CN113126218A

CN113126218A - Array wavelength division multiplexing receiver assembly

Info

Publication number: CN113126218A
Application number: CN202110574312.3A
Authority: CN
Inventors: 张丽; 曾姗姗; 孙瑶; 官良鹏
Original assignee: Finisar Optoelectronic Communication Shanghai Co ltd
Current assignee: Finisar Optoelectronic Communication Shanghai Co ltd
Priority date: 2021-05-25
Filing date: 2021-05-25
Publication date: 2021-07-16

Abstract

The invention relates to the technical field of co-packaged optical modules, in particular to an array wavelength division multiplexing receiver assembly, which comprises an assembly main body, wherein the assembly main body comprises an array planar optical waveguide chip and a semiconductor optical detector, the array planar optical waveguide chip is used for coarse wavelength division multiplexing, one side of the array planar optical waveguide chip is connected with a main input end, the assembly main body is provided with a first output end, a second output end, a third output end and a fourth output end, each multiplexing/demultiplexing unit of the array planar optical waveguide chip is respectively provided with an input waveguide, four output waveguides and a wavelength multiplexing/demultiplexing dispersion structure, and through the novel assembly main body, the functions of a plurality of wavelength division multiplexing devices can be realized in a smaller size, and the practical range of the receiver assembly is improved.

Description

Array wavelength division multiplexing receiver assembly

Technical Field

The invention relates to the technical field of co-packaged optical modules, in particular to an array wavelength division multiplexing receiver assembly.

Background

At present, a coarse wavelength division multiplexing component design for a pluggable module of a data center comprises a coarse wavelength division multiplexing (CWDM4) array Planar Lightwave Circuit (PLC) chip and a semiconductor Photodetector (PD) component, wherein the PLC and the PD are both mounted on the surface of a PCBA, the PLC chip is one-in-four-out, light of four wavelengths transmitted in an optical fiber is separated and enters four light-emitting waveguides, a 45-degree reflecting surface is ground on a light-emitting side, and the light-emitting is deflected downwards and enters a PD light-receiving surface.

At present, the size of a receiver component is large, and the receiver component is difficult to be applied to a co-packaged module with high integration level, at present, the chip size of 1x4 is about 2x10mm, and only one wavelength division multiplexing function of CWDM4 can be realized, while a typical co-packaged module requires that 16 CWDM4 functions are realized within about 2x20mm chip size, which is equivalent to that the integration level of a chip per unit area needs to be improved by 8 times, resulting in great troubles in practical use.

Therefore, there is a need to design an arrayed wavelength division multiplexing receiver assembly to solve the above-mentioned problems in the background art.

Disclosure of Invention

It is an object of the present invention to provide an arrayed wavelength division multiplexing receiver assembly that solves the problems set forth in the background above.

In order to achieve the purpose, the invention provides the following technical scheme:

the utility model provides an array wavelength division multiplexing receiver subassembly, includes the subassembly main part, the subassembly main part includes an array plane optical waveguide chip and the semiconductor optical detector that is used for thick wavelength division multiplexing, array plane optical waveguide chip one side is connected with the total input end, the subassembly main part is equipped with first output, second output, third output and fourth output, array plane optical waveguide chip comprises a plurality of multiplexing/demultiplexing array unit, and every array unit contains a unit input waveguide end, four unit output waveguide ends and dispersion structure.

As a preferable scheme of the invention, the array planar lightwave circuit chip adopts a three-surface in-and-out array 16x64CWDM4PLC chip, wherein one surface enters light, and two sides exit light, and the array planar lightwave circuit chip comprises 16 CWDM4 wavelength division multiplexing units, corresponding to 64 PD arrays and 8 CWDM4 units, and corresponding to 32 PD arrays.

As a preferable scheme of the invention, the semiconductor light detector is vertically erected on two sides of the planar optical waveguide chip.

As a preferable scheme of the present invention, the array planar optical waveguide chip is provided with three-side polishing for an input-output end surface, the three-side polishing can be performed at an angle of less than or equal to 8 degrees, wherein a short-side end surface is provided with 16 light-entering waveguides, and two long-side end surfaces are respectively provided with 32 light-exiting waveguides.

As a preferable scheme of the invention, the light-emitting waveguides of the array planar optical waveguide chip are divided into four groups, each group comprises 16 waveguides, the spacing between the waveguides in the group is 250um, and the spacing is consistent with that of the PD array.

As a preferable scheme of the invention, the light sensing surface of the semiconductor optical detector is aligned with the light-emitting surface of the waveguide of the planar optical waveguide chip.

As a preferable scheme of the invention, the total input end of the array planar optical waveguide chip is connected with an optical fiber array, and the optical fiber array comprises 16 optical fibers at intervals of 127 um.

Compared with the prior art, the invention has the beneficial effects that:

1. according to the invention, through the novel assembly main body, the assembly main body comprises the array planar optical waveguide chip and the semiconductor optical detector which are used for coarse wavelength division multiplexing, the existing receiver assembly is improved, the functions of a plurality of wavelength division multiplexing devices can be realized in a smaller size through the novel assembly main body, a three-side access array 16x64CWDM4PLC chip is adopted, the array PD chip is vertically erected on two sides of the PLC chip so as to realize a compact size, and the practical range of the receiver assembly is improved.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic top view of the present invention;

FIG. 3 is an enlarged view of point A of the present invention;

FIG. 4 is a schematic diagram of an enlarged structure at point B and a schematic diagram of a multiplexing/demultiplexing unit according to the present invention;

FIG. 5 is a schematic view of the mounting structure of the present invention;

in the figure: 1. a component body; 101. a planar optical waveguide chip; 1011. a first output terminal; 1012. a second output terminal; 1013. a third output terminal; 1014. a fourth output terminal; 102. a semiconductor photodetector; 103. a main input terminal; 104. a unit input waveguide end; 105. a unit output waveguide end; 106. a dispersive structure.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, rather than all embodiments, and all other embodiments obtained by a person of ordinary skill in the art without any creative work based on the embodiments of the present invention belong to the protection scope of the present invention.

Referring to fig. 1-5, the present invention provides a technical solution:

an array wavelength division multiplexing receiver assembly comprises an assembly main body 1, wherein the assembly main body 1 comprises a planar optical waveguide chip 101 and a semiconductor optical detector 102 which are used for array coarse wavelength division multiplexing, one side of the planar optical waveguide chip 101 is connected with a main input end 103, the assembly main body 1 is provided with a first output end 1011, a second output end 1012, a third output end 1013 and a fourth output end 1014, the planar optical waveguide chip 101 consists of a plurality of multiplexing/demultiplexing array units, two sides of each array unit are respectively connected with a unit input waveguide end 104 and four unit output waveguide ends 105, the inner ends of the unit input waveguide end 104 and the unit output waveguide ends 105 are connected with a dispersion structure 106, the invention improves the existing receiver assembly, through the novel component main body 1, the functions of a plurality of wavelength division multiplexing devices can be realized in a smaller size, and the practical range of the receiver component is improved.

In an embodiment, referring to fig. 1 and 5, a planar optical waveguide chip 101 employs a three-sided in-and-out array 16x64CWDM4PLC chip, wherein one side is in light and two sides are out light, and the planar optical waveguide chip includes 16 CWDM4 wavelength division multiplexing units corresponding to 64 PD arrays, a semiconductor photodetector 102 is vertically standing on two sides of the planar optical waveguide chip 101, and the size of the planar optical waveguide chip 101 is 2x20mm, since the array CWDM4 wavelength division multiplexing module includes a three-sided in-and-out 16x64CWDM4PLC array chip and a PD array chip with chips standing vertically on two sides of the PLC chip, the array PLC array chip size is 2x20mm, which can implement 16 CWDM4 functions, each of the array CWDM4 wavelength division multiplexing/demultiplexing is a one-in-four-out structure, four typical wavelengths of CWDM4 are 1270nm,1290nm,1310nm,1330nm, and 20nm apart from each other, and the unit structure for implementing the CWDM wavelength division multiplexing function by the array PLC chip may have multiple CWDM4, such as arrayed waveguide grating, Mach-Zehnder interferometer, etched diffraction grating, wherein four 1x16 array PD chips are arranged perpendicular to the PLC chip to realize compact size, and the scale of the PD array can be adjusted according to the yield and specific application of the PD chips.

In an embodiment, referring to fig. 2, fig. 3, and fig. 4, the planar optical waveguide chip is provided with three-side polishing for input and output end surfaces, the three-side polishing is 8-degree polishing, wherein a short-side end surface is provided with 16 light-entering waveguides, two long-side end surfaces are respectively provided with 32 light-exiting waveguides, the light-exiting waveguides of the planar optical waveguide chip 101 are divided into four groups, each group includes 16 waveguides, an inter-group waveguide interval is 250um, the interval needs to be consistent with a PD array interval, the three-side polishing of the array PLC chip is used as an input and output end surface, the three-side polishing is 8-degree polishing for reducing light path reflected light, the short-side end surface is provided with 16 light-entering waveguides, the two long-side end surfaces are respectively provided with 32 light-exiting waveguides, the light-exiting waveguides are divided into four groups, each group includes 16 waveguides, and the inter-group waveguide.

The working principle is as follows: when in use, according to fig. 1, the array CWDM4 wavelength division multiplexing module comprises a 16x64CWDM4PLC array chip with three sides entering and exiting and a PD array chip with the chip vertically standing on both sides of the PLC chip, the array PLC array chip has a size of 2x20mm, and realizes 16 CWDM4 functions, each CWDM4 wavelength division device is of a one-in-four-out structure, and multiplexes/demultiplexes four wavelength signal lights, four typical wavelengths of the CWDM4 are 1270nm,1290nm,1310nm and 1330nm, and are spaced from each other by 20nm, and the array PLC chip can have various unit structures for realizing the CWDM4 wavelength division multiplexing function, such as an array waveguide grating, a mach-zehnder interferometer, and an etched diffraction grating; as shown in fig. 2, three surfaces of the array PLC chip are polished as input and output end surfaces, the three surfaces are polished at an angle of 8 degrees for reducing light reflected back by the light path, the end surface on the short side is provided with 16 light incoming waveguides, the end surfaces on the two long sides are respectively provided with 32 light outgoing waveguides, the light outgoing waveguides are divided into four groups, each group has 16 waveguides, the interval between the waveguides in the group is 250um, and the interval is required to be consistent with the interval between the PD arrays; as shown in fig. 5, four 1 × 16 array PD chips are placed perpendicular to the PLC chip to realize a compact size, and the scale of the PD array can be adjusted according to the PD chip yield and the specific application, where each PD array chip includes 16 PD units, and the PD photosensitive surface is aligned with the PLC waveguide light-emitting surface.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. An array wavelength division multiplex receiver assembly comprising an assembly body (1), characterized in that: the module main body (1) includes an array planar optical waveguide chip (101) and a semiconductor optical detector (102) that are used for thick wavelength division multiplexing, planar optical waveguide chip (101) one side is connected with total input end (103), module main body (1) is equipped with first output (1011), second output (1012), third output (1013) and fourth output (1014), array planar optical waveguide chip (101) comprises a plurality of multiplexing/demultiplexing array units, and the both sides of every array unit are connected with a unit input waveguide end (104) and four unit output waveguide ends (105) respectively, unit input waveguide end (104) and unit output waveguide end (105) inner are connected with dispersion structure (106).

2. An arrayed wavelength division multiplexed receiver assembly in accordance with claim 1 wherein: the array planar optical waveguide chip (101) adopts a three-surface in-and-out array 16x64CWDM4PLC chip, wherein one surface is used for light entering, and two sides are used for light exiting, and the array planar optical waveguide chip comprises 16 CWDM4 wavelength division multiplexing units, 64 corresponding PD arrays and 8 CWDM4 units, and 32 corresponding PD arrays.

3. An arrayed wavelength division multiplexed receiver assembly in accordance with claim 1 wherein: the semiconductor light detector (102) is vertically erected on two sides of the array planar optical waveguide chip (101).

4. An arrayed wavelength division multiplexed receiver assembly in accordance with claim 1 wherein: the array planar optical waveguide chip (101) is provided with three-surface polishing for input and output end surfaces, the three-surface polishing can be less than or equal to 8-degree polishing, a short-side end surface is provided with 16 paths of light inlet waveguides, and two long-side end surfaces are respectively provided with 32 paths of light outlet waveguides.

5. An arrayed wavelength division multiplexed receiver assembly in accordance with claim 1 wherein: the light-emitting waveguides of the array planar optical waveguide chip (101) are divided into four groups, each group comprises 16 waveguides, the spacing between the waveguides in each group is 250um, and the spacing is consistent with that of the PD array.

6. An arrayed wavelength division multiplexed receiver assembly in accordance with claim 1 wherein: and the light sensing surface of the semiconductor optical detector (102) is aligned with the waveguide light emitting surface of the array planar optical waveguide chip (101).

7. An arrayed wavelength division multiplexed receiver assembly in accordance with claim 1 wherein: the total input end (103) of the array planar optical waveguide chip (101) is connected with an optical fiber array, and the optical fiber array comprises 16 optical fibers and is spaced by 127 micrometers.