CN113126218A - Array wavelength division multiplexing receiver assembly - Google Patents
Array wavelength division multiplexing receiver assembly Download PDFInfo
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- CN113126218A CN113126218A CN202110574312.3A CN202110574312A CN113126218A CN 113126218 A CN113126218 A CN 113126218A CN 202110574312 A CN202110574312 A CN 202110574312A CN 113126218 A CN113126218 A CN 113126218A
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- array
- wavelength division
- division multiplexing
- optical waveguide
- planar optical
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- 230000003287 optical effect Effects 0.000 claims abstract description 39
- 239000004065 semiconductor Substances 0.000 claims abstract description 12
- 239000006185 dispersion Substances 0.000 claims abstract description 4
- 238000005498 polishing Methods 0.000 claims description 11
- 238000003491 array Methods 0.000 claims description 6
- 239000013307 optical fiber Substances 0.000 claims description 6
- 239000000835 fiber Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4215—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical elements being wavelength selective optical elements, e.g. variable wavelength optical modules or wavelength lockers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/60—Receivers
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Optical Couplings Of Light Guides (AREA)
- Optical Integrated Circuits (AREA)
Abstract
本发明涉及共封装光模块技术领域，具体为一种阵列波分复用接收机组件，包括组件主体，所述组件主体包括一个用于粗波分复的阵列平面光波导芯片和半导体光探测器，所述阵列平面光波导芯片一侧连接有总输入端，所述组件主体设有第一输出端、第二输出端、第三输出端以及第四输出端，所述阵列平面光波导芯片的每个复用/解复用单元分别设有一根输入波导、四根输出波导和波长复用/解复用的色散结构，通过设置的新型组件主体，可以在比较小的尺寸内实现多个波分复用器件功能，提高了接收机组件的实用范围。
The invention relates to the technical field of co-packaged optical modules, in particular to an array wavelength division multiplexing receiver assembly, comprising an assembly main body, wherein the assembly main body includes an array planar optical waveguide chip for coarse wavelength division multiplexing and a semiconductor photodetector , one side of the array planar optical waveguide chip is connected with a total input end, the component body is provided with a first output end, a second output end, a third output end and a fourth output end, the array planar optical waveguide chip has a Each multiplexing/demultiplexing unit is respectively provided with one input waveguide, four output waveguides and a wavelength multiplexing/demultiplexing dispersion structure. By setting a new type of component body, multiple wavelengths can be realized in a relatively small size. The multiplexing device function increases the practical range of the receiver assembly.
Description
Technical Field
The invention relates to the technical field of co-packaged optical modules, in particular to an array wavelength division multiplexing receiver assembly.
Background
At present, a coarse wavelength division multiplexing component design for a pluggable module of a data center comprises a coarse wavelength division multiplexing (CWDM4) array Planar Lightwave Circuit (PLC) chip and a semiconductor Photodetector (PD) component, wherein the PLC and the PD are both mounted on the surface of a PCBA, the PLC chip is one-in-four-out, light of four wavelengths transmitted in an optical fiber is separated and enters four light-emitting waveguides, a 45-degree reflecting surface is ground on a light-emitting side, and the light-emitting is deflected downwards and enters a PD light-receiving surface.
At present, the size of a receiver component is large, and the receiver component is difficult to be applied to a co-packaged module with high integration level, at present, the chip size of 1x4 is about 2x10mm, and only one wavelength division multiplexing function of CWDM4 can be realized, while a typical co-packaged module requires that 16 CWDM4 functions are realized within about 2x20mm chip size, which is equivalent to that the integration level of a chip per unit area needs to be improved by 8 times, resulting in great troubles in practical use.
Therefore, there is a need to design an arrayed wavelength division multiplexing receiver assembly to solve the above-mentioned problems in the background art.
Disclosure of Invention
It is an object of the present invention to provide an arrayed wavelength division multiplexing receiver assembly that solves the problems set forth in the background above.
In order to achieve the purpose, the invention provides the following technical scheme:
the utility model provides an array wavelength division multiplexing receiver subassembly, includes the subassembly main part, the subassembly main part includes an array plane optical waveguide chip and the semiconductor optical detector that is used for thick wavelength division multiplexing, array plane optical waveguide chip one side is connected with the total input end, the subassembly main part is equipped with first output, second output, third output and fourth output, array plane optical waveguide chip comprises a plurality of multiplexing/demultiplexing array unit, and every array unit contains a unit input waveguide end, four unit output waveguide ends and dispersion structure.
As a preferable scheme of the invention, the array planar lightwave circuit chip adopts a three-surface in-and-out array 16x64CWDM4PLC chip, wherein one surface enters light, and two sides exit light, and the array planar lightwave circuit chip comprises 16 CWDM4 wavelength division multiplexing units, corresponding to 64 PD arrays and 8 CWDM4 units, and corresponding to 32 PD arrays.
As a preferable scheme of the invention, the semiconductor light detector is vertically erected on two sides of the planar optical waveguide chip.
As a preferable scheme of the present invention, the array planar optical waveguide chip is provided with three-side polishing for an input-output end surface, the three-side polishing can be performed at an angle of less than or equal to 8 degrees, wherein a short-side end surface is provided with 16 light-entering waveguides, and two long-side end surfaces are respectively provided with 32 light-exiting waveguides.
As a preferable scheme of the invention, the light-emitting waveguides of the array planar optical waveguide chip are divided into four groups, each group comprises 16 waveguides, the spacing between the waveguides in the group is 250um, and the spacing is consistent with that of the PD array.
As a preferable scheme of the invention, the light sensing surface of the semiconductor optical detector is aligned with the light-emitting surface of the waveguide of the planar optical waveguide chip.
As a preferable scheme of the invention, the total input end of the array planar optical waveguide chip is connected with an optical fiber array, and the optical fiber array comprises 16 optical fibers at intervals of 127 um.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, through the novel assembly main body, the assembly main body comprises the array planar optical waveguide chip and the semiconductor optical detector which are used for coarse wavelength division multiplexing, the existing receiver assembly is improved, the functions of a plurality of wavelength division multiplexing devices can be realized in a smaller size through the novel assembly main body, a three-side access array 16x64CWDM4PLC chip is adopted, the array PD chip is vertically erected on two sides of the PLC chip so as to realize a compact size, and the practical range of the receiver assembly is improved.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic top view of the present invention;
FIG. 3 is an enlarged view of point A of the present invention;
FIG. 4 is a schematic diagram of an enlarged structure at point B and a schematic diagram of a multiplexing/demultiplexing unit according to the present invention;
FIG. 5 is a schematic view of the mounting structure of the present invention;
in the figure: 1. a component body; 101. a planar optical waveguide chip; 1011. a first output terminal; 1012. a second output terminal; 1013. a third output terminal; 1014. a fourth output terminal; 102. a semiconductor photodetector; 103. a main input terminal; 104. a unit input waveguide end; 105. a unit output waveguide end; 106. a dispersive structure.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, rather than all embodiments, and all other embodiments obtained by a person of ordinary skill in the art without any creative work based on the embodiments of the present invention belong to the protection scope of the present invention.
Referring to fig. 1-5, the present invention provides a technical solution:
an array wavelength division multiplexing receiver assembly comprises an assembly main body 1, wherein the assembly main body 1 comprises a planar optical waveguide chip 101 and a semiconductor optical detector 102 which are used for array coarse wavelength division multiplexing, one side of the planar optical waveguide chip 101 is connected with a main input end 103, the assembly main body 1 is provided with a first output end 1011, a second output end 1012, a third output end 1013 and a fourth output end 1014, the planar optical waveguide chip 101 consists of a plurality of multiplexing/demultiplexing array units, two sides of each array unit are respectively connected with a unit input waveguide end 104 and four unit output waveguide ends 105, the inner ends of the unit input waveguide end 104 and the unit output waveguide ends 105 are connected with a dispersion structure 106, the invention improves the existing receiver assembly, through the novel component main body 1, the functions of a plurality of wavelength division multiplexing devices can be realized in a smaller size, and the practical range of the receiver component is improved.
In an embodiment, referring to fig. 1 and 5, a planar optical waveguide chip 101 employs a three-sided in-and-out array 16x64CWDM4PLC chip, wherein one side is in light and two sides are out light, and the planar optical waveguide chip includes 16 CWDM4 wavelength division multiplexing units corresponding to 64 PD arrays, a semiconductor photodetector 102 is vertically standing on two sides of the planar optical waveguide chip 101, and the size of the planar optical waveguide chip 101 is 2x20mm, since the array CWDM4 wavelength division multiplexing module includes a three-sided in-and-out 16x64CWDM4PLC array chip and a PD array chip with chips standing vertically on two sides of the PLC chip, the array PLC array chip size is 2x20mm, which can implement 16 CWDM4 functions, each of the array CWDM4 wavelength division multiplexing/demultiplexing is a one-in-four-out structure, four typical wavelengths of CWDM4 are 1270nm,1290nm,1310nm,1330nm, and 20nm apart from each other, and the unit structure for implementing the CWDM wavelength division multiplexing function by the array PLC chip may have multiple CWDM4, such as arrayed waveguide grating, Mach-Zehnder interferometer, etched diffraction grating, wherein four 1x16 array PD chips are arranged perpendicular to the PLC chip to realize compact size, and the scale of the PD array can be adjusted according to the yield and specific application of the PD chips.
In an embodiment, referring to fig. 2, fig. 3, and fig. 4, the planar optical waveguide chip is provided with three-side polishing for input and output end surfaces, the three-side polishing is 8-degree polishing, wherein a short-side end surface is provided with 16 light-entering waveguides, two long-side end surfaces are respectively provided with 32 light-exiting waveguides, the light-exiting waveguides of the planar optical waveguide chip 101 are divided into four groups, each group includes 16 waveguides, an inter-group waveguide interval is 250um, the interval needs to be consistent with a PD array interval, the three-side polishing of the array PLC chip is used as an input and output end surface, the three-side polishing is 8-degree polishing for reducing light path reflected light, the short-side end surface is provided with 16 light-entering waveguides, the two long-side end surfaces are respectively provided with 32 light-exiting waveguides, the light-exiting waveguides are divided into four groups, each group includes 16 waveguides, and the inter-group waveguide.
The working principle is as follows: when in use, according to fig. 1, the array CWDM4 wavelength division multiplexing module comprises a 16x64CWDM4PLC array chip with three sides entering and exiting and a PD array chip with the chip vertically standing on both sides of the PLC chip, the array PLC array chip has a size of 2x20mm, and realizes 16 CWDM4 functions, each CWDM4 wavelength division device is of a one-in-four-out structure, and multiplexes/demultiplexes four wavelength signal lights, four typical wavelengths of the CWDM4 are 1270nm,1290nm,1310nm and 1330nm, and are spaced from each other by 20nm, and the array PLC chip can have various unit structures for realizing the CWDM4 wavelength division multiplexing function, such as an array waveguide grating, a mach-zehnder interferometer, and an etched diffraction grating; as shown in fig. 2, three surfaces of the array PLC chip are polished as input and output end surfaces, the three surfaces are polished at an angle of 8 degrees for reducing light reflected back by the light path, the end surface on the short side is provided with 16 light incoming waveguides, the end surfaces on the two long sides are respectively provided with 32 light outgoing waveguides, the light outgoing waveguides are divided into four groups, each group has 16 waveguides, the interval between the waveguides in the group is 250um, and the interval is required to be consistent with the interval between the PD arrays; as shown in fig. 5, four 1 × 16 array PD chips are placed perpendicular to the PLC chip to realize a compact size, and the scale of the PD array can be adjusted according to the PD chip yield and the specific application, where each PD array chip includes 16 PD units, and the PD photosensitive surface is aligned with the PLC waveguide light-emitting surface.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110574312.3A CN113126218A (en) | 2021-05-25 | 2021-05-25 | Array wavelength division multiplexing receiver assembly |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110574312.3A CN113126218A (en) | 2021-05-25 | 2021-05-25 | Array wavelength division multiplexing receiver assembly |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006113465A (en) * | 2004-10-18 | 2006-04-27 | Showa Electric Wire & Cable Co Ltd | Waveguide type optical multiplexing/demultiplexing circuit |
| JP2008242257A (en) * | 2007-03-28 | 2008-10-09 | Furukawa Electric Co Ltd:The | Array waveguide grating multiplexer/demultiplexer |
| JP2009008952A (en) * | 2007-06-28 | 2009-01-15 | Nippon Telegr & Teleph Corp <Ntt> | Optical module |
| CN105222895A (en) * | 2015-10-14 | 2016-01-06 | 厦门大学 | A kind of spectrometer chip being integrated with array waveguide grating and photodetector |
| CN214623124U (en) * | 2021-05-25 | 2021-11-05 | 菲尼萨光电通讯(上海)有限公司 | Array wavelength division multiplexing receiver assembly |
-
2021
- 2021-05-25 CN CN202110574312.3A patent/CN113126218A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006113465A (en) * | 2004-10-18 | 2006-04-27 | Showa Electric Wire & Cable Co Ltd | Waveguide type optical multiplexing/demultiplexing circuit |
| JP2008242257A (en) * | 2007-03-28 | 2008-10-09 | Furukawa Electric Co Ltd:The | Array waveguide grating multiplexer/demultiplexer |
| JP2009008952A (en) * | 2007-06-28 | 2009-01-15 | Nippon Telegr & Teleph Corp <Ntt> | Optical module |
| CN105222895A (en) * | 2015-10-14 | 2016-01-06 | 厦门大学 | A kind of spectrometer chip being integrated with array waveguide grating and photodetector |
| CN214623124U (en) * | 2021-05-25 | 2021-11-05 | 菲尼萨光电通讯(上海)有限公司 | Array wavelength division multiplexing receiver assembly |
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