CN214507704U - Airborne electronic equipment cooling system applying spiral coil spraying - Google Patents
Airborne electronic equipment cooling system applying spiral coil spraying Download PDFInfo
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- CN214507704U CN214507704U CN202120186539.6U CN202120186539U CN214507704U CN 214507704 U CN214507704 U CN 214507704U CN 202120186539 U CN202120186539 U CN 202120186539U CN 214507704 U CN214507704 U CN 214507704U
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- 238000001816 cooling Methods 0.000 title claims abstract description 100
- 238000005507 spraying Methods 0.000 title claims abstract description 18
- 239000007921 spray Substances 0.000 claims abstract description 87
- 239000007788 liquid Substances 0.000 claims abstract description 69
- 239000000110 cooling liquid Substances 0.000 claims description 55
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 25
- 238000011084 recovery Methods 0.000 claims description 20
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 6
- 230000017525 heat dissipation Effects 0.000 abstract description 16
- 239000002826 coolant Substances 0.000 abstract description 2
- 239000003507 refrigerant Substances 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000012544 monitoring process Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000005338 heat storage Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000012782 phase change material Substances 0.000 description 1
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Abstract
An airborne electronic equipment cooling system applying spiral coil spraying belongs to the field of airborne electronic equipment cooling. This patent is not high to airborne electronic equipment cooling efficiency, heat-sinking capability promotes the potentiality limited, the refrigerant easily leaks, the not high scheduling problem of heat-sinking efficiency, an indirect spray cooling system who uses three-dimensional spiral coil has been designed, mainly including airborne electronic equipment cooling system, use spiral coil's spray cooling system and utilize high altitude low temperature environment's heat transfer system, airborne electronic equipment coolant liquid heats up the back and carries out the heat transfer cooling with spraying system, and then realize spraying system to electronic equipment's indirect cooling. The three-dimensional spiral coil increases the heat exchange area, greatly improves the heat exchange efficiency, avoids the leakage of working media in an indirect cooling mode, and fully improves the heat dissipation efficiency by directly utilizing the high-altitude low-temperature environment for heat dissipation. The system can effectively improve the operation stability and the cooling efficiency of the airborne electronic equipment.
Description
Technical Field
The patent relates to an airborne electronic equipment cooling system applying spiral coil spraying, and belongs to the field of airborne electronic equipment cooling.
Background
With the continuous development of aerospace technology, airborne equipment is developed towards complexity, integration and miniaturization, and the accompanying problems are that the heat productivity of the equipment is increased suddenly, the heat productivity of airborne electronic equipment is exponentially increased, and the temperature is an important parameter related to the normal operation of the electronic equipment. Facing the challenge of high heat flux density, more new cooling technologies are required to be introduced to meet the heat dissipation requirements of the onboard electronic devices. Liquid cooling has a higher heat transfer coefficient than air cooling, and is an inevitable trend for cooling airborne equipment. In the field of cooling of electronic equipment in high-altitude environment, the cooling liquid of the electronic equipment needs to be cooled after circulation is finished, so that the cooling liquid is ensured to normally participate in circulation, and the electronic equipment is maintained to operate at a stable working temperature.
Most electronic equipment cooling systems in the prior art directly adopt a cold plate to dissipate heat of spacecraft high-power high-heat-flux-density electronic equipment, for example, cn201218001259.x is a heat dissipation device for electronic equipment with high heat flux density and large heat consumption, the electronic equipment is installed on the surface of a heat dissipation plate, a heat conduction material is filled between the electronic equipment and the heat dissipation plate, an embedded heat pipe is installed in a larger concentrated area with higher heat flux density, heat is transferred to the heat dissipation plate through the heat conduction electronic equipment, the heat is transferred to the embedded heat pipe by the heat dissipation plate, and the embedded heat pipe is transferred to a radiation surface to dissipate heat to a space. Although this patent can reach electronic equipment's high heat flux density heat dissipation demand, its technique is air-cooled heat dissipation essentially, and follow-up heat-sinking capability promotes the potentiality limitedly, and the heat spreading plate mainly uses the radiation heat transfer mode to give off the heat, and efficiency is not high, is not a good heat transfer means in the airborne field.
In addition, in the field of spray cooling, most spray cooling surfaces are flat, for example, CN201811191797.2 is a spray cooling system of a periodic high-power density heat load of an airplane, which effectively combines the heat transfer technology of spray cooling with the heat storage technology of a phase-change material, and utilizes spray cooling as a direct heat dissipation mode, so that the spray cooling system is an efficient, energy-saving and reliable heat dissipation mode; however, the spray cooling part only has the spray cone bottom plane to participate in heat exchange, the heat exchange area is limited, the heat exchange efficiency is not high, and the electronic equipment is directly cooled by spray, so that working medium leakage can be caused, and the operation safety of the electronic equipment is influenced.
Therefore, this patent has designed an application spiral coil spraying high altitude electronic equipment cooling system, and the advantage lies in: cooling the cooling liquid of the airborne electronic equipment by adopting a spray cooling method to ensure the circulating operation of the cooling liquid; the spray droplets do not contact with the electronic equipment, and the electronic equipment is cooled by using an indirect mode, so that the problem of working medium leakage can be avoided; the spray circulating liquid after heat exchange with the cooling liquid of the electronic equipment directly carries out forced convection heat exchange with the high-altitude atmosphere in the heat exchanger to dissipate heat, so that a high-altitude cold source is fully utilized, and the heat dissipation efficiency is improved; the cooling liquid coil pipe of the electronic equipment in the spray cooling system adopts a conical spiral three-dimensional coil pipe, so that the contact area between spray and the coil pipe is increased, and the heat exchange efficiency of spray cooling is greatly improved.
Disclosure of Invention
The patent provides an airborne electronic equipment cooling system applying spiral coil spraying, which mainly comprises an airborne electronic equipment liquid cooling system 1, a first temperature sensor 2, a second temperature sensor 3, a first centrifugal water pump 4, an electronic equipment cooling liquid spiral coil 5, a spraying cooling cavity 6, a nozzle 7, a second centrifugal water pump 8, a liquid recovery box 9, a plate-fin heat exchanger 10, an axial flow fan 11, an air pipe 12, a third temperature sensor 13, a first connecting pipe 14, a second connecting pipe 15, a third connecting pipe 16 and a fourth connecting pipe 17;
the outlet of the airborne electronic equipment liquid cooling system 1 is connected with a first temperature sensor 2, the first temperature sensor 2 is connected with the inlet of a first centrifugal water pump 4, the outlet of the first centrifugal water pump 4 is connected with the inlet of an electronic equipment cooling liquid spiral coil 5 inside a spray cooling cavity 6, the outlet of the electronic equipment cooling liquid spiral coil 5 is connected with a second temperature sensor 3 outside the spray cooling cavity 6, and the second temperature sensor 3 is connected with the inlet of the airborne electronic equipment liquid cooling system 1;
a liquid outlet at the bottom of the spray cooling cavity 6 is connected with an inlet of a liquid recovery tank 9 through a first connecting pipe 14, an outlet of the liquid recovery tank 9 is connected with an inlet of a plate-fin heat exchanger 10 through a second connecting pipe 15, an outlet of the plate-fin heat exchanger 10 is connected with an inlet of a second centrifugal water pump 8 through a third connecting pipe 16, an outlet of the second centrifugal water pump 8 is connected with a third temperature sensor 13, and the third temperature sensor 13 is connected with a nozzle 7 inside the spray cooling cavity 6 through a fourth connecting pipe 17;
an air inlet of the axial flow fan 11 is directly connected with the external high-altitude environment, an outlet of the axial flow fan is connected with an inlet of the plate-fin heat exchanger 10 through an air pipe 12, and an outlet of the plate-fin heat exchanger 10 is connected with the external environment through the air pipe 12.
After the onboard electronic equipment is cooled, the temperature of electronic equipment cooling liquid in the onboard electronic equipment liquid cooling system 1 rises, the electronic equipment cooling liquid is sent into the spray cooling cavity 6 by the first centrifugal water pump 4, the electronic equipment cooling liquid exchanges heat with atomized liquid drops sprayed out from the nozzle 7 in the electronic equipment cooling liquid spiral coil 5, and the electronic equipment cooling liquid is sent back to the onboard electronic equipment liquid cooling system 1 after being cooled to continue cooling the onboard electronic equipment; the second temperature sensor 3 monitors the inlet temperature of the electronic equipment liquid cooling system 1, and the first temperature sensor 2 monitors the outlet temperature of the electronic equipment liquid cooling system 1, so that the temperature of the electronic equipment cooling liquid can be reduced to the application range;
atomized liquid drops sprayed by the nozzle 7 exchange heat with the electronic equipment cooling liquid spiral coil 5, the heated spray circulation liquid enters the liquid recovery box 9 from a liquid outlet at the bottom of the spray cooling cavity 6 after heat exchange, enters the plate-fin heat exchanger 10 from the liquid recovery box 9 to exchange heat with the high-altitude external low-temperature environment for cooling, is driven by the second centrifugal water pump 8, passes through the third temperature sensor 13 and the nozzle 7, and then continues to enter the spray cooling cavity 6 to exchange heat with the electronic equipment cooling liquid spiral coil 5; the third temperature sensor 13 is used for monitoring the temperature of the spray circulation liquid after being cooled, so as to ensure that the temperature of the spray circulation liquid is lower than that of the cooling liquid of the electronic equipment when the spray circulation liquid enters the spray cooling cavity 6;
the low-temperature air in the external environment is sent into the heat exchanger 10 by the axial flow fan 11 and the air pipe 12 connected with the heat exchanger to exchange heat with the spray circulation liquid, and the heated air is directly discharged into the high-altitude environment through the air pipe 12.
The electronic equipment cooling liquid spiral coil 5 in the spray cooling cavity 6 is distributed in a conical shape, the cone angle is equal to the spray cone angle sprayed by the nozzle 7, and the spray cone completely covers the electronic equipment cooling liquid spiral coil 5.
The spray circulation liquid directly exchanges heat with the high-altitude external low-temperature environment in the plate-fin heat exchanger 10.
The spray cooling cavity 6 is a cuboid cavity with a square section, the size of the section is slightly larger than that of the bottom surface of the spray cone, a nozzle 7 connecting pipe inlet is formed in the center above the cavity, and a liquid recovery tank 9 connecting pipe inlet is formed in the center below the cavity for liquid recovery; the side opening is connected with the inlet and the outlet of the spiral coil pipe 5 of the cooling liquid of the electronic equipment.
The distance from the bottom surface of the electronic equipment cooling liquid spiral coil 5 to the bottom of the spray cooling cavity is 10cm, and accumulated liquid at the bottom of the spray cooling cavity is prevented from influencing heat exchange and spray heat exchange of the electronic equipment cooling liquid spiral coil 5.
The liquid recovery box 9 is positioned between the spray cooling cavity 6 and the plate-fin heat exchanger 10, the inlet is connected with a spray circulating liquid pipeline below the spray cooling cavity 6, and the outlet is connected with the plate-fin heat exchanger 10.
The liquid recovery tank 9 temporarily stores spray circulation liquid to prevent the second centrifugal water pump 8 from entering gas to generate cavitation when the system is started.
The circulating working medium and the spraying circulating working medium in the liquid cooling system 1 of the airborne electronic equipment are anhydrous propylene glycol antifreezing cooling liquid.
Drawings
Fig. 1 is a perspective view of the present patent.
Reference designations in FIG. 1: the system comprises a machine-mounted electronic equipment liquid cooling system 1, a first temperature sensor 2, a second temperature sensor 3, a first centrifugal water pump 4, an electronic equipment cooling liquid spiral coil 5, a spray cooling cavity 6, a nozzle 7, a second centrifugal water pump 8, a liquid recovery box 9, a plate-fin heat exchanger 10, an axial flow fan 11, an air pipe 12, a third temperature sensor 13, a first connecting pipe 14, a second connecting pipe 15, a third connecting pipe 16 and a fourth connecting pipe 17.
Detailed Description
As shown in fig. 1, an airborne electronic device cooling system using spiral coil spraying mainly includes an airborne electronic device liquid cooling system 1, a first temperature sensor 2, a second temperature sensor 3, a first centrifugal water pump 4, an electronic device coolant spiral coil 5, a spray cooling cavity 6, a nozzle 7, a second centrifugal water pump 8, a liquid recovery box 9, a plate-fin heat exchanger 10, an axial flow fan 11, an air duct 12, a third temperature sensor 13, a first connecting pipe 14, a second connecting pipe 15, a third connecting pipe 16, and a fourth connecting pipe 17.
The system is mainly divided into three subsystems, namely an electronic equipment cooling liquid circulating system, a spray circulating system and a high-altitude heat dissipation system.
In the electronic equipment cooling liquid circulating system, the temperature of electronic equipment cooling liquid rises after cooling the heated airborne electronic equipment in the airborne electronic equipment cooling system 1, the first centrifugal water pump 4 sends the high-temperature electronic equipment cooling liquid into the electronic equipment cooling liquid spiral coil 5 in the spray cooling cavity 6, the cooling liquid exchanges heat with atomized liquid drops sprayed by a nozzle 7 in the spray circulating system in the electronic equipment cooling liquid spiral coil 5, the electronic equipment cooling liquid is cooled to a proper temperature range in the spray cooling cavity 6 and then is sent back to the electronic equipment cooling liquid system 1 to continuously participate in the circulation of the electronic equipment cooling liquid, and the temperature of the airborne electronic equipment is cooled to a use range; in the process, the first centrifugal water pump 4 provides power for conveying the electronic equipment cooling liquid, the first temperature sensor 2 monitors the outlet temperature of the electronic equipment liquid cooling system 1, and the second temperature sensor 3 monitors the inlet temperature of the electronic equipment liquid cooling system 1, so that the temperature of the electronic equipment cooling liquid can be reduced to a use range;
in the spray circulation system, atomized liquid drops sprayed by a nozzle 7 are in full contact with a cooling liquid spiral coil 5 of the electronic equipment for heat exchange; the bottom surface of the cooling liquid spiral coil pipe 5 of the electronic equipment is away from the bottom of the spray cooling cavity 6 by a certain distance, so that accumulated liquid at the bottom of the spray cooling cavity 6 is prevented from influencing heat exchange and spray heat exchange of the cooling liquid spiral coil pipe 5 of the electronic equipment; the spray circulation liquid heated after heat exchange is driven by a second centrifugal water pump 8 and enters a liquid recovery tank 9 from a liquid outlet at the bottom of the spray cooling cavity 6, and the spray circulation liquid enters a plate-fin heat exchanger 10 from the liquid recovery tank through a second connecting pipe 15 to exchange heat with the high-altitude external low-temperature environment for cooling. The cooled spray circulation liquid passes through a third connecting pipe 16, a second centrifugal water pump 8, a third temperature sensor 13 in a fourth connecting pipe 17, and then continuously enters a spray cooling cavity 6 from a nozzle 7 to exchange heat with the electronic equipment cooling liquid spiral coil 5; in the process, the liquid recovery tank 9 temporarily stores the spray circulation liquid to prevent the second centrifugal water pump 8 from entering gas to generate cavitation when the system is started, the second centrifugal water pump 8 provides power for conveying the spray circulation liquid, and the third temperature sensor 13 is used for monitoring the temperature of the spray circulation liquid after being cooled so as to ensure that the temperature of the spray circulation liquid is lower than that of the cooling liquid of the electronic equipment when the spray circulation liquid enters the spray cooling cavity 6;
in the high-altitude heat dissipation system, low-temperature air in the external environment enters an air pipe 12 through an axial flow fan 11, the low-temperature air is sent into a plate-fin heat exchanger 10 to exchange heat with high-temperature spray circulation liquid, and the heated high-temperature air is directly discharged into the high-altitude environment through the air pipe 12 to dissipate heat; in the process, the axial flow fan 12 is used for providing power for conveying outside high-altitude low-temperature air.
The cooling liquid of the airborne electronic equipment is cooled by adopting a spray cooling method, so that the circulating operation of the cooling liquid is ensured; the cooling liquid coil pipe of the electronic equipment in the spray cooling system adopts a conical spiral three-dimensional coil pipe, so that the contact area between spray and the coil pipe is increased, and the heat exchange efficiency of spray cooling is greatly improved; the spray droplets do not contact with the electronic equipment, and the electronic equipment is cooled by using an indirect mode, so that the problem of working medium leakage can be avoided; the spray circulating liquid after heat exchange with the cooling liquid of the electronic equipment directly carries out forced convection heat exchange with the high-altitude atmosphere in the heat exchanger to dissipate heat, so that a high-altitude cold source is fully utilized, and the heat dissipation efficiency is improved. The implementation of this patent will effectively promote airborne electronic equipment's operating stability and cooling efficiency.
Claims (6)
1. An airborne electronic equipment cooling system applying spiral coil spraying is characterized in that:
the device is composed of an airborne electronic equipment liquid cooling system (1), a first temperature sensor (2), a second temperature sensor (3), a first centrifugal water pump (4), an electronic equipment cooling liquid spiral coil (5), a spray cooling cavity (6), a nozzle (7), a second centrifugal water pump (8), a liquid recovery box (9), a plate-fin heat exchanger (10), an axial flow fan (11), an air pipe (12), a third temperature sensor (13), a first connecting pipe (14), a second connecting pipe (15), a third connecting pipe (16) and a fourth connecting pipe (17);
the outlet of the airborne electronic equipment liquid cooling system (1) is connected with a first temperature sensor (2), the first temperature sensor (2) is connected with the inlet of a first centrifugal water pump (4), the outlet of the first centrifugal water pump (4) is connected with the inlet of an electronic equipment cooling liquid spiral coil (5) inside a spray cooling cavity (6), the outlet of the electronic equipment cooling liquid spiral coil (5) is connected with a second temperature sensor (3) outside the spray cooling cavity (6), and the second temperature sensor (3) is connected with the inlet of the airborne electronic equipment liquid cooling system (1);
a liquid outlet at the bottom of the spray cooling cavity (6) is connected with an inlet of a liquid recovery tank (9) through a first connecting pipe (14), an outlet of the liquid recovery tank (9) is connected with an inlet of a plate-fin heat exchanger (10) through a second connecting pipe (15), an outlet of the plate-fin heat exchanger (10) is connected with an inlet of a second centrifugal water pump (8) through a third connecting pipe (16), an outlet of the second centrifugal water pump (8) is connected with a third temperature sensor (13), and the third temperature sensor (13) is connected with a nozzle (7) in the spray cooling cavity (6) through a fourth connecting pipe (17);
an air inlet of the axial flow fan (11) is directly connected with the external high-altitude environment, an outlet of the axial flow fan is connected with an inlet of the plate-fin heat exchanger (10) through an air pipe (12), and an outlet of the plate-fin heat exchanger (10) is connected with the external environment through the air pipe (12).
2. The cooling system for on-board electronics using spiral coil spraying of claim 1, wherein:
the electronic equipment cooling liquid spiral coil (5) in the spray cooling cavity (6) is distributed in a conical shape, the cone angle is equal to the spray cone angle sprayed by the nozzle (7), and the spray cone completely covers the electronic equipment cooling liquid spiral coil (5).
3. The cooling system for on-board electronics using spiral coil spraying of claim 1, wherein:
the spray cooling cavity (6) is a cuboid cavity with a square cross section, the size of the cross section is slightly larger than that of the bottom surface of the spray cone, a nozzle (7) connecting pipe inlet is formed in the center above the cavity, and a liquid recovery tank (9) connecting pipe inlet is formed in the center below the cavity for liquid recovery; the side opening is connected with the inlet and the outlet of the spiral coil pipe (5) of the cooling liquid of the electronic equipment.
4. The cooling system for on-board electronics using spiral coil spraying of claim 1, wherein:
the distance from the bottom surface of the cooling liquid spiral coil (5) of the electronic equipment to the bottom of the spray cooling cavity (6) is 10cm, and accumulated liquid at the bottom of the spray cooling cavity (6) is prevented from influencing heat exchange and spray heat exchange of the cooling liquid spiral coil (5) of the electronic equipment.
5. The cooling system for on-board electronics using spiral coil spraying of claim 1, wherein:
the liquid recovery box (9) is positioned between the spray cooling cavity (6) and the plate-fin heat exchanger (10), the inlet is connected with a spray circulating liquid pipeline below the spray cooling cavity (6), and the outlet is connected with the plate-fin heat exchanger (10).
6. The cooling system for on-board electronics using spiral coil spraying of claim 1, wherein: the circulating working medium and the spraying circulating working medium in the liquid cooling system (1) of the airborne electronic equipment are anhydrous propylene glycol antifreezing cooling liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120186539.6U CN214507704U (en) | 2021-01-22 | 2021-01-22 | Airborne electronic equipment cooling system applying spiral coil spraying |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120186539.6U CN214507704U (en) | 2021-01-22 | 2021-01-22 | Airborne electronic equipment cooling system applying spiral coil spraying |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214507704U true CN214507704U (en) | 2021-10-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120186539.6U Active CN214507704U (en) | 2021-01-22 | 2021-01-22 | Airborne electronic equipment cooling system applying spiral coil spraying |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214507704U (en) |
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2021
- 2021-01-22 CN CN202120186539.6U patent/CN214507704U/en active Active
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