CN214623124U

CN214623124U - Array wavelength division multiplexing receiver assembly

Info

Publication number: CN214623124U
Application number: CN202121142940.6U
Authority: CN
Inventors: 张丽; 曾姗姗; 孙瑶; 官良鹏
Original assignee: Finisar Optoelectronic Communication Shanghai Co ltd
Current assignee: Finisar Optoelectronic Communication Shanghai Co ltd
Priority date: 2021-05-25
Filing date: 2021-05-25
Publication date: 2021-11-05
Anticipated expiration: 2031-05-25

Abstract

The utility model relates to a encapsulate optical module technical field altogether, specifically be an array wavelength division multiplexing receiver subassembly, including the subassembly main part, the subassembly main part includes an array plane optical waveguide chip and the semiconductor photodetector that is used for thick wavelength division multiplexing, array plane optical waveguide chip one side is connected with the total input end, the subassembly main part is equipped with first output, second output, third output and fourth output, every multiplexing/demultiplexing unit of array plane optical waveguide chip is equipped with the dispersion structure that an input waveguide, four output waveguides and wavelength multiplex/demultiplex respectively, through the novel subassembly main part that sets up, can realize a plurality of wavelength division multiplexing device functions in less size, has improved the practical scope of receiver subassembly.

Description

Array wavelength division multiplexing receiver assembly

Technical Field

The utility model relates to a encapsulate optical module technical field altogether, specifically be an array wavelength division multiplexing receiver subassembly.

Background

At present, a coarse wavelength division multiplexing component design for a pluggable module of a data center comprises a coarse wavelength division multiplexing (CWDM4) array Planar Lightwave Circuit (PLC) chip and a semiconductor Photodetector (PD) component, wherein the PLC and the PD are both mounted on the surface of a PCBA, the PLC chip is one-in-four-out, light of four wavelengths transmitted in an optical fiber is separated and enters four light-emitting waveguides, a 45-degree reflecting surface is ground on a light-emitting side, and the light-emitting is deflected downwards and enters a PD light-receiving surface.

At present, the size of a receiver component is large, and the receiver component is difficult to be applied to a co-packaged module with high integration level, at present, the chip size of 1x4 is about 2x10mm, and only one wavelength division multiplexing function of CWDM4 can be realized, while a typical co-packaged module requires that 16 CWDM4 functions are realized within about 2x20mm chip size, which is equivalent to that the integration level of a chip per unit area needs to be improved by 8 times, resulting in great troubles in practical use.

Therefore, there is a need to design an arrayed wavelength division multiplexing receiver assembly to solve the above-mentioned problems in the background art.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an array wavelength division multiplexing receiver subassembly to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

the utility model provides an array wavelength division multiplexing receiver subassembly, includes the subassembly main part, the subassembly main part includes an array plane optical waveguide chip and the semiconductor optical detector that is used for thick wavelength division multiplexing, array plane optical waveguide chip one side is connected with the total input end, the subassembly main part is equipped with first output, second output, third output and fourth output, array plane optical waveguide chip comprises a plurality of multiplexing/demultiplexing array unit, and every array unit contains a unit input waveguide end, four unit output waveguide ends and dispersion structure.

As the utility model discloses preferred scheme, array planar lightwave circuit chip adopts three sides business turn over array 16x64CWDM4 PLC chip, and wherein one side advances light, and both sides light-emitting, it contains 16 CWDM4 wavelength division multiplexing units, corresponds 64 PD arrays and 8 CWDM4 units, corresponds 32 PD arrays.

As the preferred scheme of the utility model, semiconductor light detector stands vertically in plane optical waveguide chip both sides.

As the utility model discloses preferred scheme, array plane optical waveguide chip is equipped with the trilateral polishing for input/output terminal surface, and its trilateral polishing can be less than and equal to 8 degrees angle polishing, and wherein the minor face side end face sets up 16 way light guide of advancing, and two long limit side end faces respectively set up 32 way light guide.

As the utility model discloses preferred scheme, array planar lightwave circuit chip's light-emitting waveguide falls into four groups, 16 of every group, and the waveguide interval 250um in the group, this interval is unanimous with the PD battle array interval.

As the preferred scheme of the utility model, semiconductor light detector photosurface aligns with planar optical waveguide chip waveguide play plain noodles.

As the utility model discloses preferred scheme, array plane optical waveguide chip's total input is connected with fiber array, and fiber array contains 16 optic fibre, interval 127 um.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses in, through the novel subassembly main part that sets up, this subassembly main part includes that one is used for thick wavelength division complex array plane optical waveguide chip and semiconductor light detector, the utility model discloses improved current receiver subassembly, can realize a plurality of wavelength division multiplexing device functions in less size through this novel subassembly main part, adopt trilateral business turn over array 16x64CWDM4 PLC chip, array PD chip is stood vertically in PLC chip both sides to realize compact size, improved receiver subassembly's practical scope.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is a schematic top view of the present invention;

FIG. 3 is an enlarged schematic view of point A of the present invention;

fig. 4 is a schematic diagram of a point B amplifying structure and a schematic diagram of a multiplexing/demultiplexing unit according to the present invention;

fig. 5 is a schematic view of the installation structure of the present invention;

in the figure: 1. a component body; 101. a planar optical waveguide chip; 1011. a first output terminal; 1012. a second output terminal; 1013. a third output terminal; 1014. a fourth output terminal; 102. a semiconductor photodetector; 103. a main input terminal; 104. a unit input waveguide end; 105. a unit output waveguide end; 106. a dispersive structure.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, rather than all embodiments, and all other embodiments obtained by a person of ordinary skill in the art without creative work belong to the scope of the present invention based on the embodiments of the present invention.

Please refer to fig. 1-5, the present invention provides a technical solution:

an array wavelength division multiplexing receiver assembly comprises an assembly main body 1, the assembly main body 1 comprises a planar optical waveguide chip 101 and a semiconductor optical detector 102 which are used for array coarse wavelength division multiplexing, one side of the planar optical waveguide chip 101 is connected with a general input end 103, the assembly main body 1 is provided with a first output end 1011, a second output end 1012, a third output end 1013 and a fourth output end 1014, the planar optical waveguide chip 101 is composed of a plurality of multiplexing/demultiplexing array units, two sides of each array unit are respectively connected with a unit input waveguide end 104 and four unit output waveguide ends 105, the inner ends of the unit input waveguide end 104 and the unit output waveguide ends 105 are connected with a dispersion structure 106, the utility model improves the existing receiver assembly, through the novel component main body 1, the functions of a plurality of wavelength division multiplexing devices can be realized in a smaller size, and the practical range of the receiver component is improved.

In an embodiment, referring to fig. 1 and 5, a planar optical waveguide chip 101 employs a three-sided in-and-out array 16x64CWDM4 PLC chip, wherein one side is in light and two sides are out light, and the planar optical waveguide chip includes 16 CWDM4 wavelength division multiplexing units corresponding to 64 PD arrays, a semiconductor photodetector 102 is vertically standing on two sides of the planar optical waveguide chip 101, and the size of the planar optical waveguide chip 101 is 2x20mm, since the array CWDM4 wavelength division multiplexing module includes a three-sided in-and-out 16x64CWDM4 PLC array chip and a PD array chip with chips standing vertically on two sides of the PLC chip, the array PLC array chip size is 2x20mm, which can implement 16 CWDM4 functions, each of the array CWDM4 wavelength division multiplexing/demultiplexing is a one-in-four-out structure, four typical wavelengths of CWDM4 are 1270nm,1290nm,1310nm,1330nm, and 20nm apart from each other, and the unit structure for implementing the CWDM wavelength division multiplexing function by the array PLC chip may have multiple CWDM4, such as arrayed waveguide grating, Mach-Zehnder interferometer, etched diffraction grating, wherein four 1x16 array PD chips are arranged perpendicular to the PLC chip to realize compact size, and the scale of the PD array can be adjusted according to the yield and specific application of the PD chips.

In an embodiment, referring to fig. 2, fig. 3, and fig. 4, the planar optical waveguide chip is provided with three-side polishing for input and output end surfaces, the three-side polishing is 8-degree polishing, wherein a short-side end surface is provided with 16 light-entering waveguides, two long-side end surfaces are respectively provided with 32 light-exiting waveguides, the light-exiting waveguides of the planar optical waveguide chip 101 are divided into four groups, each group includes 16 waveguides, an inter-group waveguide interval is 250um, the interval needs to be consistent with a PD array interval, the three-side polishing of the array PLC chip is used as an input and output end surface, the three-side polishing is 8-degree polishing for reducing light path reflected light, the short-side end surface is provided with 16 light-entering waveguides, the two long-side end surfaces are respectively provided with 32 light-exiting waveguides, the light-exiting waveguides are divided into four groups, each group includes 16 waveguides, and the inter-group waveguide interval is 250um, the interval is consistent with the PD array interval, thereby realizing multiple functions of the wavelength division multiplexing device.

The working principle is as follows: when in use, according to fig. 1, the array CWDM4 wavelength division multiplexing module comprises a 16x64CWDM4 PLC array chip with three sides entering and exiting and a PD array chip with the chip vertically standing on both sides of the PLC chip, the array PLC array chip has a size of 2x20mm, and realizes 16 CWDM4 functions, each CWDM4 wavelength division device is of a one-in-four-out structure, and multiplexes/demultiplexes four wavelength signal lights, four typical wavelengths of the CWDM4 are 1270nm,1290nm,1310nm and 1330nm, and are spaced from each other by 20nm, and the array PLC chip can have various unit structures for realizing the CWDM4 wavelength division multiplexing function, such as an array waveguide grating, a mach-zehnder interferometer, and an etched diffraction grating; as shown in fig. 2, three surfaces of the array PLC chip are polished as input and output end surfaces, the three surfaces are polished at an angle of 8 degrees for reducing light reflected back by the light path, the end surface on the short side is provided with 16 light incoming waveguides, the end surfaces on the two long sides are respectively provided with 32 light outgoing waveguides, the light outgoing waveguides are divided into four groups, each group has 16 waveguides, the interval between the waveguides in the group is 250um, and the interval is required to be consistent with the interval between the PD arrays; as shown in fig. 5, four 1 × 16 array PD chips are placed perpendicular to the PLC chip to realize a compact size, and the scale of the PD array can be adjusted according to the PD chip yield and the specific application, where each PD array chip includes 16 PD units, and the PD photosensitive surface is aligned with the PLC waveguide light-emitting surface.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. An array wavelength division multiplex receiver assembly comprising an assembly body (1), characterized in that: the module main body (1) includes an array planar optical waveguide chip (101) and a semiconductor optical detector (102) that are used for thick wavelength division multiplexing, planar optical waveguide chip (101) one side is connected with total input end (103), module main body (1) is equipped with first output (1011), second output (1012), third output (1013) and fourth output (1014), array planar optical waveguide chip (101) comprises a plurality of multiplexing/demultiplexing array units, and the both sides of every array unit are connected with a unit input waveguide end (104) and four unit output waveguide ends (105) respectively, unit input waveguide end (104) and unit output waveguide end (105) inner are connected with dispersion structure (106).

2. An arrayed wavelength division multiplexed receiver assembly in accordance with claim 1 wherein: the array planar optical waveguide chip (101) adopts a three-surface in-and-out array 16x64CWDM4 PLC chip, wherein one surface enters light, and two sides exit light, and the array planar optical waveguide chip comprises 16 CWDM4 wavelength division multiplexing units, corresponding to 64 PD arrays and 8 CWDM4 units, and corresponding to 32 PD arrays.

3. An arrayed wavelength division multiplexed receiver assembly in accordance with claim 1 wherein: the semiconductor light detector (102) is vertically erected on two sides of the array planar optical waveguide chip (101).

4. An arrayed wavelength division multiplexed receiver assembly in accordance with claim 1 wherein: the array planar optical waveguide chip (101) is provided with three-surface polishing for input and output end surfaces, the three-surface polishing can be less than or equal to 8-degree polishing, a short-side end surface is provided with 16 paths of light inlet waveguides, and two long-side end surfaces are respectively provided with 32 paths of light outlet waveguides.

5. An arrayed wavelength division multiplexed receiver assembly in accordance with claim 1 wherein: the light-emitting waveguides of the array planar optical waveguide chip (101) are divided into four groups, each group comprises 16 waveguides, the spacing between the waveguides in each group is 250um, and the spacing is consistent with that of the PD array.

6. An arrayed wavelength division multiplexed receiver assembly in accordance with claim 1 wherein: and the light sensing surface of the semiconductor optical detector (102) is aligned with the waveguide light emitting surface of the array planar optical waveguide chip (101).

7. An arrayed wavelength division multiplexed receiver assembly in accordance with claim 1 wherein: the total input end (103) of the array planar optical waveguide chip (101) is connected with an optical fiber array, and the optical fiber array comprises 16 optical fibers and is spaced by 127 micrometers.