-hole to carry on spacingly to the viscose object to restrain the offset of viscose board in the second direction, thereby improve and compress tightly the operation accuracy.

In one possible implementation, the limiting member is a spring pin. The number of the installation through holes contained in each group of installation through holes is multiple. In the same group of mounting through holes, a plurality of mounting through holes are arranged on the pressure plate along the first direction, and the horizontal distances between at least two mounting through holes and the central line of the crystal support are different. At least one of the two groups of mounting through holes has the same horizontal distance with the central line of the crystal support.

Under the condition of adopting above-mentioned technical scheme, in the same group's installation through-hole, a plurality of installation through-holes are seted up on the briquetting along the first direction, and two at least installation through-holes are different with the horizontal distance of the central line that the brilliant holds in the palm for when the spring catch that every group installation through-hole was installed carries on spacingly to the viscose board, if some spring catch is extruded by the viscose board, this spring catch can be followed the installation through-hole and kept away from the one end of viscose board and stretched out, in order to avoid the spring catch to the rigidity damage that the viscose board caused. In addition, because the horizontal distance between at least one mounting through hole included by the two groups of mounting through holes and the central line of the crystal support is the same, the spring pins mounted by the mounting through holes with the same horizontal distance with the central line of the crystal support in the two groups of mounting through holes can be used for positioning the viscose object, so that the viscose object and the central line of the crystal support are superposed.

In one possible implementation, each lateral positioning structure includes a lateral positioning plate, at least two fixing plates, and at least two adjusting members. The lateral positioning plate is arranged on the corresponding fixing plate through at least two adjusting pieces, and each adjusting piece is used for adjusting the distance between the lateral positioning plate and the fixing plate.

When the viscose object is a crystal bar, under the condition that the crystal bar is thicker, the distance between the positioning plate and the fixing plate can be increased by adopting the adjusting piece, so that the positioning plates included in the two lateral positioning structures can inhibit the deviation of the crystal bar in the second direction. When the crystal bar is thinner, the distance between the positioning plate and the fixed plate can be reduced by using the adjusting member, so that the positioning plate included in the two lateral positioning structures can inhibit the crystal bar from deviating in the second direction. Therefore, the utility model provides a viscose closing device can compress tightly the operation to the crystal bar of different models, improves the accuracy that compresses tightly the operation.

In one possible implementation, the adjusting element may be a threaded spindle with a nut.

In a possible implementation manner, the adhesive pressing device further comprises a soft protection structure. The hardness of the soft protective structure is less than the hardness of the adhesive object.

When the soft protection structure is arranged on the surface of the pressure plate contacting with the viscose object, the soft protection structure can reduce the damage degree of the pressure plate to the viscose object and protect the viscose object.

When the soft protection structure is arranged on the surface of the limit structure contacting with the viscose object, the soft protection structure can reduce the damage degree of the limit structure to the viscose object and protect the viscose object.

In one possible implementation manner, the soft protection structure is an organic polymer protection structure, and the organic polymer protection structure is a rubber protection structure, a sponge protection structure, or a nylon protection structure.

In one possible implementation, the soft protection structure includes at least one soft bead. Of course, the soft protection structure may be a planar soft protection structure.

In one possible implementation manner, when the glue object is a crystal bar, the soft protection structure may be divided into a first soft protection structure and a second soft protection structure.

The first soft protective structure may comprise two flexible protective pads. Each soft protection pad is arranged on the lateral positioning plate included by the corresponding lateral positioning mechanism. Based on this, this soft protection pad can alleviate the wearing and tearing that side direction locating plate connects to the crystal bar.

The second soft protection structure may comprise a plurality of soft protection strips. Each soft protection strip extends along the length direction of the crystal bar, namely the first direction. At this time, the plurality of soft protection strips can reduce the abrasion of the pressure plate to the crystal bar.

In a second aspect, the utility model also provides an automatic viscose production line, this automatic viscose production line includes: automatic grabbing device and at least one viscose closing device. Each of the adhesive holding-down devices describes an adhesive holding-down device for the first aspect or any one of the possible implementations of the first aspect.

The automatic grabbing device is at least used for fixing the viscose pressing device, the crystal support with the viscose object and the viscose object formed on the crystal support together.

In one possible implementation, at least one of the adhesive holding-down devices comprises: the first adhesive pressing device is used for pressing the adhesive board; and the second viscose pressing device is used for pressing the crystal bar.

The beneficial effects of the automated adhesive production line provided by the second aspect or any possible implementation manner of the second aspect are the same as the beneficial effects of the adhesive pressing device described in any possible implementation manner of the first aspect or the first aspect, and are not described herein again.

Drawings

The accompanying drawings, which are described herein, serve to provide a further understanding of the invention and constitute a part of this specification, and the exemplary embodiments and descriptions thereof are provided for explaining the invention without unduly limiting it. In the drawings:

fig. 1 is a block diagram of an automated adhesive production line according to an embodiment of the present invention;

FIG. 2 is a schematic structural view of a crystal support according to an embodiment of the present invention;

fig. 3A is a schematic structural diagram of an example of an adhesive pressing device according to an embodiment of the present invention;

FIG. 3B is a schematic view of the adhesive pressing apparatus shown in FIG. 3A pressing the adhesive sheet;

fig. 4A is a schematic structural diagram of another example of the adhesive pressing device according to an embodiment of the present invention;

FIG. 4B is a schematic view of the viscose pressing apparatus shown in FIG. 4A pressing the ingot;

fig. 4C is a partial structural diagram of fig. 4A.

Reference numerals:

100-automatic gluing device, 200-automatic grabbing device, 300-viscose pressing device, 300A-first viscose pressing device, 300B-second viscose pressing device, 400-automatic temperature returning device, 500-crystal support, 600-viscose board and 700-crystal bar;

310-a pressure plate, 310A-a first group of mounting through holes, 310B-a second group of mounting through holes, 320-a limiting structure, 321-a positioning component, 3211A-a first end positioning plate, 3211B-a second end positioning plate, 2212A-a first lateral positioning structure, 2212B-a second lateral positioning structure, 322-a mounting part and 330-a soft protection structure.

Detailed Description

In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise. The meaning of "a number" is one or more unless specifically limited otherwise.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the gluing process, two steps of manual heavy punch placing and pressing operations exist to ensure the gluing effect. The first step is to manually place a heavy hammer on a sticky board after the sticky board is stuck on the crystal support. And secondly, coating the viscose on the viscose board, placing the crystal bar on the surface of the viscose board, and manually placing a heavy hammer on the crystal bar.

To the above problem, the embodiment of the utility model provides an automatic change viscose production line can replace the weight to compress tightly the operation to viscose objects such as viscose board and crystal bar automatically to reduce the human input cost of viscose production line, in order to satisfy automatic viscose production line requirement.

Fig. 1 illustrates a block diagram of an automatic adhesive production line according to an embodiment of the present invention. As shown in fig. 1, an automatic adhesive production line provided by the embodiment of the present invention includes an automatic gripping device 200 and at least one adhesive pressing device 300. Of course, the automatic glue line may further include an automatic glue spreading device 100 and an automatic temperature returning device 400.

As shown in fig. 1, the automatic gripping device 200 may be a truss robot on an automatic adhesive line, a six-arm robot, or the like, which can perform an automatic gripping function, but is not limited thereto.

As shown in fig. 1, the automatic glue applicator 100 may apply a plate glue on the wafer support 500 shown in fig. 2, and the automatic gripper 200 may grip the glue plate onto the surface of the wafer support 500 shown in fig. 2. Of course, after the glue stick is coated on the glue stick board, the automatic temperature returning device 400 returns the temperature of the crystal bar, and the automatic grabbing device 200 can grab the crystal bar after the temperature is returned to the crystal support 500.

In order to compress the adhesive objects such as the adhesive plate and the crystal bar, the adhesive compressing apparatus 300 can replace a heavy hammer with the automatic gripping apparatus 200, and perform an automatic compressing operation on the adhesive objects such as the adhesive plate and the crystal bar, so that the adhesive objects such as the adhesive plate and the crystal bar can be compressed on the crystal support 500 shown in fig. 2.

In practical applications, as shown in fig. 1, the adhesive pressing device 300 can be stored at a briquetting and material taking point. When the pressing operation is needed, the automatic grabbing device 200 such as the truss manipulator can go to the pressing block taking point to grab the adhesive pressing device, accurately position the adhesive pressing device on the crystal support 500 shown in fig. 2, and then perform the pressing operation on the adhesive object, so that the adhesive object is accurately bonded on the crystal support 500 shown in fig. 2.

As shown in fig. 1, the adhesive holding down device 300 can be divided into a first adhesive holding down device 300A and a second adhesive holding down device 300B. The first adhesive pressing device 300A is used for performing adhesive pressing on the adhesive board. The second adhesive pressing device 300B is used for performing adhesive pressing on the ingot.

As shown in fig. 1 and 2, when the automatic glue applicator 100 applies a plate glue to the adhesive surface of the wafer support, an automatic gripper 200, such as a truss robot, is used to place the plate glue on the adhesive surface of the wafer support 500. After that, the automatic grabbing device 200, such as a truss manipulator, goes to the pressing block taking point to grab the first adhesive pressing device 300A, and accurately positions the first adhesive pressing device on the crystal support 500, so as to perform pressing operation on the adhesive board. When the first adhesive pressing device 300A is left standing for a certain period of time, the adhesive sheet is accurately adhered to the crystal holder 500. At this time, the first adhesive pressing device 300A is removed from the adhesive sheet using an automatic gripping device 200 such as a truss robot; next, the automatic glue coating device 100 coats glue on the glue board, and the crystal bar heated by the automatic temperature returning device 400 is placed on the glue surface of the glue board by using the automatic gripping device 200 such as a truss manipulator. After that, the automatic gripping device 200 such as the truss manipulator goes to the pressing block taking point to grip the second adhesive pressing device 300B, and accurately positions the second adhesive pressing device on the crystal support 500, so as to perform pressing operation on the crystal bar. After the second adhesive pressing device 300B is left standing for a period of time, the crystal bar is accurately bonded to the crystal support 500 through the adhesive plate, and finally the first adhesive pressing device 300A is removed from the adhesive plate by using an automatic gripping device 200 such as a truss manipulator, thereby completing the adhesive process.

An embodiment of the utility model provides a viscose closing device, this viscose closing device is used for the viscose object on the brilliant support 500 shown in fig. 2. The adhesive object can be an adhesive plate, a crystal bar and the like. As shown in fig. 3, the head of the wafer holder 500 has protruding ears, and the protruding ears have a first head end 501A and a second head end 501B at two ends of the wafer holder 500, the first head end 501A has ears defined as a first ear 502A, and the second head end 501B has ears defined as a second ear 502B.

Fig. 3A and fig. 4A illustrate two exemplary structural schematic diagrams of an adhesive pressing device according to an embodiment of the present invention. As shown in fig. 3A and fig. 4A, the present invention provides an adhesive pressing device, which includes a pressing plate 310 and a limiting structure 320 disposed on the pressing plate.

Fig. 3B illustrates a state in which the adhesive pressing apparatus shown in fig. 3A presses the adhesive sheet. Fig. 4B is a schematic view illustrating a state in which the adhesive pressing apparatus shown in fig. 4A presses the ingot. As shown in fig. 3B and 4B, when the adhesive pressing device 300 is placed on the adhesive object by using the automatic gripping device 200 shown in fig. 1, the pressing block plate 310 and the limiting structure 320 enclose a containing space for containing the wafer holder 500 and the adhesive object. Therefore, in the gluing process, the automatic grabbing device 200 can be used to transfer the gluing pressing device 300 to the position where the gluing object is located, and control the accommodating space surrounded by the pressing plate 310 and the limiting structure 320 to align with the surface of the crystal holder 500 shown in fig. 2 where the gluing object is located, so that the crystal holder 500 and the gluing object located on the crystal holder 500 are accommodated in the accommodating space and are located in the accommodating space by the limiting structure 320. On this basis, since the limiting structure 320 is disposed on the pressing plate 310, when the wafer holder 500 and the adhesive object placed on the wafer holder 500 are accommodated in the accommodating space, the pressing plate 310 can contact the adhesive object, so as to ensure that the pressing plate 310 can apply its own weight to the adhesive object in the form of downward pressure, and press the adhesive object on the wafer holder 500 shown in fig. 2.

As shown in fig. 3B and 4B, the weight of the pressure plate 310 can be adjusted according to the adhesive object. As shown in fig. 3B, when the adhesive object is the adhesive board 600, the weight of the pressing board 310 can satisfy the pressing requirement of the adhesive board 600. It is considered that the weight of the pressure plate 310 is consistent with the weight of the weight manually placed on the adhesive plate 600, so as to ensure the standardization of the process control. As shown in fig. 4B, when the glue object is the boule 700, the weight of the boule 700 may satisfy the pressing requirement of the boule 700. It is considered that the weight of the pressure plate 310 is consistent with the weight of the weight manually placed on the ingot 700 to ensure the standardization of the process control.

As shown in fig. 3B and 4B, since the above-mentioned limiting structure 320 is used to position the wafer holder shown in fig. 2 and the adhesive object placed on the wafer holder 500 in the accommodating space, the limiting structure 320 can position the wafer holder 500 and the adhesive object shown in fig. 2 in the accommodating space, and can also utilize the accommodating space to suppress the deviation between the center line of the adhesive object and the center line of the wafer holder 500 (refer to the direction of arrow a in fig. 2, which is the same as the length direction of the wafer holder), so as to ensure that the adhesive object can be accurately positioned above the adhesive surface of the wafer holder 500 shown in fig. 2. At this time, the viscose pressing device exemplified in fig. 3A and fig. 4A can replace the manual operation of placing the weight on the viscose object placed on the crystal support 500 shown in fig. 2, and press the viscose object placed on the crystal support 500 shown in fig. 2 tightly, so that the viscose object can be accurately positioned on the crystal support 500 shown in fig. 2, therefore, the embodiment of the present invention provides a viscose pressing device 300 which can improve the automation level and the production efficiency of the viscose process, and reduce the labor intensity and the production cost of workers.

In an alternative, as shown in fig. 3A and 4A, the limiting structure 320 includes a positioning component 321. The positioning assembly 321 is disposed on the pressing plate 310, and the pressing plate 310 and the positioning assembly 321 together enclose a receiving space to receive the wafer holder 500 and the adhesive object shown in fig. 2.

To facilitate the mounting of the wafer holder 500 shown in fig. 2, as shown in fig. 3A and 4A, the limiting structure 320 may further include two mounting portions 322 for mounting the wafer holder shown in fig. 2. To facilitate mounting the wafer holder 500 shown in fig. 2, one mounting portion 322 is disposed on the surface of the positioning component 321 contacting the first ear portion 502A of the wafer holder 500, and the other mounting portion 322 is disposed on the surface of the positioning component 321 contacting the second ear portion 502B of the wafer holder 500.

As shown in fig. 3A and 4A, when the wafer holder 500 shown in fig. 2 and the adhesive object placed on the wafer holder 500 are accommodated in the accommodating space, each ear portion of the wafer holder 500 can be mounted on the corresponding mounting portion (for example, the first ear portion 502A is mounted on one of the mounting portions 322, and the second ear portion 502B is mounted on the other mounting portion 322), so that the wafer holder 500 is mounted on the pressing plate 310 through the positioning assembly 321. Based on this, when the pressure plate 310 applies a force to the adhesive object, the adhesive object is subjected to the gravity of the pressure plate 310 and the positioning member 321 on the one hand, and on the other hand, in the case where the mounting portion 322 is connected to the wafer holder 500, the pressing force of the positioning member 321 can be further strengthened. At this point, under these forces, the glue object can be pressed more tightly and firmly against the wafer holder 500 shown in fig. 2.

Further, as shown in fig. 2, 3A and 4A, the two mounting portions 322 and the positioning assembly 310 are used to suppress the deviation between the center line of the wafer holder and the center line of the adhesive object. For example: the geometric center line of the two mounting portions 322 can be aligned with the center line of the wafer holder 500 shown in fig. 2 by adjusting the positions of the two mounting portions 322 on the positioning element 321. Another example is: the location, shape, size, etc. of the receiving space in the positioning assembly can be adjusted so that the center line of the adhesive object in the receiving space has a relatively small deviation from the center line of the wafer holder 500.

As shown in fig. 3A and 4A, when the wafer holder 500 shown in fig. 2 is mounted on the mounting portion 322 in a concave-convex manner, the mounting portion may be a positioning groove. Under the condition, the adhesive pressing device 300 is transferred to the position of the adhesive object, and the positioning groove is controlled to be aligned with the lug part of the crystal support 500, so that the lug part of the crystal support 500 is clamped in the positioning groove.

In practical applications, as shown in fig. 3B and 4B, the adhesive board 600 can be placed on the crystal support 500 coated with the adhesive board glue by using a truss robot on an automatic adhesive line, and then the adhesive pressing device 300 is grabbed at a pressing block taking point by using the truss robot, the first ear 502A is hung in the positioning slot serving as one positioning portion 322, and the second ear 502B is hung in the positioning slot serving as the other positioning portion 322.

In order to ensure the positioning accuracy of the positioning groove shown in fig. 3A and 4A, the above-mentioned stopper structure further includes an elastic buffer member (not shown in fig. 3A and 4A) formed on an inner sidewall of at least one positioning groove. At least one elastic buffer piece is formed on the inner side wall of each positioning groove. At this time, the first ear portion 502A of the wafer holder 500 shown in fig. 2 extends into the positioning groove serving as one of the mounting portions 322, and the first ear portion 502A applies a certain acting force to the elastic buffer member in the positioning groove, so that the elastic buffer member contracts toward the inner side wall of the positioning groove. When the first ear 502A completely extends into the positioning groove, the first ear 502A is accurately positioned in the positioning groove by the reactive force of the elastic buffer member, thereby reducing the risk of the crystal support 500 falling due to poor positioning effect of the positioning groove shown in fig. 2. As for the effect of the second elastic buffer on the second ear portion 502B, reference may be made to the interaction between the first ear portion 502A and the first elastic buffer, which is not described herein again.

The elastic buffer member may be an annular elastic buffer member, or an annular elastic buffer member of another structure. When the elastic buffer member is an annular elastic buffer member, the annular elastic buffer member can carry out all-dimensional positioning on the crystal support lug part so as to further improve the positioning effect of the positioning groove on the crystal support lug part. It should be understood that the elastic buffer may be a snap spring, a spring plate or an elastic body. The elastic material can be rubber, sponge and the like.

In an alternative mode, as shown in fig. 3A, 3B, 4A and 4B, the positioning assembly 321 includes two end positioning plates (defining two end positioning plates as a first end positioning plate 3211A and a second end positioning plate 3211B) and two lateral positioning structures (a first lateral positioning structure 3212A and a second lateral positioning structure 3212B) disposed on the pressing plate 310. The first end positioning plate 3211A, the second end positioning plate 3211B, the first lateral positioning structure 3212A, and the second lateral positioning structure 3212B form an accommodating space. The surfaces of the first end positioning plate 3211A and the second end positioning plate 3211B facing the accommodating space are provided with positioning grooves serving as corresponding mounting portions. The first end positioning plate 3211A and the second end positioning plate 3211B may further have weight reduction grooves for reducing the weight of the end positioning plate, so as to reduce the influence of the first end positioning plate 3211A and the second end positioning plate 3211B on the pressure distribution of the pressure plate 310, so that the pressure plate 310 may apply pressure to the adhesive object uniformly.

As shown in fig. 3A and 4A, the first end positioning plate 3211A and the second end positioning plate 3211B are spaced apart from each other in the first direction on the pressure plate 310. The first direction is the same as the longitudinal direction (arrow a shown in fig. 2) of the wafer holder 500. The first lateral positioning structures 3212A are spaced apart from the platen 310 along a second direction (shown by arrow B in fig. 2), which is perpendicular to the first direction, but may not be perpendicular, as long as the first direction and the second direction have an included angle.

In practical applications, as shown in fig. 3A, 3B, 4A and 4B, the pressing plate 310 may be a rectangular pressing plate, the first direction is a length direction of the pressing plate 310, and the second direction is a width direction of the pressing plate 310. At this time, the first end positioning plate 3211A is disposed on the first wide side of the pressure plate 310, and the second end positioning plate 3211B is disposed on the second wide side of the pressure plate 310. At this time, when the adhesive object is limited in the accommodating space, the first end positioning plate 3211A and the second end positioning plate 3211B may limit the adhesive object in a length direction of the press plate 310 or a center line direction of the wafer holder (arrow a in fig. 2). The first lateral positioning structure 3212A is disposed on a first long side of the pressure plate 310, and the second lateral positioning structure 3212B is disposed on a second long side of the pressure plate 310. When the adhesive object is limited in the accommodating space, the first lateral positioning structure 3212A and the second lateral positioning structure 3212B may limit the adhesive object along a second direction or a width direction of the wafer support (arrow B in fig. 2).

As shown in fig. 3A, 3B, 4A and 4B, when the ear portion of the wafer holder 500 is mounted in the positioning slot formed in the first end positioning plate 3211A and the second end positioning plate 3211B, the first ear portion 502A extends into the positioning slot formed in the first end positioning plate 3211A. The second ear portion 502B extends into a positioning groove defined in the second end positioning plate 3211B. Meanwhile, a first head end 501A of the first ear 502A contacts with the first end positioning plate 3211A, and a second head end 501B of the second ear 502B contacts with the second end positioning plate 3211B.

As shown in fig. 3B, when the glue object is a glue board 600, if the glue board 600 is a rectangular glue board, two short edges of the glue board 600 are a first end and a second end of the glue object. As shown in fig. 4B, when the bonding object is the crystal bar 700, two ends of the crystal bar 700 are the first end and the second end of the bonding object.

In one example, as shown in fig. 3A and 3B, two sets of mounting through holes (a first set of mounting through holes 310A and a second set of mounting through holes 310B, respectively) are opened on the pressure plate 310. On the basis, each group of mounting through holes comprises at least one mounting through hole. Each lateral positioning structure comprises at least one limiting piece. Each limiting piece of each lateral positioning structure is correspondingly installed in the corresponding installation through hole, and each limiting piece extends out of the corresponding installation through hole and faces one end of the accommodating space.

As shown in fig. 3A and 3B, each set of mounting through-holes is treated as a structure such that the two sets of mounting through-holes are distributed in a manner distributed along the second direction. Based on this, when each of the side positioning structures includes each of the position-limiting members installed in the corresponding set of installation through holes, the first side positioning structure 3212A and the second side positioning structure 3212B are disposed on the pressing plate 310 along the second direction.

As shown in fig. 3A and 3B, the limiting members included in the first lateral positioning structure 3212A may be defined as a first set of limiting members, and the limiting members included in the second lateral positioning structure 3212B may be defined as a second set of limiting members. Each of the first set of limiting members can be mounted to a corresponding mounting through-hole included in the first set of mounting through-holes 210A. The limiting members included in the second set of limiting members can be mounted in the corresponding mounting through holes included in the second set of mounting through holes 210B.

As shown in fig. 3A and 3B, when the adhesive object is the adhesive board 600, the adhesive board 600 can be limited by the portion of the first set of limiting members extending out of the first set of mounting through holes 310A and the portion of the second set of limiting members extending out of the second set of mounting through holes 310B, so as to inhibit the adhesive board 600 from shifting in the second direction, thereby improving the accuracy of the pressing and limiting operation. Of course, the bonding object may also be the crystal bar 700 shown in fig. 4B, and reference may be made to the limiting principle of the bonding plate 600, which is not described herein again.

As shown in fig. 3A and 3B, in order to accommodate different sizes of adhesive objects, the first set of mounting through holes 310A and the second set of mounting through holes 310B each include a plurality of mounting through holes. In the same set of mounting through holes, a plurality of mounting through holes are formed in the pressure plate 310 along the first direction, and at least two mounting through holes have different horizontal distances from the center line of the wafer holder 500. Here, the horizontal distance means: the distance between the axis of the mounting through-hole and the center line of the wafer holder 500 in the direction parallel to the press block plate 310 is not the actual spatial distance between the axis of the mounting through-hole and the center line of the wafer holder. Of course, the actual distance between the axis of the mounting through hole and the center line of the wafer holder can be regarded as the projection length of the pressing plate 310. Based on this, when the spring pins installed in the first set of installation through holes 310A and the second set of installation through holes 310B limit the adhesive board 600, if a part of the spring pins is pressed by the adhesive board 600, the spring pins can extend from one end of the installation through holes far away from the adhesive board 600, so as to avoid the rigidity damage caused by the spring pins to the adhesive board 600.

As shown in fig. 3A and 3B, at least one of the two sets of mounting through holes has the same horizontal distance from the center line of the wafer holder. For example: when the first set of mounting through holes 310A has a mounting through hole with a horizontal distance m from the horizontal line of the wafer holder 500 shown in fig. 2, the second set of mounting through holes 310B also has a mounting through hole with a horizontal distance m from the horizontal line of the wafer holder 500 shown in fig. 2. Because the horizontal distance between at least one mounting through hole included by the two groups of mounting through holes and the central line of the crystal support 500 is the same, the spring pins mounted by the mounting through holes with the same horizontal distance with the central line of the crystal support in the two groups of mounting through holes can be utilized to position the viscose object, so that the viscose object and the central line of the crystal support are superposed, and the viscose accuracy is ensured.

For example, as shown in fig. 3A and 3B, when the pressure plate 310 is a rectangular pressure plate, the first and second mounting through holes 310A and 310B each include 8 mounting through holes. Each set of mounting through holes may include 8 mounting through holes that are respectively a first subset and a second subset. The first and second subsets each comprise 4 mounting through holes.

As shown in fig. 3A and 3B, the mounting through holes of the first subset are adjacent to the first broad side of the pressure plate 310. Along a direction away from the first wide side (away from the first end positioning plate 3211A), horizontal distances between the 4 mounting through holes included in the first sub-group and the center line of the wafer holder gradually increase. The second subset of mounting through-holes is adjacent to the second broad side of the platen plate 310. The horizontal distance between the 4 mounting through holes included in the second sub-group and the center line of the wafer holder gradually increases along the direction away from the second broadside (away from the first end positioning plate 3211A).

As shown in fig. 3A and 3B, when the horizontal distance between the mounting through hole and the center line of the wafer holder is relatively small, the spring pin mounted on the mounting through hole is relatively close to the center line of the wafer holder, so that the adhesive object with a relatively small second dimension can be limited by the spring pin mounted on the mounting through hole. When the horizontal distance between the mounting through hole and the center line of the crystal support is larger, the spring pin mounted by the mounting through hole is far away from the center line of the crystal support, so that the spring pin mounted by the mounting through hole can be used for limiting the adhesive object with larger dimension in the second direction. The following describes how to adapt to different sizes of adhesive boards in this example.

As shown in fig. 3A and 3B, it is assumed that, within the first subset included in each set of mounting through holes, the horizontal distances from the center line of the wafer holder to the 4 mounting through holes are 30cm, 25cm, 20cm and 10cm, respectively, in the direction away from the first broad side. In the second sub-group, the horizontal distances between the 4 mounting through holes and the central line of the crystal support are respectively 30cm, 25cm, 20cm and 10cm in the direction away from the second wide edge.

As shown in fig. 3A and 3B, for a 50cm wide adhesive board 600, the pin body of the spring pin, which is installed in the 25cm mounting through hole (i.e. the mounting through hole with the horizontal distance of 25cm from the center line of the wafer holder, and the mounting through holes with other sizes are referred to herein below) included in the first and second sets of mounting through holes 310A and 310B, can limit the long side of the adhesive board 600, so that the head end face of the adhesive board 600 is aligned with the head end face of the wafer holder, the center line of the adhesive board 600 (the adhesive surface of the adhesive board 600) is coincident with the center line of the wafer holder, and the adhesive board 600 does not move relative to the wafer holder. The 30cm installation through holes included in the first and second sets of installation through holes 210A and 210B are located outside the adhesive sheet 600, so that the spring pin bodies installed in the 30cm installation through holes have a certain distance from the first side edge of the adhesive sheet 600. And the 20cm and 10cm mounting through holes included in the first and second sets of mounting through holes 310A and 310B are covered by the adhesive sheet 600, so that the spring pins mounted by the 20cm and 10cm mounting through holes are pressed by the adhesive sheet 600 and retracted into the mounting through holes. Meanwhile, the spring pins installed in the installation through holes of 20cm and 10cm have certain reaction force on the adhesive plate 600, so that the adhesive plate 600 is reliably pressed on the adhesive surface of the crystal support 500.

As shown in fig. 3A and 3B, for the adhesive board 600 with a width of 40cm, the pin body of the spring pin, which is installed in the mounting through holes of 20cm included in the first and second sets of mounting through holes 310A and 310B (i.e., the mounting through holes with a horizontal distance of 20cm from the center line of the wafer holder, and other sizes of mounting through holes are referred to herein below), can limit the long side of the adhesive board 600, so that the head end face of the adhesive board 600 is aligned with the head end face of the wafer holder, the center line of the adhesive board 600 coincides with the center line of the wafer holder 500, and the adhesive board 600 does not move relative to the wafer holder 500, thereby ensuring the adhesive accuracy. The 30cm installation through holes and the 25cm installation through holes included in the first group of installation through holes 310A and the second group of installation through holes 310B are located outside the adhesive sheet 600, so that the spring pin bodies installed in the 30cm installation through holes and the 25cm installation through holes have a certain distance from the first side edge of the adhesive sheet 600. And the 10cm installation through holes included in the first and second sets of installation through holes 310A and 310B are covered by the adhesive sheet 600, so that the spring pins installed in the 10cm installation through holes are pressed by the adhesive sheet 600 and retracted into the installation through holes. Meanwhile, the spring pins installed in the installation through holes of 10cm have a certain reaction force on the adhesive sheet 600, so that the adhesive sheet 600 is reliably pressed on the adhesive surface of the wafer holder 400.

In another example, FIG. 4C illustrates a partial structural schematic of FIG. 4A. As shown in fig. 4A and 4C, each of the first lateral positioning structure 3212A and the second lateral positioning structure 3212B includes a lateral positioning plate 3212A, at least two fixing plates 3212B, and at least two adjusting members 3212C. The lateral positioning plate 3212a is disposed on the corresponding fixing plate 3212b by at least two adjusting members 3212c, and each adjusting member 3212c is used for adjusting a distance between the lateral positioning plate 3212a and the fixing plate 3212 b. The number of the fixing plates 3212b may be two, or three or more, specifically set with reference to actual requirements. Here, the adjusting member 3212c, which can adjust the distance between the fixing plate 3212b and the lateral positioning plate 3212a, is defined as the adjusting member 3212c corresponding to the lateral positioning plate 3212 a.

In practical application, as shown in fig. 4A and 4C, each adjusting member 3212C may be a screw rod with a nut, a through hole is formed in the fixing plate 3212b, one end of the screw rod passes through the through hole and is fixed to the lateral positioning plate 3212a, and the nut on the screw rod is located on one side of the fixing plate 3212b away from the lateral positioning plate 3212 a. When the distance between the fixing plate 3212b and the lateral positioning plate 3212a needs to be adjusted by 1, the nut is rotated, so that the lateral positioning plate 3212a moves in a direction approaching or departing from the fixing plate 3212 b. The following describes how to adapt to the implementation process of crystal bars with different sizes by taking the crystal bar as an example.

As shown in fig. 4A to 4C, it is assumed that the minimum distance between the lateral positioning plates 3212A included in the first lateral positioning structure 3212A and the second lateral positioning structure 3212B is 20cm, and the maximum distance is 60 cm. The two lateral positioning structures comprise lateral positioning plates 3212a having a current distance of 40 cm.

As shown in fig. 4A to 4C, when the diameter of the ingot 700 is 30cm, the distance between the lateral positioning plates 3212A included in the first lateral positioning structure 3212A and the second lateral positioning structure 3212B may be reduced by using an adjusting element 3212C, so that the distance between the lateral positioning plates 3212A included in the first lateral positioning structure 3212A and the second lateral positioning structure 3212B is equal to 30cm, thereby ensuring that both the first lateral positioning structure 3212A and the second lateral positioning structure 3212B can position the ingot 700 in the second direction. For example: when the adjusting member 3212c is a threaded rod with a nut, the nut can be rotated clockwise, so that the distance between the lateral positioning plates 3212a included in the two lateral positioning structures is equal to 30 cm.

As shown in fig. 4A to 4C, when the diameter of the ingot 700 is 20cm, the adjusting element 3212C is used to increase the distance between the lateral positioning plates 3212A included in the first lateral positioning structure 3212A and the second lateral positioning structure 3212B, so that the distance between the lateral positioning plates 3212A included in the first lateral positioning structure 3212A and the second lateral positioning structure 3212B is equal to 20cm, thereby ensuring that the first lateral positioning structure 3212A and the second lateral positioning structure 3212B can position the ingot 700 in the second direction. For example: the distance between the lateral positioning plates 3212A of the first lateral positioning structure 3212A and the second lateral positioning structure 3212B is equal to 20cm,

as shown in fig. 4A to 4C, when the bonding target is the ingot 700 shown in fig. 4B, when the ingot 700 is thicker, the adjusting member 3212C may be used to increase the distance between the positioning plate and the fixing plate 3212B, so that the positioning plates included in the two lateral positioning structures may inhibit the deviation of the ingot 700 in the second direction. When the ingot 700 is thin, the adjusting members 3212c may be used to reduce the distance between the positioning plates and the fixing plate 3212b, so that the positioning plates included in the two lateral positioning structures may inhibit the deviation of the ingot 700 in the second direction. Of course, the adhesive object can also be the adhesive board 600 shown in fig. 3B.

As shown in fig. 3A, 3B, and 4A to 4C, based on the above-mentioned structure of the adhesive bonding apparatus, the automatic gripper 200 can be used to transfer the adhesive bonding apparatus 300 to the position of the adhesive bonding object, and the mounting portion 322 and the wafer holder 500 are controlled to be aligned, so that the wafer holder 500 is mounted on the mounting portion 322. Moreover, since the position limiting structures are installed on the same side of the pressure plate 310, when the wafer holder 500 is installed on the installation part 322, the pressure plate 310 can apply pressure to the adhesive object to press the adhesive object onto the wafer holder 500. Moreover, since the mounting portion 322 is disposed on the surface of the limiting structure for contacting the adhesive object, when the wafer holder is mounted on the mounting portion 322, the adhesive object contacts the limiting structure 320, so that the limiting structure 320 limits the adhesive object, thereby ensuring that the center line of the adhesive object coincides with the center line of the wafer holder 500, and the pressing plate 310 can accurately press the adhesive object. It can be seen that the embodiment of the utility model provides a viscose closing device 300 can replace artifical operation of placing the weight at the viscose object that forms on brilliant support, compresses tightly the viscose object that forms on brilliant support for the viscose object can pinpoint on brilliant support, consequently, the utility model provides a viscose closing device 300 can improve the automation level and the production efficiency of viscose process, reduces workman intensity of labour and manufacturing cost.

In an alternative, as shown in fig. 3A and 4A, in order to protect the adhesive object, the above-mentioned position limiting structure may further include a soft protection structure 330. The soft protective structure 330 has a hardness less than the hardness of the adhesive object. In terms of material, the soft protection structure 330 may be an organic polymer protection structure such as a rubber protection structure, a sponge protection structure, or a nylon protection structure. Structurally, the soft protective structure 330 can include at least one soft bead. Of course, the soft protection structure 330 may be a planar soft protection structure.

In one example, as shown in fig. 3A and 4A, the soft protection structure 330 is disposed on a surface of the pressure plate 310 contacting the adhesive object, and the soft protection structure 330 can reduce damage to the adhesive object from the pressure plate 310 and protect the adhesive object. For example: in the application scenario of fig. 3A and 3B, the soft protection structure is disposed on the surface of the pressure plate 310 contacting the adhesive object, which may be the adhesive plate 600. The soft protective structure may be a planar nylon layer formed on the surface of the pressure block plate 310 contacting the adhesive object.

In another example, as shown in fig. 3A and 4A, when the soft protection structure 330 is disposed on the surface of the position limiting structure contacting the adhesive object, the soft protection structure 330 can reduce the damage degree of the position limiting structure to the adhesive object, and protect the adhesive object.

In the application scenarios of fig. 3A and 3B, the soft protection structure may be disposed on the surface of the pressing plate 310 forming the limiting structure 320 in a planar manner, so as to prevent the pressing plate 310 from damaging the adhesive plate 600.

In the application scenarios of fig. 4A and 4B, the soft protection structure 330 can be divided into a first soft protection structure and a second soft protection structure. The first soft protection structure may include two soft protection pads. Each soft protection pad is arranged on the lateral positioning plate 3212a included in the corresponding lateral positioning structure. Therefore, the soft protection pad can reduce the abrasion of the lateral positioning plate 3212a to the ingot 700. The second soft protection structure may comprise a plurality of soft protection strips. Each soft protection stripe extends along the length direction of the boule 700, i.e., the first direction. At this time, the plurality of soft protection bars may reduce the abrasion of the boule 700 by the pressure plates 310.

In the foregoing description of embodiments, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (10)

1. The viscose pressing device is characterized in that the viscose pressing device is used for bonding a viscose object to a crystal support; the viscose pressing device comprises a pressure plate and a limiting structure arranged on the pressure plate; the limiting structure and the pressing plate jointly form a containing space for containing the crystal support and the viscose object, the limiting structure is used for positioning the crystal support and the viscose object in the containing space, and the pressing plate is used for applying acting force to the viscose object when the viscose object is positioned in the containing space.

2. The adhesive holding device according to claim 1, wherein the wafer holder has two ears distributed along a length direction of the wafer holder; the limiting structure comprises a positioning assembly and two mounting parts; the locating component is arranged on the pressure plate, the locating component and the pressure plate jointly form the accommodating space, and each mounting part is arranged on the surface of the ear corresponding to the contact of the locating component.

3. The adhesive holding device of claim 2, wherein each mounting portion is a positioning groove, the limiting structure further comprises at least one elastic buffer member, and an inner side wall of each positioning groove forms at least one elastic buffer member; the elastic buffer part is a clamp spring, a spring piece or an elastic body made of elastic materials.

4. The adhesive holding device of claim 2, wherein the positioning assembly comprises two end positioning plates and two lateral positioning structures provided on the pressing block plate, the two end positioning plates, and the two lateral positioning structures enclosing the accommodating space; and a positioning groove used for forming the corresponding mounting part is formed in the surface, facing the accommodating space, of each end positioning plate.

5. The adhesive holding-down device according to claim 4, wherein two of the end positioning plates are disposed on the pressure plate at intervals along a first direction, the first direction being the same as the length direction of the wafer holder; the two lateral positioning structures are arranged on the pressure plate at intervals along a second direction, and the second direction is perpendicular to the first direction.

6. The adhesive holding-down device according to claim 5, wherein the pressure plate has two sets of mounting through-holes, each set of mounting through-holes includes at least one mounting through-hole, and each lateral positioning structure includes at least one limiting member; each limiting piece of each lateral positioning structure is correspondingly installed in the corresponding group of installation through holes, and each limiting piece extends out of one end, facing the accommodating space, of the corresponding installation through hole; wherein,

each limiting piece is a spring pin; each group of the mounting through holes comprises a plurality of mounting through holes; in the same group of the mounting through holes, a plurality of the mounting through holes are arranged on the pressure plate along the first direction, and the horizontal distances between at least two mounting through holes and the central line of the crystal support are different.

7. The adhesive holding-down device according to claim 4, wherein each of the lateral positioning structures comprises a lateral positioning plate, at least two fixing plates, and at least two adjusting pieces; the lateral positioning plate is arranged on the corresponding fixing plate through at least two adjusting pieces, and each adjusting piece is used for adjusting the distance between the lateral positioning plate and the fixing plate.

8. The adhesive pressing device according to any one of claims 1 to 7, wherein the adhesive pressing apparatus further comprises a soft protective structure, the hardness of which is less than the hardness of the adhesive object; wherein,

the soft protection structure is arranged on the surface of the pressing block plate contacting the viscose object; and/or the presence of a gas in the gas,

the soft protection structure is arranged on the surface of the limiting structure contacting the viscose object; and/or the presence of a gas in the gas,

the soft protection structure is a rubber protection structure, a sponge protection structure or a nylon protection structure; and/or the presence of a gas in the gas,

the soft protection structure comprises at least one soft pressing strip; or,

the soft protection structure is a planar soft protection structure.

9. An automatic change viscose production line which characterized in that includes:

at least one said adhesive holding down device, each said adhesive holding down device being according to any one of claims 1 to 8;

and the automatic grabbing device is at least used for fixing the viscose pressing device, the crystal support with the viscose object and the viscose object formed on the crystal support together.

10. The automated adhesive production line of claim 9, wherein the at least one adhesive holding down device comprises:

the first adhesive pressing device is used for pressing the adhesive board;

and the second viscose pressing device is used for pressing the crystal bar.

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