CN214562038U - Splitting machine capable of automatically cleaning waste materials - Google Patents

Abstract

The utility model discloses a splitting machine capable of automatically cleaning waste materials, which belongs to the technical field of cutting equipment of chip electronic components, and comprises a frame platform, wherein a protection cabinet is erected above the frame platform and is a smooth and stable working reference platform; cutting guard box, form for vertical baffle end to end, top and bottom opening, it is vertical set firmly in rack platform top, noncontacting erects between raw materials slide rail and finished product slide rail, the glass fiber board has been increased, come to provide protection and buffering for the cutting knife, avoid the cutting knife to damage, so unsuitable blow off the discarded leftover bits of surely falling with the air current, and this device brushes away the leftover bits of surely falling through cleaning the cylinder, can effectively avoid the condition that wind blows scattered, the condition that the leftover bits will block the device in the cutting machine has also been avoided, and this device can clean through cleaning the cylinder, sweep the leftover bits to same direction, and fight through the garbage collection and collect, avoid scattering everywhere in the rack platform.

Description

Splitting machine capable of automatically cleaning waste materials

Technical Field

The utility model relates to a piece formula electronic component's cutting equipment technical field especially relates to a cutting machine that can clean the waste material automatically.

Background

Along with the development of science and technology, electronic products are more and more in variety, increasingly powerful in function and smaller in size. This requires that the main electronic components of the electronic product, such as capacitors, resistors, inductors, sensors, etc., be made as small as possible and have as high a reliability as possible. At present, chip ceramic electronic components are mainly adopted, and the chip ceramic electronic components have excellent insulating property, heat resistance, durability and other aspects. Therefore, the manufacture, sale, and use of chip-type ceramic electronic components have been vigorously developed.

When the chip electronic components are manufactured, a cutting machine is needed to cut the laminated large-material electronic components in the previous process, a whole large chip electronic component is cut into a plurality of pieces of electronic components with smaller areas according to the design size requirement, and the cutting size requirement meets the edge size requirement of the subsequent trimming, so that each piece of electronic component is cut for many times from different angles through the cutting machine, the cutting times of the cutting machine are more than those of a common cutting machine, the cutting of the more times is carried out on the central line of the large electronic component, the central lines of the rotated electronic components are overlapped, and when the cutting machine is used for cutting, the blades and the cutting platform are very easy to wear.

For example, the application date is 2019, 03, 28, send chinese utility model patent application No. 201920410926.6, the publication number is CN210453274U, specifically disclose an automatic cutout machine, it includes body structure, the microscope carrier, detect positioning mechanism, cutting mechanism, parts such as control system and two guide rails, it is through the focus that reduces microscope carrier and loading board, around pitch moment of torsion reduces, improve running accuracy and life, realize the pressure of accurate regulation cutter parent, in order to satisfy the user demand of different ceramic diaphragms, prevent to crush ceramic diaphragm, improve the stability of product cutting simultaneously, guarantee the cutting quality.

This kind of cutting device, during the cutting, all can produce waste leftover bits, these leftover bits can remain on the microscope carrier of cutting always after cutting away, it is more troublesome, these rubbish not only can influence the precision of cutting next time, also can block at electronic component bottom or top, lead to the unable accurate electronic component of cutting knife to cut, still can block the ccd detector to cutting gap and electronic component's monitoring sight, lead to the condition of misjudgement, current this kind of electronic component's cleaning generally blows off through the air current, the mode that can blow the air current can make tiny leftover bits fly away, block the slide rail or other rotating device of equipment easily, lead to equipment to be blocked and shut down or equipment blocks and breaks down.

Based on this, the utility model designs a can clean cutting machine of waste material automatically to solve above-mentioned problem.

Disclosure of Invention

An object of the utility model is to provide a cutting machine that can clean waste material automatically, glass fiber board has been increased, come to provide protection and buffering for the cutting knife, avoid the cutting knife to damage, so unsuitable with the air current blow away surely discarded leftover bits that fall, this device is brushed away through the leftover bits that clean the cylinder with surely falling moreover, can effectively avoid the condition that wind blows scattered, the condition that the device in the leftover bits will be cut and cut blocks has also been avoided, and this device can clean through cleaning the cylinder, sweep leftover bits to same direction, and collect through the garbage collection fill, avoid scattering everywhere in the rack platform.

The utility model discloses a realize like this: a slitting machine capable of automatically sweeping waste material, comprising:

a protective cabinet is erected above the rack table and is a smooth and stable working reference table;

the cutting protection box is formed by connecting vertical partition plates end to end, the periphery of the cutting protection box is closed, the top and the bottom of the cutting protection box are opened, the cutting protection box is vertically and fixedly arranged at the top of the stand platform,

a cutting slide rail is horizontally erected in the cutting device, and a cutting table is horizontally arranged on the cutting slide rail in a sliding manner;

the cutting knife is arranged on a rotating shaft of the knife rest lifting motor, the knife rest lifting motor is horizontally erected on the cutting fixing frame through an air cylinder, the cutting fixing frame is arranged on the machine frame, the cutting fixing frame is erected right above the cutting slide rail, and the cutting knife is arranged right above the cutting slide rail;

a waste collecting hopper is further arranged on the outer side of one end of the cutting slide rail and is arranged in the cutting protection box;

the cleaning roller is arranged on a driving shaft of a cleaning motor and is horizontally arranged, the cleaning motor is fixedly arranged on a cleaning bracket, and the cleaning bracket can be erected on a rack platform in a lifting way through a cleaning cylinder;

the bottom of the cleaning roller can be attached to the cutting table in a separable mode, and when the cleaning cylinder is lifted, the cleaning roller is horizontally hung above the cutting table in a non-contact mode;

the length of the cleaning roller is greater than the longest diagonal line of the cutting table, and the cleaning roller, the cleaning motor, the cleaning cylinder and the cutting knife are not interfered with each other; the cleaning cylinder is vertical to the top of the stand platform, and the rotation axis of the cleaning motor is parallel to the top of the cutting table;

the top opening of the waste collecting hopper extends to the side edge of the stand from the position right below the cleaning roller, the bottom of the waste collecting hopper is communicated with the inside of the stand, and a recovery box body is arranged below the waste collecting hopper;

at least two CCD detectors are erected above the cutting table;

and the cutting table, the cleaning motor, the cleaning cylinder and the CCD detector are electrically connected with the controller.

Furthermore, the protection cabinet is fixedly arranged on the four side edges of the rack platform, and an audible and visual alarm is erected at the top of the protection cabinet;

the raw material rack is horizontally and slidably arranged on a raw material sliding rail, and the raw material sliding rail is horizontally erected at the top of the rack platform;

the finished product rack is horizontally and slidably arranged on a finished product slide rail, and the finished product slide rail is horizontally erected at the top of the rack platform;

the raw material slide rail and the finished product slide rail are respectively erected on two sides of the cutting protection box in a non-contact way, and the cutting slide rail, the finished product slide rail and the raw material slide rail are arranged in parallel;

at least one CCD detector is also erected above the raw material rack;

and the controller, the audible and visual alarm, the raw material rack, the finished product rack and the CCD detector are also electrically connected with the controller.

Further, the raw material frame, the cutting table and the finished product frame are driven by servo motors on respective sliding rails, the controller is a PLC controller, the controller is further connected with an operating device, and the servo motors driving the raw material frame, the cutting table and the finished product frame are controlled by the controller.

Furthermore, at least two CCD detectors are erected on the cutting table, the two CCD detectors on the cutting table can be installed on the cutting fixing frame in an orientation adjusting mode, the two CCD detectors are arranged right opposite to cutting lines of the wedge-shaped cutting edge of the cutting knife on the cutting table, at least one CCD detector is erected on the raw material frame, and the CCD detectors on the raw material frame are right opposite to raw material placing positions.

Further, the cleaning roller is a roller soft brush.

The utility model has the advantages that: 1. the device rolls on the cutting table through the cleaning roller, cleans and brushes the waste leftover bits in a rolling brush mode, reduces the cleaning roller when the cleaning cylinder needs cleaning, cleans the waste leftover bits in a rolling manner on the cutting table, and rises when the cleaning cylinder does not need cleaning, so that the cutting operation of the cutting table is not influenced;

2. the utility model discloses a CCD detector essence dress judges the position of piece formula electronic component at the cutting bed on the former frame, and whether the raw materials accords with the size demand of tailorring, the longitudinal displacement that the servo motor that can drive the cutting bed moved is different, make the cutting bed that bears electronic component, the position that moves at every turn slightly deviates from the position of last time, level and vertical can all move, make the position that the cutting knife cut on the cutting bed at every turn not the same line of cut, thereby make the position that the cutting knife cut at every turn all be the position that new cutting bed corresponds, the cutting knife just can not cut repeatedly in same place on the cutting bed, avoid cutting bed and cutting knife to cut repeatedly same place and lead to mutual wearing and tearing to collapse;

3. the device ensures that the glass fiber board is smoothly adsorbed on the cutting table by adding the glass fiber board with the thickness of 1mm-3mm to cover the top of the cutting table and is fixed by vacuum negative pressure adsorption, can ensure that the glass fiber board does not wrinkle due to cutting and pressing, has moderate hardness, can keep the supporting electronic element with a smooth surface to cut, ensures that the electronic element does not bend due to the pressing force under cutting, and does not collide with the cutting knife due to too hard, and only can be cut by the cutting knife because the cutting amount of the cutting knife is precisely controlled, so the amount of the cutting knife cutting into the glass fiber board is only less than 0.1mm, and can also ensure that the electronic element is completely cut off, but not lotus broken wires, and does not directly collide with the cutting table, and the glass fiber board is buffered, the possibility of the damage of blade and cutting bed has been reduced, thereby improve cutting accuracy, the glass fiber board of this device is changed also very conveniently, adsorb at the cutting bed top through the negative pressure, even glass fiber board cutting number of times is too much, cut bad when needing to be changed, just close the device that the negative pressure produced, glass fiber board just no longer adsorbs, it is also very easy to change, because the position of cutting on glass fiber board every time is all inequality, so glass fiber board is also difficult to damage, the cutting edge of this device effective protection cutting knife is not broken up by harder cutting bed.

Drawings

The invention will be further described with reference to the following examples with reference to the accompanying drawings.

FIG. 1 is a schematic view of the external front structure of the present invention;

FIG. 2 is a schematic view of the external back structure of the present invention;

fig. 3 is a schematic view of the back structure inside the rack platform of the present invention;

fig. 4 is a schematic front view of the inside of the rack platform of the present invention;

fig. 5 is a schematic structural view of the inside of the rack platform of the present invention;

FIG. 6 is a schematic structural view of the raw material frame and the finished product frame of the present invention;

fig. 7 is a structural front view of the raw material frame and the finished product frame of the present invention;

FIG. 8 is a schematic diagram of the position relationship between the cutting table and the cutting protection box of the present invention;

FIG. 9 is a schematic view of the inside of the cutting knife of the present invention;

FIG. 10 is a schematic view showing the positional relationship between the cleaning roller and the cutting table according to the present invention;

FIG. 11 is a schematic view of the structure of the cutting knife of the present invention;

fig. 12 is a front view of the cutting protection box and the cutting knife of the present invention;

FIG. 13 is a schematic view of the cutting table of the present invention in its entirety;

fig. 14 is an exploded view of the cutting table of the present invention;

fig. 15 is a schematic view of the material-taking and cutting chuck of the present invention;

fig. 16 is a bottom view of the material-taking and cutting chuck of the present invention;

fig. 17 is a schematic view of the lifting and rotational driving of the material-taking and cutting chuck of the present invention;

fig. 18 is a schematic structural view of the cutting blade holder of the present invention;

figure 19 is the utility model discloses clean cylinder and cutting bed position relation sketch map.

In the drawings, the components represented by the respective reference numerals are listed below:

1-frame table, 11-protective cabinet, 12-horizontal beam slide rail, 13-vertical support, 14-audible and visual alarm, 2-raw material frame, 21-raw material slide rail, 3-cutting protective box, 31-cutting table, 311-angle adjusting disc, 312-rotating base, 313-vacuum suction disc, 314-cutting platform, 315-glass fiber plate, 316-heating rod, 32-material-taking cutting suction disc, 321-steering motor, 322-suction disc lifting cylinder, 323-negative pressure suction pipe, 33-waste collecting hopper, 34-cutting knife, 341-knife rest lifting motor, 342-blade limiting groove, 343-lifting cutting plate, 344-cutting fixing frame, 345-floating limiting spring, 35-cutting slide rail, 4-a finished product rack, 41-a finished product slide rail, 42-a finished product taking sucker, 5-a cleaning roller, 51-a cleaning motor, 52-a cleaning cylinder, 53-a cleaning bracket, 6-a CCD detector, 7-a controller and 71-an operating device.

Detailed Description

Referring to fig. 1 to 19, the present invention provides a technical solution: a slitting machine capable of automatically sweeping waste material, comprising:

the gantry machining device comprises a rack table 1, wherein a protection cabinet 11 is erected above the rack table 1 and is a flat and stable working reference table, at least two vertical supports 13 are erected on the edges of two opposite sides of the rack table 1, a horizontal beam slide rail 12 is horizontally and fixedly arranged between the vertical supports 13 on the two sides, and the two vertical supports 13 and the horizontal beam slide rail 12 form a gantry machining center;

the cutting protection box 3 is formed by connecting vertical partition plates end to end, is closed in periphery, is opened at the top and the bottom, is vertically and fixedly arranged at the top of the rack table 1, is erected between the raw material slide rail 21 and the finished product slide rail 41 in a non-contact manner, is horizontally erected inside and is provided with a cutting slide rail 35, and the cutting slide rail 35 is provided with a cutting table 31 capable of horizontally sliding;

the cutting table 31 comprises an angle adjusting disc 311, a rotating base 312, a vacuum suction disc 313, a cutting platform 314 and a glass fiber plate 315, wherein the rotating base 312 can be horizontally installed on a cutting slide rail 35 in a sliding manner, the angle adjusting disc 311 can be horizontally installed in the center of the rotating base 312 through a vertically arranged motor, the vacuum suction disc 313 is embedded at the top of the angle adjusting disc 311, the cutting platform 314 is hermetically installed at the top of the vacuum suction disc 313, the glass fiber plate 315 is covered at the top of the cutting platform 314, the top of the cutting platform 314 and the upper and lower surfaces of the glass fiber plate 315 are mirror surface flat plates which are horizontally arranged, a plurality of suction holes which are overlapped up and down are arranged on the cutting platform 314 and the glass fiber plate 315, the suction holes on the cutting platform 314 and the glass fiber plate 315 are communicated with an external vacuum pump through the vacuum suction disc 313, the aperture of the suction hole is not more than 1 mm;

the cutting knife 34 is installed on a rotating shaft of the knife rest lifting motor 341, the knife rest lifting motor 341 is horizontally erected on the cutting fixing frame 344 through an air cylinder, the cutting fixing frame 344 is fixedly arranged on the frame table 1, the cutting fixing frame 344 is erected right above the cutting slide rail 35, and the cutting knife 34 is arranged right above the cutting slide rail 35;

a waste collecting hopper 33 is further arranged on the outer side of one end of the cutting slide rail 35, the waste collecting hopper 33 is arranged in the cutting protection box 3, the cutting slide rail 35, the finished product slide rail 41 and the raw material slide rail 21 are arranged in parallel, and the cutting slide rail 35, the finished product slide rail 41 and the raw material slide rail 21 are all perpendicular to the horizontal beam slide rail 12;

a cleaning roller 5 horizontally mounted on a driving shaft of a cleaning motor 51, the cleaning motor 51 being fixedly mounted on a cleaning bracket 53, the cleaning bracket 53 being vertically mounted on the frame 1 via a cleaning cylinder 52;

the bottom of the cleaning roller 5 can be attached to the cutting table 31 in a separated manner, and when the cleaning cylinder 52 is lifted, the cleaning roller 5 is hung above the cutting table 31 in a non-contact horizontal manner;

the length of the cleaning roller 5 is greater than the longest diagonal line of the cutting table 31, and the cleaning roller 5, the cleaning motor 51, the cleaning cylinder 52 and the cutting knife 34 do not interfere with each other; the cleaning cylinder 52 is vertically arranged with the top of the frame 1, and the rotation axis of the cleaning motor 51 is parallel to the top of the cutting table 31;

the top opening of the waste collecting hopper 33 extends from the position right below the cleaning roller 5 to the side edge of the frame 1, the bottom of the waste collecting hopper 33 is communicated with the inside of the frame 1, and a recovery box is arranged below the waste collecting hopper 33;

at least two CCD detectors 6 are erected above the cutting table 31;

the controller 7, the cutting table 31, the cleaning motor 51, the cleaning cylinder 52 and the CCD detector 6 are electrically connected with the controller 7, so that leftover materials or waste materials can be conveniently cleaned, the normal cutting of the cutting knife 34 is prevented from being shielded, the detection camera of the CCD detector 6 is also prevented from being shielded, the detection can be more accurate, the raw materials or finished products of the electronic element can be smoothly adsorbed on the glass fiber board 315 through the structure of the cutting table 31, the longitudinal position of the electronic element can be conveniently adjusted, the electronic element can be cut at different positions of the glass fiber board 315, the repeated cutting at the same position can be avoided, the electronic element can be smoothly and stably conveyed for cutting, the electronic element can be stably supported without displacement during cutting, the electronic element can be uniformly and tightly adsorbed on the cutting table 31, and can not be sunken due to the adsorption force, and the structure can ensure that the electronic element cutting machine can accurately cut the chip electronic element, avoid the waste material to block on cutting table 31 to can cut the absorption that the piece formula electronic component is leveled, cut accurately.

At least two vertical supports 13 are erected on the edges of two opposite sides of the rack 1, a horizontal beam slide rail 12 is horizontally and fixedly arranged between the vertical supports 13 on the two sides, and the two vertical supports 13 and the horizontal beam slide rail 12 form a gantry machining center;

the protection cabinet 11 is fixedly arranged at the four side edges of the rack table 1, and the audible and visual alarm 14 is erected at the top of the protection cabinet 11;

the raw material rack 2 is horizontally and slidably arranged on a raw material slide rail 21, and the raw material slide rail 21 is horizontally erected at the top of the rack table 1;

the finished product rack 4 is horizontally and slidably arranged on a finished product slide rail 41, and the finished product slide rail 41 is horizontally erected at the top of the rack table 1; the horizontal beam sliding rail 12 is horizontally and slidably provided with a material taking and cutting sucker 32 and a finished product material taking sucker 42 respectively, the bottom surface of the material taking and cutting sucker 32 is a mirror surface flat plate, the bottom surface of the material taking and cutting sucker 32 is parallel to the cutting table 31 and is flatly attached to the cutting table, the material taking and cutting sucker 32 is arranged below a sucker lifting cylinder 322, the sucker lifting cylinder 322 is arranged on a rotating shaft of a steering motor 321, the steering motor 321 is horizontally and slidably arranged on the horizontal beam sliding rail 12, and the lifting axis of the sucker lifting cylinder 322 and the rotating axis of the steering motor 321 are both vertically arranged with the top of the table frame 1;

the finished product material taking suction cup 42 and the material taking cutting suction cup 32 are sequentially arranged on the same horizontal beam slide rail 12 in the same structure;

at least one CCD detector 6 is also erected above the raw material frame 2;

the controller 7, the audible and visual alarm 14, the raw material frame 2, the material taking and cutting suction disc 32, the suction disc lifting cylinder 322, the steering motor 321, the finished product frame 4, the finished product taking suction disc 42 and the CCD detector 6 are also electrically connected with the controller 7, when materials are taken on the raw material frame 2 at each time, the material taking and cutting suction disc 32 is translated and adjusted by a servo motor to form a fixed difference, so that each time the chip electronic component is positioned at the cutting table 31, the position of the blade on the cutting table 31 is different during each cutting, the cutting table 31 is protected from bearing cutting force at the same position, the cutting table 31 cannot be broken, the flatness of the cutting table 31 is ensured, a glass fiber plate 315 with a certain thickness is additionally arranged at the top of the cutting table 31, the cutting knife 34 penetrates through the electronic component and also penetrates into the glass fiber plate 315 for a certain depth, but the glass fiber plate 315 cannot be cut through, so that the cutting edge of the cutting knife 34 is effectively protected from being broken by the harder cutting table 31, the cutting knife 34 is not in contact with the cutting table 31, and mutual impact abrasion is avoided, so that the cutting precision is improved, and the replacement frequency of the cutting knife 34 and the cutting table 31 is reduced;

sealing rings are filled in installation gaps among the angle adjusting disc 311, the rotating base 312, the vacuum suction disc 313 and the cutting platform 314, the glass fiber plate 315 is flatly adsorbed on the top of the cutting platform 314 through vacuum, the thickness of the glass fiber plate 315 is not more than 3mm, the glass fiber plate 315 is always adsorbed on the top of the cutting platform 31, the adsorption states are not influenced mutually, the glass fiber plate 315 with the thickness does not influence the flat support of electronic components, the hardness buffer can be provided, the glass fiber plate is cut to the thickness which is not cut through by the cutting disc 34, and the optimal thickness of the glass fiber plate 315 is 2 mm;

the material taking and cutting sucker 32 is also provided with a negative pressure air suction pipe 323, the bottom suction surface of the material taking and cutting sucker 32 is also uniformly provided with a plurality of suction holes, the suction holes are communicated with an external vacuum pump through the negative pressure air suction pipe 323, the material taking and cutting sucker 32 and the finished product material taking sucker 42 have the same structure, and electronic components are smoothly sucked in the mode of attaching and negative pressure suction holes;

the lifting axis of the sucker lifting cylinder 322 and the rotating axis of the steering motor 321 are both vertically arranged with the top of the rack platform 1, so that the material taking and cutting sucker 32 can be conveniently lifted vertically, and the situation that the suction is not attached due to the inclination is avoided;

the raw material rack 2, the cutting table 31 and the finished product rack 4 are driven on respective sliding rails through servo motors, the controller 7 is a PLC (programmable logic controller), the controller 7 is further connected with an operating device 71, the servo motors driving the raw material rack 2, the cutting table 31 and the finished product rack 4 are controlled through the controller 7, the movement is accurate, the precise movement is convenient, the position adjustment, the movement and the absorption of electronic elements are convenient and accurate, the controller 7 of the PLC is easy to obtain, the operation and the setting can be conveniently carried out, the popularization rate is high, and complicated operation steps and actions can be completed;

the cutting edge of the cutting knife 34 is a wedge-shaped cutting edge, the length of the cutting knife 34 is smaller than the minimum distance between any opposite sides of the glass fiber plate 315, the cutting knife 34 is elastically installed on the lifting cutting plate 343 through a floating limiting spring 345, a blade limiting groove 342 is also fixedly installed at the bottom of the lifting cutting plate 343, the blade limiting groove 342 is mutually abutted with the inclined surface at the top of the wedge-shaped cutting edge of the cutting knife 34, the wedge-shaped cutting edge of the cutting knife 34 is inseparably floated up and down in the blade limiting groove 342, the lifting cutting plate 343 is installed on the output shaft of the knife rest lifting motor 341, the output shaft of the knife rest lifting motor 341 is engaged and connected with the lifting cutting plate 343 through a lifting screw rod, the knife rest lifting motor 341 is vertically and fixedly arranged on a cutting fixing frame 344, the fixing frame which is not contacted with the cutting fixing frame 344 is arranged above the cutting slide rail 35 through the arrangement of the cutting knife 34, the structure enables the toughness to be larger, and the glass fiber plate 315 with larger resistance to the cutting knife 34 enables the cutting edge of the cutting knife 34 to retract into the blade limiting groove 342;

at least two CCD detectors 6 are erected on the cutting table 31, the two CCD detectors 6 on the cutting table 31 can be installed on the cutting fixing frame 344 in an orientation adjusting mode, the two CCD detectors 6 are arranged opposite to cutting lines of a wedge-shaped cutting edge of the cutting knife 34 on the cutting table 31, at least one CCD detector 6 is erected on the raw material frame 2, the CCD detectors 6 on the raw material frame 2 are opposite to raw material placing positions, raw materials or processing states of electronic components are monitored at any time, defective products can be removed timely when occurring, and the machine is stopped to avoid the defective products from being mixed;

a plurality of mounting holes are formed in the side face of the lower layer of the cutting platform 314, heating rods 316 are embedded in each mounting hole in a one-to-one correspondence manner, the heating rods 316 are uniformly dispersed and embedded on the peripheral side wall of the cutting platform 314, the heating rods 316 extend into the center of the inner cavity of the cutting platform 314, and the heating rods 316 are electrically connected with the controller 7, so that an electronic element can be heated and then cut, and the cutting edge is more accurate;

cleaning roller 5 is the roller pappus brush, cleans the bisection header 31 of laminating like this, avoids the waste material to block the cutting to can not damage the cutting header 31, also can not destroy the surface smoothness of glass fiber board 315, can also clean discarded leftover bits.

In a specific embodiment of the present invention:

the embodiment of the utility model provides a through providing a cutting machine that can clean the waste material automatically, the utility model provides a technical problem be:

1. in order to ensure the cutting precision in the prior art, each time when the electronic element is conveyed, the electronic element can be conveyed at a fixed position, and a positioning mechanism is added, so that each time when the chip electronic element is conveyed and transferred, the chip electronic element is positioned at the same position of the device accurately, and the cutting knife 34 can cut off the electronic element at the same position each time, therefore, the cutting edge of the cutting knife 34 falls at the same position on the cutting table 31 for cutting, the cutting depth of the cutting knife changes during cutting, the cutting depth often penetrates through the electronic element and is cut on the cutting table 31, the hardness of the cutting table 31 for cutting is higher and wear-resistant, the cutting edge of the cutting knife 34 for cutting is easy to break out of a notch for a long time, the abrasion is easy to cause, and the precision of the processed electronic element is greatly reduced;

2. the cutting table 31 of cutting needs the higher level platform of putting of the level of hardness, need the protective device of the protective action of cutting edge to the cutting knife 34, because once the cutting edge is worn and torn, it is difficult to distinguish by naked eyes, and the monitoring device only monitors the chip, and only compares the electronic component, does not carry on the specialized detection to the cutting edge 34, therefore the cutting edge has appeared the problem, the apparatus will not suggest either, personnel will not find either, the cutting edge damages the electronic component produced by cutting and generally the precision can't meet the requirements, therefore the durability and precision of the cutting edge are that this kind of apparatus does not make effective improvement at present;

3. the device can not cover the buffering cushion to protect the incision of the cutting edge, and the buffering cushion is easy to wrinkle under the long-term high-frequency transfer and sliding working conditions of the cutting platform, so that the cutting edge is difficult to cut through the electronic element, and the cushion is easy to stress and bend when being subjected to cutting stress, so that the cutting precision cannot be ensured, and the yield is low;

4. these current cutting device can't clean and collect the discarded piece formula electronic component's that the cutting dropped leftover bits, and this leftover bits that drop can only throw away through removing or rotating, is difficult to clear away totally, can influence cutting once more, still can block monitoring device's detection sight, causes the detection blind area, the false positive condition that the mistake was reported or was not reported appears easily.

The realized technical effects are as follows: 1. the device rolls on the cutting table 31 through the cleaning roller 5, cleans and brushes away waste leftover materials in a rolling brush mode, reduces the cleaning roller 5 to be attached to the cutting table 31 when the cleaning cylinder 52 needs to clean, cleans in a rolling way on the cutting table 31, rises when the cleaning is not needed, does not affect the normal cutting operation of the cutting table 31, does not use wind blowing, does not scatter the cut leftover materials, can also effectively avoid the waste leftover materials from scattering on a mobile or rotary device, can avoid fragment clamping equipment, can also collect the leftover materials cleaned and brushed away, monitors the cutting condition of an electronic element in real time through two CCD detectors 6 on the cutting table 31, and can start the cleaning roller 5 through the controller 7 when the cutting is scrapped and the possibility of remedy is completely absent, and cleans the scrapped materials into the scrap collecting hopper 33, the cleaning is more convenient;

2. the utility model discloses a CCD detector 6 on raw materials frame 2 accurately judges chip electronic component's position, and whether the raw materials accords with the size demand of tailorring, the vertical displacement that the servo motor through drive cutting bed 31 moved is different, make the position that electronic component was located totally different with the position of last time, level and vertical all can move, make the position that cutting knife 34 cut on cutting bed 31 at every turn all not be same straight line, thereby make the position that cutting knife 34 cut at every turn all be the new position of cutting bed 31, cutting knife 34 just can not be at the same department repeated cutting on cutting bed 31, avoid cutting bed 31 and cutting knife 34's same position mutual wearing and tearing to collapse, one of them accessory of cooperation cutting has broken the matched with position and also can damage more fast, this device has avoided the emergence of this condition;

3. this device comes to mend this longitudinal displacement difference back through cutting bed 31 to ensure that the margin that electronic component cut at every turn is all the same, but the position that cutting knife 34 cut at cutting bed 31 at every turn is different, therefore this device has not only adjusted cutting knife 34 the doff sword position on cutting bed 31, electronic component's cutting size can keep not changing, still original settlement size, high-frequency cutting is accomplished to technical skill, can guarantee again that cutting knife 34 does not change at the doff sword position of cutting bed 31, can also ensure electronic component's cutting precision;

4. the device is characterized in that a glass fiber plate 315 with the thickness of 1mm-3mm is additionally arranged to cover the top of the cutting table 31 and is fixed through vacuum negative pressure adsorption, so that the glass fiber plate 315 is ensured to be adsorbed on the cutting table 31 smoothly and can also be ensured not to wrinkle due to cutting and pressing, the hardness of the glass fiber plate 315 is moderate, the supporting electronic element with a smooth surface can be kept to cut, the electronic element is ensured not to bend due to the pressing force under cutting, and can not generate mutual impact force with the cutting knife 34 due to too hard force and can only be cut into by the cutting knife 34, the cutting precision of the device is micron-sized, in order to ensure the precision, the cutting edge of the cutting knife 34 is very fine, so that the cutting knife 34 can only cut into the glass fiber plate 315 by less than 0.1mm, and also ensures that the electronic components are completely cut, rather than being coupled, and that the cutting blade 34 does not collide directly with the cutting table 31, and the presence of the glass fiber plate 315 for cushioning, reduces the likelihood of damage to the blade and cutting table 31, thereby improving the cutting precision, the glass fiber plate 315 of the device is very convenient to replace, is absorbed at the top of the cutting table 31 through negative pressure, even if the glass fiber plate 315 is cut too many times and needs to be replaced, the device for generating negative pressure is closed, the glass fiber plate 315 is not absorbed any more, the replacement is very easy, because the cutting position on the glass fiber plate 315 is different each time, so the glass fiber plate 315 is not easy to be damaged, when the device is used for cutting, the blade edge of the cutting knife 34 can not contact with the hard cutting table 31 at all, so this device effectively protects the cutting edge of cutting knife 34 not to be broken up by hard cutting bed 31.

The embodiment of the utility model provides an in technical scheme for solving above-mentioned problem, the general thinking is as follows:

for better understanding of the above technical solutions, the following detailed descriptions will be provided in conjunction with the drawings and the detailed description of the embodiments.

The utility model discloses when the preparation installation, make a smooth rack platform 1 earlier, ensure that the top of rack platform 1 is in the level, and show levelly and smoothly, then install preparation raw materials slide rail 21, cutting slide rail 35 and finished product slide rail 41, make raw materials slide rail 21, cutting slide rail 35 and finished product slide rail 41, all be parallel to each other, and set up side by side, as shown in fig. 3 and fig. 4, then install raw material frame 2 on raw materials slide rail 21, install finished product frame 4 on finished product slide rail 41, and raw material frame 2 and finished product frame 4 are all driven through servo motor and chain gear, drive and transmission hoist and mount in the below, this is the installation of the conventional device that technical personnel in the field are familiar, no longer repeated description;

mounting a cutting table 31 on the cutting slide rail 35, wherein the cutting table 31 is as shown in fig. 14, a rotating base 312 is mounted on the cutting slide rail 35 through a servo motor and horizontally slides along the cutting slide rail 35, an angle adjusting disc 311 is vertically and rotatably mounted on the rotating base 312 through a rotating motor, a rotating shaft of the rotating motor on the rotating base 312 is closely butted with the angle adjusting disc 311 through a transmission speed reducer, a driving shaft of the motor is arranged to be upward vertical to the frame stand 1 so that the cutting table 31 can rotate along a vertical axial direction, then the vacuum suction disc 313 is embedded in a square groove in the middle of the rotating base 312, the rotating base 312 is excessively matched with the vacuum suction disc 313 and is sealed by a sealing gasket to ensure air tightness, an air suction channel is required to be arranged in the vacuum suction disc 313 through a channel for generating negative pressure on the top of the cutting table 31, and the cutting table 314 is mounted on the top of the vacuum suction disc 313, the installation is completed by covering the glass fiber plate 315 on the top of the cutting platform 314, a heating pad is added on the bottom of the cutting platform 314, the heating pad is uniformly covered with heat conducting wires, then the heat conducting wires are connected with an external heating rod 316, the heating pad can be connected through threads, the heating pad is embedded on the bottom of the cutting platform 314, a plurality of heating rods 316 are arranged, as shown in fig. 13, the heating pad surrounds the periphery of the cutting platform 314, one end of each heating rod is inserted on the heating pad inside the cutting platform 314, a plurality of negative pressure suction holes are also arranged in the cutting platform 314, the negative pressure suction holes are arranged in two different groups, one group of negative pressure suction holes are mutually overlapped with the negative pressure suction holes on the glass fiber plate 315, so that the suction force can pass through the glass fiber plate 315, the sheet-type electronic component is sucked through the negative pressure suction holes of the glass fiber plate 315, the other group of negative pressure suction holes on the cutting platform 314 are shielded by the glass fiber plate 315, the negative pressure suction holes blocked by the glass fiber plate 315 are used for flatly and tightly adsorbing the glass fiber plate 315 on the cutting platform 314, the negative pressure suction holes on the top of the glass fiber plate 315 or the cutting platform 314 are uniformly distributed, so that the suction force is ensured to be uniformly distributed without stress concentration, the diameter of the negative pressure suction holes is not more than 1mm, and the diameter of the negative pressure suction holes is preferably 0.2mm, and the uniform arrangement and the pore size can prevent the glass fiber plate 315 or the sheet type electronic component from being adsorbed by the suction force to generate bending.

A waste collecting hopper 33 is arranged at one end of a cutting slide rail 35, the waste collecting hopper 33 is arranged under a cleaning roller 5 and is arranged close to the centrifugal force direction of the rotation of the cleaning roller 5, the waste collecting hopper 33 is not contacted with the cutting slide rail 35, a cutting protection box 3 is arranged around the cutting slide rail 35, the waste collecting hopper 33 is also arranged in the cutting protection box 3, the cutting protection box 3 is vertically fixed at the top of a machine frame 1, as shown in figure 8, the whole cutting frame 31 can not leave the range of the cutting protection box 3 no matter rotating or translating, the shape structure of the cutting protection box 3 is similar to a vertical fence, is used for protecting the splash of fragments during cutting, can also collect waste, has the height of 10cm-20cm, is flexibly adjusted according to the height of each component and the interference condition of the device, so as to collect and shield the waste, then a cutting fixing frame 344 is arranged outside the cutting protection box 3, the cutting fixing frame 344 is fixed on the frame 1, the cutting fixing frame 344 is provided with the cutter frame lifting motor 341, then the cutter frame lifting motor 341 is provided with the lifting cutting plate 343, the cutting knife 34 is arranged on the lifting cutting plate 343 through the floating limiting spring 345, the cutting edge of the cutting knife 34 is inserted into the blade limiting groove 342, the blade limiting groove 342 is abutted against the thicker position of the wedge-shaped cutting edge of the cutting knife 34, the cutting edge of the cutting knife 34 is ensured to extend out of the blade limiting groove 342 just within 0.2mm of the thickness of the chip electronic element when floating downwards, thus the chip electronic element can be ensured to be cut off just, the cutting knife 34 can not cut through the glass fiber plate 315, the cleaning cylinder 52 is arranged on the cutting fixing frame 344, the cleaning support 53 is arranged at the telescopic end of the cleaning cylinder 52, and then the cleaning roller 5 is arranged at the outer side of the cleaning support 53 through the cleaning motor 51, ensuring that all components connected to the sweep cylinder 52 do not contact all components on the cutting fixture 344 and do not interfere with each other in the path of travel;

then two vertical supports 13 and a horizontal beam slide rail 12 in the shape of a gantry machining center are erected on the left side and the right side of the top of the rack platform 1, as shown in fig. 3 and 4, stable erection is ensured, the two vertical supports 13 and the horizontal beam slide rail 12 cross two sides of the rack platform 1 and do not interfere with other parts, then a material taking and cutting suction cup 32 and a finished product taking suction cup 42 are hung on the horizontal beam slide rail 12, the material taking and cutting suction cup 32 and the finished product taking suction cup 42 have the same structure but different positions and functions, the material taking and cutting suction cup 32 is responsible for sucking the piece type electronic elements in the raw material rack 2, adjusting the angle and stably placing the piece type electronic elements on the material taking and cutting table 31, the finished product suction cup 42 is responsible for sucking the piece type electronic elements which are cut and placing the piece type electronic elements in the finished product rack 4, the raw material rack 2 and the finished product rack 4 are both provided with openings at the top and are provided with limiting plates all around, belongs to a common device, and is also shown in the description of attached figures 3 and 4;

the material taking and cutting suction disc 32 is arranged below the suction disc lifting cylinder 322, the suction disc lifting cylinder 322 is arranged on a rotating shaft of a steering motor 321, the steering motor 321 is arranged on the horizontal beam slide rail 12 and can horizontally slide on the horizontal beam slide rail 12, the lifting axis of the suction disc lifting cylinder 322 and the rotating axis of the steering motor 321 are both vertically arranged with the top of the rack platform 1, so that the material taking and cutting suction disc 32 can lift up and down and can horizontally move on the horizontal beam slide rail 12, the steering motor 321 can control the material taking and cutting suction disc 32 to rotate along the axis, and the angle is adjusted, so that the horizontal direction of the sucked chip electronic element can be adjusted;

the finished product taking suction cup 42 and the taking cutting suction cup 32 are sequentially arranged on the same horizontal beam slide rail 12 in the same structure.

Install protection cabinet 11 additional at rack platform 1 outside, need all closed at four sides and top, and protection cabinet 11 four sides all is the cabinet door that can open and lock, protection cabinet 11 needs to install in all device outsides, and do not interfere the operation of internal device, install the recovery box body of collecting the waste material in rack platform 1, also install controller 7, operating means 71 is connected to controller 7, controller 7 is the plc controller, need with all motor and cylinder connection control, and will be connected with audible-visual annunciator 14 at protection cabinet 11 top.

The utility model discloses when using, set for various parameters on controller 7 through operating means 71, for example piece formula electronic component needs cutting size to and the size of cutting, for example with the square electronic component of a 10cm length and width, cut into 4 electronic components of 2.4cm size, need set for the orbit of removal and cutting, and the width of the limit that cuts off.

The specific setting parameters are based on actual requirements, and the implementation only explains the conventional operation state of the equipment;

in a shutdown state, a plurality of pieces of electronic components are placed in a raw material rack 2, generally 20 pieces are a bundle and can be placed together, then a cabinet door of a protection cabinet 11 is closed after parameters are set, the raw material rack 2 is started under the driving of a servo motor controlled by a controller 7, so that the raw material rack 2, a finished product rack 4 and a cutting table 31 are all in a set original point position, then a negative pressure air suction pipe 323 of a material taking and cutting suction cup 32 generates vacuum adsorption force under the suction force of an external vacuum machine, a CCD detector 6 monitors the angle, the size and the position of the electronic components, a suction cup lifting cylinder 322 moves horizontally to the position right above the raw material rack 2 on a horizontal beam slide rail 12, the suction cup lifting cylinder 322 extends downwards, the suction force of the material taking and cutting suction cup 32 enables one piece of electronic components to be adsorbed tightly in a flat mode, the suction cup lifting cylinder 322 retracts, then the material taking and cutting suction cup 32 moves horizontally to the position right above a glass fiber board 315 at the top of the cutting table 31 on the horizontal beam slide rail 12, the steering motor 321 turns to adjust the electronic component to a set angle, then the suction cup lifting cylinder 322 extends downwards to flatten the electronic component on the glass fiber plate 315 of the cutting table 31, at this time, the vacuum suction disc 313 of the cutting table 31 starts to absorb, the suction of the material taking and cutting suction cup 32 is closed to release the electronic component, then the electronic component is absorbed on the cutting table 31 by a group of negative pressure suction holes, the glass fiber plate 315 is absorbed on the top of the cutting platform 314 through another group of negative pressure suction holes as long as the cutting table is started, and cannot be loosened, then the heating rod 316 heats the electronic component, and meanwhile, the servo motor drives the cutting table 31 to move longitudinally on the cutting slide rail 35 to a set position, and the cutting knife 34 cuts at the set position;

during cutting, the cutter frame lifting motor 341 rotates, the lifting cutting plate 343 descends to cut through the rotation of the lifting lead screw, the lifting precision is higher than that of telescopic air cylinder, then the lifting cutting plate 343 descends to drive the cutting knife 34 to descend together, meanwhile, the blade limit groove 342 presses the top of the electronic element, the left CCD detector 6 and the right CCD detector 6 are just opposite to the cutting edge of the cutting knife 34, the blade limit groove 342 is subjected to resistance and is not moved, the cutting knife 34 continues to advance in the blade limit groove 342 to cut off the electronic element, the thicker position of the wedge-shaped cutting edge of the cutting knife 34 is limited by the blade limit groove 342, the electronic element can only be cut off and cannot go deep into the glass fiber plate 315, the glass fiber plate 315 with larger resistance blocks the cutting knife 34, the cutting knife 34 retracts into the blade limit groove 342 under the action of the floating limit spring 345 of the cutting knife 34, and the cutting edge of the cutting knife 34 which cannot be damaged is normally controlled just hard, the glass fiber plate 315 is not cut, but in order to cut the electronic element completely, the cutting thickness is required to exceed the thickness of the electronic element by 0.01mm, so that the cutting can be ensured, the cutting knife 34 and the glass fiber plate 315 can be contacted and cut mutually, but the glass fiber plate 315 has a buffer effect, so that the cutting cannot extend into the glass fiber plate, and meanwhile, the glass fiber plate 315 can play a good flat supporting role, so that the cutting is finished at one time;

then the other side needs to be cut, the tool rest lifting motor 341 rotates to lift the lifting cutting plate 343, the cutting knife 34 leaves the cutting table 31, then the cutting table 31 moves back to the position below the material taking and cutting suction cup 32, the material taking and cutting suction cup 32 sucks out the electronic component which is cut once, and the material taking and cutting suction cup 32 rotates in one direction or does not rotate through rotating the steering motor 321, and the cutting table 31 moves for a certain distance to cut the other side edge of the electronic component;

when the electronic component is sucked by the material taking and cutting suction disc 32, the cutting table 31 returns to the cutting original position, and the vacuum suction disc 313 releases the negative pressure suction hole of the electronic component, so that the cut off leftover materials are not adsorbed any more, the cleaning air cylinder 52 extends downwards at the moment, the cleaning motor 51 starts to drive the cleaning roller 5 to rotate, so that the cleaning roller 5 extends downwards in a rotating manner and abuts against the top of the cutting table 31, the cut off leftover materials are removed and enter the waste collecting hopper 33, the rotating direction of the cleaning roller 5 is fixed, and only the waste materials are rotated and cleaned towards the waste collecting hopper 33.

Thus, the longitudinal cutting position of the electronic element is adjusted by the displacement distance of the cutting table 31, the horizontal displacement of the material taking cutting sucker 32 on the horizontal beam slide rail 12 is used, the transverse cutting position of the electronic element is adjusted, the size and the position of the cutting can be adjusted, the position is adjusted by staggering 1mm every time, the cutting knife 34 can be uniformly cut at the cutting position of the glass fiber plate 315 every time, thus, the cutting mode of a small displacement is adjusted after each time of cutting, the glass fiber plate 315 can be basically cut at every position, the cutting is not repeatedly cut at the same position, the cutting table 31 with staggered positions adjusts the longitudinal displacement by the device, the transverse displacement is adjusted by the material taking cutting sucker 32, at the moment, the device avoids the impact force between the cutting knife 34 and the cutting table 31 and sets a unique servo motor adjusting structure, accurate adjustment, accurate dislocation, accurate cutting just can make this device cutting number of times more, and the cutting edge of cutting knife 31 is difficult for collapsing in addition, through the buffering of glass fiber board 315, it is generally that glass fiber board 315 damages, changes just one, and the precision of cutting knife 34 is high, and is with high costs, and the preparation difficulty has effectively protected cutting knife 34 and cutting bed 31, and the accident can not damaged in the cutting bed 31 of the structure such as this device.

Each time the pick-up cutting suction cup 32 is cut, the electronic component is sucked and then the cutting table 31 is returned to the lower side of the sweeping roller 5 for the operation of waste sweeping.

Through multiple cutting, a piece of electronic component is cut on four sides, the middle line is also cut twice, after the electronic component is cut into a shape like a Chinese character tian, the cutting table 31 returns to the position below the material taking and cutting sucker 32, then the controller 7 controls the material taking and cutting sucker 32 and the finished product material taking sucker 42 to move together, the finished product material taking sucker 42 moves to the position above the electronic component cut on the cutting table, the material taking and cutting sucker 32 moves to the position above the electronic component raw material of the raw material frame 2, the material taking and cutting sucker 32 and the finished product material taking sucker 42 suck the electronic component downwards together and then move together, the finished product material taking sucker 42 sucks the cut electronic component and moves to the position right above the finished product frame 4, then the finished product material taking sucker 42 extends downwards, the finished product electronic component is placed on the finished product frame 4, and the material taking and cutting sucker 32 places a new piece of electronic component raw material on the empty cutting table 31, the repeated cutting procedure is carried out, the repeated cutting procedure is carried out again, the displacements of the material taking and cutting suction disc 32 and the cutting table 31 are different from those of the previous times, the cutting positions are adjusted within the allowable range of ensuring the cutting precision, and the continuous repeated cutting at the same position of the glass fiber plate 315 is avoided.

A CCD detector 6 can be installed on the finished product frame 4, when finished electronic elements are more, the machine can be stopped to collect finished products, leftover materials of a waste recovery box body in the frame table 1 can be collected, then electronic element raw materials are supplemented in the original frame 2 again, and a new round of cutting operation is carried out.

When monitoring that an electronic element is abnormal, all CCD detectors 6 of the device can start an audible and visual alarm 14 through a controller 7 to give an alarm to notify equipment maintenance personnel to overhaul, the original size of the electronic element may not meet the requirements, the size of cut leftover materials is set incorrectly, or the dislocation distance of the device conflicts, and personnel maintenance is required.

The controller 7 is a plc controller, belongs to a common control device, is convenient to program, is simple and easy to operate, and has accurate steps, the controller 7 is controlled by an operating device 71, and the operating device 71 is a keyboard mouse and belongs to the common operating device 71 of the plc controller 7.

The longitudinal direction of the device refers to the direction which is vertical to the horizontal beam slide rail 12 and parallel to the cutting slide rail 35; the transverse direction is then perpendicular to the cutting slide 35 and parallel to the horizontal beam slide 12.

The CCD detectors 6 are also existing equipment, and each group of CCD detectors 6 comprises a CCD lens, a motor and a camera fine-tuning device; for example, as shown in fig. 3, a CCD camera is arranged on the upper side surface of the raw material frame 2, aligned with the position where the raw materials on the raw material frame 2 are stacked, and used for shooting the chip electronic component to be cut on the raw material frame 2.

The CCD detector 6 is an instrument for detecting the appearance of an object by a CCD unit through a display.

It is suitable for the flatness inspection and maintenance of various connector products such as CF CARD, FPC, BTOB, SIM CARD, etc. The width of the coordinate line is 1/2 of the existing similar product in the market, so that the detection is more accurate.

Coordinate lines of different colors may be set according to the background, and 4 coordinate lines may be set simultaneously in a general configuration. The color CCD can also be used for inspecting the appearance of the product, and can be used as a vertical projector.

The commonality is strong, changes different detection tool and just can detect the product of different material numbers. The image in the display is directly observed by naked eyes, and compared with a projector and a microscope, the operator is not easy to fatigue.

The drive arrangement that this device used includes cylinder, motor, belongs to drive arrangement commonly used, also belongs to the connected mode commonly used, and this embodiment is not repeated, and the drive motor that this device used all is servo motor, and the accurate location of being convenient for cuts electronic component.

Although specific embodiments of the present invention have been described, it will be understood by those skilled in the art that the specific embodiments described are illustrative only and are not limiting upon the scope of the invention, and that equivalent modifications and variations can be made by those skilled in the art without departing from the spirit of the invention, which is to be limited only by the claims appended hereto.

Claims (5)

1. The utility model provides a can clean cutting machine of waste material automatically which characterized in that includes:

the device comprises a rack table (1), wherein a protective cabinet (11) is erected above the rack table and is a flat and stable working reference table;

the cutting protection box (3) is formed by connecting vertical partition plates end to end, is closed at the periphery, is opened at the top and the bottom, is vertically and fixedly arranged at the top of the rack table (1), is horizontally provided with a cutting slide rail (35) inside, and is provided with a cutting table (31) which can horizontally slide;

the cutting knife (34) is installed on a rotating shaft of the knife rest lifting motor (341), the knife rest lifting motor (341) is horizontally erected on the cutting fixing frame (344) through an air cylinder, the cutting fixing frame (344) is fixedly arranged at the top of the stand table (1), the cutting fixing frame (344) is erected right above the cutting slide rail (35), and the cutting knife (34) is arranged right above the cutting slide rail (35);

a waste collecting hopper (33) is further arranged on the outer side of one end of the cutting slide rail (35), and the waste collecting hopper (33) is arranged in the cutting protection box (3);

the cleaning roller (5) is arranged on a driving shaft of a cleaning motor (51) and is horizontally arranged, the cleaning motor (51) is fixedly arranged on a cleaning bracket (53), and the cleaning bracket (53) can be erected on the frame (1) in a lifting way through a cleaning cylinder (52);

the bottom of the cleaning roller (5) can be attached to the cutting table (31) in a separable mode, and when the cleaning cylinder (52) is lifted, the cleaning roller (5) is horizontally hung above the cutting table (31) in a non-contact mode;

the length of the cleaning roller (5) is greater than the longest diagonal line of the cutting table (31), and the cleaning roller (5), the cleaning motor (51), the cleaning cylinder (52) and the cutting knife (34) are not interfered with each other; the cleaning cylinder (52) is vertical to the top of the stand frame (1), and the rotation axis of the cleaning motor (51) is parallel to the top of the cutting table (31);

the top opening of the waste collecting hopper (33) extends to the side edge of the stand (1) from the position right below the cleaning roller (5), the bottom of the waste collecting hopper (33) is communicated with the inside of the stand (1), and a recovery box body is arranged below the waste collecting hopper (33);

at least two CCD detectors (6) are erected above the cutting table (31);

and the cutting table (31), the cleaning motor (51), the cleaning cylinder (52) and the CCD detector (6) are electrically connected with the controller (7).

2. The slitting machine capable of automatically sweeping waste materials according to claim 1, wherein: the protection cabinet (11) is fixedly arranged on the four side edges of the rack table (1), and an audible and visual alarm (14) is erected at the top of the protection cabinet (11);

the raw material rack (2) is horizontally and slidably arranged on the raw material sliding rail (21), and the raw material sliding rail (21) is horizontally erected at the top of the rack table (1);

the finished product rack (4) is horizontally and slidably arranged on a finished product sliding rail (41), and the finished product sliding rail (41) is horizontally erected at the top of the rack table (1);

the raw material sliding rail (21) and the finished product sliding rail (41) are arranged on two sides of the cutting protection box (3) in a non-contact mode respectively, and the cutting sliding rail (35), the finished product sliding rail (41) and the raw material sliding rail (21) are arranged in parallel;

at least one CCD detector (6) is also erected above the raw material rack (2);

and the audible and visual alarm (14), the raw material rack (2), the finished product rack (4) and the CCD detector (6) are also electrically connected with the controller (7).

3. The slitting machine capable of automatically sweeping waste materials according to claim 2, wherein: former work or material rest (2), cutting bed (31) and finished product frame (4) all drive on the slide rail at place separately through servo motor, controller (7) are the PLC controller, controller (7) still are connected with operating means (71), drive the servo motor of former work or material rest (2), cutting bed (31) and finished product frame (4) all controls through controller (7).

4. The slitting machine capable of automatically sweeping waste materials according to claim 2, wherein: the cutting table (31) is provided with at least two CCD detectors (6), the two CCD detectors (6) on the cutting table (31) can be installed on the cutting fixing frame (344) in an orientation adjusting mode, the two CCD detectors (6) are arranged on cutting lines of the wedge-shaped cutting edge of the cutting knife (34) on the cutting table (31), at least one CCD detector (6) is arranged on the raw material frame (2) in an erected mode, and the CCD detectors (6) on the raw material frame (2) are arranged on the raw material placing positions in a right-to-material mode.

5. The slitting machine capable of automatically sweeping waste materials according to claim 1, wherein: the cleaning roller (5) is a roller soft brush.

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