CN214473541U - 测试探针模块 - Google Patents

测试探针模块 Download PDF

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CN214473541U
CN214473541U CN202120051967.8U CN202120051967U CN214473541U CN 214473541 U CN214473541 U CN 214473541U CN 202120051967 U CN202120051967 U CN 202120051967U CN 214473541 U CN214473541 U CN 214473541U
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刘俊良
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Xinzhuo Technology Zhejiang Co ltd
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Tecat Technologies Suzhou Ltd
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Priority to TW110119927A priority patent/TWI762339B/zh
Priority to US17/364,828 priority patent/US20220221490A1/en
Priority to JP2021002564U priority patent/JP3233937U/ja
Priority to KR2020210002480U priority patent/KR20220001766U/ko
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

本实用新型公开一种测试探针模块。测试探针模块包括电路基板、中介板以及探针组件。中介板耦接于电路基板，中介板包括多个穿孔。探针组件耦接于中介板。探针组件包括多个探针。每一探针的第一端通过每一穿孔电性连接电路基板。每一探针的第二端接触一待测物。中介板与待测物具有相同的材料特性。

Description

测试探针模块
技术领域
本实用新型涉及一种探针卡探测装置，特别是涉及一种测试探针模块。
背景技术
本实用新型提供用于半导体集成电路电特性测试或老化试验测试的测试探针模块，涉及对半导体集成电路晶圆在不同的温度状态下进行探针测试。
首先，在利用探针卡装置这类的精密仪器来测试晶圆时，通常需靠考虑周围环境的条件，例如湿度、压力与温度所造成的影响。举例来说，现有的探针卡装置，在考虑不同的温度条件(高温、低温及室温)下，会针对每一种温度条件而分别采用不同的探针卡装置，造成测试成本太高。
然而，即使如此，一旦温度条件不佳，现有的探针卡装置可能因其结构组件热胀冷缩的情况下造成下针位置的偏移。特别是探针卡一般采用环氧玻璃基板形成，由于环氧玻璃基板和晶圆的热膨胀系数不同，即使常温时调整好位置，温度一变化就会产生偏移。
故，如何通过结构设计的改良，来克服上述的缺陷，已成为该项事业所欲解决的重要课题之一。
实用新型内容
本实用新型所要解决的技术问题在于，针对现有技术的不足提供一种测试探针模块，其包括电路基板、中介板以及探针组件。中介板耦接于电路基板，中介板包括多个穿孔。探针组件耦接于中介板。探针组件包括多个探针。每一探针的第一端通过过穿孔电性连接电路基板。每一探针的第二端露出于中介板的一下表面，以接触一待测物。中介板与待测物具有相同的材料特性。探针的第一端的外径大于探针的第二端的外径；且多个穿孔的数量与多个探针的数量相同。
优选地，探针组件包括悬臂式探针。
优选地，探针组件包括垂直式探针。
优选地，材料特性包括硬度、延展性、导电性或热膨胀系数。
优选地，中介板的组成材料包括氮化硅、氮化铝、碳化硅、氧化锌、氮化镓或砷化镓。
本实用新型的其中一有益效果在于，本实用新型所提供的测试探针模块，其能通过“中介板与待测物具有相同的材料特性”的技术方案，使得中介板与待测物具有相同的热胀冷缩效应，以提升探针下针到待测物上的待测位置的精准度。
前述内容已相当广泛概述本实用新型所公开内容的多个特征和技术优势，以便可能更佳理解接下来所公开内容的实施方式。本领域技术人员应了解，可能很容易将所公开的概念和特定具体实施例利用为基础，以供修改或设计用于执行本实用新型所公开内容的相同目的的其他结构或程序。为使能更进一步了解本实用新型的特征及技术内容，请参阅以下有关本实用新型的详细说明与附图，然而所提供的附图仅用于提供参考与说明，并非用来对本实用新型加以限制。
附图说明
图1为本实用新型第一实施例的测试探针模块的示意图。
图2为本实用新型第二实施例的测试探针模块的示意图。
具体实施方式
以下是通过特定的具体实施例来说明本实用新型所公开有关“测试探针模块”的实施方式，本领域技术人员可由本说明书所公开的内容了解本实用新型的优点与效果。本实用新型可通过其他不同的具体实施例加以施行或应用，本说明书中的各项细节也可基于不同观点与应用，在不悖离本实用新型的构思下进行各种修改与变更。另外，本实用新型的附图仅为简单示意说明，并非依实际尺寸的描绘，事先声明。以下的实施方式将进一步详细说明本实用新型的相关技术内容，但所公开的内容并非用以限制本实用新型的保护范围。
应当可以理解的是，虽然本文中可能会使用到“第一”、“第二”、“第三”等术语来描述各种元件，但这些元件不应受这些术语的限制。这些术语主要是用以区分一元件与另一元件。另外，本文中所使用的术语“或”，应视实际情况可能包括相关联的列出项目中的任一个或者多个的组合。
第一实施例
参阅图1所示，本实用新型第一实施例提供一种测试探针模块Z1，其包括电路基板1、中介板2以及探针组件3。中介板2耦接于电路基板1，中介板2包括多个穿孔20。探针组件3耦接于中介板2。探针组件3包括多个探针31。每一探针31的第一端311通过每一穿孔20电性连接电路基板1。每一探针31的第二端312接触一待测物4。中介板2与待测物4具有相同的材料特性。材料特性包括但不限于硬度、延展性、导电性或热膨胀系数。
具体来说，本实施例的测试探针模块Z1为悬臂式的探针卡探测装置。中介板2的组成材料包括氮化硅、氮化铝、碳化硅、氧化锌、氮化镓或砷化镓。举例来说，若待测物4为受测晶圆，其材料为氮化硅基材，那么中介板2的材料可以是与受测晶圆相同的氮化硅基材。由于探针组件3的多个探针31是直接植于与受测晶圆具有相同材料特性的中介板2上，因此，受测晶圆与中介板2具有相同的热涨冷缩效应。因此，受测晶圆表面的待测位置因为热胀冷缩所造成的偏移量会与多个探针31的下针位置因为热胀冷缩所造成的偏移量相同，进而提升测试探针模块Z1下针的精准度。然而，本实用新型不以上述所举的例子为限。
第二实施例
参阅图2所示，本实用新型第二实施例提供一种测试探针模块Z2，其包括电路基板1、中介板2以及探针组件3。电路基板1为印刷电路板(Printed Circuit Board，PCB)。中介板(Interposer)2耦接于电路基板1，中介板2包括多个穿孔20。探针组件3耦接于中介板2。探针组件3包括多个探针31。每一探针31的第一端311通过每一穿孔20电性连接电路基板1。每一探针31的第二端312接触一待测物4。中介板2与待测物4具有相同的材料特性。材料特性包括但不限于硬度、延展性、导电性或热膨胀系数。每一探针中的第一端311的外径大于第二端312的外径。穿孔20的数量与探针31的数量相同。
具体来说，本实施例的测试探针模块Z2为垂直式的探针卡探测装置。中介板2的组成材料包括氮化硅、氮化铝、碳化硅、氧化锌、氮化镓或砷化镓。举例来说，若待测物4为受测晶圆，其材料为氮化硅基材，那么中介板2的材料可以是与受测晶圆相同的氮化硅基材。由于探针组件3的多个探针31是直接植于与受测晶圆具有相同材料特性的中介板2上，因此，受测晶圆与中介板2具有相同的热涨冷缩效应。因此，受测晶圆表面的待测位置因为热胀冷缩所造成的偏移量会与多个探针31的下针位置因为热胀冷缩所造成的偏移量相同，进而提升测试探针模块Z下针的精准度。然而，本实用新型不以上述所举的例子为限。
实施例的有益效果
本实用新型的其中一有益效果在于，本实用新型的其中一有益效果在于，本实用新型所提供的测试探针模块，其能通过“中介板2的材料特性与待测物4的材料特性相同”的技术方案，使得测试中介板2与待测物4在不同温度下具有相同的热胀冷缩效应，以提升探针31下针到待测物4上的待测位置的精准度。
进一步来说，本实用新型所提供的测试探针模块，可适用于悬臂式探针以及垂直式探针，也就是不受限于探针的设置型态。
以上所公开的内容仅为本实用新型的优选可行实施例，并非因此局限本实用新型的权利要求书的保护范围，所以凡是运用本实用新型说明书及附图内容所做的等效技术变化，均包含于本实用新型的权利要求书的保护范围内。

Claims (5)

1.一种测试探针模块，其特征在于，所述测试探针模块包括：
一电路基板；
一中介板，耦接于所述电路基板，所述中介板包括多个穿孔；以及
一探针组件，包括多个探针，所述探针组件耦接于所述中介板，每一所述探针的第一端通过每一所述穿孔电性连接所述电路基板，所述探针的第二端接触一待测物，其中，所述中介板与所述待测物具有相同的材料特性；
其中所述探针的第一端的外径大于所述探针的第二端的外径；且所述多个穿孔的数量与所述多个探针的数量相同。
2.根据权利要求1所述的测试探针模块，其特征在于，所述探针组件包括悬臂式探针。
3.根据权利要求1所述的测试探针模块，其特征在于，所述探针组件包括垂直式探针。
4.根据权利要求1所述的测试探针模块，其特征在于，所述材料特性包括硬度、延展性、导电性或热膨胀系数。
5.根据权利要求1所述的测试探针模块，其特征在于，所述中介板的组成材料包括氮化硅、氮化铝、碳化硅、氧化锌、氮化镓或砷化镓。
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TW110119927A TWI762339B (zh) 2021-01-08 2021-06-02 測試探針模組
US17/364,828 US20220221490A1 (en) 2021-01-08 2021-06-30 Test probe module
JP2021002564U JP3233937U (ja) 2021-01-08 2021-07-01 測定プローブモジュール
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JP2011043377A (ja) * 2009-08-20 2011-03-03 Tokyo Electron Ltd 検査用接触構造体
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