CN214544927U - Low-power consumption circuit board and computer - Google Patents
Low-power consumption circuit board and computer Download PDFInfo
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- CN214544927U CN214544927U CN202120156602.1U CN202120156602U CN214544927U CN 214544927 U CN214544927 U CN 214544927U CN 202120156602 U CN202120156602 U CN 202120156602U CN 214544927 U CN214544927 U CN 214544927U
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Abstract
The utility model provides a low-power consumption circuit board and computer, low-power consumption circuit board include computer circuit board and LPDDR3 chip, are provided with the pad on the computer circuit board, fix through the welded mode on the LPDDR3 chip on the pad on the computer circuit board. The LPDDR3 chip is fixed on the pad of the computer circuit board in a welding mode by arranging the pad on the computer circuit board, so that the LPDDR3 chip with large capacity, low power consumption and low heat productivity replaces a memory device on the computer circuit board, the capacity of the memory device on the computer circuit board can be increased, and the heat productivity of the memory device on the computer circuit board can be reduced, so that the heat dissipation effect of the memory device is improved.
Description
Technical Field
The utility model relates to a computer field, in particular to low-power consumption circuit board and computer.
Background
At present, the information industry is developing at a high speed, and for example, in the case of computers, in addition to the speed and performance of cpus, the performance, capacity and speed of other electronic components such as memory bank modules are also improved. The memory module comprises a circuit board, a plurality of random access memory chips arranged on two sides of the circuit board and related electronic elements, and is used for being inserted into a memory card connector on a computer mainboard and temporarily storing computer operation data. As the overall performance requirements of computers continue to increase, the capacity and speed of memory bank modules also continue to increase. However, the increase in the capacity and speed of the memory module inevitably makes the heat dissipation problem relatively serious.
Therefore, the present invention provides a reasonable and effective solution to the above problems by the way that the designers feel the improvement of the above problems and the study is conducted with great attention and the application of the theory is applied.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a low-power consumption circuit board and computer aims at being convenient for improve the capacity of DRAM and promote the radiating effect.
In order to achieve the above object, the utility model provides a low-power consumption circuit board, low-power consumption circuit board includes:
the computer circuit board is provided with a bonding pad;
the chip is an LPDDR3 chip, and the chip is an LPDDR3 chip which is fixed on a pad on the computer circuit board by means of welding.
In an optional embodiment, the low power circuit board further includes:
a plurality of solder ball connectors soldered to a surface of the LPDDR3 chip facing the computer circuit board.
In an alternative embodiment, the arrangement positions of the solder ball connectors on the LPDDR3 chip are matched with the positions of the pads, and the number of the solder ball connectors is 136.
In an alternative embodiment, the LPDDR3 chip is mounted on the computer circuit board by surface mount technology.
In an optional embodiment, the low power circuit board further includes:
and the heat dissipation device is connected to the surface of the LPDDR3 chip, which is far away from the connecting pins.
In an alternative embodiment, the heat dissipation device is a heat dissipation grid.
In an optional embodiment, the low power circuit board further includes:
the CPU chip is integrated on the computer circuit board, and the LPDDR3 chip is connected with the CPU chip through the computer circuit board.
In an optional embodiment, the low power circuit board further includes:
the memory chip is integrated on the computer circuit board, the memory chip is connected with the CPU chip, and the LPDDR3 chip is connected with the memory chip through the computer circuit board.
In an alternative embodiment, the memory chip is an EMMC.
In order to achieve the above object, the present invention provides a computer, which includes the low power circuit board as described above.
The utility model provides a low-power consumption circuit board and computer, low-power consumption circuit board include computer circuit board and LPDDR3 chip, be provided with the pad on the computer circuit board, fix through the welded mode on the LPDDR3 chip on the pad on the computer circuit board. The LPDDR3 chip is fixed on the pad of the computer circuit board in a welding mode by arranging the pad on the computer circuit board, so that the LPDDR3 chip with large capacity, low power consumption and low heat productivity replaces a memory device on the computer circuit board, the capacity of the memory device on the computer circuit board can be increased, and the heat productivity of the memory device on the computer circuit board can be reduced, so that the heat dissipation effect of the memory device is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments or examples of the present invention, the drawings used in the embodiments or examples will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a low power consumption circuit board according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of an LPDDR3 chip according to an embodiment of the present invention in one direction;
FIG. 3 is a schematic diagram of another structure of the LPDDR3 chip according to the embodiment of the invention;
fig. 4 is a schematic side view of the LPDDR3 chip according to an embodiment of the present invention.
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The utility model provides a low-power consumption circuit board.
In one embodiment, as shown in fig. 1, 2 and 4, the low power consumption circuit board includes a computer circuit board 1 and an LPDDR3 chip 2, a pad (not shown) is disposed on the computer circuit board 1, and the LPDDR3 chip 2 is fixed on the pad of the computer circuit board 1 by soldering. That is, the utility model provides an among the technical scheme, through set up the pad on the computer circuit board 1, so that LPDDR3 chip 2 passes through the welded mode to be fixed on computer circuit board 1's pad for capacious, low-power consumption, low calorific capacity LPDDR3 chip 2 replaces memory device on the computer circuit board 1, thereby can increase memory device's on the computer circuit board 1 capacity, and can be through the calorific capacity that reduces the memory device on the computer circuit board 1 to this radiating effect who promotes the memory device.
As the existing computer devices are more and more miniaturized, the demand of the computer circuit board 1 also approaches miniaturization, which requires that the electronic components on the computer circuit board 1 are arranged more compactly, so that the computer circuit board 1 and the electronic components thereon cannot radiate heat well due to the close arrangement of the electronic components on the computer circuit board 1 during the operation of the computer device. Therefore, the utility model provides an among the technical scheme, adopt the operation memory chip (being LPDDR3 chip 2) of mobile device to replace the memory device on the computer circuit board 1, and it is right the pad on the computer circuit board 1 improves to make this pad can the adaptation the size of LPDDR3 chip 2, thereby make the computer have bigger ground memory space during operation, and possess lower consumption and calorific capacity.
In other words, in the embodiment, the low power consumption circuit board further includes a plurality of solder ball connectors 21, and the plurality of solder ball connectors 21 are soldered to the surface of the LPDDR3 chip 2 facing the computer circuit board 1. When the LPDDR3 chip 2 is soldered to the LPDDR3 chip 2, the solder ball connectors 21 are soldered to the surface of the LPDDR3 chip 2 facing the computer circuit board 1, so that when the LPDDR3 chip 2 is soldered to the pads of the computer circuit board 1, the solder ball connectors 21 are melted by a soldering device, and the LPDDR3 chip 2 is soldered to the pads, i.e., the LPDDR3 chip 2 is connected to the computer circuit board 1.
Further, in the present embodiment, the solder pads on the computer circuit board 1 are improved, that is, the arrangement positions of the solder ball connectors 21 on the LPDDR3 chip 2 are matched with the positions of the solder pads, so that the LPDDR3 chip 2 can be soldered on the computer circuit board 1, and then the functions of the pins of the LPDDR3 chip 2 can be realized.
Specifically, since the memory disposed on the computer circuit board 1 is generally configured as 78 balls or 96 balls, and the LPDDR3 chip 2 is generally configured as 136 balls in this embodiment, that is, the number of the solder ball connectors is 136, in order to adapt to the LPDDR3 chip 2, the pad area on the computer circuit board 1 needs to be increased, so that the LPDDR3 chip 2 can be completely soldered on the computer circuit board 1.
Further, the LPDDR3 chip 2 is mounted on the computer circuit board by surface mount technology. The surface mount technology, SMT for short, described in this embodiment has the advantages of compact structure, small size, vibration resistance, impact resistance, good high-frequency characteristics, high production efficiency, and the like, and under the condition that the inclination angle is not too large and no external force is applied to collision, a general memory device cannot move, i.e., has good stability.
Further, in order to improve the heat dissipation effect of the LPDDR3 chip 2, as shown in fig. 3 or 4, the low power consumption circuit board in this embodiment further includes a heat dissipation device 22, and the heat dissipation device 22 is connected to a surface of the LPDDR3 chip 2 away from the connection pins 21, that is, when the LPDDR3 chip 2 is mounted on the computer circuit board 1 and operates, heat generated by the LPDDR3 chip 2 during operation can be conducted to the external environment through the heat dissipation device 22, so as to achieve a better heat dissipation effect.
Optionally, the heat dissipation device 22 is a heat dissipation grid.
Of course, in other embodiments, the heat dissipation device 22 may also be a heat dissipation rib, and the like, which is not limited herein.
Further, as shown in fig. 1, the low power consumption circuit board further includes a CPU chip 3, the CPU chip 3 is integrated on the computer circuit board 1, and the LPDDR3 chip 2 is connected to the CPU chip 3 through the computer circuit board 1, that is, the CPU chip 3 is used to control the operation of the LPDDR3 chip 2.
Of course, in order to realize the memory function, the low power consumption circuit board further includes a memory chip 4, the memory chip 4 is integrated on the computer circuit board 1, the memory chip 4 is connected to the CPU chip 2, the LPDDR3 chip 2 is connected to the memory chip 4 through the computer circuit board 1, and the memory chip 4 is used for storing the operation data of the LPDDR3 chip 2.
Optionally, the memory chip 4 is an EMMC.
The utility model provides an among the technical scheme, the low-power consumption circuit board includes computer circuit board 1 and LPDDR3 chip 2, be provided with the pad on the computer circuit board 1, fix through the welded mode on the LPDDR3 chip 2 on the pad of computer circuit board 1. That is, the utility model provides an among the technical scheme, through set up the pad on the computer circuit board 1, so that LPDDR3 chip 2 passes through the welded mode to be fixed on computer circuit board 1's pad for capacious, low-power consumption, low calorific capacity LPDDR3 chip 2 replaces memory device on the computer circuit board 1, thereby can increase memory device's on the computer circuit board 1 capacity, and can be through the calorific capacity that reduces the memory device on the computer circuit board 1 to this radiating effect who promotes the memory device.
Based on the above embodiment, the utility model also provides a computer.
Wherein, the computer includes the low-power consumption circuit board of the above-mentioned embodiment.
Since the computer in this embodiment includes the low power consumption circuit board in the above embodiment, that is, the computer in this embodiment includes all technical features and technical effects of the low power consumption circuit board in the above embodiment, specific reference is made to the description of the above embodiment, and details are not repeated here.
The above is only the optional embodiment of the present invention, and not therefore the limit to the patent scope of the present invention, all the concepts of the present invention utilize the equivalent transformation made by the contents of the specification and the drawings, or the direct/indirect application in other related technical fields are included in the patent protection scope of the present invention.
Claims (10)
1. A low power consumption circuit board, characterized in that the low power consumption circuit board comprises:
the computer circuit board is provided with a bonding pad;
the chip LPDDR3 is fixed on the chip LPDDR3 by means of welding on the pad of the computer circuit board.
2. The low power circuit board of claim 1, further comprising:
a plurality of solder ball connectors soldered to a surface of the LPDDR3 chip facing the computer circuit board.
3. The low power consumption circuit board of claim 2, wherein the solder ball connectors are arranged at positions on the LPDDR3 chip corresponding to the positions of the pads, and the number of the solder ball connectors is 136.
4. The low power circuit board of claim 1, wherein the LPDDR3 chip is mounted on the computer circuit board by surface mount technology.
5. The low power circuit board of claim 1, further comprising:
and the heat dissipation device is connected to the surface of the LPDDR3 chip, which is far away from the connecting pins.
6. The low power consumption circuit board of claim 5, wherein the heat dissipation device is a heat dissipation grid.
7. The low power consumption circuit board according to any one of claims 1 to 6, further comprising:
the CPU chip is integrated on the computer circuit board, and the LPDDR3 chip is connected with the CPU chip through the computer circuit board.
8. The low power circuit board of claim 7, further comprising:
the memory chip is integrated on the computer circuit board, the memory chip is connected with the CPU chip, and the LPDDR3 chip is connected with the memory chip through the computer circuit board.
9. The low power consumption circuit board of claim 8, wherein the memory chip is an EMMC.
10. A computer, characterized in that the computer comprises a low power consumption circuit board according to any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120156602.1U CN214544927U (en) | 2021-01-20 | 2021-01-20 | Low-power consumption circuit board and computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120156602.1U CN214544927U (en) | 2021-01-20 | 2021-01-20 | Low-power consumption circuit board and computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214544927U true CN214544927U (en) | 2021-10-29 |
Family
ID=78346047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120156602.1U Active CN214544927U (en) | 2021-01-20 | 2021-01-20 | Low-power consumption circuit board and computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214544927U (en) |
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2021
- 2021-01-20 CN CN202120156602.1U patent/CN214544927U/en active Active
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