CN214481329U - Heating element - Google Patents
Heating element Download PDFInfo
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- CN214481329U CN214481329U CN202120028099.1U CN202120028099U CN214481329U CN 214481329 U CN214481329 U CN 214481329U CN 202120028099 U CN202120028099 U CN 202120028099U CN 214481329 U CN214481329 U CN 214481329U
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Abstract
The utility model discloses a heating element belongs to heating paster field. The heating element comprises: the heating device comprises an insulating layer, a heating layer, a first conducting layer, a substrate and a second conducting layer which are sequentially stacked, wherein the heating layer is made of heating conducting ink, and the second conducting layer is connected with the first conducting layer; and the thermistor is arranged on one side of the second conducting layer, which is deviated from the substrate, and is connected with the second conducting layer. The utility model provides a heating element can rapid heating to predetermined temperature, realizes that heating temperature is accurate controllable.
Description
Technical Field
The utility model relates to a heating paster field, in particular to heating element.
Background
Under the low temperature environment, the related performance of the electronic product is limited, and the service life and the service condition of the electronic product are seriously influenced, so that the heating element such as a heating paste is used for rapidly heating the electronic product to the normal service temperature.
However, the conventional heating sheet is difficult to be rapidly heated to a predetermined heating temperature.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a heating element aims at solving among the prior art heating piece and is difficult to the rapid heating to predetermined heating temperature's technical problem.
To achieve the above object, the present invention provides a heating element, comprising:
the heating layer is made of heating conductive ink, and the second conductive layer is connected with the first conductive layer; and
and the thermistor is arranged on one side of the second conducting layer, which is deviated from the substrate, and is connected with the second conducting layer.
Optionally, the heating element further comprises:
and the conductive columns sequentially penetrate through the insulating layer, the heating layer, the first conductive layer, the substrate and the second conductive layer, and two ends of each conductive column are respectively connected with the first conductive layer and the second conductive layer.
Optionally, on the plane of the substrate, 20 to 200 conductive pillars are disposed per square inch of the substrate.
Optionally, the heating element further comprises:
the first protective layer is arranged on one side, away from the heating layer, of the insulating layer.
Optionally, one end of the conductive pillar penetrates through the first protection layer, and the end face of the one end of the conductive pillar and the surface of the side, away from the insulating layer, of the first protection layer are on the same plane.
Optionally, the heating element further comprises:
the second protective layer is arranged on one side, away from the substrate, of the second conductive layer;
the second protection layer is connected with the other ends of the conductive posts, and the second protection layer at least covers the other ends of all the conductive posts.
Optionally, the first protective layer and/or the second protective layer are made of a flexible protective film.
Optionally, the substrate is made of polycarbonate or polyethylene terephthalate.
Optionally, the insulating layer is provided as an insulating oil layer.
Optionally, the first conductive layer and the second conductive layer are both made of conductive ink or metal foil.
The utility model discloses technical scheme makes through setting up the layer that will generate heat into electrically conductive printing ink that generates heat to when printing electrically conductive printing ink that generates heat on the base plate, can be in the regulation within range with the resistance control on the layer that generates heat after drying, and combine the thermistor of the opposite side setting of base plate, so that heating element can rapid heating to predetermined temperature, realizes that heating temperature is accurate controllable.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic structural view of an embodiment of a heating element according to the present invention;
fig. 2 is a schematic structural view of another embodiment of the heating element of the present invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | |
200 | First |
| 300 | |
400 | Insulating |
| 500 | Second |
600 | |
| 700 | |
800 | First |
| 900 | Second protective layer |
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
In the present application, unless expressly stated or limited otherwise, the terms "connected" and "fixed" are to be construed broadly, e.g., "fixed" may be fixedly connected or detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout includes three juxtapositions, exemplified by "A and/or B" including either A or B or both A and B. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
In the related art, a heating patch is commonly used for heating and heat preservation of electronic products. Under the low temperature environment, the relevant performance of electronic products is restricted, and the service life and the service condition of the electronic products are seriously influenced, so that the heating elements such as heating pastes are used for rapidly heating the products to the normal service temperature, and the method has great significance for the electronic products. At present, a silica gel heating plate, a mica heating plate and a heating wire are commonly used for heating. However, the silica gel heating plate, the mica heating plate and the heating wire have the problems that the heating is slow and the heating temperature is difficult to accurately control. The continuous fluctuation of the heating temperature of the heating paste will inevitably affect the use of the electronic product using the heating paste.
Therefore, the embodiment of the invention provides a heating element, which is manufactured by using conductive heating ink on the heating layer 300 arranged on the substrate 100, so that when the conductive heating ink is printed on the substrate 100, the resistance of the heating layer 300 can be controlled within a specified range after drying, and the heating element can be rapidly heated to a preset temperature by combining with a thermistor arranged on the other side of the substrate, thereby realizing accurate and controllable heating temperature.
The specific concepts of the present application are further illustrated below in conjunction with some specific embodiments.
In one embodiment of the present invention, a heating element is provided.
Referring to fig. 1, in the present embodiment, the heating element includes an insulating layer 400, a heat generating layer 300, a first conductive layer 200, a substrate 100, and a second conductive layer 500, which are sequentially stacked.
Specifically, the substrate 100 used in the heating element provided in the present embodiment may be made of Polycarbonate (PC) or polyethylene terephthalate (PET). That is, the substrate 100 may be a PET substrate or a PC substrate.
The first conductive layer 200 is printed on one side surface in the thickness direction of the substrate 100. The first conductive layer 200 may be made using conductive ink or metal foil. For example, the first conductive layer 200 is made by printing conductive ink on one side wall in the thickness direction of the substrate 100. Alternatively, a metal foil is used to form a conductive line on a sidewall of the substrate 100 in the thickness direction, and the conductive line forms the first conductive layer 200.
The heat generating layer 300 is disposed on a surface of the first conductive layer 200 facing away from the substrate 100. The heat generating layer 300 may be made of heat generating conductive ink. Specifically, the heating conductive ink is printed on the surface of the first conductive layer 200 away from the substrate 100, and the resistance of the heating layer 300 can be controlled within the designed resistance range after drying, so that the heating temperature of the heating element is accurately controllable.
The insulating layer 400 is disposed on a surface of the heat generating layer 300 facing away from the first conductive layer 200. For example, after the heat generating layer 300 is formed by drying the heat generating conductive ink, the insulating oil may be printed on the surface of the heat generating layer 300, thereby forming the insulating layer 400.
When the heating element is used, the insulating layer 400 is attached to the back of an electronic product, such as a tablet computer or other handheld terminal electronic product.
The second conductive layer 500 is disposed on a side of the substrate 100 away from the first conductive layer 200. That is, the first conductive layer 200 and the second conductive layer 500 are printed on the opposite side surfaces in the thickness direction of the substrate 100, respectively. It is readily understood that the second conductive layer 500 may also be made using conductive ink or metal foil.
And the second conductive layer 500 is connected to the first conductive layer 200 so as to be conductive with each other. At this time, the thermistor 600 is disposed on a side of the second conductive layer 500 away from the substrate 100, and the thermistor 600 is connected to the second conductive layer 500.
When the insulating layer 400 is attached to the electronic product, the thermistor 600 is disposed on a side of the heating element away from the electronic product, so as not to affect the attachment of the heating element to the electronic product. And the thermistor 600 can be connected through the second conductive layer, the first conductive layer and the heating layer 300, so that the heating temperature of the heating layer 300 can be controlled, the temperature of the heating element is prevented from being out of control, and the reliability of the heating element is improved.
In this embodiment, the heating element is made by using the conductive heating ink to the heating layer 300, so that when the conductive heating ink is printed on the substrate 100, the resistance of the heating layer 300 can be controlled within a specified range after drying, and the thermistor 600 arranged on the other side of the substrate 100 is combined, so that the heating element can be rapidly heated to a predetermined temperature, and the heating temperature can be accurately controlled.
Specifically, the second conductive layer 500 and the first conductive layer 200 may be connected together by a foot or a wire. Alternatively, in one embodiment, the heating elements may be connected by conductive posts 700.
In this embodiment, the heating element further comprises: the conductive pillars 700 sequentially penetrate through the insulating layer 400, the heat generating layer 300, the first conductive layer 200, the substrate 100 and the second conductive layer 500, and two ends of the conductive pillars 700 are respectively connected to the first conductive layer 200 and the second conductive layer 500.
Specifically, a plurality of through holes may be formed in the heating element by a laser beam, and the through holes may sequentially penetrate the insulating layer 400, the heat generating layer 300, the first conductive layer 200, the substrate 100, and the second conductive layer 500 from the insulating layer 400. And then respectively injecting conductive ink into the through holes, and scraping and drying to obtain the conductive column 700.
In this embodiment, the first conductive layer 200 and the second conductive layer 500 can be conducted by conducting electricity inside the heating element, so as to avoid connecting conduction by providing a foot or the like on the sidewall of the heating element. The occurrence of the conditions of electric leakage and the like is avoided, and the use reliability of the heating element of the embodiment is improved.
As an option of this embodiment, 20 to 200 conductive pillars 700 are provided per square inch of the substrate 100 on the plane of the heating substrate 100.
Specifically, when the conductive pillars 700 are manufactured, the conductive ink may be injected into the through holes from the insulating layer 400 by using a screen with a mesh size of 20 to 200, and the conductive pillars 700 are obtained by leveling and drying.
Referring to fig. 2, in one embodiment, the heating element further includes: the first protection layer 800, the first protection layer 800 is disposed on a side of the insulation layer 400 away from the heat generating layer 300.
One end of the conductive pillar 700 penetrates through the first protection layer 800, and an end surface of the conductive pillar 700 and a surface of the first protection layer 800, which is away from the insulating layer 400, are on the same plane.
In this embodiment, the first protective layer 800 is disposed on the surface of the insulating layer 400 to protect the respective hierarchical structures of the heating elements. And one end of the conductive pillar 700 penetrates through the first protection layer 800, so that heat can be directly transferred to the electronic product through the conductive pillar 700, and the heat transfer efficiency between the heating element and the electronic product is improved. The end surface of one end of the conductive pillar 700 and the surface of one side of the first protection layer 800 departing from the insulating layer 400 are on the same plane, so that the surface of the heating element attached to the electronic product is flat.
Referring to fig. 2, further, the heating element further includes: and the second protective layer 900, wherein the second protective layer 900 is disposed on a side of the second conductive layer 500 away from the substrate 100.
The second passivation layer 900 is connected to the other end of the conductive pillar 700, and the second passivation layer 900 at least covers the other end of all the conductive pillars 700.
The second passivation layer 900 is disposed on the second conductive layer 500 to provide an insulation protection function. The insulating layer 400, the heat generating layer 300, the first conductive layer 200 and the substrate 100 may be bent, as an option in this embodiment, and the first flexible protective layer and the second flexible protective layer are made of flexible protective films. Therefore, the whole heating element has better softness so as to be completely attached to the electronic product, and the electronic product is uniformly heated.
The second passivation layer 900 may also facilitate the formation of the conductive pillars 700. For example, after the first passivation layer 800 is formed by covering the insulating layer 400 with a flexible passivation layer, laser drilling can be performed through the heating element blank. Then, a flexible protective film is covered on the back surface of the heating element semi-finished product, i.e. the second conductive layer 500, to form a second protective layer 900. The second protective layer 900 covers at least all of the laser-drilled vias. Therefore, when the conductive pillars 700 are formed, the conductive ink is injected into the through holes from the front surface by using a screen with a mesh of 20-200, the conductive ink is supported by the second passivation layer 900 from below, and the lower ends of the conductive pillars 700 are defined by the second passivation layer 900. And then, the conductive ink is scraped and dried to form the conductive post 700. Without the need to scrape the conductive posts 700 from both ends of the via.
The above is only the optional embodiment of the present invention, and not the scope of the present invention is limited thereby, all the equivalent structure changes made by the contents of the specification and the drawings are utilized under the inventive concept of the present invention, or the direct/indirect application in other related technical fields is included in the patent protection scope of the present invention.
Claims (10)
1. A heating element, comprising:
the heating device comprises an insulating layer, a heating layer, a first conducting layer, a substrate and a second conducting layer which are sequentially stacked, wherein the heating layer is made of heating conducting ink, and the second conducting layer is connected with the first conducting layer; and
the thermistor is arranged on one side, away from the substrate, of the second conducting layer and is connected with the second conducting layer.
2. The heating element of claim 1, further comprising:
the conductive columns sequentially penetrate through the insulating layer, the heating layer, the first conducting layer, the substrate and the second conducting layer, and two ends of each conductive column are respectively connected with the first conducting layer and the second conducting layer.
3. The heating element of claim 2 wherein there are between 20 and 200 conductive posts per square inch of the substrate in the plane of the substrate.
4. The heating element of claim 2, further comprising:
the first protection layer is arranged on one side, deviating from the heating layer, of the insulating layer.
5. The heating element of claim 4, wherein an end of the conductive post extends through the first protective layer, and an end surface of the end of the conductive post is coplanar with a side surface of the first protective layer facing away from the insulating layer.
6. The heating element of claim 4, further comprising:
the second protective layer is arranged on one side, away from the substrate, of the second conductive layer;
the second protection layer is connected with the other ends of the conductive posts, and the second protection layer at least covers the other ends of all the conductive posts.
7. A heating element as claimed in claim 6, wherein the first protective layer and/or the second protective layer is made of a flexible protective film.
8. A heating element as claimed in claim 1, characterized in that the substrate is made of polycarbonate or polyethylene terephthalate.
9. A heating element as claimed in claim 1, characterized in that the insulating layer is provided as an insulating oil layer.
10. A heating element as claimed in claim 1, wherein the first and second electrically conductive layers are both made of conductive ink or metal foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120028099.1U CN214481329U (en) | 2021-01-06 | 2021-01-06 | Heating element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120028099.1U CN214481329U (en) | 2021-01-06 | 2021-01-06 | Heating element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214481329U true CN214481329U (en) | 2021-10-22 |
Family
ID=78111650
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120028099.1U Active CN214481329U (en) | 2021-01-06 | 2021-01-06 | Heating element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214481329U (en) |
-
2021
- 2021-01-06 CN CN202120028099.1U patent/CN214481329U/en active Active
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