CN214374463U - MEMS ceramic-based temperature-controllable sensitive core - Google Patents
MEMS ceramic-based temperature-controllable sensitive core Download PDFInfo
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- CN214374463U CN214374463U CN202120572862.7U CN202120572862U CN214374463U CN 214374463 U CN214374463 U CN 214374463U CN 202120572862 U CN202120572862 U CN 202120572862U CN 214374463 U CN214374463 U CN 214374463U
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Abstract
MEMS ceramic base temperature controllable sensitive core belongs to gas sensor technical field, concretely relates to temperature controllable sensitive core. The semiconductor type gas sensor solves the problems that the temperature of the sensitive core of the existing semiconductor type gas sensor is difficult to control, the heating efficiency is low, the power consumption is high and the like. The sensitive unit of the utility model comprises two metal interdigital electrodes; the heating unit comprises a metal resistance line and a bonding pad; the two metal interdigital electrodes are crossed and not contacted with each other, the metal resistance line is wound between the two metal interdigital electrodes, and is wound from one side to the other side of the two metal interdigital electrodes and is not contacted with the metal interdigital electrodes; one ends of the two metal interdigital electrodes and two ends of the metal resistance line are respectively connected with a bonding pad through leads. The utility model relates to a use in the sensitive core of semiconductor gas sensor.
Description
Technical Field
The utility model belongs to the technical field of gas sensor, concretely relates to controllable sensitive core of temperature.
Background
Gas sensors are widely used in many fields, such as atmosphere, closed chamber environment monitoring, smart medical, smart agriculture, smart cities, wearable devices, and the like. The gas sensor has various types and can be divided into the following components according to the principle: optical, electrochemical, semiconductor, etc. The semiconductor type gas sensor has the advantages of high sensitivity, convenience in use, low price and the like, and is most widely applied. The semiconductor type gas sensor mainly adopts materials such as metal oxide, metal sulfide, graphene and the like as sensitive materials of the sensor to sense different types of gas molecules in the environment. The sensitive core body of the semiconductor type gas sensor mostly needs heat, and the gas detection is realized by reaching the working temperature with the most excellent performance.
The semiconductor type gas sensor sensitive core body can be divided into two structural types of an indirectly heated type and a directly heated type. The heating unit and the sensitive unit of the indirectly heated sensitive core are separated, ceramic tubes and heater structures are mostly adopted, and the sensitive core has a complex structure and is difficult to assemble, so that the consistency of products is difficult to ensure. The heating unit and the sensitive unit of the directly-heated sensitive core are integrated on the same sensitive core, the sensitive core has small size, is convenient for coating sensitive materials, has good product consistency, and is the mainstream semiconductor type gas sensor sensitive core structure at present. However, the directly-heated sensitive core body developed at present only has a heating function, and effective detection and control of heating temperature are difficult to realize, so that the stability and accuracy of the working temperature of the sensor are difficult to ensure. In addition, the heating unit and the sensitive unit of the directly-heated sensitive core body are positioned on different planes, so that the heat loss is large, the heating efficiency is reduced, and the power consumption of the sensor is large.
SUMMERY OF THE UTILITY MODEL
The utility model relates to a solve the sensitive core temperature control difficulty of current semiconductor formula gas sensor, heating efficiency low, the high scheduling problem of consumption, provided a controllable sensitive core of MEMS ceramic matrix temperature.
The MEMS ceramic-based temperature-controllable sensitive core body comprises a ceramic substrate, a heating unit and a sensitive unit; the heating unit and the sensitive unit are both arranged on the upper surface of the ceramic substrate;
the sensitive unit comprises two metal interdigital electrodes; the heating unit comprises a metal resistance line and a bonding pad;
the two metal interdigital electrodes comprise main body parts and interdigital parts, the main body parts of the two metal interdigital electrodes are parallel to each other, the interdigital parts are mutually crossed and a gap is reserved;
the metal resistance line is wound from one side of the interdigital part of the metal interdigital electrode to the other side along the gap of the interdigital part; the metal resistance lines are not in contact with the metal interdigital electrodes;
one ends of the two metal interdigital electrodes and two ends of the metal resistance line are respectively connected with a bonding pad through leads.
Furthermore, the metal resistance lines are realized by adopting Pt metal resistance lines.
Furthermore, the two metal interdigital electrodes are realized by adopting Pt metal interdigital electrodes.
Further, the lead and the pad are communicated through the welding paste.
Furthermore, the interdigital parts of the two metal interdigital electrodes, the metal resistance lines and the ceramic substrates corresponding to the interdigital parts are coated with sensitive material layers.
Furthermore, the metal resistance line and the two metal interdigital electrodes are positioned on the same plane.
Heating element adopts the metal resistance lines, and sensitive heating and temperature detection are accomplished simultaneously to the metal resistance lines, realize sensitive core temperature control, and the metal resistance lines is in the coplanar with metal interdigital electrode simultaneously, and Pt metal resistance lines is located Pt interdigital electrode gap department, promotes sensitive core heating efficiency, reduces sensitive core consumption.
Drawings
Fig. 1 is a schematic structural diagram of a heating unit and a sensing unit according to the present invention;
FIG. 2 is a schematic discrete view of the structure of layers;
fig. 3 is a schematic diagram of the product structure.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that, in the present invention, the embodiments and features of the embodiments may be combined with each other without conflict.
The first embodiment is as follows: the following describes the present embodiment with reference to fig. 1 to 3, where the MEMS ceramic-based temperature controllable sensitive core in the present embodiment includes a ceramic substrate, a heating unit and a sensitive unit; the heating unit and the sensitive unit are both arranged on the upper surface of the ceramic substrate;
the sensitive unit comprises two metal interdigital electrodes 1; the heating unit comprises a metal resistance line 2-2 and a bonding pad 2-3;
the two metal interdigital electrodes 1 comprise main body parts and interdigital parts, the main body parts of the two metal interdigital electrodes 1 are mutually parallel, the interdigital parts are mutually crossed and a gap is reserved;
the metal resistance line 2-2 is wound from one side of the interdigital part of the metal interdigital electrode 1 to the other side along the gap of the interdigital part; the metal resistance line 2-2 is not in contact with the metal interdigital electrode 1;
one end of each of the two metal interdigital electrodes 1 and two ends of each of the metal resistance lines 2-2 are respectively connected with a bonding pad 2-3 through a lead.
Metal interdigital electrode include main part and interdigital part, the interdigital of interdigital part is perpendicular with the main part, the main part is the rectangle strip, the width of rectangle strip is greater than the width that every finger of interdigital part indicates.
Further, the metal resistance line 2-2 is implemented by a Pt metal resistance line.
Further, the two metal interdigital electrodes 1 are realized by adopting Pt metal interdigital electrodes.
Further, the leads and the pads 2-3 are communicated through the solder paste.
Furthermore, the interdigital parts of the two metal interdigital electrodes 1, the metal resistance lines 2-2 and the ceramic substrates corresponding to the interdigital parts are coated with sensitive material layers.
Further, the metal resistance line 2-2 and the two metal interdigital electrodes 1 are located on the same plane.
The utility model discloses a Pt metal heating resistor realizes heating and temperature detection dual function, adopts heating unit and the coplane structural design of sensitive unit to promote heating efficiency simultaneously, reduces sensitive core consumption, accomplishes sensitive core preparation through the MEMS technique, realizes that the temperature of sensitive core is controllable, low-power consumption and miniaturization.
The MEMS ceramic-based temperature-controllable sensitive core body is provided with a ceramic substrate, a heating unit and a sensitive unit. The heating unit and the sensitive unit are both arranged on the upper surface of the ceramic substrate. The surface roughness of the ceramic substrate is less than or equal to 0.025 mu m.
The heating unit is a Pt metal resistance line which is communicated with the lead through bonding pads at two ends, so that current and voltage loading of the Pt metal resistance line is realized.
The Pt metal resistance line has a heating function, meanwhile, the temperature of the sensitive core body is detected and controlled through the resistance value change of the Pt metal resistance line, the sensitive unit is a Pt metal interdigital electrode, and the Pt interdigital electrode realizes gas detection through coating a semiconductor sensitive material. Two ends of the Pt interdigital electrode are communicated with the lead through the bonding pads at the two ends, so that sensitive signal transmission is realized.
The Pt metal interdigital electrodes are not in contact and are independent from each other, and the distance between the Pt metal interdigital electrodes is (10-30) mu m;
the Pt metal resistance line is positioned in the gap of the Pt metal interdigital electrode and is positioned on the same plane with the Pt metal interdigital electrode. The resistance value of the Pt metal resistor line is (5-50) omega, the sensitive unit is directly heated, and the heating efficiency is improved.
Although the invention herein has been described with reference to particular embodiments, it is to be understood that these embodiments are merely illustrative of the principles and applications of the present invention. It is therefore to be understood that numerous modifications may be made to the illustrative embodiments and that other arrangements may be devised without departing from the spirit and scope of the present invention as defined by the appended claims. It should be understood that features described in different dependent claims and herein may be combined in ways different from those described in the original claims. It is also to be understood that features described in connection with individual embodiments may be used in other described embodiments.
Claims (6)
- The MEMS ceramic-based temperature-controllable sensitive core is characterized by comprising a ceramic substrate, a heating unit and a sensitive unit; the heating unit and the sensitive unit are both arranged on the upper surface of the ceramic substrate;the sensitive unit comprises two metal interdigital electrodes (1); the heating unit comprises a metal resistance line (2-2) and a bonding pad (2-3);the two metal interdigital electrodes (1) comprise main body parts and interdigital parts, the main body parts of the two metal interdigital electrodes (1) are parallel to each other, the interdigital parts are mutually crossed and a gap is reserved;the metal resistance line (2-2) is wound from one side of the interdigital part of the metal interdigital electrode (1) to the other side along the gap of the interdigital part; the metal resistance lines (2-2) are not in contact with the metal interdigital electrodes (1);one end of each of the two metal interdigital electrodes (1) and the two ends of each of the metal resistance lines (2-2) are respectively connected with a bonding pad (2-3) through a lead.
- 2. The MEMS ceramic-based temperature controlled sensitive core according to claim 1, wherein the metal resistance lines (2-2) are implemented by Pt metal resistance lines.
- 3. The MEMS ceramic-based temperature-controllable sensitive core body according to claim 1, wherein the two metal interdigital electrodes (1) are realized by Pt metal interdigital electrodes.
- 4. The MEMS ceramic-based temperature controlled sensitive core according to claim 1 or 2, wherein the leads and the bonding pads (2-3) are connected by a solder paste.
- 5. The MEMS ceramic-based temperature controllable sensitive core body according to claim 1 or 2, wherein the interdigital parts of the two metal interdigital electrodes (1) and the metal resistance lines (2-2) and the ceramic substrate corresponding to the interdigital parts are coated with a sensitive material layer.
- 6. The MEMS ceramic-based temperature controlled sensitive core according to claim 1 or 2, wherein the metal resistance lines (2-2) and the two metal interdigital electrodes (1) are located on the same plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120572862.7U CN214374463U (en) | 2021-03-19 | 2021-03-19 | MEMS ceramic-based temperature-controllable sensitive core |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202120572862.7U CN214374463U (en) | 2021-03-19 | 2021-03-19 | MEMS ceramic-based temperature-controllable sensitive core |
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| CN214374463U true CN214374463U (en) | 2021-10-08 |
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| CN202120572862.7U Expired - Fee Related CN214374463U (en) | 2021-03-19 | 2021-03-19 | MEMS ceramic-based temperature-controllable sensitive core |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116183682A (en) * | 2023-02-23 | 2023-05-30 | 广州海谷电子科技有限公司 | Patch type VOC sensor and manufacturing method thereof |
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2021
- 2021-03-19 CN CN202120572862.7U patent/CN214374463U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116183682A (en) * | 2023-02-23 | 2023-05-30 | 广州海谷电子科技有限公司 | Patch type VOC sensor and manufacturing method thereof |
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Granted publication date: 20211008 |