CN214481227U - Piezoelectric hydrophone - Google Patents

Abstract

The utility model relates to a piezoelectric hydrophone, include: the fixing piece is provided with a step and a boss, and the step is arranged along the circumferential direction of the fixing piece; the wafer assembly is arranged on the step, and an induction gap is formed between one side surface of the wafer assembly close to the boss and the boss; and the protecting piece is connected with the fixing piece and is used for covering the fixing piece so as to enable the fixing piece to form a sealing state. The piezoelectric hydrophone is simple in structure and small in size, can accommodate a larger wafer assembly under the size of the same fixing piece, is high in sensitivity, and is beneficial to reducing the manufacturing cost, and therefore the production benefit is improved.

Description

Piezoelectric hydrophone

Technical Field

The utility model relates to a piezoelectricity is vibration sensor technical field under water, especially relates to a piezoelectricity hydrophone.

Background

With the development of the petroleum industry and the electronic industry, the usage amount of petroleum in the world is increasing day by day, and the exploration of petroleum resources becomes a leading industry of the petroleum industry. The earth has a large proportion of sea and land, so that the marine oil exploration becomes a main target of modern oil exploration. In geophysical exploration of petroleum, shallow sea hydrophone detection is the first link of field acquisition work and is also a key link in marine petroleum exploration instruments. The hydrophone detection is used as the first process of marine oil exploration, and plays an important role in the quality of exploration data acquisition.

In order to obtain deep-water underwater acoustic signals, a hydrophone is often used as a sensing device to detect underwater acoustic signals, and the working principle of the hydrophone converts water pressure changes into electric signal changes by utilizing the piezoelectric effect. However, in order to improve the sensitivity of the conventional hydrophone, the volume design of the conventional hydrophone is large, the structure is complex, the manufacturing cost is high, the troubleshooting steps are complex when the hydrophone fails, and the maintenance and replacement costs of elements of the hydrophone are increased.

SUMMERY OF THE UTILITY MODEL

Therefore, a piezoelectric hydrophone is needed, which can effectively improve the detection sensitivity, and has the advantages of small volume, simple structure and low manufacturing cost.

A piezoelectric hydrophone, comprising: the fixing piece is provided with a step and a boss, and the step is arranged along the circumferential direction of the fixing piece; the wafer assembly is arranged on the step, and an induction gap is formed between one side surface of the wafer assembly close to the boss and the boss; and the protecting piece is connected with the fixing piece and is used for covering the fixing piece so as to enable the fixing piece to form a sealing state.

In the assembly process of the piezoelectric hydrophone, the wafer assembly is firstly arranged on the step; then, the protector is disposed on the fixing member and covers the protector, so that the protector is brought into a sealed state. In the use, because the wafer assembly is installed on the step, and the step sets up along mounting circumference, so, the mounting can protect the wafer assembly, avoids the wafer assembly to receive the external force and the rupture damage, lead to inefficacy, improves the life of wafer assembly. Simultaneously, there is the response clearance between wafer subassembly is close to a side of boss and the boss, so, at wafer subassembly vibration in-process, wafer subassembly vibrates from top to bottom, and the setting of boss can effectively restrict metal substrate's deformation by a wide margin, can improve wafer subassembly's life on the one hand, and on the other hand can improve wafer subassembly's sensitivity to improve piezoelectric hydrophone's detectivity. The protective piece is added to enable the fixing piece to be internally sealed, and seawater can be prevented from entering a cavity surrounded by steps when the piezoelectric hydrophone is used underwater, so that the wafer assembly and other components are prevented from being corroded. The piezoelectric hydrophone is simple in structure and small in size, can accommodate a larger wafer assembly under the size of the same fixing piece, is high in sensitivity, and is beneficial to reducing the manufacturing cost, and therefore the production benefit is improved.

In one embodiment, the fixing member is provided with a mounting groove, the step is arranged on the side wall of the mounting groove, the boss is arranged on the bottom wall of the mounting groove, and the boss protrudes towards the notch of the mounting groove.

In one embodiment, the wafer assembly includes a piezoelectric element and a substrate, the substrate is disposed on the step, a gap exists between a side of the substrate facing the boss and the boss, and the piezoelectric element is disposed on a side of the substrate facing away from the boss.

In one embodiment, the substrate is a metal piece, an insulating layer is arranged on the metal piece, and the insulating layer covers the outer surface of the metal piece.

In one embodiment, the wafer assembly further comprises an adhesive, and the piezoelectric element is adhered to the substrate by the adhesive.

In one embodiment, the piezoelectric element is provided with a positive electrode part and a negative electrode part, and the positive electrode part and the negative electrode part are both arranged on one side surface of the piezoelectric element, which faces away from the boss.

In one embodiment, the wafer assembly further includes signal lines, and the two signal lines are connected to the positive electrode part and the negative electrode part, respectively.

In one embodiment, the number of the bosses is two or more, and the two or more bosses are arranged at intervals along the width direction of the fixing piece.

In one embodiment, the boss is formed by the fixing member protruding in a direction toward the wafer assembly, and a groove is formed in a side of the fixing member facing away from the wafer assembly.

In one embodiment, the protection member is a rubber member.

In one embodiment, the rubber member is a polysulfide rubber.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this application, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification.

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a first schematic structural diagram of a piezoelectric hydrophone in an embodiment;

fig. 2 is a schematic structural diagram ii of the piezoelectric hydrophone in the first embodiment.

Description of reference numerals:

100. the piezoelectric hydrophone comprises a piezoelectric hydrophone body, 110, a fixed piece, 111, steps, 112, a sensing gap, 113, bosses, 114, a mounting groove, 115, a groove, 120, a wafer assembly, 121, a piezoelectric element, 1211, a positive electrode portion, 1212, a negative electrode portion, 122, a substrate, 123, a signal wire, 130 and a protection element.

Detailed Description

In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

In one embodiment, referring to fig. 1, a piezoelectric hydrophone 100 includes: a fixing member 110, a wafer assembly 120 and a protection member 130. The fixing member 110 is provided with a step 111 and a boss 113, and the step is arranged along the circumferential direction of the fixing member 110. The wafer assembly 120 is mounted on the step 111, and an inductive gap 112 exists between a side of the wafer assembly 120 close to the boss 113 and the boss 113. The protector 130 is connected to the holder 110, and the protector 130 is used to cover the wafer assembly 120, so that the wafer assembly 120 is sealed between the protector 130 and the holder 110.

In the assembly process of the piezoelectric hydrophone 100, the wafer assembly 120 is firstly mounted on the step 111; then, the protector 130 is disposed on the fixing member 110, and the protector 110 is covered, so that the protector 110 is brought into a sealed state. In the using process, since the wafer assembly 120 is mounted on the step 111, the fixing member 110 can protect the wafer assembly 120, so as to prevent the wafer assembly 120 from being broken and damaged by an external force and causing failure, and improve the service life of the wafer assembly 120. Meanwhile, there is an induction gap 112 between a side of the wafer assembly 120 close to the boss 113 and the boss 113, so, in the vibration process of the wafer assembly 120, the wafer assembly 120 vibrates up and down, the boss 113 is arranged to effectively limit the large deformation of the metal substrate 122, on one hand, the service life of the wafer assembly 120 can be prolonged, on the other hand, the sensitivity of the wafer assembly 120 can be improved, and thus the detection sensitivity of the piezoelectric hydrophone 100 is improved. The addition of the protective member 130 allows the interior of the mounting member 110 to be sealed, thereby preventing seawater from entering the cavity defined by the steps and corroding the wafer assembly 120 and other components when the piezoelectric hydrophone 100 is used underwater. The piezoelectric hydrophone 100 is simple in structure and small in size, and can accommodate a larger wafer assembly 120 under the same size of the fixing piece 110, so that the sensitivity is high, the manufacturing cost is reduced, and the production benefit is improved.

It should be noted that, the sensing gap 112 exists between the side of the wafer assembly 120 close to the boss 113 and the boss 113, it should be understood that the wafer assembly 120 is mounted on the step 111, the edge of the outline of the wafer assembly 120 is abutted against or connected with the step 111, the central portion of the outline of the wafer assembly 120 is suspended on the fixing member 110, the boss 113 protrudes toward the opening 112, and the minimum distance between the wafer assembly 120 and the boss 113 is greater than 0, so that the sensing gap 112 is formed between the wafer assembly 120 and the boss 113.

Alternatively, the shape of the fixing member 110 may be square, circular, rectangular, or other shapes. Specifically, the fixing member 110 is rectangular in shape.

Further, the wafer assembly 120 conforms to the shape of the fixing member 110, and the size of the wafer assembly 120 is smaller than the size of the opening surrounded by the step 111. Thus, the wafer assembly 120 can be mounted on the step 111 through the opening, and the outer edge of the wafer assembly 120 contacts the step 111. Meanwhile, the shape of the wafer assembly 120 is consistent with that of the fixing member 110, so that the structure of the fixing member 110 is more compact, which is beneficial to improving the structural stability of the fixing member 110, and meanwhile, the volume of the fixing member 110 is effectively reduced, thereby reducing the overall volume of the piezoelectric hydrophone 100.

In one embodiment, the fixing member 110 is provided with a mounting groove 114, the step 111 is provided on a sidewall of the mounting groove 114, the boss 113 is provided on a bottom wall of the mounting groove 114, and the boss 113 protrudes toward a notch of the mounting groove 114. Thus, the structure of the mounting groove 114 is favorable for improving the structural stability of the fixing member 110, the wafer assembly 120 is mounted in the mounting groove 114, the connection stability of the wafer assembly 120 in the fixing member 110 can be improved, so that the overall quality and the service life of the piezoelectric hydrophone 100 are improved, and meanwhile, the structure of the mounting groove 114 is favorable for reducing the production cost, so that the economic benefit of the piezoelectric hydrophone 100 is improved.

In one embodiment, referring to fig. 1, wafer assembly 120 includes a piezoelectric element 121 and a substrate 122. The substrate 122 is mounted on the step 111, and a sensing gap 112 exists between a side of the substrate 122 facing the boss 113 and the boss 113, and the piezoelectric element 121 is disposed on a side of the substrate 122 facing away from the boss 113 (for example, the piezoelectric element 121 is laminated on the substrate 122). Thus, the substrate 122 and the piezoelectric element 121 form the wafer assembly 120, and through the piezoelectric effect, when an ultrasonic signal needs to be transmitted, the wafer assembly 120 receives an input signal, and the piezoelectric element 121 vibrates due to the piezoelectric effect to form an ultrasonic wave; when receiving ultrasonic signal, the vibration of piezoelectric element 121 produces voltage through the piezoelectric effect, thereby forms received signal after signal processing, and substrate 122 can provide guard action and bearing effect for piezoelectric element 121, avoids piezoelectric element 121 breakage, fracture, is favorable to improving piezoelectric element 121's life, and then improves piezoelectric hydrophone 100's whole quality and life.

Alternatively, the piezoelectric element 121 may be a piezoelectric ceramic such as Barium Titanate (BT), lead zirconate titanate (PZT), modified lead zirconate titanate, lead meta niobate, lead barium lithium niobate (PBLN), modified lead titanate, or the like; or a piezoelectric crystal such as crystal, quartz crystal, lithium gallate, lithium germanate, titanium germanate, lithium niobate, lithium tantalate, or the like; but also piezoelectric polymers, composite piezoelectric materials, and the like; or other piezoelectric materials.

Specifically, referring to fig. 1 and 2, the piezoelectric element 121 is a piezoelectric ceramic, such as PZT piezoelectric ceramic. Thus, the PZT piezoelectric ceramic element has strong piezoelectric performance and high dielectric constant, and is beneficial to processing the piezoelectric element 121 into any shape and improving the overall quality and the transduction efficiency of the piezoelectric hydrophone 100. Meanwhile, the PZT piezoelectric ceramics have low raw material cost, which is beneficial to reducing the production cost of the piezoelectric hydrophone 100 and improving the economic benefit of the piezoelectric hydrophone 100. The present embodiment provides only one material choice for the piezoelectric element 121, but not limited thereto.

Alternatively, the shape of the piezoelectric element 121 may be square, circular, rectangular, or other irregular shape. Specifically, in the present embodiment, the piezoelectric element 121 is rectangular in shape.

Alternatively, the substrate 122 may be a plastic, metal, composite, or other material.

Specifically, referring to fig. 1, the substrate 122 is a metal member. Further, the metal piece is beryllium copper alloy. The metal piece is provided with an insulating layer, and the insulating layer covers the outer surface of the metal piece. Therefore, the beryllium-copper alloy has excellent mechanical properties, high hardness, strong wear resistance and corrosion resistance, and is beneficial to improving the overall strength of the wafer assembly 120, further improving the quality and the service life of the wafer assembly 120, and improving the use experience of the piezoelectric hydrophone 100. Meanwhile, the piezoelectric element has high elasticity, so that the vibration requirement of the piezoelectric element 121 can be met, and the detection sensitivity of the wafer assembly 120 is effectively ensured. In addition, the beryllium-copper alloy has excellent casting performance, can be processed into a required shape, has simple process, and is beneficial to reducing the production cost of the wafer assembly 120, further reducing the production cost of the piezoelectric hydrophone 100 and improving the economic benefit of the piezoelectric hydrophone 100. The insulating layer covers the outer surface of the metal piece, so that the metal piece is insulated from the piezoelectric piece 121, the signal shielding effect is improved, the signal interference is avoided, the signal to noise ratio of the output signal is improved, and the use function experience of the piezoelectric hydrophone 100 is improved. The present embodiment provides only one selection of the substrate 122, but is not limited thereto.

Alternatively, the insulating layer may be disposed by Physical Vapor Deposition (PVD), spray coating, vacuum plating, insulating varnish, or other arrangements.

Specifically, the insulating layer is PVD, is arranged on the metal piece in a coating mode, and covers the outer surface of the metal piece. Therefore, the PVD coating mode is beneficial to uniformly covering the insulating layer on the substrate 122, the adhesive force and the durability are strong, cracking or falling off are not easy to occur when the substrate 122 bends or vibrates, the insulating effect of the insulating layer is beneficial to being ensured, and the use experience of the piezoelectric hydrophone 100 is improved. Meanwhile, the PVD coating mode can select various colors, and the color is not easy to change in severe environment, so that the attractiveness of the wafer is improved, and the overall quality and the use experience of the piezoelectric hydrophone 100 are improved. The present embodiment provides only one way of disposing the insulating layer on the substrate 122, but is not limited thereto.

Alternatively, the shape of the substrate 122 may be square, circular, rectangular, or other irregular shapes.

Specifically, the substrate 122 conforms to the shape of the piezoelectric element 121. Further, the substrate 122 is rectangular. Therefore, the protection performance of the substrate 122 on the piezoelectric element 121 is improved, damage and cracking of the piezoelectric element 121 are avoided, the quality and the service life of the wafer assembly 120 are improved, and the use experience of the piezoelectric hydrophone 100 is improved. The present embodiment provides only one shape configuration of the substrate 122, but is not limited thereto.

In one embodiment, referring to fig. 1, the wafer assembly 120 further includes a bonding element. The piezoelectric element 121 and the substrate 122 are bonded by an adhesive. Thus, the use of the adhesive is beneficial to improving the connection stability between the piezoelectric element 121 and the substrate 122, so as to improve the overall quality of the wafer assembly 120 and prolong the service life. Meanwhile, the bonding piece can play an isolation role between the piezoelectric element 121 and the substrate 122, so that the piezoelectric element 121 and the substrate 122 are insulated, the signal shielding effect is favorably improved, the signal interference is avoided, the signal to noise ratio of the output signal is improved, and the use function experience of the piezoelectric hydrophone 100 is improved.

Alternatively, the adhesive member may be an adhesive material such as epoxy resin, silicone, ab-paste, or photo-curing resin.

Specifically, the adhesive is epoxy resin. Therefore, the epoxy resin has strong bonding force, high mechanical strength after curing and convenient curing and forming, and is beneficial to improving the connection stability of the piezoelectric part 121 and the substrate 122; meanwhile, the piezoelectric element 121 can be prevented from contacting the substrate 122, so that an insulating effect is achieved, noise interference of signals is effectively reduced, the signal-to-noise ratio of output signals is improved, the overall quality of the piezoelectric hydrophone 100 is improved, and the use experience of the piezoelectric hydrophone 100 is improved. The present embodiment provides only one embodiment of the adhesive member, but not limited thereto.

In one embodiment, referring to fig. 2, the piezoelectric element 121 is provided with a positive electrode portion 1211 and a negative electrode portion 1211. The positive electrode portion 1211 and the negative electrode portion 1211 are provided on a side of the piezoelectric element 121 facing away from the boss 113. Thus, the wafer assembly 120 forms a flanged electrode structure, so that the positive electrode 1211 and the negative electrode 1211 are on the same side, which is beneficial to improving the convenience of wiring, and the operation is simple, thereby being beneficial to improving the reliability of the piezoelectric hydrophone 100. Meanwhile, the volume of the mounting groove 114 can be saved due to the structure of the flanging electrode, which is beneficial to miniaturizing the fixing member 110, so that the structure of the fixing member 110 is more compact, and the volume of the piezoelectric hydrophone 100 is reduced.

Further, referring to fig. 2, on the same side of the piezoelectric element 121, the positive electrode 1211 and the negative electrode 1211 are separated by an adhesive. In this way, in the manufacturing process of the wafer assembly 120, the positive electrode 1211 and the negative electrode 1211 are separated by the insulation effect of the adhesive member, so that the damage and failure of the wafer assembly 120 caused by the short circuit between the positive electrode 1211 and the negative electrode 1211 during wiring are avoided, the overall quality of the piezoelectric hydrophone 100 is improved, and the use experience of the piezoelectric hydrophone 100 is further improved.

Further, referring to fig. 1 and fig. 2, the chip assembly 120 further includes a signal line 123. The two signal lines 123 are connected to the positive electrode 1211 and the negative electrode 1211, respectively. Thus, positive electrode 1211 and negative electrode 1211 are led out through signal line 123, opening 112 is covered through protection member 130, mounting groove 114 is sealed, when the wiring is assembled, only signal line 123 electric connection is needed, protection member 130 and fixing member 110 are not needed to be disconnected, the use convenience of piezoelectric hydrophone 100 is improved, meanwhile, the sealing performance of piezoelectric hydrophone 100 is ensured, the service life of piezoelectric hydrophone 100 is prolonged, and the overall quality and the use experience of piezoelectric hydrophone 100 are improved.

In one embodiment, referring to fig. 1, the number of the bosses 113 is two or more, and the two or more bosses 113 are arranged at intervals along the length direction of the fixing member 110. Thus, the supporting area of the wafer assembly 120 by the bosses 113 can be increased by arranging the two or more bosses 113 at intervals, and then the middle part of the wafer assembly 120 can be supported. The wafer assembly 120 is beneficial to limiting the substrate 122 to deform greatly in the vibration process, and the wafer assembly 120 is effectively protected, so that the service life of the piezoelectric hydrophone 100 is prolonged, and the overall quality and the use experience of the piezoelectric hydrophone 100 are improved.

In order to further explain and understand the width direction of the fixing member 110, taking fig. 1 as an example, the length direction of the fixing member 110 is a straight line S₁In the direction indicated by any of the above arrows.

Further, referring to fig. 1, there are three bosses 113. Three bosses 113 are provided at intervals in the width direction of the fixing member. So, the 113 interval settings of three boss can increase the support area of boss 113 to wafer assembly 120, and then can provide the support for the middle part of wafer assembly 120, is favorable to restricting substrate 122 to warp by a wide margin at wafer assembly 120 vibration in-process, effectively plays the guard action to wafer assembly 120 to prolong piezoelectric hydrophone 100's life. Meanwhile, the structure in the mounting groove 114 can be simplified, the vibration range of the wafer assembly 120 is ensured, the detection sensitivity of the piezoelectric hydrophone 100 is improved, and the overall quality and the use experience of the piezoelectric hydrophone 100 are improved.

Alternatively, the protection member 130 and the fixing member 110 may be connected by a screw, a bolt, a snap, an adhesive, or other connection methods, or a combination of two or more connection methods.

Specifically, the protector 130 is adhesively connected to the holder 110. Therefore, the sealing performance of the protecting piece 130 after being connected with the fixing piece 110 is improved, the wafer assembly 120 is effectively prevented from being damaged when seawater permeates into the installation groove 114, the reliability of the piezoelectric hydrophone 100 is effectively improved, the service life of the piezoelectric hydrophone 100 is prolonged, and the overall quality and the use experience of the piezoelectric hydrophone 100 are further improved. The present embodiment provides only one connection manner between the protection member 130 and the fixing member 110, but not limited thereto.

Further, referring to fig. 1, the protrusion 113 is formed by the fixing member 110 protruding toward the wafer assembly 120, and a groove 115 is formed on a side of the fixing member 110 facing away from the wafer assembly 120. Thus, the boss 113 and the fixing member 110 are integrally formed, and the manufacturing process can be a metal stamping or injection molding mode, which is beneficial to simplifying the processing process of the fixing member 110, thereby reducing the production cost of the piezoelectric hydrophone 100 and improving the economic benefit of the piezoelectric hydrophone 100.

In one embodiment, referring to fig. 1, the protection member 130 is a rubber member. Thus, the protection member 130 plays a role of sealing protection and vibration isolation, which is beneficial to ensuring the detection sensitivity of the piezoelectric hydrophone 100. Meanwhile, the rubber piece is good in sealing performance, the rubber piece is simple in processing technology, good in seawater corrosion resistance, the characteristic impedance is close to that of water, sealing in the mounting groove 114 is guaranteed, seawater is prevented from entering the mounting groove 114, the overall quality of the piezoelectric hydrophone 100 is improved, the service life of the piezoelectric hydrophone 100 is prolonged, the production cost of the piezoelectric hydrophone 100 is reduced, and therefore economic benefits are improved.

Alternatively, the protection member 130 may be Natural Rubber (NR), Butadiene Rubber (BR), nitrile rubber, styrene butadiene rubber (sbr), Isoprene Rubber (IR), ethylene propylene rubber, chloroprene rubber, isoprene rubber, or other rubber materials.

Specifically, referring to fig. 1, the rubber member is polysulfide rubber. Thus, the protection member 130 has high wear resistance, high flexibility, high aging resistance and high impact resistance, and is favorable for improving the connection stability of the protection member 130 and the fixing member 110, so that the sealing performance of the protection member 130 and the fixing member 110 in the mounting groove 114 is ensured, the overall quality of the piezoelectric hydrophone 100 is improved, and the service life of the piezoelectric hydrophone 100 is prolonged. The present embodiment provides only one selection way of the rubber member, but not limited thereto.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims (10)

1. A piezoelectric hydrophone, comprising:

the fixing piece is provided with a step and a boss, and the step is arranged along the circumferential direction of the fixing piece;

the wafer assembly is arranged on the step, and an induction gap is formed between one side surface of the wafer assembly close to the boss and the boss;

and the protective piece is connected with the fixing piece and is used for covering the wafer assembly so that the wafer assembly is sealed between the protective piece and the fixing piece.

2. The piezoelectric hydrophone of claim 1, wherein the fixture has a mounting groove, the step is disposed on a sidewall of the mounting groove, the boss is disposed on a bottom wall of the mounting groove, and the boss protrudes toward a notch of the mounting groove.

3. The piezoelectric hydrophone of claim 1, wherein the wafer assembly comprises a piezoelectric element and a substrate, the substrate being mounted on the step with the sensing gap formed between a side of the substrate facing the boss and the boss, the piezoelectric element being disposed on a side of the substrate facing away from the boss.

4. The piezoelectric hydrophone of claim 3, wherein the substrate is a metal piece having an insulating layer disposed thereon, the insulating layer covering an outer surface of the metal piece.

5. The piezoelectric hydrophone of claim 3, wherein the wafer assembly further comprises an adhesive, the piezoelectric element being bonded to the substrate by the adhesive.

6. The piezoelectric hydrophone of claim 3, wherein the piezoelectric element is provided with a positive portion and a negative portion, both of the positive and negative portions being disposed on a side of the piezoelectric element facing away from the boss.

7. The piezoelectric hydrophone of claim 6, wherein the wafer assembly further comprises signal lines, both of which are connected to the positive and negative electrode sections, respectively.

8. The piezoelectric hydrophone of any one of claims 1-7, wherein there are more than two bosses, and the more than two bosses are spaced apart along the width of the fixture; and/or the presence of a gas in the gas,

the boss is formed by the fixing piece protruding towards the direction of the wafer assembly, and a groove is formed on one side of the fixing piece, which faces away from the wafer assembly.

9. The piezoelectric hydrophone of any of claims 1-7, wherein the protector is a rubber member.

10. The piezoelectric hydrophone of claim 9, wherein the rubber member is polysulfide rubber.

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