CN214612740U

CN214612740U - Wafer evaporation tray for improving back metallization quality

Info

Publication number: CN214612740U
Application number: CN202120353426.0U
Authority: CN
Inventors: 徐占勤; 王德波; 陈鹏捷
Original assignee: Jiangsu Xinshun Microelectronics Co ltd
Current assignee: Jiangsu Xinshun Microelectronics Co ltd
Priority date: 2021-02-08
Filing date: 2021-02-08
Publication date: 2021-11-05
Anticipated expiration: 2031-02-08

Abstract

The utility model relates to a promote wafer evaporation pan of back metallization quality belongs to integrated circuit or discrete device and makes technical field. The evaporation disc comprises an evaporation disc body, wherein a storage groove is formed in the upper surface of the evaporation disc body, a TFL ring is sleeved on the evaporation disc body and is arranged on the upper portion of the storage groove, a wafer is arranged on the TFL ring, and the TFL ring is in line contact with the wafer. The longitudinal section of the storage groove is funnel-shaped. The upper ring surface of the TFL ring is an inclined surface structural member which is inclined inwards. In the application, the TFL ring is sleeved on the evaporation disc body, the wafer is placed on the TFL ring and is in line contact with the TFL ring, so that the contact area between the wafer and the TFL ring is reduced, and the utilization rate of the wafer is improved; because the TFL is soft, the friction between the front die of the wafer and the storage groove of the evaporation disc body is avoided, the die on the front side of the wafer is prevented from being pressed and scratched, and the product yield is improved.

Description

Wafer evaporation tray for improving back metallization quality

Technical Field

The utility model relates to a promote wafer evaporation pan of back metallization quality belongs to integrated circuit or discrete device and makes technical field.

Background

In the wafer manufacturing process before the back metallization, a plurality of complicated processes such as diffusion, photolithography and the like are required to form a chip with electrical performance, and the back of the chip in an integrated circuit or a discrete device is generally used as an electrode, and the chip electrode has excellent ohmic contact characteristics, so that the back metallization process is required. The back side metallization process is also an important step in the manufacturing of semiconductor chips, so the quality of the back side metallization is especially important. The key to back side metallization is to control the quality of the front side active die and the back side metallization.

At present, the evaporation process is performed in a high-temperature high-vacuum environment, and the evaporation tray for loading the wafer is made of a metal material. In order to ensure that the wafer is well fixed on the small evaporation disc during the back metallization process, the small evaporation disc must have steps with a certain width so as to contact with the surface of the wafer, so that the small evaporation disc can better fix the wafer. However, if the edge step of the evaporation tray is wide, the utilization rate of the silicon wafer is reduced. In addition, although the silicon wafer is reserved with an invalid area with a certain width, the back surface metallization is manually operated, so that the silicon wafer cannot be accurately positioned, and the front surface effective tube core is easily contacted with the small evaporation disc to generate pressure scratch, so that the yield and the performance of the product are influenced.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that a wafer evaporating dish that promotes back metallization quality is provided to above-mentioned prior art, improves the utilization ratio of wafer, avoids the positive effective tube core of wafer to press the scotch, improves the product yield.

The utility model provides a technical scheme that above-mentioned problem adopted does: the wafer evaporation disc comprises an evaporation disc body, wherein a storage groove is formed in the upper surface of the evaporation disc body, a TFL ring is sleeved on the evaporation disc body and arranged on the upper portion of the storage groove, a wafer is arranged on the TFL ring, and the TFL ring is in line contact with the wafer.

The longitudinal section of the storage groove is funnel-shaped.

The upper ring surface of the TFL ring is an inclined surface structural member which is inclined inwards.

Compared with the prior art, the utility model has the advantages of: a wafer evaporation disc for improving back metallization quality is provided, in the application, a TFL ring is sleeved on an evaporation disc body, a wafer is placed on the TFL ring, and the wafer is in line contact with the TFL ring, so that the contact area of the wafer and the TFL ring is reduced, and the utilization rate of the wafer is improved; because the TFL is soft, the friction between the front die of the wafer and the storage groove of the evaporation disc body is avoided, the die on the front side of the wafer is prevented from being pressed and scratched, and the product yield is improved.

Drawings

Fig. 1 is a schematic view of an evaporation pan body in a wafer evaporation pan for improving back metallization quality according to an embodiment of the present invention;

fig. 2 is a schematic view of a TFL ring in a wafer evaporation pan for improving the back metallization quality according to an embodiment of the present invention;

in the figure 1 evaporation tray body, 2TFL ring.

Detailed Description

The present invention will be described in further detail with reference to the following embodiments.

As shown in fig. 1 and 2, the wafer evaporation pan for improving the back metallization quality in the embodiment includes an evaporation pan body 1, wherein a storage slot is formed on the upper surface of the evaporation pan body 1, the longitudinal section of the upper portion of the storage slot is conical, the longitudinal section of the lower portion of the storage slot is rectangular, and the conical bottom is smoothly connected with the top of the rectangular, so that the longitudinal section of the storage slot is funnel-shaped. The evaporation disc body 1 is sleeved with a TFL ring 2, and the TFL ring 2 is arranged at the upper part of the storage groove. The upper ring surface of the TFL ring 2 is an inclined surface inclined inward, and a wafer is placed on the upper ring surface of the TFL ring 2, so that the TFL ring 2 and the wafer are in line contact.

TFL ring 2 is the abbreviation of teflon ring in this application, and the texture of teflon ring is softer, has avoided the positive tube core of wafer and evaporation disc body to put the friction in thing groove, has avoided the positive tube core of wafer to press the scotch, has improved the product yield. The wafer is in line contact with the TFL ring, so that the contact area of the wafer and the TFL ring is reduced, and the utilization rate of the wafer is improved.

In addition to the above embodiments, the present invention also includes other embodiments, and all technical solutions formed by equivalent transformation or equivalent replacement should fall within the protection scope of the claims of the present invention.

Claims

1. The utility model provides a promote wafer evaporating pan of back metallization quality which characterized in that: the evaporation disc comprises an evaporation disc body (1), wherein a storage groove is formed in the upper surface of the evaporation disc body (1), a TFL ring (2) is sleeved on the evaporation disc body (1), the TFL ring (2) is arranged on the upper portion of the storage groove, a wafer is arranged on the TFL ring (2), and the TFL ring (2) is in line contact with the wafer.

2. A wafer evaporation pan for improving backside metallization quality as claimed in claim 1, wherein: the longitudinal section of the storage groove is funnel-shaped.

3. A wafer evaporation pan for improving backside metallization quality as claimed in claim 1, wherein: the upper ring surface of the TFL ring (2) is an inward inclined plane structural member.