CN214474812U

CN214474812U - High-speed data processing device based on FPGA

Info

Publication number: CN214474812U
Application number: CN202120684062.4U
Authority: CN
Inventors: 唐春晖; 尤文杰
Original assignee: Wuxi Xiaosuan Technology Co ltd
Current assignee: Wuxi Xiaosuan Technology Co ltd
Priority date: 2021-04-02
Filing date: 2021-04-02
Publication date: 2021-10-22
Anticipated expiration: 2031-04-02

Abstract

The utility model discloses a high-speed data processing apparatus based on FPGA, relate to electronic information technical field, including management module, PCIE bridging module, storage module, external interface module, alarm module, temperature management module, PCIE bus interface module, a plurality of FPGA operation module and a plurality of storage module that are connected with a plurality of FPGA operation module, power module, heat dissipation module, work through each module provides one kind and calculates with higher speed than, low-power consumption, low cost, the framework is changeable, the wide high-speed data processing apparatus based on FPGA of application range, realize that various business data handle at a high speed, satisfy the application demand that internet big data and high performance data handle, temperature management module and heat dissipation device protection components and parts, in order to avoid the device to damage.

Description

High-speed data processing device based on FPGA

Technical Field

The utility model belongs to the technical field of the information technology and specifically relates to a high-speed data processing apparatus based on FPGA is related to.

Background

With the rise of big data, various applications put forward high requirements on the transmission and storage of high-speed large-capacity data, and aiming at the problems that the current mainstream PC has weak computing capability and cannot meet the processing requirements of various service data, a high-speed data processing device based on FPGA with higher computing acceleration ratio, low power consumption, low cost, variable architecture and wide application range is needed.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a high-speed data processing device based on FPGA to traditional mainstream PC operational capability is weak in solving the background art, can not satisfy the problem of various business data processing demands.

The utility model provides a high-speed data processing device based on FPGA, which comprises a management module, a PCIE bridging module, a storage module, an external interface module, an alarm module, a temperature management module, a PCIE bus interface module, a plurality of FPGA operation modules, and a plurality of storage modules, a power supply module and a heat dissipation module which are connected with the FPGA operation modules, wherein the PCIE bridging module is connected with the PCIE bus interface module, the management module is connected with the FPGA operation modules through a data bus, the management module is used for managing and controlling data transmission and time sequence control between the PCIE bridging module and the FPGA operation modules, the storage module is connected with the management module, the FPGA operation modules are connected with the PCIE bridging module, each FPGA operation module is respectively connected with a DDR storage module, the LED alarm module, the temperature management module and the external interface module are all connected with the management module, the power module is used for supplying power to the device for operation, and the heat dissipation module adopts a passive heat dissipation mode or an active heat dissipation mode.

Further, the PCIE bridge module selects a model PEX8311 bridge chip.

Furthermore, the management module selects a CPLD chip or a ZYNQ management chip.

Furthermore, the FPGA operation module selects Xilinx or Altera series FPGA chips.

Furthermore, the temperature management module is composed of a receiving unit, a display unit, a processing unit and a feedback unit.

Furthermore, the heat dissipation module is composed of a receiving unit, a processing unit and a feedback unit.

Compared with the prior art, the beneficial effects of the utility model reside in that:

the high-speed data processing device based on the FPGA with higher calculation acceleration ratio, low power consumption, low cost, variable structure and wide application range is provided through the work of each module, the high-speed processing of various service data is realized, the application requirements of internet big data and high-performance data processing are met, the temperature management module and the heat dissipation module are used for dissipating heat of a data processing device body and dissipating heat of air in a computer box body, the temperature management module can correspondingly adjust the heat dissipation efficiency according to the change condition of the internal temperature of the computer data processing device, when the internal temperature of the computer exceeds the normal working temperature range, the heat dissipation module is started to work, under the control of the heat dissipation module control device, if the internal temperature of the computer is in a gradually rising trend, the heat dissipation efficiency of the heat dissipation module in the computer is increased, and if the internal temperature of the computer is in a gradually falling trend, the heat dissipation efficiency of the heat dissipation module in the computer is reduced, and finishing the temperature monitoring and heat dissipation operation.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a module connection diagram of the present invention.

Detailed Description

The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention.

The components of the embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention.

Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The utility model provides a high-speed data processing apparatus based on FPGA includes management module, PCIE bridging module, storage module, external interface module, alarm module, temperature management module, PCIE bus interface module, a plurality of FPGA operation module and a plurality of storage module that are connected with a plurality of FPGA operation module, power module, heat dissipation module, work through each module provides one kind and calculates with higher speed than, low-power consumption, low cost, the framework is changeable, wide application range's high-speed data processing apparatus based on FPGA realizes various business data high-speed processing, satisfy the application demand of internet big data and high performance data processing.

Specifically, the PCIE bridge module selects PEX8311 or other bridge chips to connect the PCIE bus interface module, and may convert the PCIE bus interface into a local parallel bus interface.

Specifically, the management module selects a CPLD chip or a ZYNQ management chip, is interconnected with a plurality of FPGA operation modules through a data bus, and is used for initializing the FPGA operation modules and managing and controlling data transmission and time sequence control between the PCIE bridging module and the FPGA operation modules, so that data is accurately transmitted to a specified address for processing and a result is returned; the storage module is connected with the management module, and the FLASH storage module is used for storing a bootstrap program and configuring initialization configuration information of the pins of the FPGA chip and the like.

Specifically, the DDR memory module is a high-speed high-capacity cache and is used for realizing dynamic storage of codes and data; the FPGA operation module selects Xilinx or Altera series FPGA chips and is connected with the PCIE bridging module, the FPGA operation module executes an operation program according to received data to complete data operation, and an operation result is transmitted to an upper computer through the PCIE bridging module; each FPGA operation module is connected with 1 DDR storage module and used for storing and reading original data and intermediate operation data.

Specifically, the LED alarm module, the temperature management module and the external interface module are all connected with the management module and are respectively used for alarm reminding of an indicator lamp when the state of the board card changes, power-off or configuration management of the board card is carried out when the temperature changes, and the external interface is used for receiving external data; the power supply module is used for supplying power to the whole device; the heat dissipation module adopts a passive heat dissipation mode or an active heat dissipation mode and is used for cooling the device so as to avoid damaging components of the device.

Specifically, the temperature management module is composed of a receiving unit, a display unit, a processing unit and a feedback unit. The heat dissipation module is composed of a receiving unit, a processing unit and a feedback unit, the temperature management module and the heat dissipation module are used for dissipating heat of the data processing device body and dissipating heat of air in the computer box body, the temperature management module can correspondingly adjust the heat dissipation efficiency according to the change condition of the internal temperature of the computer data processing device, when the temperature in the computer exceeds the normal working temperature range, the heat dissipation module is started to work, under the control of the heat dissipation module control device, if the temperature in the computer is in a gradually rising trend, the heat dissipation efficiency of the heat dissipation module in the computer is increased, and if the temperature in the computer is in a gradually falling trend, the heat dissipation efficiency of the heat dissipation module in the computer is reduced, and the temperature monitoring and heat dissipation operations are completed.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.

Claims

1. The high-speed data processing device based on the FPGA is characterized by comprising a management module, a PCIE bridging module, a storage module, an external interface module, an alarm module, a temperature management module, a PCIE bus interface module, a plurality of FPGA operation modules, a plurality of storage modules, a power supply module and a heat dissipation module, wherein the storage modules, the power supply module and the heat dissipation module are connected with the FPGA operation modules, the PCIE bridging module is connected with the PCIE bus interface module, the management module is mutually connected with the FPGA operation modules through a data bus, the management module is used for managing and controlling data transmission and time sequence control between the PCIE bridging module and the FPGA operation modules, the storage module is connected with the management module, the FPGA operation modules are connected with the PCIE bridging module, each FPGA operation module is respectively connected with a DDR storage module, the high-speed data processing device further comprises an LED alarm module, the temperature management module, the storage module, the external interface module, the alarm module, the power supply module and the heat dissipation module, and the PCIE bus interface module are connected with the management module, and the management module, The external interface modules are all connected with the management module, the power supply module is used for power supply operation of the device, and the heat dissipation module adopts a passive heat dissipation mode or an active heat dissipation mode.

2. The FPGA-based high-speed data processing device of claim 1, wherein the PCIE bridge module is a PEX8311 bridge chip.

3. The FPGA-based high-speed data processing device of claim 1, wherein the management module is a CPLD chip or a ZYNQ management chip.

4. The FPGA-based high-speed data processing device of claim 1, wherein the FPGA arithmetic module is selected from Xilinx or Altera FPGA chips.

5. The FPGA-based high-speed data processing device of claim 1, wherein the temperature management module comprises a receiving unit, a display unit, a processing unit and a feedback unit.

6. The FPGA-based high-speed data processing device of claim 1, wherein the heat dissipation module comprises a receiving unit, a processing unit and a feedback unit.