CN210847050U - Ultrasonic piezoelectric ceramic piece - Google Patents
Ultrasonic piezoelectric ceramic piece Download PDFInfo
- Publication number
- CN210847050U CN210847050U CN201921805904.6U CN201921805904U CN210847050U CN 210847050 U CN210847050 U CN 210847050U CN 201921805904 U CN201921805904 U CN 201921805904U CN 210847050 U CN210847050 U CN 210847050U
- Authority
- CN
- China
- Prior art keywords
- ceramic chip
- potsherd
- ceramic
- groove
- piezoelectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 72
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910052709 silver Inorganic materials 0.000 claims abstract description 14
- 239000004332 silver Substances 0.000 claims abstract description 14
- 239000003989 dielectric material Substances 0.000 claims description 12
- 238000009413 insulation Methods 0.000 claims description 5
- 239000000428 dust Substances 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 6
- 238000012856 packing Methods 0.000 abstract description 3
- 238000009434 installation Methods 0.000 abstract 2
- 230000001681 protective effect Effects 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Transducers For Ultrasonic Waves (AREA)
Abstract
The utility model discloses an ultrasonic wave piezoceramics piece, concretely relates to potsherd field, including the potsherd body, the potsherd body includes potsherd internal installation subassembly, and the fixed cover in the inner chamber that the outside of potsherd internal installation subassembly is located the potsherd body is equipped with potsherd outside casing subassembly. The utility model discloses a have silver layer at positive pole piezoelectric piece and negative pole piezoelectric piece top fixed mounting to can be very big increase the electric conduction efficiency inside the device, in addition seted up the protection groove outside the ceramic chip inside the casing subassembly, and inside packing has rubber, can prevent on the one hand that the internal current interruption from leading to the external world, thereby avoided the emergence of incident, on the other hand because the characteristic of rubber layer, can play the effect of protection to internal device; and through offering first wiring groove and second wiring groove in the middle part of the both ends of the outside casing subassembly of ceramic chip to can avoid inside dust to cause the damage to it, thereby improve the fail safe nature of wiring mouth.
Description
Technical Field
The utility model relates to a potsherd technical field, more specifically say, the utility model relates to an ultrasonic wave piezoceramics piece.
Background
The piezoelectric ceramic piece is an electronic sound producing element, a piezoelectric ceramic dielectric material is placed between two copper round electrodes, when an alternating current audio signal is connected to the two electrodes, the piezoelectric piece can vibrate according to the magnitude frequency of the signal to generate corresponding sound, and in addition, tin is usually adopted for welding when cables are respectively connected with the two electrodes.
The prior art has the following problems:
the conventional piezoelectric ceramic piece is welded by adopting tin and is mostly welded on the outer surface of the ceramic piece, so that a large amount of dust can fall on a welding position after the ceramic piece is used for a long time, and water drops can be generated in the piezoelectric ceramic piece, so that the welding position of the piezoelectric ceramic piece is corroded or internal equipment is damaged due to invasion of the dust, and the normal work is influenced; in addition, the ceramic wafer is fragile in texture, so that the ceramic wafer can be damaged when being installed, the production cost is improved, and the normal working efficiency is influenced.
Therefore, the ultrasonic piezoelectric ceramic sheet with good protection effect needs to be provided.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
In order to overcome the above-mentioned drawbacks of the prior art, embodiments of the present invention provide an ultrasonic piezoelectric ceramic sheet, by the silver layer fixedly arranged on the top of the positive electrode piezoelectric piece and the negative electrode piezoelectric piece, thereby greatly increasing the conductive efficiency inside the device, in addition, the protective groove is arranged inside the shell component outside the ceramic chip, and the rubber is filled inside the protective groove, on one hand, the cut-off inside the ceramic chip can be prevented from being led to the outside, thereby avoiding the occurrence of safety accidents, on the other hand, the rubber layer can play a role of protecting internal devices due to the characteristics of the rubber layer, and the first wiring groove and the second wiring groove are arranged in the middle of the two ends of the ceramic chip outer shell component, thereby can avoid inside dust to cause the damage to it to improve wiring mouthful fail safe nature, then increased the life of device, in order to solve the problem that proposes among the above-mentioned background art.
(II) technical scheme
In order to achieve the above object, the utility model provides a following technical scheme: ultrasonic wave piezoceramics piece, including the potsherd body, the potsherd body includes potsherd internal arrangement subassembly, the fixed cover in the inner chamber that the outside of potsherd internal arrangement subassembly is located the potsherd body is equipped with potsherd external casing subassembly, first wiring groove and second wiring groove have been seted up at potsherd external casing subassembly's both ends.
In a preferred embodiment, the ceramic chip internal device component includes a piezoelectric ceramic dielectric material, a positive electrode piezoelectric chip is fixedly mounted on the top of the piezoelectric ceramic dielectric material, and a first silver layer is fixedly mounted on the top of the positive electrode piezoelectric chip.
In a preferred embodiment, a negative piezoelectric plate is fixedly mounted on the bottom of the piezoelectric ceramic dielectric material, and a second silver layer is fixedly mounted on the bottom of the negative piezoelectric plate.
In a preferred embodiment, the ceramic chip outer shell assembly comprises an outer shell, a protective groove is formed in the inner cavity of the top of the outer shell, which is located on the ceramic chip outer shell assembly, and an insulating groove is formed in the inner cavity of the top of the protective groove, which is located on the ceramic chip outer shell assembly.
In a preferred embodiment, the inside of the protection groove is filled with rubber, and the inside of the insulation groove is fixedly mounted with ceramic.
In a preferred embodiment, the bottom of the first wiring groove and the bottom of the second wiring groove are positioned at the top of the ceramic chip inner device assembly, and the cable is fixedly connected with the top of the ceramic chip inner device assembly.
In a preferred embodiment, the first wiring slot and the second wiring slot are positioned in the middle of the inner cavity of the ceramic chip outer shell assembly.
(III) advantageous effects
Compared with the prior art, the utility model provides an ultrasonic wave piezoceramics piece possesses following beneficial effect:
1. the utility model discloses a have silver layer at positive pole piezoelectric piece and negative pole piezoelectric piece top fixed mounting to can be very big increase the electric conduction efficiency inside the device, in addition seted up the protection groove outside the ceramic chip inside the casing subassembly, and inside packing has rubber, can prevent on the one hand that the internal current interruption from leading to the external world, thereby avoided the emergence of incident, on the other hand because the characteristic of rubber layer, can play the effect of protection to internal device;
2. the utility model discloses a set up the both ends middle part at the outside casing subassembly of ceramic chip with first wiring groove and second wiring groove to can avoid inside dust to cause the damage to it, thereby improve the fail safe nature of wiring mouth, increase the life of device then.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a schematic sectional view of the present invention.
Fig. 3 is a schematic structural diagram of the assembly of the ceramic chip internal device of the present invention.
Fig. 4 is a schematic structural view of the ceramic plate external housing assembly of the present invention.
The reference signs are: 1. a ceramic wafer body; 2. the ceramic chip internal device component; 21. a piezoelectric ceramic dielectric material; 22. a positive electrode piezoelectric sheet; 23. a first silver layer; 24. a negative electrode piezoelectric sheet; 25. a second silver layer; 3. a ceramic wafer outer housing assembly; 31. an outer housing; 32. a protective groove; 33. an insulating groove; 4. a first wiring groove; 5. a second wire connection slot.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: ultrasonic wave piezoceramics piece, including potsherd body 1, potsherd body 1 includes potsherd internal device subassembly 2, the fixed cover in the inner chamber that potsherd internal device subassembly 2's outside is located potsherd body 1 is equipped with potsherd external housing assembly 3, first wiring groove 4 and second wiring groove 5 have been seted up at potsherd external housing assembly 3's both ends.
The technical means are adopted: the utility model discloses a have silver layer at positive pole piezoelectric piece and negative pole piezoelectric piece top fixed mounting to can be very big increase the electric conduction efficiency inside the device, in addition seted up the protection groove outside the ceramic chip inside the casing subassembly, and inside packing has rubber, can prevent on the one hand that the internal current interruption from leading to the external world, thereby avoided the emergence of incident, on the other hand because the characteristic of rubber layer, can play the effect of protection to internal device; the utility model discloses a set up the both ends middle part at the outside casing subassembly of ceramic chip with first wiring groove and second wiring groove to can avoid inside dust to cause the damage to it, thereby improve the fail safe nature of wiring mouth, increase the life of device then.
Specifically referring to the attached drawing 3 of the specification, the ceramic chip internal device component 2 includes a piezoelectric ceramic dielectric material 21, an anode piezoelectric chip 22 is fixedly mounted on the top of the piezoelectric ceramic dielectric material 21, and a first silver layer 23 is fixedly mounted on the top of the anode piezoelectric chip 22;
specifically referring to the attached drawing 1 of the specification, a negative piezoelectric plate 24 is fixedly mounted at the bottom of the piezoelectric ceramic dielectric material 21, and a second silver layer 25 is fixedly mounted at the bottom of the negative piezoelectric plate 24, so that the piezoelectric ceramic plate can normally work.
Referring to the attached drawing 4 of the specification specifically, the ceramic chip outer shell assembly 3 includes an outer shell 31, a protection groove 32 is formed in the top of the outer shell 31, which is located in the inner cavity of the ceramic chip outer shell assembly 3, and an insulation groove 33 is formed in the top of the protection groove 32, which is located in the inner cavity of the ceramic chip outer shell assembly 3;
referring to the attached figure 4 of the specification, the protection groove 32 is filled with rubber, and the insulation groove 33 is fixedly provided with ceramic inside, so that the service life of the ultrasonic hydraulic ceramic product is prolonged.
With specific reference to the attached drawing 1 of the specification, the bottom of the first wiring groove 4 and the bottom of the second wiring groove 5 are fixedly connected with cables on the top of the ceramic chip internal device assembly 2, and the cables are connected with external devices to enable the ceramic chip internal device assembly to work normally.
With specific reference to the attached drawing 1 of the specification, the first wiring groove 4 and the second wiring groove 5 are located in the middle of the inner cavity of the ceramic chip outer shell component 3, so that dust is prevented from falling into a welding position, and the service life of the ceramic chip outer shell component is prolonged.
During operation, at first install positive electrode piezoelectric patch 22 and negative electrode piezoelectric patch 24 in the both sides of piezoceramics dielectric material 21, the first silver layer 23 of positive electrode piezoelectric patch 22 and the top fixed mounting of negative electrode piezoelectric patch 24 and second silver layer 25 simultaneously, then pack potsherd internal device subassembly 2 into potsherd outside casing subassembly 3 inner chamber, connect the cable respectively at the top of positive electrode piezoelectric patch 22 and negative electrode piezoelectric patch 24 through first wiring groove 4 and second wiring groove 5 again, locate the welding point in the inner chamber of first wiring groove 4 and second wiring groove 5 again, thereby reached and avoided the dust to fall into inside effect, thereby its life has been increased.
The points to be finally explained are: first, in the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounted," "connected," and "connected" should be understood broadly, and may be a mechanical connection or an electrical connection, or a communication between two elements, and may be a direct connection, and "upper," "lower," "left," and "right" are only used to indicate a relative positional relationship, and when the absolute position of the object to be described is changed, the relative positional relationship may be changed;
secondly, the method comprises the following steps: in the drawings of the disclosed embodiments of the present invention, only the structures related to the disclosed embodiments are referred to, and other structures can refer to the common design, and under the condition of no conflict, the same embodiment and different embodiments of the present invention can be combined with each other;
and finally: the above description is only for the preferred embodiment of the present invention and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. Ultrasonic wave piezoceramics piece, including ceramic wafer body (1), its characterized in that: the ceramic chip comprises a ceramic chip body (1) and is characterized in that the ceramic chip body (1) comprises a ceramic chip internal device component (2), a ceramic chip external shell component (3) is fixedly sleeved in an inner cavity of the ceramic chip body (1) outside the ceramic chip internal device component (2), and a first wiring groove (4) and a second wiring groove (5) are formed in two ends of the ceramic chip external shell component (3).
2. The ultrasonic piezoceramic sheet according to claim 1, wherein: the ceramic chip internal device component (2) comprises a piezoelectric ceramic dielectric material (21), an anode piezoelectric sheet (22) is fixedly mounted at the top of the piezoelectric ceramic dielectric material (21), and a first silver layer (23) is fixedly mounted at the top of the anode piezoelectric sheet (22).
3. The ultrasonic piezoceramic sheet according to claim 2, wherein: the bottom of the piezoelectric ceramic dielectric material (21) is fixedly provided with a negative piezoelectric sheet (24), and the bottom of the negative piezoelectric sheet (24) is fixedly provided with a second silver layer (25).
4. The ultrasonic piezoceramic sheet according to claim 1, wherein: the ceramic chip outer shell component (3) comprises an outer shell (31), a protection groove (32) is formed in an inner cavity, located at the top of the outer shell (31), of the ceramic chip outer shell component (3), and an insulation groove (33) is formed in an inner cavity, located at the top of the protection groove (32), of the ceramic chip outer shell component (3).
5. The ultrasonic piezoceramic sheet according to claim 4, wherein: rubber is filled in the protection groove (32), and ceramic is fixedly mounted in the insulation groove (33).
6. The ultrasonic piezoceramic sheet according to claim 1, wherein: the bottom of the first wiring groove (4) and the bottom of the second wiring groove (5) are positioned at the top of the ceramic chip internal device assembly (2) and are fixedly connected with cables.
7. The ultrasonic piezoceramic sheet according to claim 1, wherein: the first wiring groove (4) and the second wiring groove (5) are located in the middle of an inner cavity of the ceramic chip outer shell component (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921805904.6U CN210847050U (en) | 2019-10-25 | 2019-10-25 | Ultrasonic piezoelectric ceramic piece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921805904.6U CN210847050U (en) | 2019-10-25 | 2019-10-25 | Ultrasonic piezoelectric ceramic piece |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210847050U true CN210847050U (en) | 2020-06-26 |
Family
ID=71301526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921805904.6U Expired - Fee Related CN210847050U (en) | 2019-10-25 | 2019-10-25 | Ultrasonic piezoelectric ceramic piece |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210847050U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112097124A (en) * | 2020-08-31 | 2020-12-18 | 中国南方电网有限责任公司超高压输电公司天生桥局 | Novel infrasonic wave sensor that structure is strengthened |
-
2019
- 2019-10-25 CN CN201921805904.6U patent/CN210847050U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112097124A (en) * | 2020-08-31 | 2020-12-18 | 中国南方电网有限责任公司超高压输电公司天生桥局 | Novel infrasonic wave sensor that structure is strengthened |
| CN112097124B (en) * | 2020-08-31 | 2022-07-08 | 中国南方电网有限责任公司超高压输电公司天生桥局 | Novel infrasonic wave sensor that structure is strengthened |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106207285B (en) | Battery component and smart machine | |
| EP3291328A1 (en) | Electrochemical secondary battery having inbuilt charging circuit | |
| US20120199958A1 (en) | Method of manufacturing high frequency module and high frequency module | |
| JP2002050808A (en) | Hall element unit, capacitor unit, and method for manufacturing hall element and capacitor units | |
| CN101005127A (en) | Winding type battery | |
| CN210847050U (en) | Ultrasonic piezoelectric ceramic piece | |
| US20230021432A1 (en) | Chip package assembly, electronic device, and preparation method of chip package assembly | |
| CN211056708U (en) | Silicon microphone packaging structure | |
| CN105047834A (en) | Negative electrode sealing body of secondary battery | |
| CN210112277U (en) | Silicon microphone packaging structure | |
| TW201327877A (en) | Preventing charge buildup in PV module backsheet metal foil vapor barriers | |
| KR101093894B1 (en) | Secondary Battery | |
| CN1288269A (en) | Breaking-down type pressure testing device, chargeable cell and portable electronic device therewith | |
| CN212380482U (en) | Button cell | |
| US20170338450A1 (en) | Secondary electrochemical battery sealing body with charging indicator | |
| CN112705448A (en) | Ultrasonic piezoelectric ceramic piece | |
| CN216626052U (en) | Microphone structure, packaging structure and electronic equipment | |
| CN210847048U (en) | Piezoelectric ceramic ring silver layer protection device of ultrasonic transducer | |
| CN213277813U (en) | Cylindrical three-phase reactive compensation capacitor with built-in temperature switch | |
| CN216648080U (en) | Capacitor packaging structure | |
| CN2836245Y (en) | Cell output terminal structure | |
| KR20150112959A (en) | Button cell, in particular for a tire pressure sensor | |
| KR101384930B1 (en) | Protection circuit module and secondary battery using the same | |
| CN114006091A (en) | Button cell | |
| CN206947319U (en) | A kind of high-power Transient Voltage Suppressor structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 214000 nanhu road, Binhu street, Binhu District, Jiangsu, Wuxi Patentee after: Wuxi Lishifa Technology Co.,Ltd. Address before: 214000 nanhu road, Binhu street, Binhu District, Jiangsu, Wuxi Patentee before: Wuxi Lishifa Machinery Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200626 |