CN214417128U - Wafer cleaning device - Google Patents
Wafer cleaning device Download PDFInfo
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- CN214417128U CN214417128U CN202120047010.6U CN202120047010U CN214417128U CN 214417128 U CN214417128 U CN 214417128U CN 202120047010 U CN202120047010 U CN 202120047010U CN 214417128 U CN214417128 U CN 214417128U
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- China
- Prior art keywords
- wafer
- cleaning device
- support
- placing table
- set forth
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- 238000004140 cleaning Methods 0.000 title claims abstract description 35
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 46
- 239000007921 spray Substances 0.000 claims description 29
- 229910052757 nitrogen Inorganic materials 0.000 claims description 18
- 238000005507 spraying Methods 0.000 claims description 11
- 229910001873 dinitrogen Inorganic materials 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 10
- 239000003814 drug Substances 0.000 claims description 9
- 230000000694 effects Effects 0.000 abstract description 5
- 239000008187 granular material Substances 0.000 abstract description 3
- 238000005406 washing Methods 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 86
- 239000002923 metal particle Substances 0.000 description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 229940079593 drug Drugs 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model provides a wafer cleaning device, which comprises a placing table, wherein a first supporting component and a second supporting component which are used for fixing a wafer are arranged on the placing table; the first supporting component and the second supporting component are alternately arranged in a telescopic manner along the height direction of the placing table; the first support component is provided with a plurality of first support rods, and the second support component is provided with a plurality of second support rods; and the circumscribed circle connecting the graph formed by the first support rod and the second support rod is concentric with the wafer. The utility model discloses belt cleaning device, especially to the upper and lower two sides of wasing the wafer, have obvious improvement effect than traditional washing control mode, the cleaning performance reduces to below 20ea from present terminal surface granule about 50ea, and not only structural design is simple, easily controls moreover.
Description
Technical Field
The utility model belongs to the technical field of semiconductor silicon chip makes auxiliary assembly, especially, relate to a wafer belt cleaning device.
Background
With the continuous development of large-scale integrated circuits, the requirement on the surface cleanliness of polished wafers is higher and higher, and the cleaning quality of the wafers directly influences geometric parameters and subsequent physicochemical test analysis. At present, when the back of a wafer, namely the surface of the wafer close to one side of a placing table, is cleaned, the technical problem that the surface of the wafer cannot be cleaned completely is caused due to unreasonable structural design of a cleaning and placing device.
SUMMERY OF THE UTILITY MODEL
The utility model provides a wafer belt cleaning device has solved the technical problem that the wafer washs unclean among the prior art.
In order to solve the technical problem, the utility model discloses a technical scheme is:
a wafer cleaning device comprises a placing table, wherein a first supporting assembly and a second supporting assembly which are used for fixing a wafer are arranged on the placing table; the first supporting component and the second supporting component are alternately arranged in a telescopic manner along the height direction of the placing table; the first support component is provided with a plurality of first support rods, and the second support component is provided with a plurality of second support rods; and the circumscribed circle connecting the graph formed by the first support rod and the second support rod is concentric with the wafer.
Preferably, the circumscribed circle connecting the figures formed by the first support rod and the second support rod is the same circle, and the first support rod and the second support rod are arranged along the circumscribed circle in a staggered mode.
Furthermore, the first support rod and the second support rod are the same in telescopic height and are arranged in the direction close to one side of the wafer.
Furthermore, all the first supporting rods and all the second supporting rods respectively move synchronously and are clamped with the outer edge of the wafer.
Furthermore, the number of the first supporting rods is the same as or different from that of the second supporting rods.
Preferably, the number of the first struts is at least 3; the number of the second supporting rods is at least 3.
Furthermore, the first supporting rod and the second supporting rod are uniformly arranged at intervals along the circumference of the circumscribed circle of the first supporting rod and the second supporting rod.
Further, a first spray pipe group and a second spray pipe group which are used for spraying liquid medicine are arranged on the placing table, and the first spray pipe group and the second spray pipe group are symmetrically arranged on two sides of the wafer; the first spray pipe assembly is arranged above the wafer, and the second spray pipe assembly is arranged below the wafer.
Further, the first nozzle group and the second nozzle group are both disposed toward the center of the wafer.
The device further comprises a first nitrogen pipe and a second nitrogen pipe which respectively spray nitrogen to the two sides of the wafer, wherein the first nitrogen pipe and the second nitrogen pipe are arranged on the side surface of the wafer and are at a certain distance from the wafer; and is arranged above the placing table; the first nitrogen pipe sprays air to the upper end face of the wafer, and the second nitrogen pipe sprays air to the lower end face of the wafer.
Adopt the utility model discloses a belt cleaning device especially to the upper and lower two sides of wasing the wafer, has obvious improvement effect than traditional washing control mode, and the cleaning performance reduces to below 20ea from present terminal surface granule about 50ea, and not only structural design is simple, easily controls moreover.
The wafer can be stably controlled to be horizontally arranged and stably placed through the first supporting component and the second supporting component which are alternately arranged, and meanwhile, the two sides of the wafer can be completely covered by liquid medicine while the wafer rotates, and particularly, the positions of the first supporting component and the second supporting component which are fixedly contacted with the wafer in a clamping mode can be completely cleaned; meanwhile, the wafer placed stably is also beneficial to spraying of liquid medicines of the first spray pipe group and the second spray pipe group which are symmetrically arranged up and down and the first nitrogen pipe and the second nitrogen pipe, and finally the purpose of cleaning the two sides is achieved.
Drawings
Fig. 1 is a schematic structural view of a cleaning device according to an embodiment of the present invention;
fig. 2 is a plan view of a cleaning device according to an embodiment of the present invention.
In the figure:
10. placing table 20, first supporting component 30 and second supporting component
40. A first spray pipe group 50, a second spray pipe group 60 and a first nitrogen pipe
70. Nitrogen gas pipe II 80 and wafer
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
The embodiment provides a wafer cleaning device, as shown in fig. 1-2, comprising a rotatable placing table 10, wherein a first supporting component 20 and a second supporting component 20 for fixing a wafer 80 are arranged on the placing table 10; the first support assembly 20 and the second support assembly 30 are both in contact with the outer edge of the wafer 70 and enable the wafer 70 to be horizontally and stably placed, and the first support assembly 20 and the second support assembly 30 are alternately arranged in a telescopic mode along the height direction of the placing table 10; the first support component 20 comprises a plurality of first support rods, and the second support component 30 comprises a plurality of second support rods; the circumscribed circle of the pattern formed by the first connecting support rod and the second connecting support rod is concentric with the wafer 80. The first support assembly 20 and the second support assembly 30 which are alternately arranged can stably control the wafer 80 to be horizontally arranged and stably placed, and simultaneously can ensure that both sides of the wafer 80 are completely covered by the liquid medicine while the wafer 80 rotates on the placing table 10, and particularly, the positions of the first support assembly 20 and the second support assembly 30 which are fixedly contacted with the wafer 80 in a clamping manner can be completely cleaned.
Preferably, the circumscribed circle of the figure formed by the connection supporting rod I and the connection supporting rod II is the same circle, and the connection supporting rod I and the connection supporting rod II are arranged along the circumscribed circle in a staggered mode. The first and second struts have the same extension height and are both arranged in a direction close to one side of the wafer 80.
Further, all the first support rods and all the second support rods respectively move synchronously and are clamped with the outer edge of the wafer 80, the time for alternately clamping the wafers is the same, and the stretching speed is the same. All the first supporting rods and all the second supporting rods penetrate through the placing table 10 and rotate along with the rotation of the placing table 10, when the wafer 80 is placed horizontally by the manipulator sucker, the first supporting rods in the first supporting assembly 20 synchronously ascend and are in contact with the wafer 80, the wafer 80 is stably clamped and fixed, and the wafer is rotated for a certain time; then, the second supporting rod in the second supporting component 30 is controlled to synchronously ascend to be in contact with the wafer 80, the wafer 80 is clamped and fixed, and the first supporting component 20 is withdrawn and rotated for the same time; then, the first support assembly 20 is controlled to ascend to clamp the wafer 80, and the second support assembly 30 is replaced; thus alternately contacting the wafer 80.
Further, the number of the first supporting rods in the first supporting assembly 20 is the same as or different from the number of the second supporting rods in the second supporting assembly 30.
Preferably, the number of the first struts is at least 3; the number of the second supporting rods is at least 3. The first 3 support rods or the second 3 support rods can ensure that the wafer 80 is stably supported and fixed. In the embodiment, the number of the first rotating support rods is 3, the number of the second rotating support rods is 3, and the lowest number of the first rotating support rods and the second rotating support rods are selected to contact with the wafer 80, so that the number of contact points between the first rotating support rods and the wafer 80 is minimized under the condition that the wafer 80 is stably and horizontally placed by the support assemblies of each group, and the cleaning effect on the surface of the wafer 80 is improved.
Furthermore, the first supporting rod and the second supporting rod are uniformly arranged at intervals along the circumference of the circumscribed circle of the first supporting rod and the second supporting rod. In the present embodiment, the first and second support rods have the same structure, and the clamping structure contacting the wafer 80 may be a U-shaped clamp or any other clamping structure, which is a common matching method in the art and is omitted here.
Further, a first spray pipe group 40 and a second spray pipe group 50 for spraying liquid medicine are arranged on the placing table 10, the first spray pipe group 40 and the second spray pipe group 50 are symmetrically arranged on the upper side and the lower side of the wafer 80, namely, the first spray pipe group 40 is fixed and telescopically fixed above the wafer 80 by a frame body, and when liquid spraying is not needed or the wafer 80 is not placed, the frame body drives the first spray pipe group 40 to be away from the placing table 10 and retract to the initial position; avoiding the first frame and nozzle group 40 from interfering with the placement of the wafer 80 when the wafer 80 needs to be placed. The second spraying pipe set 50 penetrates through the placing table 10 and is located below the wafer 80, and the second spraying pipe set 50 can vertically move upwards or retract downwards along the thickness direction of the wafer 80 so as to adjust the spraying effect of the spraying liquid medicine on the wafer 80.
Further, the first nozzle group 40 and the second nozzle group 50 are both disposed toward the center of the wafer 80, that is, the first nozzle group 40 and the second nozzle group 50 both spray the chemical toward the center of the wafer 80. In this embodiment, the first nozzle group 40 and the second nozzle group 50 each include three nozzles, which are a water pipe, an ozone-spraying water pipe, and a hydrofluoric acid pipe, and the three nozzles are disposed in close contact with each other, the ozone water oxidizes a silicon surface layer containing metal particles on the surface of the wafer 80 to form a silicon dioxide oxide loaded with the metal particles, the silicon dioxide oxide loaded with the metal particles is removed by the hydrofluoric acid, so that the metal particles are removed from the surface of the silicon wafer, and the flowing water cleans the surface of the wafer 80, thereby completing the cleaning of the metal particles on the surface of the wafer 80.
Further, in order to accelerate the drying of the surface of the cleaned wafer 80, the cleaning device further comprises a first nitrogen pipe 60 and a second nitrogen pipe 70 which respectively spray nitrogen to the two sides of the wafer 80 so as to rapidly blow the surfaces of the two sides of the wafer 80, and meanwhile, the cleaning device cannot react with the surface of the wafer 80, so that the surface quality of the wafer 80 is ensured.
In the present embodiment, the first nitrogen gas pipe 60 and the second nitrogen gas pipe 70 are disposed on the side surface of the wafer 80 and spaced from the wafer 80 by a predetermined distance; and are all placed above the placing table 10, and in the present embodiment, the first nitrogen gas pipe 60 jets gas toward the upper end face of the wafer 80, and the second nitrogen gas pipe 70 jets gas toward the lower end face of the wafer 80. The nitrogen tube is arranged to further accelerate the drying of the wet wafer 80 surface after cleaning, and the cleaning time is saved.
Adopt the utility model discloses a belt cleaning device especially to the upper and lower two sides of wasing the wafer, has obvious improvement effect than traditional washing control mode, and the cleaning performance reduces to below 20ea from present terminal surface granule about 50ea, and not only structural design is simple, easily controls moreover.
The wafer can be stably controlled to be horizontally arranged and stably placed through the first supporting component and the second supporting component which are alternately arranged, and meanwhile, the two sides of the wafer can be completely covered by liquid medicine while the wafer rotates, and particularly, the positions of the first supporting component and the second supporting component which are fixedly contacted with the wafer in a clamping mode can be completely cleaned; meanwhile, the wafer placed stably is also beneficial to spraying of liquid medicines of the first spray pipe group and the second spray pipe group which are symmetrically arranged up and down and the first nitrogen pipe and the second nitrogen pipe, and finally the purpose of cleaning the two sides is achieved.
The embodiments of the present invention have been described in detail, and the description is only for the preferred embodiments of the present invention, and should not be construed as limiting the scope of the present invention. All the equivalent changes and improvements made according to the application scope of the present invention should still fall within the patent coverage of the present invention.
Claims (10)
1. The wafer cleaning device comprises a placing table, and is characterized in that a first supporting component and a second supporting component which are used for fixing a wafer are arranged on the placing table; the first supporting component and the second supporting component are alternately arranged in a telescopic manner along the height direction of the placing table; the first support component is provided with a plurality of first support rods, and the second support component is provided with a plurality of second support rods; and the circumscribed circle connecting the graph formed by the first support rod and the second support rod is concentric with the wafer.
2. The wafer cleaning device as set forth in claim 1, wherein the circumscribed circles connecting the first and second struts form a pattern are the same circle, and the first and second struts are disposed in a staggered manner along the circumscribed circle.
3. The wafer cleaning device as set forth in claim 1 or 2, wherein the first and second support rods extend and contract at the same height and are disposed in a direction toward one side of the wafer.
4. The wafer cleaning device as set forth in claim 3, wherein all of the first support rods and all of the second support rods move synchronously and are engaged with the outer edge of the wafer.
5. The wafer cleaning device as claimed in any one of claims 1-2 and 4, wherein the number of the first support bars is the same as or different from the number of the second support bars.
6. The wafer cleaning device as set forth in claim 5, wherein the number of the first support rods is at least 3; the number of the second supporting rods is at least 3.
7. The wafer cleaning device as set forth in claim 6, wherein the first support bar and the second support bar are uniformly and alternately arranged along the circumference of the circumscribed circle thereof.
8. The wafer cleaning device as set forth in any one of claims 1-2 and 6-7, further comprising a first spray pipe set and a second spray pipe set for spraying a liquid medicine, which are symmetrically arranged on both sides of the wafer, on the placing table; the first spray pipe set is arranged above the wafer, and the second spray pipe set is arranged below the wafer.
9. The wafer cleaning device as set forth in claim 8, wherein the first nozzle group and the second nozzle group are both disposed toward the center of the wafer.
10. The wafer cleaning apparatus as set forth in claim 9, further comprising a first nitrogen gas pipe and a second nitrogen gas pipe for injecting nitrogen gas to both sides of the wafer, respectively, the first nitrogen gas pipe and the second nitrogen gas pipe being disposed on the side surface of the wafer at a distance from the wafer; and is arranged above the placing table; the first nitrogen pipe sprays air to the upper end face of the wafer, and the second nitrogen pipe sprays air to the lower end face of the wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120047010.6U CN214417128U (en) | 2021-01-08 | 2021-01-08 | Wafer cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120047010.6U CN214417128U (en) | 2021-01-08 | 2021-01-08 | Wafer cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214417128U true CN214417128U (en) | 2021-10-19 |
Family
ID=78055388
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120047010.6U Active CN214417128U (en) | 2021-01-08 | 2021-01-08 | Wafer cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214417128U (en) |
-
2021
- 2021-01-08 CN CN202120047010.6U patent/CN214417128U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 300384 Tianjin Binhai New Area high tech Zone Huayuan Industrial Area (outside the ring) Hai Tai Road 12 inside. Patentee after: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Country or region after: China Patentee after: Zhonghuan Leading Semiconductor Technology Co.,Ltd. Address before: No.12 Haitai East Road, Huayuan Industrial Zone, Binhai New Area, Tianjin Patentee before: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Country or region before: China Patentee before: Zhonghuan leading semiconductor materials Co.,Ltd. |