CN205615091U - Adopt copper surface coating structure of rhodium cladding material - Google Patents
Adopt copper surface coating structure of rhodium cladding material Download PDFInfo
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- CN205615091U CN205615091U CN201620018857.0U CN201620018857U CN205615091U CN 205615091 U CN205615091 U CN 205615091U CN 201620018857 U CN201620018857 U CN 201620018857U CN 205615091 U CN205615091 U CN 205615091U
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- nickel
- rhodium
- coating
- plating
- cladding material
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Abstract
A adopt copper surface coating structure of rhodium cladding material, including copper superficial layer, preplating nickel dam, bright plating nickel dam, palladium nickel alloy cladding material and the rhodium cladding material that sets up from bottom to top. The preplating nickel dam contacts with the copper superficial layer to the preplating nickel dam is located the outside of copper superficial layer, the bright plating nickel dam contacts with the preplating nickel dam to the bright plating nickel dam is located the outside of preplating nickel dam, palladium nickel alloy cladding material contacts with the bright plating nickel dam to the palladium nickel coating is located the outside of bright plating nickel dam, rhodium cladding material contacts with palladium nickel alloy cladding material to rhodium cladding material is located the outside of palladium nickel alloy cladding material. An adopt copper surface coating structure of rhodium cladding material, carries out the rhodium to copper and electroplates the hardness and abrasion resistance that can improve cladding material greatly to give copper superficial layer silver white metal gloss, expanded the range of application of copper product matter.
Description
Technical field
This utility model relates to a kind of copper surface layer coating structure, is a kind of copper surface plating structure using rhodium coating in particular.
Background technology
Increasing watchcase, watchband use copper material, but plating is easily caused the abrasion of coating and comes off, simultaneously because the difference of material heat expansion, also results in coming off of coating.
As can be seen here, above-mentioned existing copper surface layer coating structure still suffers from many defects, and is urgently improved, and rhodium coating has excellent hardness and wearability is provided simultaneously with good silvery-white appearance and gloss.
Utility model content
This utility model overcomes shortcoming of the prior art, it is provided that a kind of copper surface plating structure using rhodium coating, overcomes the defect that copper galvanization coating easily weares and teares and comes off, and adds coating hardness, corrosion resistance and good.
In order to solve above-mentioned technical problem, this utility model is achieved through the following technical solutions:
A kind of copper surface plating structure using rhodium coating, including the copper surface layer arranged from bottom to top, pre-nickel plating, bright plating nickel dam, palladium-nickel alloy coating and rhodium coating, overcome the defect that copper galvanization coating easily weares and teares and comes off, and add coating hardness, corrosion resistance and good.
Pre-nickel plating contacts with copper surface layer, and pre-nickel plating is positioned at the outside of copper surface layer；Bright plating nickel dam contacts with pre-nickel plating, and bright plating nickel dam is positioned at the outside of pre-nickel plating；Palladium-nickel alloy coating contacts with bright plating nickel dam, and palladium nickel coating is positioned at the outside of bright plating nickel dam；Rhodium coating contacts with palladium-nickel alloy coating, and rhodium coating is positioned at the outside of palladium-nickel alloy coating.
As the further optimization of the technical program, the thickness of a kind of pre-nickel plating described in copper surface plating structure using rhodium coating of this utility model is 0.5 micron to 1 micron.
As the further optimization of the technical program, the thickness of a kind of bright plating nickel dam described in copper surface plating structure using rhodium coating of this utility model is 3 microns to 5 microns.
As the further optimization of the technical program, the thickness of a kind of palladium-nickel alloy electrodeposited coating described in copper surface plating structure using rhodium coating of this utility model is 2 microns to 3 microns.
As the further optimization of the technical program, the thickness of a kind of rhodium coating described in copper surface plating structure using rhodium coating of this utility model is 1 micron to 2 microns.
Compared with prior art, the beneficial effects of the utility model are:
A kind of copper surface plating structure using rhodium coating described in the utility model, carries out rhodium plating and can be greatly improved hardness and the wearability of coating, and give copper surface layer silvery white metallic luster, extend the range of application of copper material copper.
Accompanying drawing explanation
Accompanying drawing is used for providing being further appreciated by of the present utility model, is used for explaining this utility model, is not intended that restriction of the present utility model, in the accompanying drawings together with embodiment of the present utility model:
Fig. 1 is the structural representation of a kind of copper surface plating structure using rhodium coating of this utility model.
In figure: copper surface layer 1；Pre-nickel plating 2；Bright plating nickel dam 3；Palladium-nickel alloy coating 4；Rhodium coating 5.
Detailed description of the invention
Below in conjunction with accompanying drawing, preferred embodiment of the present utility model is illustrated, it will be appreciated that preferred embodiment described herein is merely to illustrate and explains this utility model, be not used to limit this utility model.
Embodiment 1:
As it is shown in figure 1, a kind of copper surface plating structure using rhodium coating, including copper surface layer 1, pre-nickel plating 2, bright plating nickel dam 3 and palladium-nickel alloy coating 4, rhodium coating 5, overcome the defect that copper galvanization coating easily weares and teares and comes off, and add coating hardness, corrosion resistance and good.
Pre-nickel plating 2 contacts with copper surface layer 1, and pre-nickel plating 2 is positioned at the outside of copper surface layer 1.Pre-nickel plating 2 is generally room temperature when plating, and cost is relatively low, and ductility of electrodeposited film is good, has the highest adhesive strength with Copper substrate.Bright plating nickel dam 3 contacts with pre-nickel plating 2, and bright plating nickel dam 3 is positioned at the outside of pre-nickel plating 2.Palladium-nickel alloy coating 4 contacts with bright plating nickel dam 3, and palladium nickel coating 4 is positioned at the outside of bright plating nickel dam 3；Rhodium coating 5 contacts with palladium-nickel alloy coating 4, and rhodium coating 5 is positioned at the outside of palladium-nickel alloy coating 4.Rhodium coating 5 has extremely strong decay resistance, high strength and high hardness, is suitable for the needs of copper-based material constructional appearance part.
Embodiment 2:
The present embodiment, the thickness of pre-nickel plating 2 is 0.5 micron to 1 micron.
Embodiment 3:
The present embodiment, the thickness of bright plating nickel dam 3 is 3 microns to 5 microns.
Embodiment 4:
The present embodiment, the thickness of palladium-nickel alloy coating 4 is 2 microns to 3 microns.
Embodiment 5:
The present embodiment, the thickness of rhodium coating 5 is 1 micron to 2 microns.
Last it is noted that these are only preferred embodiment of the present utility model; it is not limited to this utility model; although this utility model being described in detail with reference to embodiment; for a person skilled in the art; technical scheme described in foregoing embodiments still can be modified by it; or wherein portion of techniques feature is carried out equivalent; but it is all within spirit of the present utility model and principle; the any modification, equivalent substitution and improvement etc. made, within should be included in protection domain of the present utility model.
Claims (5)
1. the copper surface plating structure using rhodium coating, it is characterized in that: include copper surface layer (1), pre-nickel plating (2), bright plating nickel dam (3), palladium-nickel alloy electrodeposited coating (4) and the rhodium coating (5) set gradually from bottom to top, pre-nickel plating (2) contacts with copper surface layer (1), and pre-nickel plating (2) is positioned at the outside of copper surface layer (1)；Bright plating nickel dam (3) contacts with pre-nickel plating (2), and bright plating nickel dam (3) is positioned at the outside of pre-nickel plating (2)；Palladium-nickel alloy coating (4) contacts with bright plating nickel dam (3), and palladium nickel coating (4) is positioned at the outside of bright plating nickel dam (3)；Rhodium coating (5) contacts with palladium-nickel alloy coating (4), and rhodium coating (5) is positioned at the outside of palladium-nickel alloy coating (4).
A kind of copper surface plating structure using rhodium coating the most according to claim 1, it is characterised in that: the thickness of described pre-nickel plating (2) is 0.5 micron to 1 micron.
A kind of copper surface plating structure using rhodium coating the most according to claim 1, it is characterised in that: the thickness of described bright plating nickel dam (3) is 3 microns to 5 microns.
A kind of copper surface plating structure using rhodium coating the most according to claim 1, it is characterised in that: the thickness of described palladium-nickel alloy coating (4) is 2 microns to 3 microns.
A kind of copper surface plating structure using rhodium coating the most according to claim 1, it is characterised in that: the thickness of described rhodium coating (5) is 1 micron to 2 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620018857.0U CN205615091U (en) | 2016-01-07 | 2016-01-07 | Adopt copper surface coating structure of rhodium cladding material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620018857.0U CN205615091U (en) | 2016-01-07 | 2016-01-07 | Adopt copper surface coating structure of rhodium cladding material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205615091U true CN205615091U (en) | 2016-10-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620018857.0U Expired - Fee Related CN205615091U (en) | 2016-01-07 | 2016-01-07 | Adopt copper surface coating structure of rhodium cladding material |
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| CN (1) | CN205615091U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108400463A (en) * | 2017-07-05 | 2018-08-14 | 启东乾朔电子有限公司 | Conducting terminal coating and its electric connector |
-
2016
- 2016-01-07 CN CN201620018857.0U patent/CN205615091U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108400463A (en) * | 2017-07-05 | 2018-08-14 | 启东乾朔电子有限公司 | Conducting terminal coating and its electric connector |
| CN108574162A (en) * | 2017-07-05 | 2018-09-25 | 启东乾朔电子有限公司 | The manufacturing method of conducting terminal and its electric connector |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161005 Termination date: 20180107 |