CN214627499U - Circuit board convenient to heat dissipation - Google Patents
Circuit board convenient to heat dissipation Download PDFInfo
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- CN214627499U CN214627499U CN202120263257.1U CN202120263257U CN214627499U CN 214627499 U CN214627499 U CN 214627499U CN 202120263257 U CN202120263257 U CN 202120263257U CN 214627499 U CN214627499 U CN 214627499U
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- circuit board
- heat
- heat dissipation
- surface wall
- screw
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Abstract
The utility model discloses a circuit board convenient for heat dissipation, which comprises an upper shell, a circuit board substrate and a lower shell, wherein the inner surface wall of the top end of the upper shell is provided with a fixed bearing seat, one side of the inner surface wall of the upper shell is provided with a vent hole, and one end of the fixed bearing seat is provided with a connecting bearing; this circuit board convenient to heat dissipation, screw hole swing joint through the screw that sets up upper casing bottom and the interior table wall in circuit board base member top, the screw of circuit board base member bottom and the screw hole swing joint of the interior table wall in lower floor's casing top, the circuit board can produce the heat at the during operation, the heat can be absorbed by the absorber plate, the swing joint who utilizes screw and screw hole can make between the device closely closed, the heat gets into in the radiator net through the heat absorption hole, the heat passes through the radiator net, the operation that utilizes small-size fan can make the heat dissipation partly, another part dissipates to the air through the bleeder vent, accomplish the exchange of cold and hot air, reach the radiating effect of being convenient for.
Description
Technical Field
The utility model relates to a A technical field specifically is a circuit board convenient to heat dissipation.
Background
A wiring board is an important electronic component, is a support for an electronic component, and is a provider of electrical connection of the electronic component. With the rapid development of the electronic industry, the electronic circuit board is increasingly applied to the industrial fields of electronics, communication, power supply, automobiles, motors and the like.
The prior art has the following defects or problems:
1. when the existing circuit board works, certain heat can be generated, so that the internal temperature of the equipment is rapidly increased, if the heat is not timely dissipated, the circuit board can be continuously heated, devices can fail due to overheating, the reliability of the electronic equipment can be reduced, and the practicability is poor;
2. when the existing circuit board works, the service life is reduced due to the fact that the existing circuit board is in contact with air due to poor sealing performance and is affected with damp.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a weak point to prior art, provide a circuit board convenient to heat dissipation to solve the problem that proposes in the background art.
In order to achieve the above object, the utility model provides a following technical scheme: a circuit board convenient for heat dissipation comprises an upper shell, a circuit board substrate and a lower shell, wherein a fixed bearing seat is arranged on the inner surface wall of the top end of the upper shell, air holes are formed in one side of the inner surface wall of the upper shell, a connecting bearing is arranged at one end of the fixed bearing seat, a material containing layer is arranged on the inner surface wall of the upper shell, a small fan is arranged inside the material containing layer, a connecting hole is formed in the inner surface wall of the top end of the material containing layer, a heat dissipation net is arranged at the bottom end of the material containing layer, a screw is fixedly arranged at the bottom end of the heat dissipation net, a heat absorption plate is fixedly arranged on the inner surface wall of the top end of the circuit board substrate, a heat absorption hole is formed in the inner surface wall of the top end of the heat absorption plate, a threaded hole is formed in the inner surface wall of the top end of the heat absorption plate at one side of the heat absorption hole, and a heat dissipation fin is arranged on the inner surface wall of the bottom end of the circuit board substrate, the inside of lower floor's casing is provided with the heat dissipation layer, the bottom on heat dissipation layer is provided with the nano material layer.
As an optimal technical scheme of the utility model, the inner wall on nanometer material layer is provided with nanometer material pipe, the quantity of nanometer material pipe is a plurality of, every nanometer material pipe's the same, every both ends of nanometer material pipe all with the interior table wall both sides in close contact with of nanometer material layer, every nanometer material pipe's inside all is provided with the dry granule of nanometer material.
As the utility model discloses an optimized technical scheme, the internal diameter size of fixed bearing frame and the external diameter size phase-match of connecting the bearing, the one end and the fixed bearing frame transmission of connecting the bearing are connected, the other end of connecting the bearing pass through the connecting hole with small-size fan transmission is connected.
As the preferred technical scheme of the utility model, radiating fin's material is copper aluminum alloy, radiating fin and the interior table wall in bottom of circuit board base member in close contact with.
As the utility model discloses a preferred technical scheme, the material of absorber plate is organic polymer high temperature resistant material, the quantity of absorber plate is two, every a plurality of has all been seted up to the table wall in the top of absorber plate the heat absorption hole.
As the utility model discloses an optimized technical scheme, the bottom of upper casing and the bottom of circuit board base member all are provided with the screw, every the size of screw is the same, threaded hole has all been seted up to the table wall in the top of two absorber plates, the external diameter size of screw and the internal diameter size phase-match of screw hole, the length size and the thickness size phase-match of absorber plate of screw.
As the utility model discloses a preferred technical scheme, the quantity of bleeder vent is a plurality of, every the bleeder vent size is the same, every bleeder vent evenly distributed.
Compared with the prior art, the utility model provides a circuit board convenient to heat dissipation possesses following beneficial effect:
1. the circuit board convenient for heat dissipation is movably connected with the threaded hole in the inner surface wall of the top end of the circuit board substrate through the screw arranged at the bottom end of the upper layer of the shell, the screw at the bottom end of the circuit board substrate is movably connected with the threaded hole in the inner surface wall of the top end of the lower layer of the shell, heat can be generated when the circuit board works, the heat can be absorbed by the heat absorbing plate, the devices can be tightly closed through the movable connection of the screw and the threaded hole, the heat enters the heat dissipation net through the heat absorbing hole, the heat can be dissipated into one part through the heat dissipation net by the operation of a small fan, the other part is dissipated into the air through the air holes, the exchange of cold air and hot air is completed, and the effect of facilitating heat dissipation is achieved;
2. this circuit board convenient to heat dissipation through both ends and the nano material layer both sides in close contact with that set up a plurality of nano material pipe, and the dry granule of nano material is placed at the intraductal close closure of nano material, contains moisture in the air, and long-time contact can make the circuit board wet and damage, utilizes dry granule to carry out the drying of moisture, reaches the effect that utilizes the new material dampproofing, extension circuit board life.
Drawings
Fig. 1 is a schematic view of the overall structure of a circuit board convenient for heat dissipation according to the present invention;
fig. 2 is a schematic front plan view of an internal structure of an upper housing of a circuit board convenient for heat dissipation according to the present invention;
fig. 3 is a schematic diagram of the internal structure of the circuit board substrate of the circuit board convenient for heat dissipation according to the present invention;
fig. 4 is a schematic view of the internal structure of the lower casing of the circuit board convenient for heat dissipation according to the present invention;
fig. 5 is a schematic plane view of the internal structure of the nanomaterial layer of the circuit board convenient for heat dissipation according to the present invention.
In the figure: 1. an upper shell; 2. a circuit board substrate; 3. a lower shell; 4. fixing a bearing seat; 5. air holes are formed; 6. connecting a bearing; 7. placing a layer; 8. a small fan; 9. connecting holes; 10. a heat-dissipating web; 11. a screw; 12. a heat absorbing plate; 13. a heat absorption hole; 14. a threaded hole; 15. a heat dissipating fin; 16. a heat dissipation layer; 17. a layer of nanomaterial; 18. a nanomaterial tube; 19. the nanomaterial is dry particles.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-5, in this embodiment: a circuit board convenient for heat dissipation comprises an upper shell 1, a circuit board base body 2 and a lower shell 3, wherein a fixed bearing seat 4 is arranged on the inner surface wall of the top end of the upper shell 1, an air vent 5 is formed in one side of the inner surface wall of the upper shell 1, a connecting bearing 6 is arranged at one end of the fixed bearing seat 4, a storage layer 7 is arranged on the inner surface wall of the upper shell 1, a small fan 8 is arranged inside the storage layer 7, a connecting hole 9 is formed in the inner surface wall of the top end of the storage layer 7, a heat dissipation net 10 is arranged at the bottom end of the storage layer 7, a screw 11 is fixedly arranged at the bottom end of the heat dissipation net 10, a heat absorption plate 12 is fixedly arranged on the inner surface wall of the top end of the circuit board base body 2, a heat absorption hole 13 is formed in the inner surface wall of the top end of the heat absorption plate 12, a threaded hole 14 is formed in the inner surface wall of one side of the heat absorption hole 13 and positioned at the top end of the heat absorption plate 12, a heat dissipation fin 15 is arranged on the inner surface wall of the bottom end of the circuit board base body 2, the inside of lower floor's casing 3 is provided with heat dissipation layer 16, and the bottom of heat dissipation layer 16 is provided with nano material layer 17.
In this embodiment, the inner wall of the nanomaterial layer 17 is provided with a plurality of nanomaterial tubes 18, each nanomaterial tube 18 has the same size, both ends of each nanomaterial tube 18 are in close contact with both sides of the inner surface wall of the nanomaterial layer 17, and the inside of each nanomaterial tube 18 is provided with nanomaterial dry particles 19, so that the effect of damp proofing by using a new material is achieved; the inner diameter of the fixed bearing seat 4 is matched with the outer diameter of the connecting bearing 6, one end of the connecting bearing 6 is in transmission connection with the fixed bearing seat 4, the other end of the connecting bearing 6 is in transmission connection with the small fan 8 through the connecting hole 9, and the effect of stable operation of the small fan 8 is achieved through the arrangement; the radiating fins 15 are made of copper-aluminum alloy materials, the radiating fins 15 are in close contact with the inner surface wall of the bottom end of the circuit board substrate 2, and the effect of preventing the circuit board substrate 2 from being damaged due to high temperature is achieved through the arrangement; the heat absorbing plates 12 are made of organic high-polymer high-temperature-resistant materials, the number of the heat absorbing plates 12 is two, and a plurality of heat absorbing holes 13 are formed in the inner surface wall of the top end of each heat absorbing plate 12, so that the heat absorbing effect is achieved; the bottom end of the upper shell 1 and the bottom end of the circuit board substrate 2 are both provided with screws 11, each screw 11 is the same in size, the inner surface wall of the top ends of the two heat absorbing plates 12 is provided with a threaded hole 14, the outer diameter size of each screw 11 is matched with the inner diameter size of the threaded hole 14, the length size of each screw 11 is matched with the thickness size of the heat absorbing plate 12, and the integrity effect of the device is achieved through the arrangement; the number of the air holes 5 is a plurality, the size of each air hole 5 is the same, and the air holes 5 are uniformly distributed, so that the heat dissipation effect is achieved.
The utility model discloses a theory of operation and use flow: a circuit board convenient for heat dissipation is characterized in that when a user uses the circuit board, a small fan 8 is firstly placed in a placing layer 7, one end of a connecting bearing 6 is in transmission connection with the small fan 8 through a connecting hole 9, the other end of the connecting bearing 6 is in transmission connection with a fixed bearing seat 4, the small fan 8 is powered on, the effect of stable operation can be achieved, a screw 11 at the bottom end of an upper layer shell 1 is movably connected with a threaded hole 14 on the inner surface wall at the top end of a circuit board base body 2, the screw 11 at the bottom end of the circuit board base body 2 is movably connected with the threaded hole 14 on the inner surface wall at the top end of a lower layer shell body to form a complete heat dissipation device, the circuit board can generate heat during working, the heat at the front side of the circuit board base body 2 can be absorbed by a heat absorption plate 12, the heat enters a heat dissipation net 10 through a heat absorption hole 13, the heat dissipation net 10 enters the upper layer shell body 1, and the heat can be dissipated partially by the operation of the small fan 8, the other part is dissipated into the air through the air holes 5 to achieve a radiating effect, heat on the back face of the circuit board base body 2 can be absorbed by the radiating fins 15, the heat dissipated by the radiating fins 15 is absorbed by the heat absorbing plate 12 and is also discharged into the air through the air holes 5 on the inner surface wall of the radiating layer 16 to complete exchange of cold air and hot air, the radiating effect is achieved, moisture is contained in the air, the circuit board can be affected with damp and damaged due to long-time contact, the two ends of the nano material tubes 18 are in close contact with the two sides of the nano material layer 17, the nano material dry particles 19 are placed in the nano material tubes 18 to be closed tightly, and the effect of utilizing new materials to prevent moisture is achieved.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. The utility model provides a circuit board convenient to heat dissipation which characterized in that: the heat dissipation device comprises an upper shell (1), a circuit board base body (2) and a lower shell (3), wherein a fixed bearing seat (4) is arranged on the top inner surface wall of the upper shell (1), air holes (5) are formed in one side of the inner surface wall of the upper shell (1), a connecting bearing (6) is arranged at one end of the fixed bearing seat (4), a material containing layer (7) is arranged on the inner surface wall of the upper shell (1), a small fan (8) is arranged inside the material containing layer (7), a connecting hole (9) is formed in the top inner surface wall of the material containing layer (7), a heat dissipation net (10) is arranged at the bottom end of the material containing layer (7), a screw (11) is fixedly arranged at the bottom end of the heat dissipation net (10), a heat absorption plate (12) is fixedly arranged on the top inner surface wall of the circuit board base body (2), and a heat absorption hole (13) is formed in the top inner surface wall of the circuit board (12), the heat-absorbing plate is characterized in that a threaded hole (14) is formed in the inner surface wall of one side of the heat-absorbing hole (13) and located at the top end of the heat-absorbing plate (12), heat-radiating fins (15) are arranged on the inner surface wall of the bottom end of the circuit board substrate (2), a heat-radiating layer (16) is arranged inside the lower-layer shell (3), and a nanometer material layer (17) is arranged at the bottom end of the heat-radiating layer (16).
2. A circuit board for facilitating heat dissipation according to claim 1, wherein: the inner wall of the nanometer material layer (17) is provided with nanometer material pipes (18), the number of the nanometer material pipes (18) is a plurality, the size of each nanometer material pipe (18) is the same, two ends of each nanometer material pipe (18) are in close contact with two sides of the inner surface wall of the nanometer material layer (17), and nanometer material dry particles (19) are arranged inside each nanometer material pipe (18).
3. A circuit board for facilitating heat dissipation according to claim 1, wherein: the inner diameter of the fixed bearing seat (4) is matched with the outer diameter of the connecting bearing (6), one end of the connecting bearing (6) is in transmission connection with the fixed bearing seat (4), and the other end of the connecting bearing (6) is in transmission connection with the small fan (8) through a connecting hole (9).
4. A circuit board for facilitating heat dissipation according to claim 1, wherein: the heat dissipation fins (15) are made of copper-aluminum alloy, and the heat dissipation fins (15) are in close contact with the inner surface wall of the bottom end of the circuit board base body (2).
5. A circuit board for facilitating heat dissipation according to claim 1, wherein: the heat absorbing plates (12) are made of organic high-polymer high-temperature-resistant materials, the number of the heat absorbing plates (12) is two, and a plurality of heat absorbing holes (13) are formed in the inner surface wall of the top end of each heat absorbing plate (12).
6. A circuit board for facilitating heat dissipation according to claim 1, wherein: the heat absorption plate is characterized in that screws (11) are arranged at the bottom end of the upper shell (1) and the bottom end of the circuit board substrate (2), the size of each screw (11) is the same, threaded holes (14) are formed in the inner surface walls of the top ends of the two heat absorption plates (12), the outer diameter size of each screw (11) is matched with the inner diameter size of each threaded hole (14), and the length size of each screw (11) is matched with the thickness size of each heat absorption plate (12).
7. A circuit board for facilitating heat dissipation according to claim 1, wherein: the number of the air holes (5) is a plurality, the size of each air hole (5) is the same, and the air holes (5) are uniformly distributed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120263257.1U CN214627499U (en) | 2021-01-30 | 2021-01-30 | Circuit board convenient to heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120263257.1U CN214627499U (en) | 2021-01-30 | 2021-01-30 | Circuit board convenient to heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214627499U true CN214627499U (en) | 2021-11-05 |
Family
ID=78439570
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120263257.1U Active CN214627499U (en) | 2021-01-30 | 2021-01-30 | Circuit board convenient to heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214627499U (en) |
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2021
- 2021-01-30 CN CN202120263257.1U patent/CN214627499U/en active Active
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