CN214491896U - Coating structure adopting gold-copper alloy - Google Patents
Coating structure adopting gold-copper alloy Download PDFInfo
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- CN214491896U CN214491896U CN202023245250.1U CN202023245250U CN214491896U CN 214491896 U CN214491896 U CN 214491896U CN 202023245250 U CN202023245250 U CN 202023245250U CN 214491896 U CN214491896 U CN 214491896U
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Abstract
The utility model discloses an adopt gold copper alloy's cladding material structure, the cladding material structure that adopts gold copper alloy has set gradually gold cladding material from last to down, first gold copper alloy cladding material, gold nickel alloy cladding material, the copper coating, gold cobalt alloy cladding material, nickel coating and base member, the thickness of first gold copper alloy cladding material is greater than the thickness of gold nickel alloy cladding material, the thickness of gold nickel alloy cladding material is greater than the thickness of gold cobalt alloy cladding material, the thickness of gold cobalt alloy cladding material is greater than the thickness of gold cladding material, the gold cladding material, copper cladding material and nickel cladding material three's thickness is the same, the copper content of first gold copper alloy cladding material is 10 to 90 atomic percent and the gold content is 90 to 10 atomic percent. The utility model discloses an adopt gold copper alloy's cladding material structure to plate article not only have golden effect on the surface, compare moreover that present cladding material structure has better wearability and corrosion resistance.
Description
Technical Field
The utility model relates to a technical field of plated layer structure, concretely relates to adopt gold copper alloy's plated layer structure.
Background
With the rapid development of society, the requirements of people for the beauty, wear resistance and corrosion resistance of various articles are continuously increased. Particularly on watch straps, watchcases and the like, the currently popular aesthetic in the market is golden.
However, the plating structure electroplated on the surface of the object in the prior art includes, from top to bottom, the first gold plating layer, the nickel layer, and the second gold plating layer in sequence, but the prior plating structure often falls off due to friction or thermal expansion with the outside during actual production and use.
Therefore, a plating structure using a gold-copper alloy is needed to solve the above problems.
Disclosure of Invention
The utility model provides a plating layer structure adopting gold-copper alloy aiming at the defects of the prior art.
The utility model discloses a realize that the technical scheme that above-mentioned purpose adopted is:
the utility model provides an adopt cladding material structure of gold copper alloy, adopt cladding material structure of gold copper alloy from last to having set gradually gold cladding material, first gold copper alloy cladding material, gold nickel alloy cladding material, copper plating layer, gold cobalt alloy cladding material, nickel plating layer and base member down, the thickness of first gold copper alloy cladding material is greater than the thickness of gold nickel alloy cladding material, the thickness of gold nickel alloy cladding material is greater than the thickness of gold cobalt alloy cladding material, the thickness of gold cobalt alloy cladding material is greater than the thickness of gold cladding material, the gold cladding material copper cladding material and the thickness of nickel cladding material three is the same, the copper content of first gold copper alloy cladding material is 10 to 90 atomic percent and the gold content is 90 to 10 atomic percent.
In a further improvement, the substrate comprises a second gold-copper alloy plating layer and a gold-titanium alloy plating layer electroplated on the upper surface of the second gold-copper alloy plating layer.
In a further improvement, the thickness of the second gold-copper alloy plating layer is greater than that of the gold-titanium alloy plating layer.
In a further improvement, the thickness of the first gold-copper alloy plating layer is equal to the thickness of the second gold-copper alloy plating layer.
In a further improvement, the thickness of the first gold-copper alloy plating layer is between 10 and 20 microns.
In a further improvement, the gold plating layer has a thickness of between 5 and 10 microns.
In a further improvement, the gold-nickel alloy plating layer has a thickness of between 5 and 15 microns.
In a further improvement, the thickness of the gold-cobalt alloy plating layer is between 6 and 13 microns.
The utility model has the advantages that: the utility model discloses an adopt cladding material structure of gold copper alloy, from last to having set gradually the gold cladding material down, first gold copper alloy cladding material, gold nickel alloy cladding material, the copper coating, gold cobalt alloy cladding material, nickel coating and base member, the thickness of first gold copper alloy cladding material is greater than the thickness of gold nickel alloy cladding material, the thickness of gold nickel alloy cladding material is greater than the thickness of gold cobalt alloy cladding material, the thickness of gold cobalt alloy cladding material is greater than the thickness of gold cladding material, the gold cladding material, copper coating and nickel cladding material three's thickness is the same, the copper content of first gold copper alloy cladding material is 10 to 90 atomic percent and gold content is 90 to 10 atomic percent. The utility model discloses an adopt gold copper alloy's cladding material structure to plate article not only have golden effect on the surface, compare moreover that present cladding material structure has better wearability and corrosion resistance.
The present invention will be further described with reference to the accompanying drawings and the following detailed description.
Drawings
FIG. 1 is a schematic structural diagram of a coating structure using gold-copper alloy according to the present invention;
fig. 2 is a schematic structural diagram of the base body of the present invention.
In the figure: 100. the gold-copper alloy plating structure is adopted, 10 is a gold plating layer, 20 is a first gold-copper alloy plating layer, 30 is a gold-nickel alloy plating layer, 40 is a copper plating layer, 50 is a gold-cobalt alloy plating layer, 60 is a nickel plating layer, 70 is a substrate, 71 is a second gold-copper alloy plating layer, 72 is a gold-titanium alloy plating layer, and 80 is a mark layer.
Detailed Description
The following description is only a preferred embodiment of the present invention, and does not limit the scope of the present invention.
Referring to fig. 1 and 2, the coating structure 100 of the present invention using gold-copper alloy sequentially includes a gold coating 10, a first gold-copper alloy coating 20, a gold-nickel alloy coating 30, a copper coating 40, a gold-cobalt alloy coating 50, a nickel coating 60 and a substrate 70 from top to bottom, the thickness of the first gold-copper alloy coating 20 is greater than that of the gold-nickel alloy coating 30, the thickness of the gold-nickel alloy coating 30 is greater than that of the gold-cobalt alloy coating 50, the thickness of the gold-cobalt alloy coating 50 is greater than that of the gold coating 10, the thicknesses of the gold coating 10, the copper coating 40 and the nickel coating 60 are the same, the copper content of the first gold-copper alloy coating 20 is 10 to 90 atomic percent, and the gold content is 90 to 10 atomic percent. It should be noted that the substrate 70 includes the second gold-copper alloy plating layer 71 and the gold-titanium alloy plating layer 72 electroplated on the upper surface of the second gold-copper alloy plating layer 71, so that the aesthetic property and the wear resistance of the coating structure 100 using gold-copper alloy of the present invention can be further enhanced by the substrate 70, but not limited thereto.
With continued reference to fig. 1 and 2, the thickness relationship among the other plating layers of the plating layer structure 100 using gold-copper alloy of the present invention is as follows: the thickness of the second gold-copper alloy plating layer 71 is greater than that of the gold-titanium alloy plating layer 72; and the thickness of the first gold-copper alloy plating layer 20 is equal to the thickness of the second gold-copper alloy plating layer 71.
For example, the thickness of the first gold-copper alloy plating layer 20 is between 10 microns and 20 microns, the thickness of the gold plating layer 10 is between 5 microns and 10 microns, the thickness of the gold-nickel alloy plating layer 30 is between 5 microns and 15 microns, and the thickness of the gold-cobalt alloy plating layer 50 is between 6 microns and 13 microns. Of course, in other embodiments, the thicknesses of the first gold-copper alloy plating layer 20, the gold plating layer 10, the gold-nickel alloy plating layer 30, and the gold-cobalt alloy plating layer 50 of the present invention may be set by those skilled in the art as needed, and therefore, the present invention is not limited thereto.
It should be noted that the surface of the gold plating layer 10 of the present invention may be further provided with a mark layer 80, and the mark layer 80 may be an ink mark printed on the surface of the gold plating layer 10, but is not limited thereto.
The utility model has the advantages that: the utility model discloses an adopt gold copper alloy's cladding material structure 100, from last to having set gradually gold cladding material 10 down, first gold copper alloy cladding material 20, gold nickel alloy cladding material 30, copper plating layer 40, gold cobalt alloy cladding material 50, nickel cladding material 60 and base member 70, the thickness of first gold copper alloy cladding material 20 is greater than the thickness of gold nickel alloy cladding material 30, the thickness of gold nickel alloy cladding material 30 is greater than the thickness of gold cobalt alloy cladding material 50, the thickness of gold cobalt alloy cladding material 50 is greater than the thickness of gold cladding material, the gold cladding material, copper cladding material and nickel cladding material three's thickness is the same, the copper content of first gold copper alloy cladding material 20 is 10 to 90 atomic percent and gold content is 90 to 10 atomic percent. The utility model discloses an adopt gold copper alloy's cladding material structure 100 to plate article not only have golden effect on the surface, compare moreover that present cladding material structure has better wearability and corrosion resistance.
The utility model discloses not limited to above-mentioned embodiment, adopt with the same or similar structure or device of the above-mentioned embodiment of the utility model, and the other cladding material structure that is used for adopting gold copper alloy that obtains is all within the protection scope of the utility model.
Claims (8)
1. A plating layer structure adopting gold-copper alloy is characterized in that: the plating layer structure that adopts the gold copper alloy has set gradually gold cladding material, first gold copper alloy cladding material, gold nickel alloy cladding material, copper cladding material, gold cobalt alloy cladding material, nickel cladding material and base member from last to down, the thickness of first gold copper alloy cladding material is greater than the thickness of gold nickel alloy cladding material, the thickness of gold nickel alloy cladding material is greater than the thickness of gold cobalt alloy cladding material, the thickness of gold cobalt alloy cladding material is greater than the thickness of gold cladding material, the gold cladding material copper cladding material and nickel cladding material three's thickness is the same.
2. The plating structure using gold-copper alloy according to claim 1, characterized in that: the substrate comprises a second gold-copper alloy plating layer and a gold-titanium alloy plating layer electroplated on the upper surface of the second gold-copper alloy plating layer.
3. The plating structure using gold-copper alloy according to claim 2, characterized in that: the thickness of the second gold-copper alloy plating layer is larger than that of the gold-titanium alloy plating layer.
4. The plating structure using gold-copper alloy according to claim 3, characterized in that: the thickness of the first gold-copper alloy plating layer is equal to that of the second gold-copper alloy plating layer.
5. The plating structure using gold-copper alloy according to claim 4, characterized in that: the thickness of the first gold-copper alloy plating layer is between 10 and 20 microns.
6. The plating structure using gold-copper alloy according to claim 1, characterized in that: the gold plating layer has a thickness of between 5 and 10 microns.
7. The plating structure using gold-copper alloy according to claim 1, characterized in that: the gold-nickel alloy plating layer has a thickness of between 5 and 15 microns.
8. The plating structure using gold-copper alloy according to claim 1, characterized in that: the thickness of the gold-cobalt alloy plating layer is between 6 and 13 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023245250.1U CN214491896U (en) | 2020-12-29 | 2020-12-29 | Coating structure adopting gold-copper alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023245250.1U CN214491896U (en) | 2020-12-29 | 2020-12-29 | Coating structure adopting gold-copper alloy |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214491896U true CN214491896U (en) | 2021-10-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202023245250.1U Active CN214491896U (en) | 2020-12-29 | 2020-12-29 | Coating structure adopting gold-copper alloy |
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|---|---|
| CN (1) | CN214491896U (en) |
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