CN214264066U

CN214264066U - Edge trimmer for chip electronic component

Info

Publication number: CN214264066U
Application number: CN202022610293.9U
Authority: CN
Inventors: 罗光裕; 王一鸣
Original assignee: Xiamen Hairio Tinto Automation Technology Co ltd
Current assignee: Xiamen Hairio Tinto Automation Technology Co ltd
Priority date: 2020-11-12
Filing date: 2020-11-12
Publication date: 2021-09-24
Anticipated expiration: 2030-11-12

Abstract

The utility model discloses an edge trimmer for chip electronic components, which belongs to the technical field of chip electronic component cutting equipment, and comprises a frame platform, the top of which is a horizontal working platform, the top edge of the protective cabinet is covered with a protective cabinet, the protective cabinet is also provided with an alarm and a controller, the front side of the protective cabinet is provided with an operation opening, the controller is arranged right above the operation opening, the sliding base is fixedly arranged at the top of the rack platform, the central axis of the cutting machine is overlapped with the central axis of the rack platform, the sliding rails are arranged on the cutting machine, cutting raw materials can be added without stopping the machine, the thin sheet type electronic components can be smoothly and stably sucked and translated through the improved sucker, and the piece type electronic component can not deform due to suction, and the leftover materials cut off by the piece type electronic component can be cleaned in time through the cleaning device, so that the normal work of the blade can not be influenced when the blade is cut again.

Description

Edge trimmer for chip electronic component

Technical Field

The utility model relates to a piece formula electronic component cutting equipment technical field especially relates to a piece formula electronic component's bead cutter.

Background

In an automated manufacturing process, material supply equipment is usually required to improve the manufacturing efficiency. For example, in the cutting process of chip electronic components, in order to improve the production efficiency, a feeding device is usually used to feed materials instead of manual feeding, and the edge trimmer cuts off the small electronic components cut by the slitter to expose the electrodes on the side edges, and the electrodes serve as recording points for image capture by the slitter. The parameter is also an important comparison parameter when the edge trimmer cuts, and is also an important monitoring standard for whether the edge trimmer is qualified or not. The prior cutting machine has the following defects:

first, in the semiconductor industry, in the manufacturing process of chip electronic components, a vacuum suction device is usually used to suck and move the whole chip electronic components onto a worktable, and then the chip electronic components are cut into individual chips. Because the thickness of the chip electronic component is very thin and the texture is soft, the suction nozzle or the suction disc is easy to suck and deform the chip electronic component during vacuum adsorption, and the contact position of the suction nozzle or the suction disc forms an upward bulge or bulge, thereby influencing the quality of the chip electronic component;

secondly, in the production process, in the process of cutting the chip electronic component by the blade, the edge of the chip electronic component is cut off by the edge trimmer during cutting, only the chip electronic component which is tidy and has the size meeting the requirement is left, the cut edge of the chip electronic component is not needed, but the edge materials are left on the cutting table, the next cutting is influenced, the detection sight line is blocked, the edge trimmer cannot accurately monitor the electrode on the side edge of the electronic component at all, and the device cannot judge an accurate cutting point; and the waste leftover materials which are cut off can influence the cutting angle of the cutting blade, so that the cutting precision of the chip electronic component cannot be guaranteed.

Based on this, the utility model designs a chip electronic component's bead cutter to solve above-mentioned problem.

Disclosure of Invention

An object of the utility model is to provide a slice electronic component's bead cutter can just add the cutting raw materials without shutting down, can also be through the modified sucking disc, can level and smooth stable absorption and translation with thinner slice electronic component to slice electronic component can not be because of suction produces the deformation, and through cleaning device, can in time clean the leftover bits that slice electronic component cut off, can not influence the normal work of blade when guaranteeing to cut next time once more.

The utility model discloses a realize like this: an edge trimmer for chip electronic components, comprising:

the top of the rack table is a horizontal working platform, a protection cabinet is covered on the edge of the top of the rack table, an alarm and a controller are further arranged on the protection cabinet, an operation opening is formed in the front face of the protection cabinet, and the controller is arranged right above the operation opening;

the sliding base is fixedly arranged at the top of the rack platform, the central axis of the sliding base is overlapped with the central axis of the rack platform, and a sliding rail is arranged on the sliding base;

a cutting table is arranged on the sliding rail in a sliding manner and can rotate horizontally;

the sliding base is also transversely and fixedly provided with a sliding rail cross beam, and the sliding rail cross beam is provided with a translation motor;

the cutting device can be installed on the supporting frame in a lifting mode through a lifting motor, is suspended right above the cutting table and is arranged on one side close to the front face of the machine frame platform;

the waste hopper is of a square hopper-shaped structure, an opening at the top of the waste hopper is formed at one side close to the edge of the front side of the rack, and an opening at the bottom of the waste hopper is arranged in the rack and is arranged right below one end of the front side of the sliding base;

the device comprises a raw material frame and a finished product frame, wherein the raw material frame and the finished product frame are erected at the top of one side of the front face of a rack table, and the bottoms of the raw material frame and the finished product frame are both installed on the rack table through vertically arranged cylinders;

the raw material frame and the finished product frame have the same structure, and are provided with limiting plates for clamping chip electronic elements; the raw material frame and the finished product frame are symmetrically arranged on the left side and the right side of the sliding base;

the two ccd detectors are respectively erected at the left side and the right side of the cutting table, and the two ccd detectors are arranged right opposite to the cutting position of the cutting table;

the feeding sucker and the finished product sucker are hoisted on a slide rail cross beam through a motor which moves up and down, are transversely driven on the slide rail cross beam through a translation motor and are respectively arranged right above the raw material rack and the finished product rack, the working positions of the raw material rack and the finished product rack are respectively overlapped with the projection positions of the raw material rack, the cutting table and the finished product rack, and the feeding sucker and the finished product sucker have the same structure;

the feeding sucker comprises a cover plate, suckers, sucker adjusting plates, a suction plate and a linking buffer frame, wherein the linking buffer frame is arranged on a slide rail beam in a lifting mode through an air cylinder, the cover plate is arranged at the bottom of the linking buffer frame through a spring, the suction plate is fixedly locked at the bottom of the cover plate, the sucker adjusting plates are arranged below the suction plate in a distance-adjustable mode through adjusting screws, the sucker adjusting plates are not connected with the suction plate, a plurality of suckers are uniformly and fixedly arranged at the bottom of the suction plate, the lower end of the bottom of each sucker penetrates through the sucker adjusting plates to extend out of the lower portion of the bottom of the sucker, and the top of each sucker is hermetically connected with an external negative pressure device on the suction plate;

the cleaning device comprises a cleaning roller, a cleaning motor, a lifting frame and a lifting cylinder, wherein the cleaning roller is horizontally arranged on a rotating shaft of the cleaning motor, the cleaning motor is arranged on the lifting frame, and the lifting frame is lifted and hung on the supporting frame through the lifting cylinder;

the cleaning device is arranged on one side of the back of the supporting frame, and the cleaning device and the cutting device do not interfere with each other;

the controller is in communication connection with the alarm, the ccd detector, the cleaning device, the cutting table, the cutting device, the feeding sucker, the raw material frame, the finished product frame and the finished product sucker.

Further, the sucking disc bottom is the absorption quotation of silica gel, absorb the quotation and pass through buffering elastic sleeve and external negative pressure device intercommunication, every the absorption quotation diameter of sucking disc is no longer than 15mm, every a plurality of little suction holes have been seted up on the absorption quotation of sucking disc, every little suction hole passes through sucking disc suction pipe and external negative pressure device intercommunication.

Further, the buffering elastic sleeve is a tubular rubber elastic joint, and the aperture of the micro suction hole is not more than 1 mm.

Further, the controller is a plc controller.

Further, the cleaning roller is a roller-shaped soft brush;

when the lifting cylinder extends, the cleaning roller is tightly attached to the cutting table;

when the lifting cylinder contracts, the cleaning roller is separated from the cutting table.

Further, cutting device includes elevator motor, cutting stopper, links up frame and blade, the blade can go up and down through linking up the frame install on elevator motor's lift lead screw, elevator motor sets firmly on the support frame, link up still elastic mounting in frame bottom has cut the stopper, the contactless clamp of cutting stopper is established in both sides around the blade.

Furthermore, the top of the cutting table is a flat surface which is horizontally arranged, a plurality of suction holes are formed in the flat surface, the aperture of each suction hole is not more than 1mm, and each suction hole is connected with an external vacuum device.

Further, when the raw material rack and the finished product rack are lowered to the top of the machine frame, the height difference between the raw material rack and the finished product rack and the cutting table is not less than 25 cm.

The utility model has the advantages that: 1. the utility model adds the cleaning device, the whole cleaning device can move up and down through the lifting cylinder, so that the cleaning device can be tightly attached to the cutting table and can be separated from the cutting table, and the cutting table can be cleaned conveniently, thereby ensuring that the cutting table is clean when cutting each time, ensuring the cutting precision, and when cleaning the cleaning device, the cut leftover bits can be rolled and swept into a waste material funnel without being stacked on the machine frame platform, and the normal operation of other devices is not influenced;

2. the sucking disc of the device is different from a common sucking disc, not only can stably suck and move the chip electronic element, but also can generate a plurality of strands of small and uniform suction forces through a plurality of micro suction holes, thereby avoiding the large suction force and the sunken sucking disc from sucking and deforming the electronic element and avoiding the electronic element from being scrapped;

3. the device can timely detect whether the cut of the electronic element meets the production requirement through the matching of the ccd detector and the cutting device, can timely send out a warning through the alarm, timely processes the warning, and avoids unqualified products from flowing into the market;

4. the raw material frame and the finished product frame of the device can be lifted on the stand platform, cutting and cutting tables can be far away, moving sliding rails can be far away, danger is avoided, so that raw materials can be put into the device without stopping, finished products can also be taken out, the raw material frame and the finished product frame of the device are fixed, the raw materials can be placed into the accurate position, and the cutting accuracy and the material taking accuracy of the feeding sucker are improved.

Drawings

The invention will be further described with reference to the following examples with reference to the accompanying drawings.

FIG. 1 is a schematic structural view of the external whole front of the present invention;

FIG. 2 is a schematic view of the external overall back structure of the present invention;

FIG. 3 is an overall exterior elevation view of the present invention;

FIG. 4 is a schematic view of the front structure of the interior of the present invention;

FIG. 5 is a schematic view of the internal back structure of the present invention;

FIG. 6 is a schematic view showing the positional relationship between the slide base and the waste hopper according to the present invention;

FIG. 7 is a schematic view of the position relationship between the support frame and the cutting table of the present invention;

FIG. 8 is a schematic structural view of the cutting device of the present invention;

FIG. 9 is a schematic view of the cleaning device of the present invention;

FIG. 10 is a schematic view of the installation relationship between the cutting table and the sliding base according to the present invention;

FIG. 11 is a schematic view of the structure of the feeding sucker of the present invention;

fig. 12 is a bottom view of the feeding sucker;

fig. 13 is an exploded view of the feeding sucker of the present invention;

FIG. 14 is a schematic view of a single suction cup of the present invention;

FIG. 15 is a schematic view of the top structure of the feeding sucker;

fig. 16 is a schematic view of the bottom structure of the feeding sucker.

In the drawings, the components represented by the respective reference numerals are listed below:

1-frame table, 11-protection cabinet, 12-alarm, 13-operation opening, 14-controller, 2-feeding sucker, 21-raw material frame, 22-cover plate, 221-adjusting screw, 23-sucker, 231-micro sucking hole, 232-buffering elastic tube, 24-sucker adjusting plate, 241-sucker plate, 25-engagement buffer frame, 3-sliding base, 31-cutting table, 311-steering motor, 312-sliding table, 32-sliding rail, 33-waste hopper, 34-cutting device, 341-lifting motor, 342-cutting limiting block, 343-engagement frame, 344-clamping plate, 345-blade, 4-cleaning device, 41-cleaning roller, 42-cleaning motor, 43-lifting frame, 44-lifting cylinder, 5-finished product sucker, 51-finished product frame, 6-support frame, 61-slide rail beam, 62-beam motor and 7-ccd detector.

Detailed Description

Referring to fig. 1 to 16, the present invention provides a technical solution: an edge trimmer for chip electronic components, comprising:

the device comprises a rack table 1, wherein the top of the rack table is a horizontal working platform, a protective cabinet 11 is covered on the edge of the top of the rack table, an alarm 12 and a controller 14 are further arranged on the protective cabinet 11, an operation opening 13 is formed in the front of the protective cabinet 11, and the controller 14 is arranged right above the operation opening 13;

the sliding base 3 is fixedly arranged at the top of the rack table 1, wherein the central axis of the sliding base is overlapped with the central axis of the rack table 1, and a sliding rail 32 is arranged on the sliding base;

the sliding rail 32 is provided with a cutting table 31 in a sliding manner and can rotate horizontally;

the support frame 6 is fixedly erected above the sliding base 3, the sliding base 3 is further transversely and fixedly provided with a sliding rail cross beam 61, and the sliding rail cross beam 61 is provided with a translation motor 62;

the cutting device 34 can be installed on the support frame 6 in a lifting mode through the lifting motor 341, the cutting device 34 is suspended right above the cutting table 31, and the cutting device 34 is arranged on one side close to the front face of the rack frame 1;

the waste hopper 33 is of a square hopper-shaped structure, an opening at the top of the waste hopper is formed at one side close to the edge of the front side of the rack table 1, and an opening at the bottom of the waste hopper is arranged in the rack table 1 and is arranged right below one end of the front side of the sliding base 3;

the raw material frame 21 and the finished product frame 51 are erected at the top of one side of the front face of the frame 1, and the bottoms of the raw material frame 21 and the finished product frame 51 are both arranged on the frame 1 through vertically arranged air cylinders;

the raw material frame 21 and the finished product frame 51 have the same structure, and are provided with limiting plates for clamping chip electronic components; the raw material frame 21 and the finished product frame 51 are symmetrically arranged at the left side and the right side of the sliding base 3;

at least two ccd detectors 7 are arranged, the two ccd detectors 7 are respectively erected at the left side and the right side of the cutting table 31, and the two ccd detectors 7 are arranged right opposite to the cutting position of the cutting table 31;

the feeding sucker 2 and the finished product sucker 5 are hung on a sliding rail cross beam 61 through a motor which moves up and down, are transversely driven on the sliding rail cross beam 61 through a translation motor 62 and are respectively arranged right above the raw material frame 21 and the finished product frame 51, the working positions of the raw material frame 21 and the finished product frame 51 are respectively overlapped with the projection positions of the raw material frame 21, the cutting table 31 and the finished product frame 51, and the feeding sucker 2 and the finished product sucker 5 have the same structure;

the feeding sucker 2 comprises a cover plate 22, suckers 23, a sucker adjusting plate 24, a suction plate 241 and a connecting buffer frame 25, the connecting buffer frame 25 is installed on a sliding rail beam 61 in a lifting mode through an air cylinder, the cover plate 22 is installed at the bottom of the connecting buffer frame 25 through a spring, the suction plate 241 is fixed at the bottom of the cover plate 22 in a locking mode, the sucker adjusting plate 24 is installed below the suction plate 241 in a distance adjusting mode through an adjusting screw 221, the sucker adjusting plate 24 is not connected with the suction plate 241, a plurality of suckers 23 are evenly and fixedly installed at the bottom of the suction plate 241, the lower end of the bottom of each sucker 23 penetrates through the sucker adjusting plate 24 to extend out of the bottom of the sucker adjusting plate 24, and the top of each sucker 23 is hermetically connected with an external negative pressure device on the suction plate 241;

the cleaning device 4 comprises a cleaning roller 41, a cleaning motor 42, a lifting frame 43 and a lifting cylinder 44, wherein the cleaning roller 41 is horizontally arranged on a rotating shaft of the cleaning motor, the cleaning motor 42 is arranged on the lifting frame 43, and the lifting frame 43 can be lifted and hung on the supporting frame 6 through the lifting cylinder 44;

the cleaning device 4 is arranged on one side of the back surface of the supporting frame 6, and the cleaning device 4 and the cutting device 34 do not interfere with each other;

controller 14 and siren 12, the ccd detector 7, cleaning device 4, cutting table 31, cutting device 34, material loading sucking disc 2, raw material frame 21, finished product frame 51 and finished product sucking disc 5 communication connection, can just can add the cutting raw materials without shutting down, can also be through modified sucking disc 23, can level stable absorption and translation with thinner piece formula electronic component, and piece formula electronic component can not be because of suction produces the deformation, and through cleaning device 4, can in time clean the leftover bits that piece formula electronic component was cut off, can not influence the normal work of blade when guaranteeing to cut next time again.

The bottom of the sucking disc 23 is a sucking disc surface of silica gel, the sucking disc surface is communicated with an external negative pressure device through a buffering elastic sleeve 232, the diameter of the sucking disc surface of each sucking disc 23 is not more than 15mm, a plurality of micro sucking holes 231 are formed in the sucking disc surface of each sucking disc 23, each micro sucking hole 231 is communicated with the external negative pressure device through a sucking pipe of the sucking disc 23, the electronic element and the feeding sucking disc 2 can be stably sucked and moved even if the electronic element and the feeding sucking disc are not completely parallel to each other through the elastic buffering elastic sleeve 232, and the sucking force can be controlled to be more uniform through the micro sucking holes 231;

the buffering elastic sleeve 232 is a tubular rubber elastic joint, the aperture of the micro suction hole 231 is not more than 1mm, and the micro suction hole can uniformly and stably suck the electronic element and can prevent the electronic element from being sucked and deformed by a larger suction disc surface;

the controller 14 is a plc controller, which is a common controller and is convenient for setting programming and operation;

the cleaning roller 41 is a roller-shaped soft brush;

when the lifting cylinder 44 extends, the cleaning roller 41 is tightly attached to the cutting table 31;

when the lifting cylinder 44 contracts, the cleaning roller 41 is separated from the cutting table 31, so that the cleaning roller 41 can clean the leftover conveniently without sweeping the finished product;

the cutting device 34 comprises a lifting motor 341, a cutting limit block 342, a connecting frame 343 and a blade 344, the blade 344 is installed on a lifting screw rod of the lifting motor 341 in a lifting manner through the connecting frame 343, the lifting motor 341 is fixedly arranged on the support frame 6, the cutting limit block 342 is also elastically installed at the bottom of the connecting frame 343, the cutting limit block 342 is clamped on the front side and the rear side of the blade 344 in a non-contact manner, and the cutting device 34 can accurately cut the electronic element through the structure;

the top of the cutting table 31 is a flat surface which is horizontally arranged, a plurality of suction holes are arranged on the flat surface, the aperture of each suction hole is not more than 1mm, each suction hole is connected with an external vacuum device, accurate cutting can be carried out through the flat cutting table 31, and the cutting table 31 can stably suck electronic components to carry out translation and cutting;

when the raw material frame 21 and the finished product frame 51 are lowered to the top of the rack table 1, the height difference between the raw material frame 21 and the finished product frame 51 and the cutting table 31 is not lower than 25cm, and the height difference is large, so that the cutting device 34 can conveniently and directly place electronic elements in principle when being in a rest state, finished products after cutting can be collected, and the machine does not need to be stopped.

In a specific embodiment of the present invention:

the embodiment of the utility model provides a trimming machine for chip electronic components, which solves the technical problem that the trimming machine for chip electronic components is provided with a trimming head;

1. in order to ensure the cutting precision, the cutting blade 345 of the electronic component is very thin, and is easy to wear and produce a gap under impact, when the existing edge trimmer is used for cutting, the quality of the cut electronic component cannot be monitored in real time, the yield of products is low, the cutting blade cannot be carefully checked, and whether the cutting blade keeps a high-precision cutting state in long-time high-frequency cutting or not is uncertain;

2. the cutting with high frequency causes more leftover materials dropped during cutting, the leftover materials are easy to accumulate on a cutting table 31, and subsequent cutting cannot be normally carried out, the existing method is that air is used for blowing, manual timely cleaning is used for some materials, each electronic element is used for cutting, and at least 4 edges are required to be cut neatly, so that the leftover materials are more, the air can blow the cut materials to equipment, the cut materials can be clamped in a moving device, the equipment is clamped, manual cleaning is used, in the normal operation process of the equipment, the accurate cleaning time is difficult to grasp, and the normal operation of the equipment is easy to influence;

3. the suction clamping device of the existing edge trimmer is basically used for sucking by negative pressure, the chip electronic element is low in hardness, poor in toughness and easy to deform and damage, the sucked part of the electronic element is easy to deform and scrap due to the fact that the negative pressure of the existing suction device is too large, the electronic element cannot be stably conveyed to an accurate position due to too small suction force, and the cutting position is not accurate due to the fact that the electronic element cannot be stably conveyed due to too small suction force;

the realized technical effects are as follows: 1. the utility model discloses increased cleaning device 4, made whole cleaning device 4 can reciprocate through lift cylinder 44, thereby can closely laminate on cutting bed 31, also can separate with cutting bed 31, thereby convenient section cutting bed 31 cleans, thereby ensures that when cutting at every turn, cutting bed 31 is clean, guarantees the cutting precision, and when this device cleans, can roll the leftover bits that cut down and sweep to waste material funnel 33 in, do not pile up in frame platform 1, do not influence the normal operating of other devices;

2. the sucking disc 23 of the device is different from a common sucking disc 23, not only can stably suck and move a chip type electronic element, but also can generate a plurality of strands of smaller and uniform suction forces through a plurality of micro suction holes 231, can avoid the deformation of the electronic element sucked by a large suction force and a sunken sucking disc 23 and avoid the scrapping of the electronic element, because the bottom of the sucking disc 23 of the device is provided with the buffering elastic tube 232, when the device sucks the whole electronic element, the electronic element is allowed to be incompletely positioned on a complete horizontal plane and can be inclined to a certain degree, the feeding sucking disc 2 and the finished product sucking disc 5 of the device can also stably suck and place the electronic element, when the two previous rigid flat surface sucking discs are mutually matched, the two previous rigid flat surface sucking discs cannot be inclined to a certain degree, otherwise, the upper sucking disc and the lower sucking disc can be damaged by collision, and the accurate coordinate of the placing position can not be ensured, the device has no problem of complete level;

3. the device can timely detect whether the cut of the electronic element meets the production requirement through the matching of the ccd detector 7 and the cutting device 34, can timely send out a warning through the alarm, timely process the cut, and prevent unqualified products from flowing into the market, and the ccd detector 7 of the device can also timely check whether the cut blade is intact, so that the cutting precision is ensured;

The embodiment of the utility model provides an in technical scheme for solving above-mentioned problem, the general thinking is as follows:

for better understanding of the above technical solutions, the following detailed descriptions will be provided in conjunction with the drawings and the detailed description of the embodiments.

When the utility model is manufactured and installed, a flat workbench is firstly manufactured as a rack platform 1, then a protection cabinet 11 is erected on the workbench, an alarm 12 and a controller 14 are installed on the protection cabinet 11, one surface of the rack platform is selected as a front surface, and an operation opening 13 is arranged, as shown in fig. 1;

the raw material frame 21, the finished product frame 51, the feeding sucker 2, the finished product sucker 5, the cutting device 34, the cleaning device 4, the sliding base 3 and the cutting table 31 of the device are all arranged at the top of the machine frame 1 and are positioned inside the protection cabinet 11;

firstly, a sliding base 3 is arranged on the top of a machine frame 1, the sliding base 3 is a long strip-shaped base station, the long strip-shaped base station is positioned on a central axis of the top of the machine frame 1, the front side and the rear side of the machine frame 1 are connected, the central axis of the machine frame 1 is vertically overlapped with the central axis of the sliding base 3, then a sliding rail 32 is arranged on the top of the sliding base 3, the sliding rail 32 is connected with the front end and the rear end of the sliding base 3, the central line of the sliding rail 32 is overlapped with the central line of the sliding base 3, a sliding table 312 is arranged in the sliding rail 32, the sliding table 312 can slide back and forth through the driving of a servo motor in the sliding rail 32, a steering motor 311 is arranged on the top of the sliding table 312, a rotating shaft of the steering motor 311 is perpendicular to the machine frame 1, the rotating shaft 311 is upwards arranged, a cutting table 31, namely, the cutting table 31 is inlaid in the protective frame at the top of the sliding table 312 without contact, as shown in fig. 10, such a structure enables the cutting table 31 to horizontally rotate on the sliding table 312 along a vertical axis, and also to horizontally move on the sliding rail 32 along with the sliding table 312, and the cutting table 31 can be protected by the sliding table 312 and is not easily collided with other devices;

two holes are symmetrically formed in the rack stand 1 on two sides of the sliding base 3, and the holes are formed in one side close to the front surface of the rack stand 1, as shown in fig. 4, the raw material rack 21 and the finished product rack 51 are respectively installed in the holes on two sides through lifting cylinders, so that the raw material rack 21 and the finished product rack 51 can be lifted up and down, stability needs to be established, the maximum difference between the cutting table 31 and the raw material rack 21 and the finished product rack 51 can be ensured to be not less than 25cm, preferably 35cm, that is, under the condition that the raw material rack 21 and the finished product rack 51 are lowered to the minimum, the vertical height difference between the raw material rack 21 and the finished product rack 51 and the cutting table 31 is 35cm, the support frame 6 and the slide rail cross beam 61 are established on the rack stand 1 to form the structure of a gantry machining center, the feed sucker 2 and the finished product sucker 5 are installed on the slide rail cross beam 61, the feed sucker 2 and the finished product sucker 5 are used as the driving of translation through a cross beam motor 62, and the motor is also servo-driven;

a waste hopper 33 is arranged on the frame platform 1 at the front end of the sliding base 3, so that the top opening of the waste hopper 33 is connected to the front end of the sliding base 3, the raw material frame 21 and the finished product frame 51 are not flush with the waste hopper 33, and the edges of the raw material frame 21 and the finished product frame 51, which are closest to the front side of the frame platform 1, are flush with the front end of the sliding base 3;

the structure of the feeding sucker 2 is the same as that of the finished product sucker 5, the feeding sucker 2 is hung on a sliding rail beam 61 through a connecting buffer frame 25 and is driven to translate on the sliding rail beam 61 through a beam motor 62, the feeding sucker 2 is formed by sequentially covering and overlapping a cover plate 22, a suction plate 241 and a sucker adjusting plate 24 from top to bottom, the sucker adjusting plate 24 is directly installed on the cover plate 22 through an adjusting screw 221, so that the distance between the sucker adjusting plate 24 and the cover plate 22 can be adjusted through the adjusting screw 221, the suckers 23 are inserted into the sucker adjusting plate 24 and are arranged in the sucker adjusting plate 24 in a vertically penetrating mode, a plurality of suckers are uniformly installed on the suction plate 241, the suckers 23 are not fixed on the sucker adjusting plate 24, the structure enables the sucker adjusting plate 24 to be adjusted, and the length of the suckers extending out of the sucker adjusting plate 24 can be changed, thereby enabling adjustment of the suction depression distance of the suction cup 23;

the bottom of the sucker 23 is connected with a negative pressure device at the top through a buffer elastic tube 232, so that the sucker 23 can be elastically buffered when being pressed down, a plurality of micro-suction holes 231 are formed in the suction disc surface of the sucker 23, the diameter of the suction disc surface of the sucker 23 is generally between 1cm and 2cm, the aperture of each micro-suction hole 231 is 1mm, electronic elements can not deform through the micro-suction holes 231, and the electronic elements can be uniformly and powerfully sucked;

hoisting the cutting device 34 and the cleaning device 4 on the support frame 6, wherein the cleaning device 4 is positioned on one side of the back surface of the support frame 6, and the cutting device 34 is positioned on one side of the front surface of the support frame 6, so that all leftover materials cut by the cutting device 34 can be swept away by the cleaning device 4;

the cutting device 34 is hoisted on the support frame 6 in a lifting manner through the lifting motor 341, the whole cutting device 34 is arranged right above the cutting table 31 and is positioned on one side of the support frame 6 close to the front side of the frame table 1, the blade 345 is clamped on the connecting frame 343 through the clamping plate 344, the connecting frame 343 is hoisted on the support frame 6 through the lifting motor 341, a cutting limit block 342 is also hoisted on the connecting frame 343 through a spring, the cutting limit block 342 is blocked on a certain extending position of the blade 345, the cutting is prevented from being too deep, and an electronic element can be pressed;

cleaning device 4's cleaning roller 41 is the level and erects, and install in the axis of rotation of cleaning motor 42, and cleaning roller 41 is horizontal pivoted too, cleaning motor 42 is installed on crane 43, crane 43 reciprocates on support frame 6 through lift cylinder 44, it cleans cutting platform 31 to roll cleaning roller 41 decline when being convenient for clean, raise cleaning roller 41 when not cleaning and do not contact with cutting platform 31, cleaning roller 41 is the soft brush cylinder, can not scratch cutting platform 31 top plane, ensure electronic component's roughness, can clean in time the entering waste material funnel 33 with the leftover bits of cutting again.

The ccd detector 7 is also erected on the support frame 6, and two ccd detectors are erected to align the cutting positions from the left and right sides of the cutting table 31, so that whether the blade 345 is chipped or worn or not can be monitored, and whether the cut of the electronic component is complete or not can also be monitored.

All of the above devices are pre-programmed via plc controller 14.

When the utility model is used, firstly, a plurality of electronic elements are neatly overlapped into a batch, then the raw material frame 21 is placed, then the machine is started, the raw material frame 21 is lifted to the highest position, at the moment, the raw material frame 21 is highly flush with the cutting table 31, then the cutting table 31 slides on the slide rail 32 of the sliding base table 3 to the front side of the machine frame table 1, namely the side close to the raw material frame 21, then the feeding sucker 2 is started to move to the position right above the raw material frame 21, the feeding sucker 2 is arranged on the slide rail beam 61 through a lifting servo motor, the finished product sucker 5 and the feeding sucker 2 have the same structure, are adjacent to each other and are not in contact with each other, then the feeding sucker 2 extends downwards to suck the electronic elements through the negative pressure of the micro suction holes 231 on the sucker 23, the feeding sucker 2 shrinks and rises, then the crossbeam motor 62 translates to the position right above the cutting table 31, the feeding sucker 2 extends again, placing the electronic element at a set position on the cutting table 31, returning the feeding sucker 2 to the position right above the raw material frame 21 immediately, and moving the finished product sucker 5 to the position right above a working position for receiving raw materials before the cutting table 31;

then the cutting table 31 slides on the slide rail 32 of the sliding base 3 to the back of the rack platform 1, slides to the lower part of the cutting device 34, the lifting motor 341 descends, the connecting frame 343 descends together, the clamping plate 344 and the blade 345 cut downwards together to cut off the electronic component, the cutting limiting block 342 compresses the electronic component in advance, the cut blade 345 is cut into the gap between the cutting limiting blocks 342, the cutting limiting block 342 is connected with the connecting frame 343 through a spring, the spring can also play a role in buffering, the cutting guide can be carried out through the gap, the cutting depth of the oblique blade 345 can be limited through the size of the gap, when the blade is cut downwards to a certain depth, the thickness of the blade 345 is larger than the gap between the cutting limiting blocks 342, and the downward cutting cannot be continued;

after cutting, the lifting motor 341 controls the blade 345 to ascend, the steering motor 311 controls the cutting table 31 to axially rotate, and the cutting table rotates to the other side of the electronic component for cutting, because the leftover materials are only arranged on the side of the electronic component, the leftover materials cannot affect each other when cutting the same electronic component, and the peripheral side of one electronic component is cut;

the cutting table 31 moves to the front end on the slide rail 32, then the finished product sucker 5 sucks the electronic component, at this time, the lifting cylinder 44 controls the cleaning roller 41 to move downwards, the cleaning motor 42 drives the cleaning roller 41 to rotate, the rotation direction is fixed, the cut leftover materials are swept into the waste material hopper 33, the feeding sucker 2 can also suck a new piece of electronic component raw materials at the same time, then the finished product sucker 5 and the feeding sucker 2 move leftwards together, the feeding sucker 2 moves right above the cutting table 31, the finished product sucker 5 moves right above the finished product rack 51, then the finished product sucker 5 and the feeding sucker 2 extend downwards together, the finished product sucker 5 puts the cut electronic element on a finished product rack 51, the feeding sucker 2 places new electronic element raw materials on the cutting table 31, the cutting table 31 is provided with a flat sucker, and the electronic elements are sucked by the flat sucker to perform a new round of cutting operation;

in the cutting process, the ccd detector 7 can monitor the cutting blade 345 in real time and can also monitor the cut of the cut electronic components, once a problem is found, the alarm 12 is started to inform personnel of overhauling, and meanwhile, the cleaning device 4 is controlled to sweep the damaged electronic components into the waste hopper 33.

As shown in fig. 1 and 4, the longitudinal direction, the front side and the back of the device are the front side, that is, the side of the rack 1 near the raw material rack 21 and the finished product rack 51 is the front side, and the opposite side is the back side, that is, the other end of the sliding base 3 is the back side; the opposite transverse direction is the left side and the right side, and the straight line where the slide rail cross beam 61 is located is the left side and the right side connected with the rack table 1.

In addition, in the description of the present invention, it should be noted that, as the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. appear, the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and it is not intended to indicate or imply that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

Although specific embodiments of the present invention have been described, it will be understood by those skilled in the art that the specific embodiments described are illustrative only and are not limiting upon the scope of the invention, and that equivalent modifications and variations can be made by those skilled in the art without departing from the spirit of the invention, which is to be limited only by the claims appended hereto.

Claims

1. An edge trimmer for chip electronic components, comprising:

the device comprises a rack table (1), wherein the top of the rack table is a horizontal working platform, a protective cabinet (11) is covered on the edge of the top of the rack table, an alarm (12) and a controller (14) are further arranged on the protective cabinet (11), an operation opening (13) is formed in the front of the protective cabinet (11), and the controller (14) is arranged right above the operation opening (13);

the sliding base (3) is fixedly arranged at the top of the rack table (1), the central axis of the sliding base is overlapped with the central axis of the rack table (1), and a sliding rail (32) is arranged on the sliding base;

a cutting table (31) is arranged on the sliding rail (32) in a sliding manner and can rotate horizontally;

the support frame (6) is fixedly erected above the sliding base (3), the sliding base (3) is further transversely and fixedly provided with a sliding rail cross beam (61), and the sliding rail cross beam (61) is provided with a translation motor (62);

the cutting device (34) can be installed on the support frame (6) in a lifting mode through the lifting motor (341), the cutting device (34) is hung right above the cutting table (31), and the cutting device (34) is arranged on one side close to the front face of the rack table (1);

the waste hopper (33) is of a square hopper-shaped structure, an opening at the top of the waste hopper is formed at one side close to the edge of the front side of the rack (1), an opening at the bottom of the waste hopper is arranged in the rack (1) and is arranged right below one end of the front side of the sliding base (3);

the raw material frame (21) and the finished product frame (51) are erected at the top of one side of the front face of the rack table (1), and the bottoms of the raw material frame (21) and the finished product frame (51) are both installed on the rack table (1) through vertically arranged air cylinders;

the raw material rack (21) and the finished product rack (51) have the same structure, and are provided with limiting plates for clamping chip electronic components; the raw material frame (21) and the finished product frame (51) are symmetrically arranged on the left side and the right side of the sliding base (3);

the number of the ccd detectors (7) is at least two, the two ccd detectors (7) are respectively erected at the left side and the right side of the cutting table (31), and the two ccd detectors (7) are arranged right opposite to the cutting position of the cutting table (31);

the feeding sucker (2) and the finished product sucker (5) are hung on a sliding rail beam (61) through a motor which moves up and down, are transversely driven on the sliding rail beam (61) through a translation motor (62), and are respectively arranged right above a raw material rack (21) and a finished product rack (51), the working positions of the raw material rack (21) and the finished product rack (51) are respectively overlapped with the projection positions of the raw material rack (21), a cutting table (31) and the finished product rack (51), and the feeding sucker (2) and the finished product sucker (5) have the same structure;

the feeding sucker (2) comprises a cover plate (22), a sucker (23), a sucker adjusting plate (24), a suction plate (241) and a connecting buffer frame (25), the linking buffer frame (25) can be installed on the sliding rail beam (61) in a lifting way through an air cylinder, the bottom of the connecting buffer frame (25) is provided with a cover plate (22) through a spring, the suction plate (241) is locked and fixed at the bottom of the cover plate (22), the sucker adjusting plate (24) can be arranged below the suction plate (241) through an adjusting screw rod (221) with adjustable distance, the sucker adjusting plate (24) is not connected with the suction plate (241), a plurality of suckers (23) are uniformly and fixedly installed at the bottom of the suction plate (241), the lower end of the bottom of each sucker (23) penetrates through the sucker adjusting plate (24) to extend out of the bottom of the sucker adjusting plate, and the top of each sucker (23) is hermetically connected with an external negative pressure device on the suction plate (241);

the cleaning device (4) comprises a cleaning roller (41), a cleaning motor (42), a lifting frame (43) and a lifting cylinder (44), wherein the cleaning roller (41) is horizontally arranged on a rotating shaft of the cleaning motor, the cleaning motor (42) is arranged on the lifting frame (43), and the lifting frame (43) can be lifted and lifted on the supporting frame (6) through the lifting cylinder (44);

the cleaning device (4) is arranged on one side of the back surface of the support frame (6), and the cleaning device (4) and the cutting device (34) do not interfere with each other;

the controller (14) is in communication connection with the alarm (12), the ccd detector (7), the cleaning device (4), the cutting table (31), the cutting device (34), the feeding sucker (2), the raw material frame (21), the finished product frame (51) and the finished product sucker (5).

2. The edge trimmer for chip electronic components according to claim 1, wherein: sucking disc (23) bottom is the absorption quotation of silica gel, absorb the quotation through buffering elastic sleeve (232) and external negative pressure device intercommunication, every the absorption quotation diameter of sucking disc (23) is no longer than 15mm, every a plurality of little suction holes (231), every have been seted up on the absorption quotation of sucking disc (23) little suction holes (231) are through sucking disc (23) suction pipe and external negative pressure device intercommunication.

3. The edge trimmer for chip electronic components according to claim 2, wherein: the buffering elastic sleeve (232) is a tubular rubber elastic joint, and the aperture of the micro suction hole (231) is not more than 1 mm.

4. The edge trimmer for chip electronic components according to claim 1, wherein: the controller (14) is a plc controller.

5. The edge trimmer for chip electronic components according to claim 1, wherein: the cleaning roller (41) is a roller-shaped soft brush;

when the lifting cylinder (44) extends, the cleaning roller (41) is tightly attached to the cutting table (31);

when the lifting cylinder (44) contracts, the cleaning roller (41) is separated from the cutting table (31).

6. The edge trimmer for chip electronic components according to claim 1, wherein: the cutting device (34) comprises a lifting motor (341), a cutting limiting block (342), a connecting frame (343) and a blade (344), wherein the blade (344) can be installed on a lifting screw rod of the lifting motor (341) in a lifting mode through the connecting frame (343), the lifting motor (341) is fixedly arranged on a supporting frame (6), the cutting limiting block (342) is further elastically installed at the bottom of the connecting frame (343), and the cutting limiting block (342) is clamped on the front side and the rear side of the blade (344) in a non-contact mode.

7. The edge trimmer for chip electronic components according to claim 1, wherein: the top of the cutting table (31) is a flat surface which is horizontally arranged, a plurality of suction holes are arranged on the flat surface, the aperture of each suction hole is not more than 1mm, and each suction hole is connected with an external vacuum device.

8. The edge trimmer for chip electronic components according to claim 1, wherein: when the raw material rack (21) and the finished product rack (51) are lowered to the top of the machine frame (1), the height difference between the raw material rack (21) and the finished product rack (51) and the cutting table (31) is not less than 25 cm.