CN218735045U - PI electric heating film capable of effectively preventing bending - Google Patents
PI electric heating film capable of effectively preventing bending Download PDFInfo
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- CN218735045U CN218735045U CN202222861887.6U CN202222861887U CN218735045U CN 218735045 U CN218735045 U CN 218735045U CN 202222861887 U CN202222861887 U CN 202222861887U CN 218735045 U CN218735045 U CN 218735045U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
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Abstract
The utility model relates to an electric heat membrane technical field's the PI electric heat membrane that effectively prevents to bend, including the semiconductor layer that generates heat, the base film lamella, heat conduction protection rete and current-carrying electric conductor, the semiconductor layer that generates heat, the equal fixed connection of heat conduction protection rete and current-carrying electric conductor is at the top face of base film lamella, the top face of current-carrying electric conductor is equipped with the paster that resets, the inside of paster that resets is equipped with a plurality of memory metal strips, the memory metal strip extends along the direction of current-carrying electric conductor, the surface of memory metal strip is equipped with insulating rubber coated layer, the bottom of paster that resets is equipped with attaches the viscose layer, the paster that resets is through attaching the top face of gluing layer laminating at the current-carrying electric conductor, the heat through electric heat membrane production effectively resets the department of bending of current-carrying electric conductor, the resistance that makes the current-carrying electric conductor tends to steady, effectively improve the inhomogeneous problem of generating heat that the electric heat membrane leads to because of bending, be fit for promoting on a large scale.
Description
Technical Field
The utility model relates to an electric heat membrane technical field specifically is effectively prevent PI electric heat membrane of bending.
Background
The electrothermal film is divided into high-temperature and low-temperature electrothermal films. The high-temperature electrothermal film is generally used for electronic appliances, military affairs and the like, and is produced by the present science and technology. The electrothermal film heating system is different from point heating systems represented by radiators, air conditioners and heating plates and line heating systems represented by heating cables, and is a low-carbon heating high-tech product developed by adopting the modern aerospace technology in the field of surface heating.
The existing electrothermal film is easy to deform the current-carrying conductor under external extrusion, so that the current-carrying conductor is influenced in the production of the resistor at the bending part, the heat release effect of the electrothermal film is not uniform, and the heating effect of the electrothermal film on the outside is influenced. Therefore, in view of these current situations, it is urgently needed to develop a PI electric heating film that effectively prevents bending so as to meet the needs of practical use.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the above defect, provide the PI electric heat membrane that effectively prevents to bend.
In order to solve the technical problem, the utility model discloses a following technical scheme:
effectively prevent PI electric heat membrane of bending, including the semiconductor layer that generates heat, the base film lamella, heat conduction protection rete and current-carrying conductor, the semiconductor layer that generates heat, the equal fixed connection of heat conduction protection rete and current-carrying conductor is in the top face of base film lamella, the top face of current-carrying conductor is equipped with the paster that resets, the inside of paster that resets is equipped with a plurality of memory metal strips, the memory metal strip extends along the direction of current-carrying conductor, the surface of memory metal strip is equipped with insulating rubber coating layer, the bottom of paster that resets is equipped with the adhesive layer that closes, the paster that resets is through closing the adhesive layer laminating at the top face of current-carrying conductor.
In the above description, as a further scheme, the semiconductor heating layer is formed by a plurality of carbon fiber heat release layers, the plurality of carbon fiber heat release layers are flatly laid on the surface of the base film layer, and a consistent distance is kept between two adjacent carbon fiber heat release layers.
In the above description, as a further scheme, the current-carrying conductor includes a plurality of copper foil current-carrying sheets and a plurality of silver paste current-carrying sheets, the silver paste current-carrying sheets are respectively and fixedly connected to two sides of the top end surface of the base film layer, and the silver paste current-carrying sheets are in contact with the carbon solder heat release layer, the copper foil current-carrying sheets are respectively and fixedly connected to the top end surface of the silver paste current-carrying sheets, and the copper foil current-carrying sheets and the silver paste current-carrying sheets are vertically and alternately distributed with the carbon solder heat release layer.
In the above description, as a further scheme, the middle portion of the silver paste current-carrying sheet is provided with a plurality of conductive through holes, and the conductive through holes are located above the gap between two adjacent carbon fiber heat release layers.
In the above description, as a further mode, the base film sheet layer is formed of a PET film.
The utility model discloses produced beneficial effect as follows:
the PI electric heat membrane that effectively prevents to bend of this application sets up the paster that resets through the top face of current-carrying electric conductor, and the heat through electric heat membrane production effectively resets the department of bending of current-carrying electric conductor, makes the resistance of current-carrying electric conductor tend to steadily, effectively improves the inhomogeneous problem of generating heat of electric heat membrane because of bending and leading to, is fit for promoting on a large scale.
Drawings
Fig. 1 is an exploded view of an electric heating film capable of preventing deformation of a diaphragm according to the present invention;
FIG. 2 is a schematic view of a portion A of FIG. 1;
in the figure: the heat-conducting film comprises a 1-carbon brazing fiber heat-releasing layer, a 2-copper foil current-carrying strip, a 3-silver paste current-carrying strip, a 4-base film layer, a 5-heat-conducting protective film layer, a 6-reset paster, a 301-conducting through hole, a 601-memory metal strip, a 602-insulating rubber coating layer and a 603-adhesive layer.
Detailed Description
In order to facilitate understanding of those skilled in the art, the present invention will be further described with reference to the following examples and drawings, which are not intended to limit the present invention. The present invention will be described in detail with reference to the accompanying drawings.
Referring to fig. 1-2, an embodiment of a PI electrothermal film for effectively preventing bending includes a semiconductor heating layer, a base film layer 4, a thermal conductive protective film layer 5, and a current-carrying conductor, the semiconductor heating layer, the thermal conductive protective film layer 5, and the current-carrying conductor are all fixedly connected to a top end surface of the base film layer 4, the base film layer 4 is made of a PET film, a reset patch 6 is disposed on the top end surface of the current-carrying conductor, a plurality of memory metal strips 601 are disposed inside the reset patch 6, the memory metal strips 601 extend along a direction of the current-carrying conductor, an insulating adhesive layer 602 is disposed on a surface of the memory metal strips 601, an adhesive layer 603 is disposed at a bottom of the reset patch 6, and the reset patch 6 is attached to the top end surface of the current-carrying conductor through the adhesive layer 603.
The semiconductor heating layer is composed of a plurality of carbon fiber heat release layers 1, the carbon fiber heat release layers 1 are flatly laid on the surface of the base membrane sheet layer 4, and consistent distance is kept between every two adjacent carbon fiber heat release layers 1.
The current-carrying electric conductor includes a plurality of copper foil current-carrying pieces 2 and a plurality of silver thick liquid current-carrying pieces 3, and silver thick liquid current-carrying pieces 3 difference fixed connection is in the both sides of 4 top end faces of base film lamella, and contacts between silver thick liquid current-carrying piece 3 and carbon borer dimension heat release layer 1, and copper foil current-carrying piece 2 difference fixed connection is in the top end face of silver thick liquid current-carrying piece 3, and copper foil current-carrying piece 2 and silver thick liquid current-carrying piece 3 all are perpendicular crisscross distribution with carbon borer dimension between the heat release layer 1.
The middle part of the silver paste current-carrying sheet 3 is provided with a plurality of conductive through holes 301, and the conductive through holes 301 are positioned above the gap between two adjacent carbon fiber heat release layers 1.
The above description is only for the preferred embodiment of the present invention, and the present invention is not limited to the above description, and although the present invention is disclosed in the preferred embodiment, it is not limited to the above description, and any person skilled in the art can make some changes or modifications to equivalent embodiments without departing from the scope of the present invention, but all the technical solutions of the present invention are within the scope of the present invention.
Claims (5)
1. Effectively prevent PI electric heat membrane of bending, including semiconductor heating layer, base film lamella, heat conduction protection rete and current-carrying conductor, its characterized in that: semiconductor generate heat layer, heat conduction protection rete and current-carrying conductor all fixed connection are at the top face of base film lamella, and the top face of current-carrying conductor is equipped with the paster that resets, and the inside of paster that resets is equipped with a plurality of memory metal strips, and the memory metal strip extends along the direction of current-carrying conductor, and the surface of memory metal strip is equipped with the insulating rubber coating layer, and the bottom of paster that resets is equipped with the adhesive layer that closes, and the paster that resets is through closing the adhesive layer laminating at the top face of current-carrying conductor.
2. The PI electrothermal film capable of effectively preventing bending according to claim 1, wherein: the semiconductor heating layer is composed of a plurality of carbon fiber heat release layers, the carbon fiber heat release layers are flatly laid on the surface of the base membrane sheet layer, and the consistent distance is kept between every two adjacent carbon fiber heat release layers.
3. The PI electrothermal film capable of effectively preventing bending according to claim 1, wherein: the current-carrying electric conductor comprises a plurality of copper foil current-carrying sheets and a plurality of silver paste current-carrying sheets, the silver paste current-carrying sheets are respectively and fixedly connected with the two sides of the top end face of the base film sheet, the silver paste current-carrying sheets are in contact with the carbon borer heat release layer, the copper foil current-carrying sheets are respectively and fixedly connected with the top end face of the silver paste current-carrying sheets, and the copper foil current-carrying sheets and the silver paste current-carrying sheets are vertically and alternately distributed with the carbon borer heat release layer.
4. The PI electrothermal film capable of effectively preventing bending according to claim 3, wherein: the middle part of the silver paste current-carrying sheet is provided with a plurality of conductive through holes, and the conductive through holes are positioned above the gap between every two adjacent carbon fiber heat release layers.
5. The PI electrothermal film capable of effectively preventing bending according to any one of claims 1 to 3, wherein: the base film sheet layer is composed of a PET film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222861887.6U CN218735045U (en) | 2022-10-28 | 2022-10-28 | PI electric heating film capable of effectively preventing bending |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222861887.6U CN218735045U (en) | 2022-10-28 | 2022-10-28 | PI electric heating film capable of effectively preventing bending |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218735045U true CN218735045U (en) | 2023-03-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222861887.6U Active CN218735045U (en) | 2022-10-28 | 2022-10-28 | PI electric heating film capable of effectively preventing bending |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218735045U (en) |
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2022
- 2022-10-28 CN CN202222861887.6U patent/CN218735045U/en active Active
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