CN214477371U - Automatic material receiving and discharging device of die bonder for chip diode - Google Patents
Automatic material receiving and discharging device of die bonder for chip diode Download PDFInfo
- Publication number
- CN214477371U CN214477371U CN202120647794.6U CN202120647794U CN214477371U CN 214477371 U CN214477371 U CN 214477371U CN 202120647794 U CN202120647794 U CN 202120647794U CN 214477371 U CN214477371 U CN 214477371U
- Authority
- CN
- China
- Prior art keywords
- fixedly connected
- case
- upper portion
- automatic material
- box
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Die Bonding (AREA)
Abstract
The utility model discloses a paster diode is with automatic material device that receives and releases of solid brilliant machine, the on-line screen storage device comprises a base, the top fixedly connected with processing case of base, the internally mounted of processing case has material all in one piece mechanism, the left side fixedly connected with discharge mechanism of processing case, the right side fixedly connected with mainframe box of base, control mechanism is installed on the upper portion of mainframe box. The utility model discloses can be through the automatic material device that receives and releases of solid crystal machine for the control mechanism control paster diode, carry out timely arrangement to sending into the raw materials in the automatic material device that receives and releases of solid crystal machine for the paster diode through material all in one piece mechanism, through detection case and ejection of compact case, send out the automatic material device that receives and releases of solid crystal machine for the paster diode with the raw materials that will arrange in order, improve the production work efficiency of paster diode, avoid because do not have special material all in one piece part, lead to the raw materials in disorder, problem that production efficiency is low.
Description
Technical Field
The utility model relates to a technical field of diode production and processing especially relates to a paster diode is with automatic material device that receives and releases of solid brilliant machine.
Background
The chip diode, also called crystal diode, is called diode for short, and in addition, it is an electronic device with unidirectional current conduction, and in the interior of semiconductor diode there are two lead terminals of PN junction, and said electronic device possesses the unidirectional current conduction according to the direction of applied voltage.
The paster diode need unify the arrangement before the production and processing under the general condition and put to in sending into follow-up machine, carry out the contour machining, present mode of putting is mostly the manual work and puts, intensity of labour is big, and the work efficiency of putting is lower, for this reason, we have proposed a paster diode and have received material device with automatic receipts of solid crystal machine and solve above-mentioned problem.
Disclosure of Invention
The utility model aims at solving the defects existing in the prior art and providing an automatic material receiving and discharging device of a die bonder for a chip diode.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a paster diode is with automatic blowing device of receiving and dispatching of solid brilliant machine, the on-line screen storage device comprises a base, the top fixedly connected with processing case of base, the internally mounted of processing case has material all in one piece mechanism, the left side fixedly connected with discharge mechanism of processing case, the right side fixedly connected with mainframe box of base, control mechanism is installed on the upper portion of mainframe box, the workbin is swept to the upper portion right side fixedly connected with of mainframe box, sweep the bottom fixedly connected with pay-off case of workbin, the right side and the pay-off case intercommunication of processing case, the left side and the discharge mechanism intercommunication of processing case.
Preferably, material all in one piece mechanism includes the installation rail of fixed mounting in processing bottom of the case portion, the upper portion sliding connection of installation rail has two whole stub bars, and the equal fixedly connected with blowing pole in top of two whole stub bars, the spread groove has all been seted up to the upper portion inner of two blowing poles, the spread groove internal rotation is connected with the threaded rod.
Preferably, the discharging mechanism comprises a detection box fixedly connected to the left side of the processing box, the upper portion of the detection box is connected with an upper cover through a support rod, a detection plate is fixedly mounted inside the detection box, a detection sensor is fixedly connected to the right side of the upper portion of the detection plate, a discharging box is fixedly connected to the bottom of the detection box, and the bottom of the detection plate is communicated with the discharging box.
Preferably, control mechanism includes the control panel of fixed connection on mainframe box upper portion, control button is installed on the surperficial right side of control panel, the top fixedly connected with control computer of mainframe box, the upper portion right side fixedly connected with warning light of control computer.
Preferably, the surface of the sweeping box is rotatably connected with a plurality of dust blocking belts, and the sweeping box and the feeding box are connected with a feeding conveyor belt together.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the bottom of the raw material fed into the processing box can be placed through the mounting rail by matching the mounting rail, the material arranging head, the discharging rod and the material arranging head, the power is provided by the output shaft of the micro motor, and the raw material is arranged by driving the discharging rod and the material arranging head through the threaded rod, so that the subsequent use is facilitated;
2. through the matching use of the control panel, the display screen, the warning lamp and other components, the working state of the automatic material receiving and discharging device of the die bonder for the chip diode can be displayed in real time, and an operator is reminded of maintaining and using the automatic material receiving and discharging device of the die bonder for the chip diode in time;
to sum up, the utility model discloses can be through the automatic blowing device that receives of solid brilliant machine of control mechanism control paster diode, carry out timely arrangement to sending into the raw materials in the automatic blowing device that receives of solid brilliant machine for paster diode through material all in one piece mechanism, through detection case and ejection of compact case, send out the automatic blowing device that receives of solid brilliant machine for paster diode with the raw materials that will arrange in order, improve the production work efficiency of branded diode, avoid because do not have special material all in one piece part, lead to the raw materials in disorder, problem that production efficiency is low.
Drawings
Fig. 1 is an overall structure diagram of an automatic material receiving and discharging device of a die bonder for a chip diode according to the present invention;
fig. 2 is a structural view of a detection box connecting discharge box of an automatic material receiving and discharging device of a die bonder for a chip diode, which is provided by the utility model;
fig. 3 is a structural view of an opening of a processing box of an automatic material receiving and discharging device of a die bonder for a chip diode, which is provided by the utility model;
fig. 4 is a structural diagram of a material discharging rod and a connecting part of an automatic material receiving and discharging device of a die bonder for a chip diode, which is provided by the utility model;
in the figure: the automatic feeding device comprises a detection box 1, a discharge box 2, a base 3, a processing box 4, a control computer 5, a warning lamp 6, a sweeping box 7, a feeding box 8, a control panel 9, a mainframe box 10, a support rod 11, a detection plate 12, a detection sensor 13, a discharge rod 14, an installation rail 15, a micro motor 16, a material finishing head 17, a connecting groove 18 and a threaded rod 19.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1-4, an automatic material receiving and discharging device of a die bonder for a chip mounter comprises a base 3, a processing box 4 fixedly connected to the top of the base 3, a sweeping box 7 fixedly connected to the right side of the upper portion of a main box 10, a feeding box 8 fixedly connected to the bottom of the sweeping box 7, the right side of the processing box 4 is communicated with the feeding box 8, the left side of the processing box 4 is communicated with a discharging mechanism, a plurality of dust blocking belts are rotatably connected to the surface of the sweeping box 7, a feeding conveying belt is jointly connected to the insides of the sweeping box 7 and the feeding box 8, a matched sweeping mechanism is installed in the sweeping box 7 to scan fed materials, the dust is prevented from entering the automatic material receiving and discharging device of the die bonder for a chip mounter through the dust blocking belts, and the fed materials are classified and returned through the processing box 4.
The utility model discloses in, the right side fixedly connected with mainframe box 10 of base 3, carry out the data processing when paster diode is with the automatic material device that receives and releases of solid crystal machine uses through mainframe box 10, control mechanism is installed on the upper portion of mainframe box 10, control mechanism includes control panel 9 of fixed connection on mainframe box 10 upper portion, carry out the control of the automatic material device that receives and releases of solid crystal machine for paster diode through control panel 9, control button is installed on control panel 9's surperficial right side, the top fixedly connected with control computer 5 of mainframe box 10, carry out the demonstration of the automatic material device data that receives and releases of solid crystal machine for paster diode through control computer 5, upper portion right side fixedly connected with warning lamp 6 of control computer 5, when carrying out paster diode with the automatic material device that receives and releases of solid crystal machine through warning lamp 6, the warning of behavior.
In the utility model, a material arranging mechanism is arranged inside a processing box 4, the material arranging mechanism comprises an installation rail 15 fixedly arranged at the bottom of the processing box 4, the upper part of the installation rail 15 is connected with two material arranging heads 17 in a sliding way, the tops of the two material arranging heads 17 are both fixedly connected with a material discharging rod 14, the inner ends of the upper parts of the two material discharging rods 14 are both provided with a connecting groove 18, the connecting groove 18 is a circular sliding groove arranged on the material discharging rod 14, a threaded rod 19 is rotationally connected in the connecting groove 18, the raw materials fed from the feeding box 8 are limited and contained at two sides through the mounting rails 15, the discharging rod 14 is driven to move through the threaded rod 19, and then the material-finishing head 17 is driven to move, to sending into the raw materials that pile up on the installation rail 15, transversely stir and stir for raw materials on the installation rail 15 becomes the level, carries out the abundant arrangement of raw materials, improves the work efficiency of the automatic material device that receives and releases of solid crystal machine for the paster diode.
The utility model discloses in, the left side fixedly connected with discharge mechanism of processing case 4, discharge mechanism includes fixed connection at the left detection case 1 of processing case 4, the upper portion of detection case 1 is connected with the upper cover through bracing piece 11, the inside fixed mounting of detection case 1 has pick-up plate 12, the upper portion right side fixedly connected with detection sensor 13 of pick-up plate 12, the bottom fixedly connected with discharge box 2 of detection case 1, the bottom of pick-up plate 12 and the setting of discharge box 2 intercommunication, through the pick-up plate 12 in the detection case 1, the arrangement back raw materials that send into detection case 1 through supporting conveyer belt in the processing case 4 are examined, carry out the data proofreading through detection sensor 13, improve the automatic accuracy of receiving and releasing the material device of solid crystal machine for the chip diode.
In the utility model, the automatic material receiving and discharging device of the die bonder for the chip bonding diode is used, the automatic material receiving and discharging device of the die bonder for the chip bonding diode is connected with a power supply, the control panel 9 on the surface of the main case 10 controls the starting, the diode raw material to be processed is sent into the material sweeping box 7 through the material feeding conveying belt through the material feeding box 8, after the detection is carried out through the corollary equipment, the diode raw material enters the processing box 4 through the main case 10, the raw material sent in through the corollary conveying equipment is arranged through the mounting rail 15, the threaded rod 19 is driven to rotate through the micro motor 16, and then the discharging rod 14 connected with the threaded rod 19 is driven to horizontally move in the processing box 4, the raw material on the mounting rail 15 is arranged through the discharging rod 14, the material is pushed through the material arranging head 17, the raw material is pushed to be arranged, after the finished raw material is detected through the detection box 1, the matched raw material is sent out from the discharging box 2 through the conveying belt, the machine is convenient to take materials for processing and use in the next step of automatic processing.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (5)
1. The utility model provides a paster diode is with automatic material device that receives and releases of solid brilliant machine, includes base (3), its characterized in that: the top fixedly connected with of base (3) processes case (4), the internally mounted of processing case (4) has material all in one piece mechanism, the left side fixedly connected with discharge mechanism of processing case (4), the right side fixedly connected with mainframe box (10) of base (3), control mechanism is installed on the upper portion of mainframe box (10), workbin (7) are swept to the upper portion right side fixedly connected with of mainframe box (10), sweep bottom fixedly connected with pay-off case (8) of workbin (7), the right side and pay-off case (8) intercommunication of processing case (4), the left side and the discharge mechanism intercommunication of processing case (4).
2. The automatic material receiving and discharging device of the die bonder for the chip diode as claimed in claim 1, wherein: the material arranging mechanism comprises an installation rail (15) fixedly installed at the bottom of the processing box (4), the upper portion of the installation rail (15) is connected with two material arranging heads (17) in a sliding mode, the top of each material arranging head (17) is fixedly connected with a discharging rod (14), the inner ends of the upper portions of the two discharging rods (14) are provided with connecting grooves (18), and threaded rods (19) are rotatably connected in the connecting grooves (18).
3. The automatic material receiving and discharging device of the die bonder for the chip diode as claimed in claim 1, wherein: discharge mechanism includes fixed connection at left detection case (1) of processing case (4), the upper portion of detection case (1) is connected with the upper cover through bracing piece (11), the inside fixed mounting of detection case (1) has pick-up plate (12), the upper portion right side fixedly connected with detection sensor (13) of pick-up plate (12), the bottom fixedly connected with of detection case (1) goes out workbin (2), the bottom and the play workbin (2) intercommunication setting of pick-up plate (12).
4. The automatic material receiving and discharging device of the die bonder for the chip diode as claimed in claim 1, wherein: control mechanism includes control panel (9) of fixed connection on mainframe box (10) upper portion, control button is installed on the surperficial right side of control panel (9), the top fixedly connected with control computer (5) of mainframe box (10), the upper portion right side fixedly connected with warning light (6) of control computer (5).
5. The automatic material receiving and discharging device of the die bonder for the chip diode as claimed in claim 1, wherein: sweep the surperficial rotation of workbin (7) and be connected with a plurality of dust blocking belt, sweep the inside of workbin (7) and pay-off case (8) and be connected with the material loading conveyer belt jointly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120647794.6U CN214477371U (en) | 2021-03-30 | 2021-03-30 | Automatic material receiving and discharging device of die bonder for chip diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120647794.6U CN214477371U (en) | 2021-03-30 | 2021-03-30 | Automatic material receiving and discharging device of die bonder for chip diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214477371U true CN214477371U (en) | 2021-10-22 |
Family
ID=78176291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120647794.6U Active CN214477371U (en) | 2021-03-30 | 2021-03-30 | Automatic material receiving and discharging device of die bonder for chip diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214477371U (en) |
-
2021
- 2021-03-30 CN CN202120647794.6U patent/CN214477371U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110560582A (en) | multi-axis module full-automatic cell casing machine | |
| CN103594733A (en) | Automatic sorting machine for lithium battery cores | |
| CN210504550U (en) | Annular workpiece feeding device | |
| CN217141260U (en) | CSP chip packaging inferior-quality goods sorting equipment | |
| CN114985294A (en) | Full-automatic chip detection equipment | |
| CN203631679U (en) | Automatic sorting machine for lithium cells | |
| CN210586771U (en) | Multi-axis module full-automatic cell casing machine | |
| CN214477371U (en) | Automatic material receiving and discharging device of die bonder for chip diode | |
| CN113878348A (en) | Automatic assembling machine for middle box body of photovoltaic junction box | |
| CN213795153U (en) | Automatic special screw and nut assembling machine | |
| CN210392671U (en) | Direction-dividing device | |
| CN218638945U (en) | Solar cell string arrangement welding device | |
| CN217830819U (en) | Product is quality testing device for standardization | |
| CN213243928U (en) | Automatic RV testing arrangement of photovoltaic module | |
| CN216978322U (en) | Detection light-emitting device for intelligent manufacturing | |
| CN213351937U (en) | Automatic balance mechanism for ground copper parts | |
| CN207964667U (en) | A kind of appearance automatic checkout equipment | |
| CN108539282B (en) | A kind of rectangular cellular li-ion battery test production line | |
| CN112171257A (en) | Automatic special screw and nut assembling machine | |
| CN220432197U (en) | Automatic feeding and discharging device of photovoltaic module repairing machine | |
| CN221473818U (en) | Device for welding positive and negative plates of integrated circuit board battery in batches | |
| CN215390904U (en) | Label outward appearance detection device that can sort | |
| CN110238500A (en) | A kind of opto-electronic device metal shell automatic soldering device | |
| CN221612883U (en) | Compound fertilizer production compounding check out test set | |
| CN212525027U (en) | NG buffer memory connection platform |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |