CN214482010U - Water cooling head strengthening structure - Google Patents

Water cooling head strengthening structure Download PDF

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Publication number
CN214482010U
CN214482010U CN202120553305.0U CN202120553305U CN214482010U CN 214482010 U CN214482010 U CN 214482010U CN 202120553305 U CN202120553305 U CN 202120553305U CN 214482010 U CN214482010 U CN 214482010U
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heat exchange
substrate
heat
water
strengthening
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CN202120553305.0U
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李嵩蔚
黄冠霖
杨明璁
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Asia Vital Components Co Ltd
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Asia Vital Components Co Ltd
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Abstract

The utility model provides a structure is reinforceed to water-cooling head, close a base plate and define a heat exchange cavity between this lid and this base plate including a lid, be equipped with at least one in this heat exchange cavity and reinforce portion and at least a fin group, should reinforce the inboard that portion has an upper end and this lid and combine together via a bonding technology.

Description

Water cooling head strengthening structure
Technical Field
The utility model relates to a liquid heat radiation structure field especially relates to a structure is reinforceed in heat dissipation of liquid (water) cold head.
Background
With the demand of big data and cloud computing service being greatly improved, the heat dissipation demand of related electronic products is also increasing, especially the server of a large-scale computing center, the computing density thereof is improved, the waste heat generated in the space with the same size is also greatly improved, and in order to reduce the energy consumed by heat dissipation, the heat source is taken away from the server by using liquid recently, and the heat dissipation is performed in other ways, so as to solve the problem generated by the high-density waste heat.
Since the water cooling head is usually fixed on the heating element (e.g. wafer) via a fixture, the working fluid under a certain water pressure takes away the heat of the wafer through the water cooling head. Therefore, as shown in fig. 6, the outer surface of the conventional water cooling head 21 is subjected to the clamping pressure of the fastener, and the water cooling head interior 211 is subjected to the hydraulic pressure of the working fluid to generate an expansion pressure, so that an upper cover 212 and/or a base of the water cooling head 21 are raised upward or bent downward to generate an expansion deformation, thereby failing to work.
Therefore, how to solve the above problems and disadvantages is a direction in which the present inventors and related manufacturers in the industry need to research and improve.
SUMMERY OF THE UTILITY MODEL
In order to solve the above problem, an object of the present invention is to provide a water cooling head strengthening structure that can endure the internal expansion pressure and the external clamping pressure to reduce the deformation of the expansion bulge and the deformation of the extrusion indent.
To achieve the above object, the present invention provides a water cooling head strengthening structure, which comprises: a substrate having a heat exchange surface and a thermal contact surface; a cover body covering the substrate and defining a heat exchange cavity for a working liquid to flow between the substrate and the cover body, the heat exchange cavity having at least one distributed heat radiation fin group and at least one strengthening part, the cover body having an inner side and an inlet and an outlet, the inner side corresponding to the heat exchange surface of the substrate, the inlet and the outlet penetrating the cover body and communicating with the heat exchange cavity, the strengthening part having an upper end combined with the inner side of the cover body via a combination process
In addition, the utility model provides a structure is reinforceed to water-cooling head, it contains: a substrate having a heat exchange surface and a thermal contact surface; a cover body covering the substrate and defining a heat exchange cavity for a working liquid to flow between the substrate and the cover body, the cover body having an inner side corresponding to the heat exchange surface of the substrate and an inlet and an outlet penetrating through the cover body and communicating with the heat exchange cavity; a heat sink unit is disposed in the heat exchange chamber, the heat sink unit has a plurality of heat sink fin sets, and a strengthening portion is disposed between two adjacent heat sink fin sets.
The strengthening part has a lower end integrally formed with the heat exchange surface of the base plate.
The strengthening part has a lower end combined with the heat exchange surface of the substrate through the combination process.
The aforementioned bonding process includes welding.
The heat exchange chamber comprises two strengthening parts and three radiating fin groups, and each strengthening part is arranged between the two radiating fin groups.
The heat radiating fin group comprises a plurality of heat radiating fins, and the strengthening part has a thickness thicker than that of a single fin.
The utility model has the advantages of, combine together with a bonding technology (for example welding, ultrasonic welding etc.) by borrowing this intensive portion and this base plate and/or this lid, not only support the water-cooling head and tolerate outside clamp extrusion pressure in order to reduce the extrusion indent deflection of base plate and lid, also promote simultaneously and tolerate inside expansion pressure in order to reduce the inflation uplift deflection of base plate and lid to have the characteristic of strengthening overall structure intensity concurrently.
Drawings
Fig. 1A is a schematic perspective exploded view of the present invention;
FIG. 1B is a schematic perspective exploded view of another embodiment of the present invention;
FIG. 2 is a perspective view of the present invention;
FIG. 3 is a schematic top view of a substrate according to another embodiment of the present invention;
FIGS. 4A and 4B are schematic sectional views of various embodiments of the present invention;
FIGS. 5A and 5B are Displacement-load (Lord-Displacement) graphs;
FIG. 5C is a pressure and deflection gauge;
FIG. 6 is a schematic cross-sectional view of a prior art water head expansion deformation.
Description of reference numerals: a substrate 11; a heat exchange surface 111; a thermal contact surface 112; a lid 12; an inner side 121; an inlet 124; an outlet 125; a heat radiation fin group 13; a fin 131; a top surface 133; the flow-through sides 134, 135; a heat exchange chamber 14; a reinforcing portion 15; an upper end 151; and a lower end 152.
Detailed Description
The above objects, together with the structure and functional characteristics of the invention, will be best understood from the following description of the preferred embodiments when read in connection with the accompanying drawings.
The water cooling head (water block) of the present invention is a part of a liquid cooling loop (liquid cooling loop), and is mainly used to contact a heating element to dissipate heat of the heating element, and the water cooling head communicates with an external heat dissipation unit (heat exchange fins or water drainage) and/or a pump through a water inlet pipe and a water inlet pipe.
Please refer to fig. 1A, fig. 1B and fig. 2, which are schematic exploded and assembled views of the present invention. As shown in the drawings, the water-cooling head strengthening structure of the present invention includes a substrate 11 and a cover 12 covering the substrate 11, a heat exchange chamber 14 (see fig. 4A and 4B) is defined between the substrate 11 and the cover 12 for a working fluid to flow, and at least one heat dissipating fin set 13 and at least one strengthening portion 15 are distributed in the heat exchange chamber 14. In a preferred embodiment, the heat sink fin set 13 is disposed corresponding to a heat source, and the reinforcing portion 15 is disposed away from the heat source. The base plate 11 has a heat exchange surface 111 and a thermal contact surface 112, the cover 12 has an inner side 121 (fig. 4A and 4B), the inner side 121 faces the heat exchange surface 111 of the base plate 11, and an inlet 124 and an outlet 125 penetrate the cover 12 and communicate with the heat exchange chamber 14. The inlet 124 and the outlet 125 are connected to a liquid inlet pipe and a liquid outlet pipe, respectively, for guiding the working liquid to flow into and out of the heat exchange chamber 14.
The heat sink fin set 13 and the strengthening portion 15 are disposed on the heat exchanging surface 111 of the base 11. The heat sink fin set 13 includes a plurality of fins 131 arranged at intervals, and the adjacent fins 131 have flow channels therebetween and define two flow sides 134, 135. In the present embodiment, for example and without limitation, three heat dissipation fin sets 13 are integrally formed on the heat exchange surface 111 of the base 11, and a top surface 133 of the heat dissipation fin set 13 faces the inner side 121 of the cover 12, and the top surface 133 is not combined with the inner side 121 of the cover 12.
The reinforcing portions 15 are, for example, ribs (fig. 1A) or columns (fig. 1B) or geometric structures adjacent to the heat sink fin set 13 and have an upper end 151 and a lower end 152, in this embodiment, two reinforcing portions 15 are shown to cooperate with the three heat sink fin sets 13. In another embodiment, a reinforcing portion 15 may be coupled to one or two heat dissipating fin sets 13. In another embodiment, a plurality of strengthening portions 15 may be combined with one heat dissipating fin set 13.
In one embodiment, each strengthening portion 15 is located between two heat dissipating fin sets 13. The reinforcing portion 15 has a thickness thicker than that of the single fin 131, and the reinforcing portion 15 has a height slightly higher than that of the single fin 131.
Furthermore, in the present embodiment, the heat dissipating fin set 13 and the strengthening portion 15 are disposed parallel to the substrate 11 in the X direction shown in fig. 1, and the two flow sides 134 and 135 of the heat dissipating fin set 13 are in the same (X) direction as the inlet 124 and the outlet 125. However, in other embodiments, as shown in fig. 3, the heat sink fins 13 and the reinforcing portion 15 are disposed parallel to the substrate 11 in a Y direction as shown in fig. 3, and the inlet 124 and the outlet 125 and the two flow-through sides 134 and 135 are disposed in different directions, that is, the inlet 124 and the outlet 125 are in the X direction, and the two flow-through sides 134 and 135 are in the Y direction.
Referring to fig. 4A and 4B, which are combined and sectional views, and also referring to fig. 1, the heat sink fins 13 and/or the reinforcing portion 15 are integrally formed on the heat exchanging surface 111 of the substrate 11, or are separate elements from the substrate 11, and are bonded (including brazing, soldering, or ultrasonic welding) to the heat exchanging surface 111 of the substrate 11 by a bonding process.
In one possible implementation, as shown in fig. 4A, if the reinforcing part 15 and the base plate 11 are separate individual elements, one or more positioning grooves 1111 may be dug on the heat exchanging surface 111 of the base plate 11 in advance to assist in positioning the lower end 152 of each reinforcing part 15, and then the lower end 152 of the reinforcing part 15 and the heat exchanging surface 111 are welded together, and the upper end 151 of the reinforcing part 15 and the inner side 121 of the cover 12 are welded together. The positioning groove can be omitted by temporarily positioning each reinforcing portion 15 on the heat exchanging surface 111 of the substrate 11 by solder and then welding the lower end 152 and the heat exchanging surface 111 together. In another possible implementation, as shown in fig. 4B, the reinforced portion 15 is integrally formed on the heat exchanging surface 111 of the base plate 11, the lower end 152 of the reinforced portion 15 is integrally formed on the heat exchanging surface 111 of the base plate 11, and the upper end 151 is welded to the inner side 121 of the cover 12.
The heat sink 13 and the stiffener 15 may be made of the same or different metals as the base 11, such as but not limited to gold, silver, copper, aluminum, steel, titanium, or alloys thereof, or combinations thereof.
Furthermore, as shown in fig. 4A and 4B, after the substrate 11 and the cover 12 are covered, the inlet 124 and the outlet 125 are respectively located at two opposite ends of the heat dissipating fin set 13, so that the working fluid entering the heat exchanging chamber 14 can flow from one end of the heat dissipating fin set 13 to the other end, and the working fluid can fully exchange heat with the heat dissipating fin set 13.
Hereinafter, the overall structural rigidity and the expansion pressure resistance of the present invention after the reinforcing portion 15 is welded to the lid body 12 or the base plate 11 is welded to the lid body 12 will be compared with each other by various test data.
Please refer to fig. 5A and 5B, which are graphs of Displacement-load (Lord-Displacement) of the Stiffness test (stilffness Tester) without the reinforcement part and the reinforcement part. In the figure, the horizontal axis represents displacement and the vertical axis represents load. In FIG. 5A, the reinforcing portion 138 is not provided, and in FIG. 5B, the reinforcing portion 138 is provided. The test load increased from 170 pounds force (lbf) to 330 pounds force (lbf), the linearity of the displacement-load curve with the reinforcement 138 was steeper than without the reinforcement, and the stiffness test values output by fig. 5A were lower than 1000lbf/mm, about 847lbf/mm, and fig. 5B were higher than 1000lbf/mm, about 1266lbf/mm, which is significantly better than the performance of fig. 5A.
Fig. 5C shows a table for measuring the amount of deformation of the top surface (i.e., one outer surface of the lid 12) and the bottom surface (i.e., the thermal contact surface 112 of the substrate 11) of the liquid-cooled heat dissipation structure having the reinforcing portion 15. Please refer to fig. 1. In order to obtain the measured values more objectively, two liquid-cooled heat dissipation structures with the same structure are tested, and the numbers 1 and 2 in the table represent the first and second liquid heat dissipation structures. As shown in fig. 5C, when the pressure values are 0, 120psi, 150psi, 200psi and 230psi, the expansion deformation amounts are measured on the top surface and the bottom surface, and it is shown from the figure that the deformation values on the top surface and the bottom surface are maintained at 0.03mm when the pressure value is increased from 0 to 150psi, and the deformation values on the top surface and the bottom surface are maintained at 0.04mm and 0.05mm when the pressure value is continuously increased to 200psi and 230psi, which means that the upper end 151 of the reinforcing part 15 is welded to the inner side 121 of the lid 12 (as shown in fig. 4B) or the upper and lower ends 151 and 152 of the reinforcing part 15 are welded to the inner side 121 of the lid 12 and the heat exchange surface 111 of the base plate 11 (as shown in fig. 4A), respectively, the withstand expansion pressure can be increased to reduce the expansion deformation amounts of the base plate 11 and the lid 12.
By combining the strengthening part 15 with the substrate 11 and/or the cover 12 through a combining process (e.g., welding, ultrasonic welding, etc.), the water cooling head is supported to endure external clamping pressure to reduce the amount of concave deformation of the substrate 11 and the cover 12, and at the same time, the water cooling head is also improved to endure internal expansion pressure to reduce the amount of bulging deformation of the substrate 11 and the cover 12, and the water cooling head has the characteristic of strengthening the overall structural strength.
The foregoing description is intended to be illustrative rather than limiting, and it will be appreciated by those skilled in the art that many modifications, variations or equivalents may be made without departing from the spirit and scope of the invention as defined in the appended claims.

Claims (5)

1. A water-cooled header strengthening structure, comprising:
a substrate having a heat exchange surface and a thermal contact surface;
the cover body covers the substrate and defines a heat exchange cavity, working liquid flows between the substrate and the cover body in the heat exchange cavity, the heat exchange cavity is internally provided with at least one radiating fin group and at least one strengthening part which are distributed, the cover body is provided with an inner side, an inlet and an outlet, the inner side corresponds to the heat exchange surface of the substrate, the inlet and the outlet penetrate through the cover body and are communicated with the heat exchange cavity, the strengthening part is provided with an upper end, and the upper end is combined with the inner side of the cover body through a combining process.
2. The water-cooled head strengthening structure of claim 1, wherein: the strengthening part is provided with a lower end which is integrally formed with the heat exchange surface of the base plate.
3. The water-cooled head strengthening structure of claim 1, wherein: the strengthening part is provided with a lower end, and the lower end is combined with the heat exchange surface of the substrate through the combination process.
4. A water head strengthening structure as defined in claim 1 or 3, wherein: the bonding process is solder bonding.
5. The water-cooled head strengthening structure of claim 1, wherein: the reinforced portion includes a rib or a column.
CN202120553305.0U 2021-03-17 2021-03-17 Water cooling head strengthening structure Active CN214482010U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202120553305.0U CN214482010U (en) 2021-03-17 2021-03-17 Water cooling head strengthening structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202120553305.0U CN214482010U (en) 2021-03-17 2021-03-17 Water cooling head strengthening structure

Publications (1)

Publication Number Publication Date
CN214482010U true CN214482010U (en) 2021-10-22

Family

ID=78156395

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202120553305.0U Active CN214482010U (en) 2021-03-17 2021-03-17 Water cooling head strengthening structure

Country Status (1)

Country Link
CN (1) CN214482010U (en)

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