CN114777967A - Wide-range flexible pressure sensor and preparation method thereof - Google Patents
Wide-range flexible pressure sensor and preparation method thereof Download PDFInfo
- Publication number
- CN114777967A CN114777967A CN202210335287.8A CN202210335287A CN114777967A CN 114777967 A CN114777967 A CN 114777967A CN 202210335287 A CN202210335287 A CN 202210335287A CN 114777967 A CN114777967 A CN 114777967A
- Authority
- CN
- China
- Prior art keywords
- layer
- flexible
- flexible substrate
- packaging
- pressure sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- 238000005516 engineering process Methods 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 claims description 73
- 238000007639 printing Methods 0.000 claims description 26
- 238000009459 flexible packaging Methods 0.000 claims description 22
- 238000004806 packaging method and process Methods 0.000 claims description 13
- 239000007787 solid Substances 0.000 claims description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- 229920000642 polymer Polymers 0.000 claims description 8
- 238000005245 sintering Methods 0.000 claims description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 6
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 5
- 239000002086 nanomaterial Substances 0.000 claims description 5
- 239000002002 slurry Substances 0.000 claims description 5
- 239000004744 fabric Substances 0.000 claims description 4
- 239000004753 textile Substances 0.000 claims description 4
- 239000002042 Silver nanowire Substances 0.000 claims description 3
- 239000011344 liquid material Substances 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 238000004528 spin coating Methods 0.000 claims description 3
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 2
- 239000003292 glue Substances 0.000 claims 1
- 238000001514 detection method Methods 0.000 abstract description 14
- 230000008447 perception Effects 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000000465 moulding Methods 0.000 abstract description 3
- 239000000654 additive Substances 0.000 abstract description 2
- 230000000996 additive effect Effects 0.000 abstract description 2
- 238000013461 design Methods 0.000 abstract description 2
- 238000010923 batch production Methods 0.000 abstract 1
- 238000001723 curing Methods 0.000 description 14
- 239000000463 material Substances 0.000 description 5
- 239000004205 dimethyl polysiloxane Substances 0.000 description 4
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 4
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 4
- -1 polyethylene naphthalate Polymers 0.000 description 4
- 239000004372 Polyvinyl alcohol Substances 0.000 description 3
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 3
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 229910021389 graphene Inorganic materials 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920006254 polymer film Polymers 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229920000144 PEDOT:PSS Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012994 photoredox catalyst Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/18—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/14—Printing or colouring
- B32B38/145—Printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
- B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
- B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
- H01C17/281—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B2038/0052—Other operations not otherwise provided for
- B32B2038/0076—Curing, vulcanising, cross-linking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/558—Impact strength, toughness
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
Abstract
The invention relates to a wide-range flexible pressure sensor and a preparation method thereof. The invention realizes the pressure enhancement perception detection of the maximum measuring range of 1000N through the design of the hole microstructure and the special bulge structure, and meanwhile, the wide-range flexible device also has good curved/planar conformal attachment detection and better linear output. The flexible additive manufacturing technology is used for integrated molding, so that good adhesion, bonding force and stability among layers are guaranteed, the preparation process is simple, the cost is low, and batch production and preparation are easy.
Description
Technical Field
The invention relates to the technical field of flexible pressure sensor preparation, in particular to a wide-range flexible pressure sensor and a preparation method thereof.
Background
With the rapid development of the flexible sensing technology, the flexible sensing technology is widely applied to the fields of internet of things, intelligent wearing, medical health, consumer electronics, intelligent automobiles, human-computer interaction and the like. In recent years, flexible pressure sensors based on flexible sensing technology have great progress in aspects of sensitivity, hysteresis, thickness and the like, but the pressure detection range of the flexible pressure sensors needs to be further expanded in partial market application scenes, and the maximum detection range of the conventional flexible pressure sensors is about 100N at present, so that the requirements of wide-range application scenes are difficult to meet. In order to solve the challenge, the invention provides a wide-range flexible pressure sensor and a preparation method thereof, aiming at some technical problems existing in the existing flexible pressure sensor preparation technology.
Disclosure of Invention
The technical problem to be solved by the invention is to provide a wide-range flexible pressure sensor and a preparation method thereof, wherein the wide-range flexible pressure sensor has super-strong flexibility and mechanical property, and can realize high-sensitivity pressure detection feedback and pressure enhancement perception detection with the maximum range of 1000N.
The technical scheme adopted by the invention for solving the technical problem is as follows:
a wide range flexible pressure sensor comprising:
the device comprises a lower-layer flexible substrate, a first electrode layer and a second electrode layer, wherein a patterned electrode layer is arranged on the surface of the lower-layer flexible substrate;
the surface of the upper layer flexible substrate is provided with a high-sensitivity resistance sensitive layer;
the flexible packaging structure comprises a lower flexible substrate, an upper flexible substrate, a patterned electrode layer, a flexible packaging layer, a flexible supporting layer and a flexible packaging layer, wherein the flexible supporting layer and the flexible packaging layer are positioned between the lower flexible substrate and the upper flexible substrate, and a gap is formed between the patterned electrode layer and the high-sensitivity resistance sensitive layer;
the elastic support layer is arranged at the patterned electrode gap on the surface of the lower flexible substrate or on the high-sensitivity resistance sensitive layer on the surface of the upper flexible substrate, and the thickness of the elastic support layer is far greater than that of the high-sensitivity resistance sensitive layer;
the flexible packaging layer is used for laminating and packaging an upper flexible substrate and a lower flexible substrate, and the flexible packaging layer is arranged on the periphery of the upper flexible substrate and the lower flexible substrate.
Further, the upper and lower layers of flexible substrates are made of flexible films or elastic textile fabrics.
Furthermore, the patterned electrode layer is formed by printing, sintering and curing silver nanowires, silver paste or PEDOT, namely PSS high-molecular conductive material.
Furthermore, the high-sensitivity resistance sensitive layer is formed by adopting a carbon nano material and an elastic high polymer and printing, sintering and curing through a gas-solid two-phase pore-forming technology, so that the high-sensitivity resistance sensitive layer with a micropore structure is formed.
Furthermore, the supporting layer is of a punctiform, strip-shaped or columnar elastic bulge structure and is formed by printing a liquid insulating elastic substance and then curing or adhering a solid insulating elastic substance.
Further, the flexible packaging layer is formed by printing or spin-coating a flexible insulating high polymer liquid material to form a film and then curing the film, or a solid flexible adhesive film is pasted to carry out laminating packaging.
A preparation method of a wide-range flexible pressure sensor comprises the following steps:
s1, preparing a patterned electrode layer, printing the patterned electrode layer on the lower-layer flexible substrate, and curing and molding;
s2, preparing a high-sensitivity resistance sensitive layer, printing a high-sensitivity resistance sensitive material on the upper-layer flexible substrate, and curing and forming;
s3, preparing an elastic support layer, and printing or sticking the elastic support layer on the patterned electrode gap on the surface of the lower flexible substrate or the high-sensitivity resistance sensitive layer on the surface of the upper flexible substrate, wherein the thickness of the elastic support layer is greater than that of the high-sensitivity resistance sensitive layer;
and S4, attaching and packaging, namely printing or pasting a flexible packaging layer on the periphery of the lower layer flexible substrate or the upper layer flexible substrate, and attaching and packaging the upper layer flexible substrate and the lower layer flexible substrate.
The beneficial effects of the invention are:
1. according to the invention, the pressure enhancement perception detection of the maximum range of 1000N is realized through the design of the hole microstructure and the special bulge structure, and meanwhile, the wide-range flexible device also has good curved/planar conformal attachment detection and good linear output.
2. The wide-range flexible pressure sensor is integrally formed by a flexible additive manufacturing technology so as to ensure good adhesion, bonding force and stability among layers, and the wide-range flexible pressure sensor is simple in preparation process, low in cost and easy to produce and prepare in batches.
Drawings
Fig. 1 is a schematic structural diagram of a wide-range flexible pressure sensor according to the present invention.
Fig. 2 is an enlarged view of fig. 1.
FIG. 3 is a flow chart of the fabrication of a wide range flexible pressure sensor of the present invention.
FIG. 4 is a diagram of a range test according to an embodiment of the present invention.
Wherein: 1. the flexible substrate comprises a lower-layer flexible substrate, 101, a patterned electrode layer, 2, an upper-layer flexible substrate, 201, a high-sensitivity resistance sensitive layer, 3, an elastic supporting layer and 4 and a flexible packaging layer.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
A large-range flexible pressure sensor is shown in figures 1 and 2 and comprises an upper flexible substrate, a lower flexible substrate, a patterned electrode layer 101, a high-sensitivity resistance sensitive layer 201, an elastic support layer 3 and a flexible packaging layer 4. The patterning electrode layer 101 is fixed on the surface of the lower flexible substrate 1 in a printing mode, the high-sensitivity resistance sensitive layer 201 is fixed on the surface of the upper flexible substrate 2 in a printing mode, the elastic support layer 3 and the flexible packaging layer 4 are located between the upper flexible substrate and the lower flexible substrate, a gap is formed between the upper flexible substrate 2 and the lower flexible substrate 1, the patterning electrode layer 101 and the high-sensitivity resistance sensitive layer 201 are separated to form the gap, the elastic support layer 3 is used for supporting the electrode layer and the sensitive layer to enable the electrode layer and the sensitive layer to form a proper distance, and the flexible packaging layer 4 is used for fitting and packaging the upper flexible substrate and the lower flexible substrate together.
The elastic support layer 3 separates the patterned electrode layer 101 from the high-sensitivity resistance sensitive layer 201 to form a gap, so that the patterned electrode layer and the sensitive layer can support the patterned electrode layer and the sensitive layer to a certain extent, on one hand, the patterned electrode layer and the resistance sensitive layer can provide a corresponding large range, and on the other hand, the patterned electrode layer and the high-sensitivity resistance layer can be quickly separated after pressure detection is conveniently pressed through the elasticity of the elastic support layer, so that the sensitivity of the sensor is improved. The thickness of the elastic support layer 3 is much greater than the thickness of the high-sensitivity resistance sensitive layer 201 and the patterned electrode layer 101, so that the patterned electrode layer and the high-sensitivity resistance sensitive layer are supported and isolated. The resilient support layer 3 is disposed at the patterned electrode gaps on the surface of the lower flexible substrate, as shown in fig. 2, and may be disposed between the upper and lower gaps of the left and right fingers of the interdigital electrode, or at the front end of the finger, for example, as an interdigital electrode. The elastic supporting layer 3 may also be disposed on the high-sensitivity resistance sensitive layer 201, and when disposed on the sensitive layer, it is necessary to avoid a flexible patterned electrode layer on the surface of the lower flexible substrate, and avoid affecting the contact area between the sensitive layer and the electrode layer, thereby improving the sensitivity of pressure detection.
The flexible packaging layer 4 is used for attaching and packaging the upper and lower layers of flexible substrates together, is arranged on the periphery of the upper and lower layers of flexible substrates, and surrounds and packages the flexible electrode of the patterned electrode layer 101 and the high-sensitivity resistance sensitive layer 201 to form the wide-range flexible pressure sensor.
The flexible film or the elastic textile fabric with the upper and lower flexible substrates is preferably a flexible film, and the flexible film with different thicknesses (1 μm-1 mm), different softness (such as 2H, 4H), and different light transmittances (one of completely transparent, semi-transparent, or opaque) can be selected according to specific application requirements, and is selected from but not limited to one of PET, PEN, PI, PC, PDMS, EVA, PVA, TPU, TPE (polyester, polyethylene naphthalate, polyimide, ethylene-vinyl acetate copolymer, polyvinyl alcohol, polydimethylsiloxane, polyethylene terephthalate, polymethyl methacrylate, polyvinyl alcohol, polyethylene, and the like). When the elastic textile fabric is selected as the flexible substrate, a layer of elastic high polymer film is printed to play a compact supporting role when the patterned electrode layer and the resistance sensitive layer are printed, and the elastic high polymer film adopts TPU, TPE, PDMS or silica gel and the like.
The patterned electrode layer 101 is formed by printing a conductive material (silver nanowire, silver paste or PEDOT: PSS polymer conductive material) on a flexible substrate, sintering and curing, and is specifically customized according to the requirement, wherein the conductive material includes, but is not limited to, an interdigital shape and a spiral shape. The patterned electrode layer comprises a sensing area (the sensing area is in the shape of the interdigital or spiral) which is in contact with the high-sensitivity resistance sensitive layer, and also comprises a specific lead wire which is led out from the sensing area, and the lead wire leads out of the flexible packaging layer for signal transmission.
The high-sensitivity resistance sensitive layer 201 is formed by printing a carbon nano material and an elastic high polymer with super-strong flexibility and mechanical property on an upper flexible substrate, sintering and curing the materials by a gas-solid two-phase pore-forming technology, and forming the high-sensitivity resistance sensitive layer with a micro-pore structure. The carbon nano material is preferably selected from one or more of carbon nano tube, graphene, Reduced Graphene Oxide (RGO) and the like, and the elastic high polymer is preferably selected from one or more of TPU, TPE, PDMS, silica gel and other high polymer materials. The principle of the gas-solid two-phase pore-forming technology is that during sintering and curing of a liquid with high viscosity, a plurality of micro-grooves and micro-pores are formed on the surface of a material during curing along with the volatilization of a volatile solvent in the liquid. According to the tunneling effect, the linear range and the detection range of the cavity deformation of the pressure-sensitive material to the external pressure are wider than those without the cavity, so that the pressure enhancement perception detection with the maximum range of 1000N is realized, and good linear output can be realized through the carbon nano material and the elastic high polymer material with super-high flexibility and mechanical property, and the adhesion and the stability of the material to the flexible substrate are better.
The elastic supporting layer 3 is formed by printing a liquid insulating elastic substance and then curing or sticking a solid insulating elastic substance by adopting a punctiform, strip or columnar elastic bulge structure. The flexible packaging layer 4 is formed by printing or spin-coating a flexible insulating polymer liquid material to form a film and then curing the film, or a solid flexible adhesive film is directly pasted to carry out laminating packaging.
The invention also provides a preparation method of the wide-range flexible pressure sensor, which comprises the following steps as shown in fig. 3:
s1, preparing a patterned electrode layer, printing patterned electrode layer slurry on the lower-layer flexible substrate, and drying, curing and molding at high temperature;
s2, preparing a high-sensitivity resistance sensitive layer, printing high-sensitivity resistance sensitive slurry on an upper-layer flexible substrate, drying at high temperature, curing and forming, and forming a plurality of micro-pores on the surface of the sensitive layer along with volatilization of a volatile solvent in the slurry;
s3, preparing an elastic supporting layer, and printing or sticking the elastic supporting layer on the patterned electrode gap on the surface of the lower layer flexible substrate or the high-sensitivity resistance sensitive layer on the surface of the upper layer flexible substrate, wherein the thickness of the elastic supporting layer is larger than that of the high-sensitivity resistance sensitive layer;
and S4, attaching and packaging, namely printing or pasting a flexible packaging layer on the periphery of the lower layer flexible substrate or the upper layer flexible substrate, and attaching and packaging the upper layer flexible substrate and the lower layer flexible substrate.
As shown in fig. 4, which is a measurement range test chart of the wide-range flexible pressure sensor of the present invention, it can be known from the chart that the sensor can realize the pressure enhanced sensing detection between 0N and 1000N, and meanwhile, the wide-range flexible device also has good curved/planar conformal attachment detection and good linear output.
The above-mentioned embodiments, objects, technical solutions and advantages of the present invention are further described in detail, it should be understood that the above-mentioned embodiments are only examples of the present invention, and should not be construed as limiting the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. A wide-range flexible pressure sensor, comprising: the method comprises the following steps:
the surface of the lower layer flexible substrate is provided with a patterned electrode layer;
the surface of the upper layer flexible substrate is provided with a high-sensitivity resistance sensitive layer;
the elastic support layer and the flexible packaging layer are positioned between the lower layer flexible substrate and the upper layer flexible substrate, a gap is formed between the upper layer flexible substrate and the lower layer flexible substrate through the elastic support layer and the flexible packaging layer, and a gap is formed between the patterned electrode layer and the high-sensitivity resistance sensitive layer;
the elastic support layer is arranged at the patterned electrode gap on the surface of the lower-layer flexible substrate or on the high-sensitivity resistance sensitive layer on the surface of the upper-layer flexible substrate, and the thickness of the elastic support layer is far greater than that of the high-sensitivity resistance sensitive layer;
the flexible packaging layer is used for laminating and packaging an upper flexible substrate and a lower flexible substrate, and the flexible packaging layer is arranged on the periphery of the upper flexible substrate and the lower flexible substrate.
2. A wide range flexible pressure sensor as in claim 1, wherein: the upper and lower layers of flexible substrates are made of flexible films or elastic textile fabrics.
3. A wide range flexible pressure sensor as in claim 1, wherein: the patterned electrode layer is formed by printing, sintering and curing silver nanowires, silver paste or PEDOT, PSS high-molecular conductive materials.
4. A wide range flexible pressure sensor as in claim 1, wherein: the high-sensitivity resistance sensitive layer is formed by printing, sintering and curing a carbon nano material and an elastic high polymer through a gas-solid two-phase pore-forming technology, and a high-sensitivity resistance sensitive layer with a micro-hole structure is formed.
5. A wide range flexible pressure sensor as in claim 1, wherein: the supporting layer is a point-shaped, strip-shaped or columnar elastic protruding structure and is formed by printing a liquid insulating elastic substance and then curing or adhering a solid insulating elastic substance.
6. A wide range flexible pressure sensor as in claim 1, wherein: the flexible packaging layer is formed by printing or spin-coating a flexible insulating high polymer liquid material to form a film and then curing the film, or pasting a solid flexible glue film to carry out laminating packaging.
7. A preparation method of a wide-range flexible pressure sensor is characterized by comprising the following steps: the method comprises the following steps:
s1, preparing a patterned electrode layer, printing patterned electrode layer slurry on the lower-layer flexible substrate, and curing and forming;
s2, preparing a high-sensitivity resistance sensitive layer, printing high-sensitivity resistance sensitive slurry on the upper-layer flexible substrate, and curing and forming;
s3, preparing an elastic support layer, and printing or sticking the elastic support layer on the patterned electrode gap on the surface of the lower flexible substrate or the high-sensitivity resistance sensitive layer on the surface of the upper flexible substrate, wherein the thickness of the elastic support layer is greater than that of the high-sensitivity resistance sensitive layer;
and S4, attaching and packaging, namely printing or pasting a flexible packaging layer on the periphery of the lower layer flexible substrate or the upper layer flexible substrate, and attaching and packaging the upper layer flexible substrate and the lower layer flexible substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210335287.8A CN114777967A (en) | 2022-03-31 | 2022-03-31 | Wide-range flexible pressure sensor and preparation method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210335287.8A CN114777967A (en) | 2022-03-31 | 2022-03-31 | Wide-range flexible pressure sensor and preparation method thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
CN114777967A true CN114777967A (en) | 2022-07-22 |
Family
ID=82426523
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202210335287.8A Pending CN114777967A (en) | 2022-03-31 | 2022-03-31 | Wide-range flexible pressure sensor and preparation method thereof |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN114777967A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024103263A1 (en) * | 2022-11-15 | 2024-05-23 | 京东方科技集团股份有限公司 | Pressure sensor, manufacturing method therefor, and electronic apparatus |
-
2022
- 2022-03-31 CN CN202210335287.8A patent/CN114777967A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024103263A1 (en) * | 2022-11-15 | 2024-05-23 | 京东方科技集团股份有限公司 | Pressure sensor, manufacturing method therefor, and electronic apparatus |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Wang et al. | Research progress of flexible wearable pressure sensors | |
CN106197772B (en) | Flexible pressure sensor and preparation method thereof | |
CN110207866B (en) | High-sensitivity flexible pressure sensor based on modified paper base and preparation method thereof | |
CN106908176B (en) | Multi-phase dielectric layer capacitive pressure sensor with micro-structure and manufacturing method thereof | |
CN107478148B (en) | Flexible wearable electronic strain sensor and preparation method thereof | |
CN110375895B (en) | Multifunctional fully flexible fingerprint-shaped touch sensor | |
CN111759315A (en) | Preparation method of self-powered electronic skin system based on laser reduction graphene/MXene composite material | |
CN113340480B (en) | Flexible pressure sensor and preparation method thereof | |
Tai et al. | Flexible pressure sensing film based on ultra-sensitive SWCNT/PDMS spheres for monitoring human pulse signals | |
CN105708425A (en) | Development of flexible resistance type pressure sensor for human body pulse detection | |
CN110082012B (en) | Flexible pressure sensor and manufacturing method thereof | |
CN109770866B (en) | Preparation method of high-sensitivity electronic skin | |
CN111998965A (en) | Double-electrode type flexible sensor capable of simultaneously detecting and distinguishing temperature and pressure as well as preparation method and application thereof | |
CN105136873B (en) | A kind of integrated sensor and preparation method thereof | |
CN111024272A (en) | Preparation method of capacitive flexible sensor | |
KR20190091216A (en) | Piezoresistive-type flexible sensor including laminated rlc and preparing method thereof | |
CN109827700A (en) | A kind of double-disk graphite-based pressure resistance type pliable pressure sensor and its manufacture craft | |
CN107340082A (en) | A kind of flexible film pressure sensor | |
CN114777967A (en) | Wide-range flexible pressure sensor and preparation method thereof | |
CN111786590A (en) | Friction nanometer generator capable of detecting temperature and pressure simultaneously and flexible sensor | |
JP6257088B2 (en) | Capacitance type three-dimensional sensor and manufacturing method thereof | |
CN106953001A (en) | A kind of pliable pressure sensor based on carbon nano-tube film and photoresist and preparation method thereof | |
Zou et al. | Highly sensitive ionic pressure sensor with broad sensing range based on interlaced ridge-like microstructure | |
Wang et al. | A highly sensitive capacitive pressure sensor with microdome structure for robot tactile detection | |
Guo et al. | AP (VDF-TrFE) nanofiber composites based multilayer structured dual-functional flexible sensor for advanced pressure-humidity sensing |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: Zhou Zhen Inventor before: Request for anonymity Inventor before: Feng Jingdong Inventor before: Zhou Zhen |