CN214521433U - Dustproof and antistatic LED module adhesive sealing device - Google Patents
Dustproof and antistatic LED module adhesive sealing device Download PDFInfo
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- CN214521433U CN214521433U CN202120595282.XU CN202120595282U CN214521433U CN 214521433 U CN214521433 U CN 214521433U CN 202120595282 U CN202120595282 U CN 202120595282U CN 214521433 U CN214521433 U CN 214521433U
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Abstract
The utility model discloses a can prevent dust and prevent LED module molding equipment of static, the on-line screen storage device comprises a base, the base top is provided with the support, install the cylinder on the support, the flexible end of cylinder is connected with the lifter plate, lifter plate slidable mounting is on the support, the nozzle is installed to the lifter plate bottom, the base top is provided with and seals the mould, it is located under the nozzle to seal the mould, the base bottom is provided with the input pump, the output of input pump is connected with the nozzle through the hose, and the input is connected with external storage glue jar through the pipeline, the support periphery is covered with the dust cover, the up end cover of base has antistatic backing, the utility model discloses in can effectively avoiding production process, because of condensing pipeline or the nozzle blockage problem that causes of gluing, improved production efficiency.
Description
Technical Field
The utility model relates to a LED production technical field specifically is a but dustproof antistatic LED module molding equipment.
Background
Light emitting diodes are referred to as LEDs for short. Is made of a compound containing gallium (Ga), arsenic (As), phosphorus (P), nitrogen (N), etc. When electrons and holes are recombined, visible light is radiated, so that the light-emitting diode can be manufactured. In circuits and instruments as indicator lights or to form text or numerical displays. Gallium arsenide diodes emit red light, gallium phosphide diodes emit green light, silicon carbide diodes emit yellow light, and gallium nitride diodes emit blue light. Organic light emitting diodes OLED and inorganic light emitting diodes LED are classified by their chemical properties. At present, the market of LED lamps is expanding year by year, and the number of manufacturers invested in the LED production industry is gradually increased. In the LED production process, the LED module needs to be subjected to a pouring sealant process, so that the sealing property and the insulating property of the electronic element are ensured. However, the current sealing equipment is easy to cause the conditions of sealing glue condensation and nozzle blockage in the production process.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a but dustproof antistatic LED module molding equipment to solve the problem that provides among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a can dustproof prevent LED module adhesive sealing device of static, includes the base, the base top is provided with the support, install the cylinder on the support, the flexible end of cylinder is connected with the lifter plate, lifter plate slidable mounting is on the support, the nozzle is installed to the lifter plate bottom, the base top is provided with glues the mould, it is located under the nozzle to glue the mould, the base bottom is provided with the input pump, the output of input pump is connected with the nozzle through the hose, and the input is connected with external storage glue jar through the pipeline, the support periphery is covered with the dust cover, the up end cover of base has the antistatic backing.
Preferably, the nozzle includes the installation department, the installation department bottom is provided with into gluey portion, it is provided with the injecting glue mouth to advance gluey portion bottom, the installation department, advance gluey portion and injecting glue mouth be integrated into one piece, injecting glue mouth periphery cover is equipped with the heating jacket, the hose connection is in advancing gluey portion.
Preferably, a stirrer is installed in the glue storage tank, and a plurality of heaters are installed on the inner side wall of the glue storage tank.
Preferably, electric putter is installed on the inside top of installation department, electric putter's flexible end is connected with the piston board, piston board slidable mounting is inside the installation department.
Preferably, the heating jacket internally mounted has electric heating wire, the heating jacket has the heat conduction pad with the one end surface that the injecting glue mouth contacted.
Preferably, the heating jacket is connected with the injecting glue mouth through a plurality of coupling mechanism, coupling mechanism includes solid fixed ring and spacing ring, the spacing ring is located solid fixed ring top, gu fixed ring fixes on the lateral wall of injecting glue mouth, the spacing ring rotates to be installed on the heating jacket, the lateral wall surface of heating jacket sets up the logical groove corresponding with the spacing ring, gu be provided with a plurality of archs on fixed ring's the lateral wall, the recess corresponding with the arch has been seted up on the inside wall surface of spacing ring.
Compared with the prior art, the beneficial effects of the utility model are that: the dustproof cover plays a dustproof role, and the antistatic layer can prevent static electricity in the production process from influencing the product quality; in the production process, the heater is started to increase the storage temperature of the sealing adhesive, and the stirrer stirs the sealing adhesive to promote the flow of the sealing adhesive, so that the sealing adhesive is prevented from condensing and blocking a pipeline after long-time waiting; in the glue injection process, the input pump pumps the sealing glue into the glue inlet part, and meanwhile, the electric push rod pushes the piston plate to descend so as to further promote the sealing glue to flow out; the electric heating wire is electrified to generate heat to heat the glue injection nozzle, so that the glue in the glue injection nozzle can be kept at a certain temperature in the glue injection process, the liquidity of the glue injection nozzle is ensured, and the blockage of the glue injection nozzle caused by the coagulation and blocking of the cooled glue is avoided; the heating jacket is connected with the nozzle through a connecting mechanism, and is convenient to disassemble and assemble. The utility model discloses in can effectively avoiding production process, because of sealing the pipeline that the glue condenses and cause or nozzle block up the problem, improved production efficiency.
Drawings
Fig. 1 is a schematic overall structure diagram of the present invention;
FIG. 2 is a schematic structural view of a nozzle according to the present invention;
FIG. 3 is a schematic structural view of a heating jacket according to the present invention;
fig. 4 is a schematic structural diagram of the middle connection mechanism of the present invention.
In the figure: the method comprises the following steps of 1-base, 2-cylinder, 3-lifting plate, 4-nozzle, 5-glue sealing mold, 6-glue storage tank, 7-pipeline, 8-input pump, 9-hose, 10-installation part, 11-glue inlet part, 12-glue injection nozzle, 13-heating sleeve, 14-heater, 15-stirrer, 16-electric push rod, 17-piston plate, 18-electric heating wire, 19-heat conducting pad, 20-fixing ring, 21-limiting ring, 22-protrusion and 23-groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
Referring to fig. 1-3, the present invention provides a technical solution: a dustproof and antistatic LED module glue sealing device comprises a base 1, wherein a support is arranged at the top end of the base 1, a cylinder 2 is installed on the support, a lifting plate 3 is connected to the telescopic end of the cylinder 2, the lifting plate 3 is slidably installed on the support, a nozzle 4 is installed at the bottom end of the lifting plate 3, a glue sealing mold 5 is arranged at the top end of the base 1, the glue sealing mold 5 is located under the nozzle 4, an input pump 8 is arranged at the bottom end of the base 1, the output end of the input pump 8 is connected with the nozzle 4 through a hose 9, the input end of the input pump is connected with an external glue storage tank 6 through a pipeline 7, a dustproof cover is covered on the periphery of the support, an antistatic layer covers the upper end face of the base 1, an LED module to be processed is placed in the glue sealing mold 5 in the production process, the nozzle 4 is driven to descend through the extension of the cylinder 2, and the nozzle 4 extends into a glue injection opening on the glue sealing mold 5, starting the input pump 8, injecting the sealing glue into the sealing glue mold 5, resetting the cylinder 2 after the injection process is finished, opening the sealing glue mold 5, and taking out the product; the dust cover can be fixed on the base 1 in a manual installation mode and can also be connected with external lifting power parts such as air cylinders, hydraulic cylinders and the like, the dust cover is lowered in the production process each time, the support is covered, and after the production is finished, the dust cover is detached or lifted for carrying out material taking and placing operation; the dust cover has played dustproof effect, and the antistatic backing can prevent in the production process static influence product quality.
Nozzle 4 includes installation department 10, installation department 10 bottom is provided with into gluey portion 11, it is provided with injecting glue mouth 12 to advance gluey 11 bottom, installation department 10, advance gluey portion 11 and injecting glue mouth 12 be integrated into one piece, injecting glue mouth 12 periphery cover is equipped with heating jacket 13, hose 9 is connected on advancing gluey portion 11.
Install agitator 15 in the glue storage tank 6, install a plurality of heaters 14 on the inside wall of glue storage tank 6, store in glue storage tank 6 and seal glue, in process of production, heater 14 starts, improves and seals the glue storage temperature, and agitator 15 stirs simultaneously and seals the glue, impels to seal the glue and flows, avoids long-time waiting to cause to seal the glue and condense, blocks up the pipeline.
Heating jacket 13 internally mounted has electric heating wire 18, the one end surface covering that heating jacket 13 and injecting glue mouth 12 contacted has heat conduction pad 19, and electric heating wire 18 circular telegram produces the heat, heats injecting glue mouth 12 for at the injecting glue in-process, the sealed glue in injecting glue mouth 12 can keep at certain temperature, thereby guarantees its circulation, avoids sealing glue to condense the piece after the cooling, causes the jam of injecting glue mouth 12.
The heating sleeve 13 is connected with the glue injection nozzle 12 through a plurality of connecting mechanisms, each connecting mechanism comprises a fixing ring 20 and a limiting ring 21, the limiting ring 21 is located above the fixing ring 20, the fixing ring 20 is fixed on the outer side wall of the glue injection nozzle 12, the limiting ring 21 is rotatably installed on the heating sleeve 13, a through groove corresponding to the limiting ring 21 is formed in the surface of the side wall of the heating sleeve 13, a plurality of protrusions 22 are arranged on the outer side wall of the fixing ring 20, grooves 23 corresponding to the protrusions 22 are formed in the surface of the inner side wall of the limiting ring 21, when the heating sleeve 13 needs to be disassembled, the limiting ring 21 is pressed through the through groove, the limiting ring 21 is driven to rotate, the grooves 23 in the limiting ring 21 and the protrusions 22 in the fixing ring 20 at the bottom of the limiting ring 21 are in one-to-one correspondence, and after the limiting rings 21 are rotated to the proper positions, the heating sleeve 13 can move up and down relative to the glue injection nozzle 12, at this time, the heating jacket 13 can be slid downwards and removed from the glue injection nozzle 12; on the contrary, when the heating sleeve 13 needs to be installed, the limiting rings 21 are firstly kept at the correct positions, the heating sleeve 13 is sleeved on the glue injection nozzle 12 from bottom to top until the limiting rings 21 correspond to the fixing rings 20 one by one, the limiting rings 21 in each group of connecting mechanisms are all located above the fixing rings 20, the limiting rings 21 are rotated, the grooves 23 and the protrusions 22 are deviated from each other, and after hands are loosened, the limiting rings 21 are blocked at the tops of the fixing rings 20 due to the blocking of the protrusions 22, so that the relative fixing of the heating sleeve 13 and the glue injection nozzle 12 is realized.
The working principle is as follows:
in the production process, the LED module to be processed is arranged in the sealing glue mould 5, the nozzle 4 is driven to descend by the extension of the cylinder 2, the nozzle 4 extends into a glue injection opening on the sealing glue mould 5, the input pump 8 is started, and sealing glue is injected into the sealing glue mould 5; in the glue injection process, the input pump 8 pumps the sealing glue into the glue inlet part 11, and meanwhile, the electric push rod 16 pushes the piston plate 17 to descend so as to further promote the sealing glue to flow out; after the injection process is finished, the cylinder 2 is reset, the glue sealing mold 5 is opened, and the product is taken out; the dust cover can be fixed on the base 1 in a manual installation mode and can also be connected with external lifting power parts such as air cylinders, hydraulic cylinders and the like, the dust cover is lowered in the production process each time, the support is covered, and after the production is finished, the dust cover is detached or lifted for carrying out material taking and placing operation; in the production process, the heater 14 is started to increase the storage temperature of the sealing adhesive, and the stirrer 15 stirs the sealing adhesive to promote the flow of the sealing adhesive, so that the sealing adhesive is prevented from condensing and blocking a pipeline after long-time waiting; the electric heating wire 18 is electrified to generate heat to heat the glue injection nozzle 12, so that in the glue injection process, the glue in the glue injection nozzle 12 can be kept at a certain temperature, the liquidity of the glue is ensured, and the blockage of the glue injection nozzle 12 caused by the agglomeration of the cooled glue is avoided.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a but LED module molding equipment of dust prevention and static electricity, includes base (1), its characterized in that: the utility model discloses a plastic sealing machine, including base (1), cylinder (2), lifter plate (3), nozzle (4) are installed to lifter plate (3) bottom, the flexible end of cylinder (2) is connected with lifter plate (3), lifter plate (3) slidable mounting is on the support, nozzle (4) are installed to lifter plate (3) bottom, base (1) top is provided with seals glue mould (5), it is located under nozzle (4) to seal glue mould (5), base (1) bottom is provided with input pump (8), the output of input pump (8) is connected with nozzle (4) through hose (9), and the input is connected with external storage glue jar (6) through pipeline (7), the support periphery is covered with the dust cover, the up end cover of base (1) has the antistatic backing.
2. The LED module molding compound device of claim 1, wherein: nozzle (4) include installation department (10), installation department (10) bottom is provided with into gluey portion (11), it is provided with injecting glue mouth (12) to advance gluey portion (11) bottom, installation department (10), advance gluey portion (11) and injecting glue mouth (12) be integrated into one piece, injecting glue mouth (12) periphery cover is equipped with heating jacket (13), hose (9) are connected on advancing gluey portion (11).
3. The LED module molding compound device of claim 2, wherein: install agitator (15) in storing up gluey jar (6), install a plurality of heaters (14) on storing up the inside wall of gluey jar (6).
4. The LED module molding compound device of claim 3, wherein: electric putter (16) are installed on the inside top of installation department (10), electric putter's (16) flexible end is connected with piston plate (17), piston plate (17) slidable mounting is inside installation department (10).
5. The LED module molding compound device of claim 4, wherein: heating jacket (13) internally mounted has electric heating wire (18), the one end surface that heating jacket (13) and injecting glue mouth (12) contacted covers has heat conduction pad (19).
6. The LED module molding compound device of claim 5, wherein: heating jacket (13) are connected with injecting glue mouth (12) through a plurality of coupling mechanism, coupling mechanism is including solid fixed ring (20) and spacing ring (21), spacing ring (21) are located solid fixed ring (20) top, gu fixed ring (20) are fixed on the lateral wall of injecting glue mouth (12), spacing ring (21) are rotated and are installed on heating jacket (13), the corresponding logical groove with spacing ring (21) is seted up on the lateral wall surface of heating jacket (13), be provided with a plurality of archs (22) on the lateral wall of solid fixed ring (20), recess (23) corresponding with arch (22) are seted up on the inside wall surface of spacing ring (21).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120595282.XU CN214521433U (en) | 2021-03-19 | 2021-03-19 | Dustproof and antistatic LED module adhesive sealing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120595282.XU CN214521433U (en) | 2021-03-19 | 2021-03-19 | Dustproof and antistatic LED module adhesive sealing device |
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| Publication Number | Publication Date |
|---|---|
| CN214521433U true CN214521433U (en) | 2021-10-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120595282.XU Active CN214521433U (en) | 2021-03-19 | 2021-03-19 | Dustproof and antistatic LED module adhesive sealing device |
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| CN (1) | CN214521433U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115527785A (en) * | 2022-09-16 | 2022-12-27 | 扬州日精电子有限公司 | Prevent blockking up film capacitor encapsulating device with dustproof protection |
-
2021
- 2021-03-19 CN CN202120595282.XU patent/CN214521433U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115527785A (en) * | 2022-09-16 | 2022-12-27 | 扬州日精电子有限公司 | Prevent blockking up film capacitor encapsulating device with dustproof protection |
| CN115527785B (en) * | 2022-09-16 | 2023-11-03 | 扬州日精电子有限公司 | Anti-blocking film capacitor glue filling device with dustproof protection |
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