CN217849630U - Microphone assembly and electronic equipment - Google Patents
Microphone assembly and electronic equipment Download PDFInfo
- Publication number
- CN217849630U CN217849630U CN202221765452.5U CN202221765452U CN217849630U CN 217849630 U CN217849630 U CN 217849630U CN 202221765452 U CN202221765452 U CN 202221765452U CN 217849630 U CN217849630 U CN 217849630U
- Authority
- CN
- China
- Prior art keywords
- electrode
- substrate
- sound hole
- sound
- microphone assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The utility model discloses a microphone subassembly and electronic equipment. The microphone assembly includes a substrate, an acoustic-electric conversion element, and a housing on one side of the substrate; the substrate is provided with a sound hole which penetrates through the substrate in the thickness direction, the shell is fixedly connected with the substrate to form a cavity, and the sound-electricity conversion element is positioned in the cavity; wherein, on a plane perpendicular to the axis of the sound hole, a projection of the sound wave sensing area of the acoustoelectric conversion element at least partially overlaps with a projection of the sound hole, and an electrode structure is arranged on a partial area of the inner wall of the sound hole, the electrode structure forming an electric field on a sound wave path inside the sound hole. The utility model discloses be provided with electrode structure on the subregion of sound hole inner wall, electrode structure is in form the electric field on the sound wave route in the sound hole to electrode structure is part of the metal level of base plate does not influence the circulation of sound hole air current from this on.
Description
Technical Field
The utility model relates to a microphone technical field that prevents dust especially relates to a microphone subassembly and electronic equipment.
Background
In order to prevent the chip inside the microphone from being affected by external powder, particles and moisture, and therefore the service life of the microphone is shortened, under normal conditions, a miniature microphone dust-proof device needs to be designed at a communication position (such as a sound hole) between the inside of the miniature microphone and the outside, the miniature microphone chip is separated from the outside environment through the miniature microphone dust-proof device, and the miniature microphone chip is protected.
In the conventional microphone packaging structure, in order to receive an external sound signal, the packaging structure is generally provided with a through hole, a back cavity of a packaged Micro-Electro-Mechanical System (MEMS for short) is opposite to the through hole of a PCB, the through hole of the PCB is directly communicated with the outside, and foreign matters easily enter the inside of the MEMS through the through hole of the PCB during the packaging process or during the working process of a finished product, so that the performance and reliability of the MEMS are abnormal.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a microphone subassembly and electronic equipment aims at effectively solving present microphone dust screen structure and can increase the damping, leads to the SNR to reduce, and increases conductive polar plate at PCB through-hole lateral wall, and conductive polar plate has certain thickness and can correspondingly reduce the circulation aperture of the gas, and the increase damping leads to the SNR to reduce, increases the technology cost simultaneously.
According to the utility model discloses an aspect, the utility model provides an equipment microphone subassembly, include: a substrate, an acoustic-electric conversion element, and a housing on one side of the substrate; the substrate is provided with an acoustic hole which penetrates through the substrate in the thickness direction, the shell is fixedly connected with the substrate to form a cavity, and the acoustic-electric conversion element is positioned in the cavity; wherein, on a plane perpendicular to the axis of the sound hole, the projection of the sound wave sensing area of the sound-electricity conversion element is at least partially overlapped with the projection of the sound hole, and an electrode structure is arranged on a partial area of the inner wall of the sound hole, and the electrode structure forms an electric field on a sound wave path in the sound hole.
Further, the electrode structure includes at least one first electrode and at least one second electrode electrically isolated from the at least one first electrode and in one-to-one correspondence with the at least one first electrode, and the at least one first electrode and the at least one second electrode are part of a metal layer of the substrate, wherein effective working surfaces of the at least one first electrode and the at least one second electrode are exposed from and flush with an inner wall of the acoustic hole.
Further, the at least one first electrode includes a plurality of first electrodes arranged at intervals in a thickness direction of the substrate and the at least one second electrode includes a plurality of second electrodes arranged at intervals in the thickness direction of the substrate.
Further, the electrode structure includes at least one first electrode and at least one second electrode electrically isolated from and in one-to-one correspondence with the at least one first electrode, and the at least one first electrode and the at least one second electrode are embedded within the substrate, wherein effective working surfaces of the at least one first electrode and the at least one second electrode are exposed from and flush with the inner wall of the acoustic aperture.
Further, the at least one first electrode and the at least one second electrode have an extension length in the axial direction of the sound hole that is smaller than the extension length of the sound hole.
Further, the electrode structure includes at least one first electrode and at least one second electrode electrically isolated from the at least one first electrode and corresponding to one another one to one, and the at least one first electrode and the at least one second electrode are part of a metal layer of the substrate, wherein an effective working portion of the at least one first electrode and the at least one second electrode protrudes into the acoustic hole, and a protruding length of the at least one first electrode and the at least one second electrode is less than a preset threshold value.
Further, on a plane perpendicular to the axis of the sound hole, projections of the parts of the at least one first electrode and the at least one second electrode, which protrude into the sound hole, are both fan-shaped.
Further, the area of the effective working surface of each first electrode is equal to the area of the effective working surface of the corresponding second electrode.
Further, the at least one first electrode plate and the at least one second electrode plate are symmetrically arranged in a one-to-one correspondence manner.
Furthermore, the microphone assembly further comprises a signal processing circuit positioned in the cavity, the signal processing circuit is electrically connected with the sound-electricity conversion element through a first conductive path, and the signal processing circuit is electrically connected with the substrate through a second conductive path.
According to the utility model discloses an on the other hand, the utility model provides an electronic equipment, include the utility model discloses arbitrary embodiment microphone subassembly.
The utility model has the advantages of, the utility model discloses be provided with electrode structure on the subregion of sound hole inner wall, electrode structure is in form the electric field on the sound wave route in the sound hole to electrode structure is the partly of the metal level of base plate does not influence the circulation of sound hole air current from this point on.
Drawings
The technical solution and other advantages of the present invention will become apparent from the following detailed description of the embodiments of the present invention with reference to the accompanying drawings.
Fig. 1 is a schematic structural diagram of a microphone assembly according to a first embodiment of the present invention.
Fig. 2 is a schematic diagram of the operation of the first electrode and the second electrode according to the embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a microphone assembly according to a second embodiment of the present invention.
Fig. 4 is a schematic structural diagram of a microphone assembly according to a third embodiment of the present invention.
Fig. 5 is a top view of an acoustic hole of a microphone assembly according to a third embodiment of the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. It is to be understood that the disclosed embodiments are merely exemplary of the invention, and are not intended to limit the invention to the precise embodiments disclosed. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected" and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; may be mechanically, electrically or may be in communication with each other; they may be directly connected or indirectly connected through intervening media, or may be connected through the use of two elements or the interaction of two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
As shown in fig. 1, it is a schematic structural diagram of a microphone assembly according to an embodiment of the present invention. The equipment mounting bracket includes: a substrate 100, an acoustic-electric conversion element 300, and a case 500.
Illustratively, the housing 500 is located on one side of the substrate 100, the substrate 100 is provided with a sound hole 210 penetrating through the substrate 100 in the thickness direction, the housing 500 is fixedly connected with the substrate 100 to form a cavity, and the acoustoelectric conversion element 300 is located in the cavity. Wherein, on a plane perpendicular to the axis of the sound hole 210, a projection of the sound wave sensing region 310 of the acoustic-electric conversion element 300 at least partially overlaps with the projection of the sound hole 210, and when a sound wave is transmitted from the sound hole 210 to the sound wave sensing region 310 of the acoustic-electric conversion element 300, the larger the overlapping portion is, transmission of the sound wave to the sound wave sensing region 310 of the acoustic-electric conversion element 300 is facilitated.
And an electrode structure 200 is arranged on a partial region of the inner wall of the sound hole 210, and the electrode structure 200 forms an electric field on a sound wave path in the sound hole 210. Referring to fig. 2, for example, the electrode structure 200 may be divided into an electrode structure 200 having a high level as the first electrode 220 and an electrode structure 200 having a low level as the second electrode 230 to form an electric field having a force on the charged substance put therein.
Illustratively, the electrode structure 200 includes at least one first electrode 220 and at least one second electrode 230 electrically isolated from and in one-to-one correspondence with the at least one first electrode 220, and the at least one first electrode 220 and the at least one second electrode 230 are part of a metal layer of the substrate 100, wherein an effective working surface of the at least one first electrode 220 and the at least one second electrode is exposed from and flush with an inner wall of the acoustic hole 210. For example, a plurality of metal layers are generally disposed in the substrate 100, and when the substrate 100 is integrally formed, the corresponding metal layers may be extended to the sound holes 210, in this embodiment, by extending the corresponding metal layers to the sound holes 210, no obstacle is added inside the sound holes 210, and when the sound waves pass through the sound holes 210, the sound waves are not affected and the attenuation degree is minimal.
Illustratively, the at least one first electrode 220 includes a plurality of first electrodes 220 arranged at intervals in a thickness direction of the substrate 100 and the at least one second electrode 230 includes a plurality of second electrodes 230 arranged at intervals in the thickness direction of the substrate 100. In some embodiments, the metal layer in the substrate 100 is generally designed to be thinner, and several metal layers may be disposed as the first electrode 220 and the second electrode 230 as a compensation in order to increase the dust-proof performance.
Illustratively, the effective working surface area of each of the first electrodes 220 is equal to the effective working surface area of the corresponding second electrode 230.
Illustratively, the at least one first electrode 220 plate and the at least one second electrode 230 plate are symmetrically disposed in a one-to-one correspondence.
If there is a non-overlapping corresponding region in the second electrode 230 corresponding to the first electrode 220, the non-overlapping corresponding region will not generate an effective electric field, and thus a part of the surface area will be lost, so that the dust-proof performance will be reduced.
Illustratively, the microphone assembly further comprises a signal processing circuit 400 located within the cavity, the signal processing circuit 400 being electrically connected to the acousto-electric conversion element 300 through a first conductive path, the signal processing circuit (400) being electrically connected to the substrate 100 through a second conductive path.
The first embodiment of the present invention is that the electrode structure 200 is disposed on the partial region of the inner wall of the sound hole 210, the electrode structure 200 forms an electric field on the sound wave path in the sound hole 210, and the electrode structure 200 is a part of the metal layer of the substrate 100, and therefore, the circulation of the air flow of the sound hole 210 is not affected.
As shown in fig. 3, it is a schematic structural diagram of a microphone assembly according to a second embodiment of the present invention. The equipment mounting bracket includes: a substrate 100, an acoustic-electric conversion element 300, and a case 500.
Illustratively, the housing 500 is located on one side of the substrate 100, the substrate 100 is provided with a sound hole 210 penetrating through the substrate 100 in the thickness direction, the housing 500 is fixedly connected with the substrate 100 to form a cavity, and the acoustoelectric conversion element 300 is located in the cavity. Wherein, on a plane perpendicular to the axis of the acoustic hole 210, a projection of the acoustic wave sensing region 310 of the acoustic-electric conversion element 300 at least partially overlaps with the projection of the acoustic hole 210, and when an acoustic wave is transmitted from the acoustic hole 210 to the acoustic wave sensing region 310 of the acoustic-electric conversion element 300, the larger the overlapping portion is, transmission of the acoustic wave to the acoustic wave sensing region 310 of the acoustic-electric conversion element 300 is facilitated.
And an electrode structure 200 is disposed on a partial region of the inner wall of the sound hole 210, and the electrode structure 200 forms an electric field on a sound wave path in the sound hole 210. For example, the electrode structure 200 may be divided into an electrode structure 200 having a high level and an electrode structure 200 having a low level to form an electric field having a force on the charged substance put therein.
Illustratively, the electrode structure 200 includes at least one first electrode 220 and at least one second electrode 230 electrically isolated from and in one-to-one correspondence with the at least one first electrode 220, and the at least one first electrode 220 and the at least one second electrode are embedded within the substrate 100, wherein the effective working surfaces of the at least one first electrode 220 and the at least one second electrode are exposed from and flush with the inner wall of the acoustic aperture 210. For example, the electrode structure 200 may be formed by forming the sound hole 210, and then digging a groove on the inner wall of the sound hole 210 to embed the electrode structure 200 in the groove of the inner wall, so that the electrode structure 200 is flush with the inner wall of the sound hole 210, and the electrode structure 200 may form an effective working surface area larger than that of the embodiment, in this embodiment, by extending the corresponding metal layer to the sound hole 210, no obstacle is added inside the sound hole 210, and when the sound wave passes through the sound hole 210, it is not affected at all, and the attenuation degree is minimal.
Illustratively, the at least one first electrode 220 and the at least one second electrode extend less than the extension of the acoustic hole 210 in the axial direction of the acoustic hole 210.
Illustratively, the effective working surface area of each of the first electrodes 220 is equal to the effective working surface area of the corresponding second electrode 230.
Illustratively, the at least one first electrode 220 plate and the at least one second electrode 230 plate are symmetrically disposed in a one-to-one correspondence.
If there is a non-overlapping corresponding region in the second electrode 230 corresponding to the first electrode 220, the non-overlapping corresponding region will not generate an effective electric field, and thus a part of the surface area will be lost, so that the dust-proof performance will be reduced.
Illustratively, the microphone assembly further comprises a signal processing circuit 400 located within the cavity, the signal processing circuit 400 being electrically connected to the acousto-electric conversion element 300 through a first conductive path, the signal processing circuit (400) being electrically connected to the substrate 100 through a second conductive path.
The second embodiment of the present invention is to provide the electrode structure 200 on the partial region of the inner wall of the sound hole 210, the electrode structure 200 forms an electric field on the sound wave path in the sound hole 210, and the electrode structure 200 is a part of the metal layer of the substrate 100, and therefore, the circulation of the air flow of the sound hole 210 is not affected.
As shown in fig. 4, it is a schematic structural diagram of a microphone assembly according to a second embodiment of the present invention. The equipment mounting bracket includes: a substrate 100, an acoustic-electric conversion element 300, and a case 500.
Illustratively, the housing 500 is located on one side of the substrate 100, the substrate 100 is provided with a sound hole 210 penetrating through the substrate 100 in the thickness direction, the housing 500 is fixedly connected with the substrate 100 to form a cavity, and the acoustoelectric conversion element 300 is located in the cavity. Wherein, on a plane perpendicular to the axis of the sound hole 210, a projection of the sound wave sensing region 310 of the acoustic-electric conversion element 300 at least partially overlaps with a projection of the sound hole 210, and when a sound wave is transmitted from the sound hole 210 to the sound wave sensing region 310 of the acoustic-electric conversion element 300, the larger the overlapping portion is, transmission of the sound wave to the sound wave sensing region 310 of the acoustic-electric conversion element 300 is facilitated.
And an electrode structure 200 is disposed on a partial region of the inner wall of the sound hole 210, and the electrode structure 200 forms an electric field on a sound wave path in the sound hole 210. For example, the electrode structure 200 may be divided into an electrode structure 200 having a high level and an electrode structure 200 having a low level to form an electric field having a force on a charged substance put therein.
Illustratively, the electrode structure 200 includes at least one first electrode 220 and at least one second electrode 230 electrically isolated from and in one-to-one correspondence with the at least one first electrode 220, and the at least one first electrode 220 and the at least one second electrode are part of a metal layer of the substrate 100, wherein an effective working portion of the at least one first electrode 220 and the at least one second electrode protrudes into the acoustic aperture 210, and a protruding length of the at least one first electrode 220 and the at least one second electrode is less than a preset threshold. For example, multiple metal layers are generally disposed in the substrate 100, and when the substrate 100 is integrally formed, the corresponding metal layers may extend to the sound hole 210 and protrude out of the inner wall of the sound hole 210 by a length less than a preset threshold. Typically the predetermined threshold is 15mm and the protrusion length is greater than 10mm.
Referring to fig. 5, for example, on a plane perpendicular to the axis of the sound hole 210, projections of the at least one first electrode 220 and the at least one second electrode protruding into the sound hole 210 are each in a fan-shaped ring shape, and the portion of the at least one second electrode protruding into the sound hole 210 is for increasing the absorption area. In some embodiments, the metal layer in the substrate 100 is generally designed to be thinner, and several metal layers may be disposed as the first electrode 220 and the second electrode 230 as a compensation in order to increase the dust-proof performance.
Illustratively, the effective working surface area of each of the first electrodes 220 is equal to the effective working surface area of the corresponding second electrode 230.
Illustratively, the at least one first electrode 220 plate and the at least one second electrode 230 plate are symmetrically disposed in a one-to-one correspondence.
Referring to fig. 2, if there are non-overlapping corresponding regions in the second electrode 230 corresponding to the first electrode 220, the non-overlapping corresponding regions will not generate an effective electric field, so that a portion of the surface area will be lost, and the dust-proof performance will be reduced.
Illustratively, the microphone assembly further comprises a signal processing circuit 400 located within the cavity, the signal processing circuit 400 being electrically connected to the acousto-electric conversion element 300 through a first conductive path, the signal processing circuit (400) being electrically connected to the substrate 100 through a second conductive path.
The third embodiment of the present invention is that the electrode structure 200 is disposed on the partial region of the inner wall of the sound hole 210, the electrode structure 200 forms an electric field on the sound wave path in the sound hole 210, and the electrode structure 200 is a part of the metal layer of the substrate 100, and therefore does not affect the circulation of the air flow of the sound hole 210.
It should be noted that, in the third embodiment, when there are a plurality of first electrodes 220 and a plurality of second electrodes 230, a part of the first electrodes 220 and the second electrodes 230 may extend out of the inner wall of the sound hole 210, and another part of the first electrodes 220 and the second electrodes 230 may be flush with the inner wall of the sound hole 210. Of course, the arrangement is also applicable to the first embodiment, and the first and third embodiments all use the metal layer inside the substrate 100 to fabricate the first electrode 220 and the second electrode 230.
The utility model also provides an electronic equipment, include the utility model discloses arbitrary embodiment microphone subassembly.
In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, so that the scope of the present invention shall be determined by the scope of the appended claims.
Claims (11)
1. A microphone assembly characterized by comprising a substrate (100), an acoustic-electric conversion element (300), and a housing (500) on one side of the substrate (100);
the substrate (100) is provided with a sound hole (210) penetrating through the substrate (100) in the thickness direction, the shell (500) is fixedly connected with the substrate (100) to form a cavity, and the sound-electricity conversion element (300) is positioned in the cavity;
wherein, on a plane perpendicular to the axis of the sound hole (210), the projection of the sound wave sensing area (310) of the sound-electricity conversion element (300) at least partially overlaps the projection of the sound hole (210), and an electrode structure (200) is arranged on a partial area of the inner wall of the sound hole (210), the electrode structure (200) forming an electric field on the sound wave path inside the sound hole (210).
2. The microphone assembly of claim 1, wherein the electrode structure (200) comprises at least one first electrode (220) and at least one second electrode (230) electrically isolated from the at least one first electrode (220) and in one-to-one correspondence, and the at least one first electrode (220) and the at least one second electrode (230) are part of a metal layer of the substrate (100), wherein the effective working surface of the at least one first electrode (220) and the at least one second electrode is exposed from and flush with the inner wall of the acoustic aperture (210).
3. The microphone assembly of claim 2, wherein the at least one first electrode (220) comprises a plurality of first electrodes (220) spaced apart in a thickness direction of the substrate (100) and the at least one second electrode (230) comprises a plurality of second electrodes (230) spaced apart in the thickness direction of the substrate (100).
4. The microphone assembly of claim 1, wherein the electrode structure (200) comprises at least one first electrode (220) and at least one second electrode (230) electrically isolated from and in one-to-one correspondence with the at least one first electrode (220), and the at least one first electrode (220) and the at least one second electrode (230) are embedded within the substrate (100), wherein the effective working surfaces of the at least one first electrode (220) and the at least one second electrode (230) are exposed from and flush with the inner wall of the acoustic aperture (210).
5. The microphone assembly according to claim 4, wherein the at least one first electrode (220) and the at least one second electrode (230) have an extension in the axial direction of the sound hole (210) that is smaller than the extension of the sound hole (210).
6. The microphone assembly according to claim 1, wherein the electrode structure (200) comprises at least one first electrode (220) and at least one second electrode (230) electrically isolated from the at least one first electrode (220) and in one-to-one correspondence, and the at least one first electrode (220) and the at least one second electrode (230) are part of a metal layer of the substrate (100), wherein an active working portion of the at least one first electrode (220) and the at least one second electrode (230) protrudes into the acoustic aperture (210), and the protruding length of the at least one first electrode (220) and the at least one second electrode (230) is smaller than a preset threshold.
7. The microphone assembly of claim 6, wherein the at least one first electrode (220) and the at least one second electrode (230) protrude to the sound hole (210) in a plane perpendicular to the axis of the sound hole
The projections of the parts in the holes (210) are all in fan-shaped ring shapes.
8. The microphone assembly of any of claims 2-7, wherein an area of an effective working surface of each of the first electrodes (220) is equal to an area of an effective working surface of the corresponding second electrode (230).
9. The microphone assembly of claim 8, wherein the at least one first electrode (220) plate and the at least one second electrode (230) plate are symmetrically arranged in a one-to-one correspondence.
10. The microphone assembly of claim 1, further comprising a signal processing circuit (400) located within the cavity, the signal processing circuit (400) being electrically connected to the acousto-electric conversion element (300) by a first conductive path, the signal processing circuit (400) being electrically connected to the substrate (100) by a second conductive path.
11. An electronic device, comprising a microphone assembly as claimed in any one of claims 1-10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221765452.5U CN217849630U (en) | 2022-07-08 | 2022-07-08 | Microphone assembly and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221765452.5U CN217849630U (en) | 2022-07-08 | 2022-07-08 | Microphone assembly and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217849630U true CN217849630U (en) | 2022-11-18 |
Family
ID=84034477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221765452.5U Active CN217849630U (en) | 2022-07-08 | 2022-07-08 | Microphone assembly and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217849630U (en) |
-
2022
- 2022-07-08 CN CN202221765452.5U patent/CN217849630U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4150407B2 (en) | Electroacoustic transducer | |
| US20120008805A1 (en) | Acoustic Transducer Unit | |
| JP2006174005A (en) | Capacitor microphone and its manufacturing method | |
| EP1175123B1 (en) | Electric acoustic converter having a rear surface terminal | |
| CN211056708U (en) | Silicon microphone packaging structure | |
| CN210112277U (en) | Silicon microphone packaging structure | |
| CN217849630U (en) | Microphone assembly and electronic equipment | |
| JP2021027574A (en) | Semiconductor device package and acoustic device including the same | |
| JP2008283312A (en) | Pressure transducer device | |
| CN106102367B (en) | Anti-static module shell and application thereof | |
| CN210112276U (en) | Silicon microphone packaging structure | |
| CN209861104U (en) | Microphone damping device and electronic equipment | |
| KR102339558B1 (en) | Microphone unit | |
| CN216626052U (en) | Microphone structure, packaging structure and electronic equipment | |
| CN216491057U (en) | Microphone structure and electronic equipment | |
| CN215773560U (en) | MEMS microphone, electronic equipment and MEMS device with connector | |
| US6975736B2 (en) | Microphone | |
| WO2022268575A1 (en) | Compact vibration sensor with piezo electric read-out | |
| CN217849678U (en) | Microphone assembly and electronic equipment | |
| US20080310665A1 (en) | Headphone and headset | |
| CN111050238A (en) | Novel microphone packaging structure | |
| CN110856065A (en) | Microphone packaging structure of multisensor | |
| KR20060119278A (en) | Condenser microphone having internal air ventilation system | |
| CN218831992U (en) | Electron cigarette sensing subassembly and electron cigarette | |
| JP2001313215A (en) | Bead core for electronic part |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 201204 floor 3, building 2, No. 200, zhangheng Road, China (Shanghai) pilot Free Trade Zone, Pudong New Area, Shanghai Patentee after: Shanghai Xinyi Chunchang Microelectronics Technology Co.,Ltd. Address before: 215213 nw09-503, No. 99, Jinjihu Avenue, Suzhou Industrial Park, Suzhou, Jiangsu Province Patentee before: Suzhou Xinyi Microelectronics Technology Co.,Ltd. |
|
| CP03 | Change of name, title or address |