CN204719664U - Memory bar, mainboard and system - Google Patents
Memory bar, mainboard and system Download PDFInfo
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- CN204719664U CN204719664U CN201520440581.0U CN201520440581U CN204719664U CN 204719664 U CN204719664 U CN 204719664U CN 201520440581 U CN201520440581 U CN 201520440581U CN 204719664 U CN204719664 U CN 204719664U
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Abstract
The utility model provides a kind of memory bar, mainboard and system.This memory bar comprises: storage chip, register die, temperature detecting element and splicing ear; Memory bar is connected to mainboard by splicing ear, and temperature detecting element is connected with storage chip, register die respectively, and register die is connected with splicing ear; Storage chip storage inputs to the data of memory bar; Temperature detecting element, by the connection with storage chip, detects the temperature of storage chip, and by temperature being stored to register die with the connection of register die; Register die storing temperature, reads for mainboard.Memory bar of the present utility model, independently can detect the temperature of self, thus providing the temperature foundation of memory bar for mainboard adjustment memory bar frequency of operation, the situation avoiding the system instability caused because memory bar is too high or too low for temperature occurs, and improves the stability of system.
Description
Technical field
The utility model relates to the communication technology, particularly relates to a kind of memory bar, mainboard and system.
Background technology
Memory bar is as the important component of computer equipment or server, and can memory bar normally work and decide the serviceability of computing equipment or server.Usually, along with the rising of memory bar frequency of operation, its heat distributed can increase, and causes memory bar temperature to rise, if radiating treatment is bad, this causes certain influence to the performance of internal memory, even can cause blue screen, the serious consequences such as machine of delaying.
Therefore, the temperature how obtaining memory bar is beneficial to the stable of system, becomes technical matters urgently to be resolved hurrily at present.
Utility model content
The utility model provides a kind of memory bar, mainboard and system, solves the technical matters of the memory bar system instability caused too high or too low for temperature.
First aspect, the utility model provides a kind of memory bar, comprising: storage chip, register die, temperature detecting element and splicing ear; Described memory bar is connected to mainboard by described splicing ear, and described temperature detecting element is connected with described storage chip, described register die respectively, and described register die is connected with described splicing ear;
Described storage chip storage inputs to the data of described memory bar;
Described temperature detecting element, by the connection with described storage chip, detects the temperature of described storage chip, and by described temperature being stored to described register die with the connection of described register die;
Described register die stores described temperature, reads for described mainboard.
In conjunction with first aspect, in the first possible embodiment of first aspect, described splicing ear is golden finger.
In conjunction with the first possible embodiment of first aspect or first aspect, in the embodiment that the second of first aspect is possible, described temperature detecting element comprises at least one in the PN junction of temperature sensor, hot coupling silk, semiconductor;
When described temperature detecting element is described hot coupling silk, described memory bar also comprises the chip for detecting described hot coupling silk temperature variation, and the described chip for detecting described hot coupling silk temperature variation is connected with described register die;
When described temperature detecting element is the PN junction of described semiconductor, described memory bar also comprises the chip for detecting described PN junction temperature variation, and the described chip for detecting described PN junction temperature variation is connected with described register die.
In conjunction with the first possible embodiment of first aspect or first aspect, in the third possible embodiment of first aspect, described register die is connected with described splicing ear by System Management Bus SMBUS.
Second aspect, the utility model provides a kind of mainboard, comprise Memory Controller Hub, platform courses maincenter PCH, memory bank, described Memory Controller Hub is connected with described PCH, described PCH is connected with described memory bank, also comprise: the memory bar described in first aspect to any one in the third possible embodiment of first aspect, described memory bar is connected with described memory bank.
The third aspect, the utility model provides a kind of system, comprises power-supply device, also comprises the mainboard described in second aspect.
The memory bar that the utility model provides, mainboard and system, by the temperature of temperature detecting element detecting storage chip, and detected temperature is stored to register die, for the temperature that mainboard is detected from described register die reading temperature detecting element, thus be convenient to Memory Controller Hub on the mainboard memory bar frequency of operation current according to the adjustment that current read temperature is in good time, the running status of memory optimization bar, the i.e. memory bar that provides of the utility model, independently can detect the temperature of self, thus provide the temperature foundation of memory bar for the Memory Controller Hub adjustment memory bar frequency of operation on mainboard, the situation avoiding the system instability caused because memory bar is too high or too low for temperature occurs, improve the stability of system.In addition, the memory bar that the utility model provides, goes for arbitrary mainboard comprising memory bar, and without the need to changing the circuit on mainboard, compatible high, effectively reduce circuit cost.
Accompanying drawing explanation
The structural representation of the memory bar embodiment one that Fig. 1 provides for the utility model;
The structural representation of the mainboard embodiment one that Fig. 2 provides for the utility model;
The structural representation of the system embodiment one that Fig. 3 provides for the utility model;
Reference numeral:
10: memory bar; 101: storage chip; 102: register die;
103: temperature detecting element; 104: splicing ear; 20: mainboard;
201:PCH; 202: Memory Controller Hub; 203: memory bank;
30: system; 301: power-supply device.
Embodiment
The system 30 that the utility model relates to can be arbitrary system comprising memory bar 10, and such as, computer system, server system etc., the utility model does not do other restrictions, as long as this system 30 comprises memory bar 10 to system 30.
The mainboard 20 that the utility model relates to, it can be the mainboard that arbitrary system comprises memory bar 10, such as, the mainboard etc. that computer system comprises the mainboard of memory bar 10, server system comprises memory bar 10, the utility model does not do other restrictions, as long as this mainboard 20 comprises memory bar 10 to mainboard 20.
The structural representation of the memory bar embodiment one that Fig. 1 provides for the utility model.As shown in Figure 1, this memory bar 10 comprises: storage chip 101, register die 102, temperature detecting element 103 and splicing ear 104; Described memory bar 10 is connected to mainboard 20 by described splicing ear 104; Described temperature detecting element 103 is connected with described storage chip 101, described register die 102 respectively, and described register die 102 is connected with described splicing ear 104.Wherein, described storage chip 101 stores the data inputing to described memory bar 10; Described temperature detecting element 103, by the connection with described storage chip 101, detects the temperature of described storage chip 101, and by described temperature being stored to described register die 102 with the connection of described register die 102; Above-mentioned register die 102 stores described temperature, and can be connected by splicing ear 104 and mainboard, reads for the platform courses maincenter 201 (Platform Controller Hub is called for short PCH) on mainboard.
Concrete, the memory bar 10 in the present embodiment, storage chip 101, the register die 102 of its inside are connected with temperature detecting element 103 respectively, and this temperature detecting element 103 is connected with described splicing ear 104.Further, memory bar 10 is connected to the PCH201 on mainboard 20 by splicing ear 104, because Memory Controller Hub 202 (not shown in figure 1) of PCH201 and CPU inside connects, therefore, memory bar 10 is just coupled together by PCH201 and Memory Controller Hub 202.Optionally, above-mentioned splicing ear 104 can be the contact pin pin of common chip, also can be common connection soft board (FlexiblePrinted Circuit, be called for short FPC), as long as can form with mainboard 20 splicing ear 104 be electrically connected, be all applicable to the memory bar 10 in the utility model.
Above-mentioned memory bar 10, the storage chip 101 of its inside can store the data that external unit inputs to memory bar 10, can also store to be output to the data of external unit.Storage chip 101 can coordinate with above-mentioned splicing ear 104, and data are inputed to storage chip 101 by splicing ear 104 by external unit, and access storage chip 101 by splicing ear 104, read the data required for external unit from storage chip 101.Optionally, this storage chip 101 can be a chip, and can be also a groups of memory chips, this groups of memory chips comprises multiple storage chip, to expand memory capacity.
Above-mentioned memory bar 10, the register die 102 of its inside can be data register, can also be other buffer, as long as can the temperature of storage chip 101 that detects of storing temperature detecing element 103.In addition, this register die 102 is also for the running parameter of stored memory bar 10, and the running parameter of this memory bar 10 can comprise the speed, capacity, operating voltage etc. of memory bar 10.It should be noted that, due to memory bar 10 operationally, its power consumption major part concentrates on storage chip 101, along with the rising of memory bar 10 frequency of operation, the heat that storage chip 101 distributes can increase gradually, and therefore the temperature of storage chip 101 just can reflect the temperature of whole memory bar 10.
Above-mentioned memory bar 10, the temperature detecting element 103 of its inside can be temperature sensor, it can be thermistor, can also be other can the device of temperature sensor, as long as this device can be connected with storage chip 101, and be integrated in the inside of memory bar 10.This temperature detecting element 103 can by detecting the temperature of above-mentioned storage chip 101 with the connection of described storage chip 101, and by detected temperature being stored in register die 102 with the connection of register die 102.Optionally, temperature detecting element 103 can the temperature of detecting storage chip 101 in cycle, thus the cycle detected temperature is stored in register die 102; Also can the temperature of aperiodic detecting storage chip 101, thus aperiodic detected temperature is stored in register die 102; Can also the temperature of real-time detecting storage chip 101, thus real-time detected temperature is stored in register die 102;
The detailed process that above-mentioned memory bar 10 controls the temperature of self is as follows: after memory bar 10 is connected with mainboard 20, mainboard 20 works on power, PCH201 in mainboard 20 can read the running parameter of the memory bar 10 in register die 102, this running parameter is transferred to Memory Controller Hub 202, by the duty of Memory Controller Hub 202 set memory bar 10.In the duty of set memory bar 10, after memory bar 10 is started working, the temperature of storage chip 101 detected by temperature detecting element 103, and detected temperature is stored to register die 102, and then PCH201 can read the temperature of the storage chip 101 that the temperature detecting element 103 stored in register die 102 detects, and this temperature is transferred to Memory Controller Hub 202; When Memory Controller Hub 202 judges that this temperature exceedes memory bar 10 maximum operation temperature pre-set time, Memory Controller Hub 202 adjusts memory bar 10 duty now, as reduced the running frequency of internal memory or the measures such as this main memory access of temporarily shutting down, reduce the temperature of memory bar 10, ensure the system stable operation at memory bar 10 place.When this temperature of Memory Controller Hub 202 is lower than memory bar 10 optimum working temperature pre-set time, Memory Controller Hub 202 adjusts and also can adjust memory bar 10 duty now, promoting memory bar 10 work efficiency as promoted running frequency etc., ensureing the stable operation of the system at memory bar 10 place.
The memory bar that the utility model provides, mainboard and system, by the temperature of temperature detecting element detecting storage chip, and detected temperature is stored to register die, for the temperature that mainboard is detected from described register die reading temperature detecting element, thus be convenient to Memory Controller Hub on the mainboard memory bar frequency of operation current according to the adjustment that current read temperature is in good time, the running status of memory optimization bar, the i.e. memory bar that provides of the utility model, independently can detect the temperature of self, thus provide the temperature foundation of memory bar for the Memory Controller Hub adjustment memory bar frequency of operation on mainboard, the situation avoiding the system instability caused because memory bar is too high or too low for temperature occurs, improve the stability of system.In addition, the memory bar that the utility model provides, goes for arbitrary mainboard comprising memory bar, and without the need to changing the circuit on mainboard, compatible high, effectively reduce circuit cost.
Further, the splicing ear 104 in above-mentioned memory bar 10 can be golden finger.
Further, said temperature detecing element 103 can comprise at least one in the PN junction of temperature sensor, hot coupling silk, semiconductor.When said temperature detecing element 103 is hot coupling silk, memory bar 10 also comprises the chip for detecting described hot coupling silk temperature variation, this chip is connected with above-mentioned register die 102, detected temperature to be stored in register die 102, and this chip is integrated in memory bar 10 together with hot coupling silk; When said temperature detecing element 103 is the PN junction of semiconductor, memory bar 10 also comprises the chip for detecting described PN junction temperature variation, this chip is connected with above-mentioned register die 102, detected temperature to be stored in register die 102, and this chip is integrated in memory bar 10 together with the PN junction of semiconductor.
Further, above-mentioned register die 102 can be passed through System Management Bus (SystemManagement BUS, be called for short SMBUS) and is connected with described splicing ear 104.
The memory bar that the utility model provides, mainboard and system, by the temperature of temperature detecting element detecting storage chip, and detected temperature is stored to register die, for the temperature that mainboard is detected from described register die reading temperature detecting element, thus be convenient to Memory Controller Hub on the mainboard memory bar frequency of operation current according to the adjustment that current read temperature is in good time, the running status of memory optimization bar, the i.e. memory bar that provides of the utility model, independently can detect the temperature of self, thus provide the temperature foundation of memory bar for the Memory Controller Hub adjustment memory bar frequency of operation on mainboard, the situation avoiding the system instability caused because memory bar is too high or too low for temperature occurs, improve the stability of system.In addition, the memory bar that the utility model provides, goes for arbitrary mainboard comprising memory bar, and without the need to changing the circuit on mainboard, compatible high, effectively reduce circuit cost.
The structural representation of the mainboard embodiment one that Fig. 2 provides for the utility model.As shown in Figure 2, this mainboard 20 comprises: Memory Controller Hub 202, PCH201, memory bank 203, described Memory Controller Hub 202 is connected with described PCH201, described PCH201 is connected with described memory bank 203, also comprise: the memory bar 10 described in above-described embodiment, described memory bar 10 is connected with described memory bank 203.
Concrete, the memory bank 203 that memory bar 10 can be inserted on mainboard 20 by splicing ear 104 (inserts the reason of memory bank 203 because of memory bar 10 in Fig. 2, therefore splicing ear 104 is not shown), because on mainboard 20, memory bank 203 is connected by SMBUS with the PCH201 on mainboard 20, and the Memory Controller Hub 202 of PCH201 and CPU inside connects, therefore, memory bar 10 is just coupled together by PCH201 and Memory Controller Hub 202.
Insert the memory bank 203 on mainboard 20 when memory bar 10 after, mainboard 20 works on power, PCH201 in mainboard 20 can read register die 102 (because memory bar 10 inserts the reason of memory bank 203 in Fig. 2, therefore register die 102 is not shown) in the running parameter of memory bar 10, this running parameter is transferred to Memory Controller Hub 202, by the duty of Memory Controller Hub 202 set memory bar 10.In the duty of set memory bar 10, after memory bar 10 is started working, temperature detecting element 103 detects the temperature of storage chip 101 (because memory bar 10 inserts the reason of memory bank 203 in Fig. 2, therefore temperature detecting element 103 and storage chip 101 all not shown), and detected temperature is stored to register die 102, and then PCH201 can read the temperature of the storage chip 101 that the temperature detecting element 103 stored in register die 102 detects, and this temperature is transferred to Memory Controller Hub 202; When Memory Controller Hub 202 judges that this temperature exceedes memory bar 10 maximum operation temperature that system 30 pre-sets time, Memory Controller Hub 202 adjusts memory bar 10 duty now, as reduced the running frequency of internal memory or the measures such as this main memory access of temporarily shutting down, reduce the temperature of memory bar 10, ensure system 30 stable operation.When memory bar 10 optimum working temperature that this temperature of Memory Controller Hub 202 pre-sets lower than system 30 time, Memory Controller Hub 202 adjusts and also can adjust memory bar 10 duty now, promoting memory bar 10 work efficiency as promoted running frequency etc., ensureing the stable operation of system 30.
The mainboard that the utility model provides, PCH on mainboard can read the temperature detecting element that register die in memory bar stores the temperature detected, and the Memory Controller Hub detected temperature exported on mainboard, the memory bar frequency of operation current according to the adjustment that current detected temperature is in good time by Memory Controller Hub, the running status of memory optimization bar, thus provide foundation for Memory Controller Hub adjusts memory bar frequency of operation with the temperature controlling memory bar, and then the situation avoiding the system instability caused because memory bar is too high or too low for temperature occurs, improve the stability of system.
The structural representation of the system embodiment one that Fig. 3 provides for the utility model.As shown in Figure 3, this system 30 can comprise the mainboard 20 in power-supply device 301 and above-described embodiment.
After system 30 is powered on by power-supply device 301, each circuit on mainboard 20 is started working, this mainboard 20 can Memory Controller Hub 202, PCH201, memory bank 203, this Memory Controller Hub 202 is connected with described PCH201, described PCH201 is connected with described memory bank 203, this mainboard 20 also comprises the memory bar 10 in above-described embodiment, and described memory bar 10 is connected with the memory bank 203 on mainboard 20.
The temperature of the storage chip 101 that the temperature detecting element 103 that this system 30 reads storage in register die 102 by the PCH201 on mainboard 20 detects is (because memory bar 10 inserts the reason of memory bank 203 in Fig. 3, therefore register die 102, temperature detecting element 103, storage chip 101 are all not shown), and the Memory Controller Hub 202 detected temperature exported on mainboard 20, memory bar 10 frequency of operation current according to the adjustment that current detected temperature is in good time by Memory Controller Hub 202.Detailed process see the description of above-described embodiment, can not repeat them here.
The system that the utility model provides, the situation avoiding the system instability caused because memory bar is too high or too low for temperature occurs, and improves the stability of system.
Last it is noted that above each embodiment is only in order to illustrate the technical solution of the utility model, be not intended to limit; Although be described in detail the utility model with reference to foregoing embodiments, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein some or all of technical characteristic; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the scope of each embodiment technical scheme of the utility model.
Claims (6)
1. a memory bar, is characterized in that, comprising: storage chip, register die, temperature detecting element and splicing ear; Described memory bar is connected to mainboard by described splicing ear, and described temperature detecting element is connected with described storage chip, described register die respectively, and described register die is connected with described splicing ear;
Described storage chip storage inputs to the data of described memory bar;
Described temperature detecting element, by the connection with described storage chip, detects the temperature of described storage chip, and by described temperature being stored to described register die with the connection of described register die;
Described register die stores described temperature, reads for described mainboard.
2. memory bar according to claim 1, is characterized in that, described splicing ear is golden finger.
3. memory bar according to claim 1 and 2, is characterized in that, described temperature detecting element comprises at least one in the PN junction of temperature sensor, hot coupling silk, semiconductor;
When described temperature detecting element is described hot coupling silk, described memory bar also comprises the chip for detecting described hot coupling silk temperature variation, and the described chip for detecting described hot coupling silk temperature variation is connected with described register die;
When described temperature detecting element is the PN junction of described semiconductor, described memory bar also comprises the chip for detecting described PN junction temperature variation, and the described chip for detecting described PN junction temperature variation is connected with described register die.
4. memory bar according to claim 1 and 2, is characterized in that, described register die is connected with described splicing ear by System Management Bus SMBUS.
5. a mainboard, comprise Memory Controller Hub, platform courses maincenter PCH, memory bank, described Memory Controller Hub is connected with described PCH, described PCH is connected with described memory bank, it is characterized in that, also comprise: the memory bar described in claim 1 to any one of claim 4, described memory bar is connected with described memory bank.
6. a system, comprises power-supply device, it is characterized in that, also comprises mainboard according to claim 5.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520440581.0U CN204719664U (en) | 2015-06-24 | 2015-06-24 | Memory bar, mainboard and system |
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| CN201520440581.0U CN204719664U (en) | 2015-06-24 | 2015-06-24 | Memory bar, mainboard and system |
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| CN204719664U true CN204719664U (en) | 2015-10-21 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107885632A (en) * | 2017-12-05 | 2018-04-06 | 中国科学院长春光学精密机械与物理研究所 | A kind of FPGA configurations PROM selective mechanisms method |
| CN109933169A (en) * | 2019-02-21 | 2019-06-25 | 深圳康佳电子科技有限公司 | A kind of chip and radiator detection processing method, system and storage medium |
-
2015
- 2015-06-24 CN CN201520440581.0U patent/CN204719664U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107885632A (en) * | 2017-12-05 | 2018-04-06 | 中国科学院长春光学精密机械与物理研究所 | A kind of FPGA configurations PROM selective mechanisms method |
| CN109933169A (en) * | 2019-02-21 | 2019-06-25 | 深圳康佳电子科技有限公司 | A kind of chip and radiator detection processing method, system and storage medium |
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| C14 | Grant of patent or utility model | ||
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| CP01 | Change in the name or title of a patent holder |
Address after: 100095 Building 2, Longxin Industrial Park, Zhongguancun environmental protection technology demonstration park, Haidian District, Beijing Patentee after: Loongson Zhongke Technology Co.,Ltd. Address before: 100095 Building 2, Longxin Industrial Park, Zhongguancun environmental protection technology demonstration park, Haidian District, Beijing Patentee before: LOONGSON TECHNOLOGY Corp.,Ltd. |
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| CP01 | Change in the name or title of a patent holder |