CN214350132U

CN214350132U - Intelligent soldering device

Info

Publication number: CN214350132U
Application number: CN202120378398.8U
Authority: CN
Inventors: 孟礼军; 胡志明
Original assignee: Changsha Niutai Automation Technology Co ltd
Current assignee: Changsha Niutai Automation Technology Co ltd
Priority date: 2021-02-18
Filing date: 2021-02-18
Publication date: 2021-10-08
Anticipated expiration: 2031-02-18

Abstract

The application provides an intelligent soldering device, relates to PCB board welding equipment technical field. The intelligent soldering device comprises a rack, a carrying mechanism, a welding manipulator, a detection mechanism and a controller; the carrying mechanism is arranged on the rack and used for conveying the PCB products, and the rack is sequentially provided with a cleaning station, a welding station and a detection station along the conveying direction of the PCB products; the welding manipulator comprises a support frame, an execution assembly, a welding head and a cleaning assembly, wherein the support frame is arranged on the rack, the execution assembly is arranged on the support frame and connected with the controller, the welding head is arranged on the execution assembly, the cleaning assembly is arranged on the support frame, and the cleaning assembly is positioned at a cleaning station; the detection mechanism is arranged on the frame and located at the detection station, and the detection mechanism is connected with the controller. The application provides an intelligent soldering device can be fine control soldering tin volume and welding quality, avoids causing the damage to the PCB product, improves welding quality.

Description

Intelligent soldering device

Technical Field

The application relates to the technical field of PCB (printed circuit board) welding equipment, in particular to an intelligent soldering device.

Background

An Electronic Control Unit (ECU) is a central Control Unit of an Electronic steering system of an automobile, wherein the welding of a Printed Circuit Board (PCB) Board and a driving motor is particularly critical and important, and the stability of the whole steering system is directly influenced by the quality of the welding.

At present, in the existing welding mode, a multi-module is adopted for welding, the welding action cannot be adjusted according to the position of a welding leg, the PCB is easily damaged during welding, and the quantity and the welding quality of the tin welding cannot be effectively monitored.

SUMMERY OF THE UTILITY MODEL

For overcoming the not enough among the prior art, this application provides an intelligent soldering device to in solving current welding mode, the welding action can not adjust according to the position of leg, causes the damage to the PCB board easily during the welding moreover, can't carry out the technical problem of effective control to soldering tin volume and welding quality.

In order to achieve the above object, the present application provides an intelligent soldering device, which includes a frame, a carrying mechanism, a welding manipulator, a detecting mechanism, and a controller;

the carrying mechanism is arranged on the rack, and is used for conveying PCB products during working, and the rack is sequentially provided with a cleaning station, a welding station and a detection station along the conveying direction of the PCB products;

the welding manipulator comprises a support frame, an executing assembly, a welding head and a cleaning assembly, wherein the support frame is arranged on the rack, the executing assembly is arranged on the support frame, the executing assembly is connected with the controller, the welding head is arranged on the executing assembly, the cleaning assembly is arranged on the support frame, the cleaning assembly is located at the cleaning station, when the welding manipulator works, the executing assembly drives the welding head to weld a PCB product at the welding station, after welding, the executing assembly drives the welding head to move to the cleaning station, and the cleaning assembly cleans the welding head;

the detection mechanism is arranged on the rack and positioned at the detection station, and the detection mechanism is connected with the controller;

before welding, the detection mechanism is used for detecting the position information of the welding leg of the welding position of the PCB product, and the controller is used for acquiring the position information and controlling the execution assembly to act according to a preset mode; after welding, the detection mechanism detects the welding quality of the welding leg.

In one possible embodiment, the carrying mechanism comprises a conveying guide rail, a carrying tray and a driving assembly;

the two conveying guide rails are arranged on the rack and are parallel to each other, and the conveying guide rails are sequentially connected with the cleaning station, the welding station and the detection station;

the carrying tray is in sliding fit with the two conveying guide rails, and a clamping assembly for positioning the PCB product is arranged on the carrying tray;

the driving assembly is arranged on the carrying tray.

In a possible embodiment, the carrying tray is also provided with an RFID electronic tag.

In a possible embodiment, clean station the welding station reaches the detection station all is provided with climbing mechanism, climbing mechanism is located two between the transfer rail, the during operation, climbing mechanism is used for lifting the delivery tray makes the delivery tray with the transfer rail breaks away from, in addition, is located detect the station climbing mechanism still has servo rotation the function of delivery tray is used for realizing detection mechanism is right the welding quality of the different fillets of PCB product welding department detects, improves and detects the precision.

In a possible implementation mode, the welding station is further provided with a protection plate, a welding port is arranged on the protection plate, and the welding port corresponds to the welding position of the PCB product.

In one possible embodiment, the cleaning assembly comprises a cleaning table and a blowing member and a brushing member arranged on the cleaning table.

In one possible embodiment, the actuator assembly includes a wire feeder having an encoder disposed thereon.

In one possible embodiment, the detection mechanism comprises a movable detection component and a fixed detection component;

the movable detection assembly comprises a movable sliding table, a sliding installation seat and a first detection camera, the movable sliding table is arranged on the rack, the sliding installation seat is arranged on the movable sliding table, the first detection camera is arranged on the sliding installation seat, and when the movable detection assembly works, the movable sliding table is used for driving the sliding direction of the sliding installation seat to be parallel to the conveying direction of the PCB products;

the fixed detection assembly comprises a fixed mounting seat and a second detection camera, the fixed mounting seat is arranged on the rack, and the second detection camera is arranged on the fixed mounting seat.

In a possible implementation manner, the movement detection assembly further includes a light-gathering cover, and the light-gathering cover is disposed on the sliding mounting seat and located below the first detection camera.

In a possible implementation manner, the intelligent soldering device further comprises a dust suction mechanism arranged at the cleaning station, and during operation, the dust suction mechanism is used for sucking dust and cleaning the PCB product entering the cleaning station.

Compared with the prior art, the beneficial effects of the application are that:

the application provides an intelligent soldering device which comprises a rack, a carrying mechanism, a welding manipulator, a detection mechanism and a controller; the carrying mechanism is arranged on the rack, and is used for conveying PCB products during working, and the rack is sequentially provided with a cleaning station, a welding station and a detection station along the conveying direction of the PCB products; the welding manipulator comprises a support frame, an execution assembly, a welding head and a cleaning assembly, wherein the support frame is arranged on the rack, the execution assembly is arranged on the support frame, the execution assembly is connected with the controller, the welding head is arranged on the execution assembly, the cleaning assembly is arranged on the support frame, the cleaning assembly is positioned on the cleaning station, when the welding manipulator works, the execution assembly drives the welding head to weld a PCB product at the welding station, after welding, the execution assembly drives the welding head to move to the cleaning station, and the cleaning assembly cleans the welding head; the detection mechanism is arranged on the rack and positioned at a detection station, and the detection mechanism is connected with the controller; before welding, the detection mechanism is used for detecting the position information of a welding leg at the welding position of the PCB product, and the controller is used for acquiring the position information and controlling the execution assembly to act according to a preset mode; after welding, the detection mechanism detects the welding quality of the welding leg. The application provides an intelligent soldering device, the soldered connection after welding is in time clean through clean subassembly, avoids having the residue on the soldered connection, when welding once more, can guarantee welding quality, better control soldering tin volume. Meanwhile, the cleaning assembly timely clears away residues on the welding head, the pressure between the welding head and the PCB product is guaranteed to be stable during welding, and the damage caused by the fact that the PCB product is pressed too much is avoided.

In addition, the accurate positioning of the welding pins at the welding positions of the PCB products is realized before welding through the matching of the detection mechanism and the controller, the controller controls the execution assembly to act according to a preset mode so as to adapt to the welding of the welding pins at different positions, and after welding, the detection mechanism can also detect the welding quality of the welding pins, so that the welding quality and the soldering tin amount are further improved, and the quality of the PCB products is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 illustrates a front view of an intelligent soldering apparatus provided in an embodiment of the present application;

fig. 2 shows a top view of the intelligent soldering apparatus shown in fig. 1;

fig. 3 shows a perspective view of the intelligent soldering apparatus shown in fig. 1;

FIG. 4 shows an enlarged partial schematic view at A in FIG. 3;

fig. 5 is a schematic perspective view illustrating a movable detection assembly in an intelligent soldering apparatus according to an embodiment of the present disclosure;

FIG. 6 shows an enlarged partial schematic view at B in FIG. 3;

fig. 7 is a schematic structural diagram illustrating a carrier tray mounted PCB product of a carrier mechanism in an intelligent soldering apparatus according to an embodiment of the present application;

fig. 8 is a schematic perspective view illustrating a welding robot in an intelligent soldering apparatus according to an embodiment of the present disclosure;

fig. 9 shows a partial enlarged schematic view at C in fig. 8.

Description of the main element symbols:

100-a frame; 100 a-a cleaning station; 100 b-a welding station; 100 c-a detection station; 120-protective plate; 121-a welding port; 200-a carrying mechanism; 210-a transport rail; 220-a carrier tray; 221-a clamping assembly; 222-an RFID electronic tag; 300-a welding manipulator; 310-a support frame; 320-an execution component; 321-a body; 322-a first drive member; 323-a second drive member; 324-a wire feeder; 330-a welding head; 331-a pre-compression spring; 340-a cleaning assembly; 341-a cleaning station; 342-a blowing member; 343-a brush; 400-a detection mechanism; 410-an activity detection component; 411-moving the sliding table; 412-a slide mount; 413-a first detection camera; 414-a snoot; 415-a lifting cylinder; 420-fixing the detection assembly; 421-fixed mounting seat; 422-a second detection camera; 500-dust suction mechanism; 600-a jacking mechanism; 700-electric appliance control cabinet; 1000-PCB product.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

Example one

Referring to fig. 1 to 7, the present embodiment provides an intelligent soldering apparatus for soldering a solder fillet on a PCB product 1000 to improve the soldering quality.

The steering control unit ECU is the central pivot of an automobile electronic steering system, wherein the welding of a PCB and a driving motor is particularly critical and important, and the stability of the whole steering system is directly influenced by the quality of the welding.

Therefore, the PCB product 1000 welded in this embodiment belongs to a component in an automotive electronic steering system, and the PCB board has been pre-mounted on the PCB product 1000, and the intelligent soldering device provided in this embodiment is now used to intelligently weld the solder feet on the PCB board.

Referring to fig. 1, fig. 2, fig. 3 and fig. 7, the intelligent soldering apparatus provided in the present embodiment includes a rack 100, a carrying mechanism 200, a welding robot 300, a detecting mechanism 400 and a controller (not shown).

The carrying mechanism 200 is disposed on the frame 100, and during operation, the carrying mechanism 200 is used for conveying the PCB product 1000, and the frame 100 is sequentially provided with a cleaning station 100a, a welding station 100b, and a detection station 100c along a conveying direction of the PCB product 1000.

That is, the PCB products 1000 conveyed by the carrier 200 sequentially pass through the cleaning station 100a, the soldering station 100b and the detecting station 100c, and the carrier 200 stays at each station for a predetermined time, which is determined according to the operation duration of each station.

In order to realize that the carrying mechanism 200 can accurately stop when reaching the corresponding station, a travel switch (not shown) is arranged at each station, wherein each travel switch is electrically connected with the controller, and when the carrying mechanism 200 touches the travel switch, the controller controls the carrying mechanism 200 to stop, namely the carrying mechanism 200 accurately stops at the appointed station.

Referring to fig. 3 and 7, the carrying mechanism 200 includes a conveying rail 210, a carrying tray 220 and a driving assembly (not shown). In this embodiment, two conveying rails 210 are provided, two conveying rails 210 are both provided on the rack 100, and the two conveying rails 210 are parallel to each other, and the conveying rails 210 sequentially connect the cleaning station 100a, the welding station 100b, and the detection station 100 c. That is, the cleaning station 100a, the welding station 100b, and the detecting station 100c are sequentially disposed along the length direction of the conveying guide 210.

The carrying tray 220 is slidably engaged with the two conveying rails 210, and the driving assembly is disposed on the carrying tray 220 and can drive the carrying tray 220 to slide along the conveying rails 210.

Further, be provided with the clamping subassembly 221 that is used for fixing a position PCB product 1000 on the delivery tray 220, clamping subassembly 221 is used for fixing PCB product 1000 on delivery tray 220, guarantees that PCB product 1000 moves along with delivery tray 220, and can not appear shaking the skew, guarantees follow-up welded quality, simultaneously, behind the clamping of PCB product 1000, the one side that needs the welding is up.

In some embodiments, the carrying trays 220 are further provided with RFID electronic tags 222(Radio Frequency Identification), wherein the RFID electronic tags 222 on each carrying tray 220 can record data of the PCB product 1000 reaching each station, so that the data of the PCB product 1000 at each station can be traced and monitored, process omission is avoided, and product quality is improved.

Referring to fig. 3, 8 and 9, the welding robot 300 includes a support frame 310, an actuator 320, a welding head 330 and a cleaning assembly 340.

The supporting frame 310 is disposed on the rack 100, the executing assembly 320 is disposed on the supporting frame 310, the executing assembly 320 is electrically connected to the controller, the soldering head 330 is disposed at an end of the executing assembly 320, the executing assembly 320 can drive the soldering head 330 to perform a soldering operation, so as to solder the PCB product 1000 reaching the soldering station 100b, wherein the executing assembly 320 can act according to a predetermined manner according to a position of a solder fillet at a soldering position of the PCB product 1000, so that the soldering head 330 can perform precise soldering on each solder fillet.

Further, clean subassembly 340 sets up on support frame 310, and clean subassembly 340 is located clean station 100a, and clean subassembly 340 is used for cleaning on the butt weld joint 330, avoids having the residue on the weld joint 330, influences the welding next time, and then improves welding quality.

Specifically, the welding manipulator 300 is in operation:

firstly, the executing component 320 drives the welding head 330 to weld the PCB product 1000 at the welding station 100 b;

then, after the welding is completed, the execution assembly 320 drives the welding head 330 to move to the cleaning station 100a, and the cleaning assembly 340 cleans the welding head 330;

furthermore, after the welding head 330 is cleaned, the executing component 320 drives the welding head 330 to return to the welding station 100b for the next welding operation, and so on.

Therefore, after the welding head 330 is welded once, the welding head 330 needs to enter the cleaning station 100a and be cleaned once by the cleaning assembly 340, so that no residue is left when the welding head 330 is welded every time, the welding quality every time is ensured, and meanwhile, the soldering tin amount of the welding position of each PCB product 1000 is consistent and uniform.

In addition, if the welding head 330 has residue, the pressure of the welding head 330 on the PCB product 1000 is higher than the initial pressure, and the PCB plate material in the PCB product 1000 is weak, so that the PCB plate material is deformed or cracked under a small pressure, thereby causing damage. Therefore, the cleaning assembly 340 removes residues before the welding head 330 welds each time, ensures stable pressure between the welding head 330 and the PCB during welding, and prevents the PCB from being damaged due to compression.

Referring to fig. 8, the executing assembly 320 includes a main body 321, a first driving member 322 and a second driving member 323, wherein the main body 321 is disposed on the supporting frame 310 via the first driving member 322, and the first driving assembly drives the main body 321 to rotate, so as to realize the switching of the welding head 330 between the welding station 100b and the cleaning station 100 a.

Optionally, the first driving member 322 is a servo motor, and the servo motor controls the precision, thereby ensuring the precision of the movement of the welding head 330.

The second driving member 323 is disposed on the body 321 and rotates with the body 321, the second driving member 323 is connected to the soldering head 330, the second driving member 323 is used for driving the soldering head 330 to move up and down along a vertical direction, and the first driving member 322 and the second driving member 323 are mutually matched to realize soldering of a plurality of soldering points on the PCB product 1000.

In some embodiments, the actuating assembly 320 further includes a wire feeding mechanism 324, and an encoder (not shown) is disposed on the wire feeding mechanism 324, and the encoder is configured to strictly control the feeding amount of the solder wire, so as to ensure the amount of solder at the welding position, thereby avoiding the problems of more welding and less welding.

Referring to fig. 4 and 7, further, the welding station 100b is further provided with a protection plate 120, the protection plate 120 is provided with a welding opening 121, and the welding opening 121 corresponds to a welding position of the PCB product 1000. And then the setting of guard plate 120 can make the welded junction of PCB product 1000 expose, and shelter from the protection to the part that need not the welding, avoids the welding to be that soldering tin splashes, the wire drawing or drops and lead to PCB product 1000 to damage, and then improves welding quality, guarantees that PCB product 1000 is intact.

Referring to fig. 7 and 9, in other embodiments, the soldering head 330 is provided with a pre-pressing spring 331, so that the soldering head 330 has a certain buffering effect when contacting the PCB product 1000, thereby preventing damage to the PCB due to pressing and ensuring consistent height of the soldered pins.

Referring to fig. 8 and 9, the cleaning assembly 340 includes a cleaning table 341, and an air blowing unit 342 and a brushing unit 343 disposed on the cleaning table 341, wherein the cleaning table 341 is disposed on the supporting frame 310, and the air blowing unit 342 and the brushing unit 343 are disposed independently.

The soldering head 330 firstly enters the blowing part 342, air flow is blown to the soldering head 330 by the blowing head in the blowing part 342 for cleaning, the soldering head 330 enters the scrubbing part 343 after being cleaned by blowing, and the scrubbing part 343 is cleaned by driving the steel wire brush to rotate so as to remove residual tin on the soldering head 330, and the tin quantity is strictly controlled.

Referring to fig. 1, fig. 3, fig. 5 and fig. 6, the detecting mechanism 400 is disposed on the rack 100 and located at the detecting station 100c, the detecting mechanism 400 is electrically connected to the controller, and during operation, the detecting mechanism 400 is used for performing pre-solder and post-solder detection on the solder joints of the PCB product 1000.

Specifically, before soldering, the detection mechanism 400 is configured to detect position information of a solder fillet at a solder joint of the PCB product 1000, and the controller is configured to obtain the position information and control the execution component 320 to operate in a preset manner; after welding, the detection mechanism 400 detects the welding quality of the fillet.

The actuating component 320 acts in a predetermined manner, including the first driving component 322 driving the body 321 to rotate by a predetermined angle, and the second driving component 323 ascending or descending by a predetermined stroke.

The detection of the welding quality of the solder tail by the detection mechanism 400 includes: whether the soldering tin is uniform or not, whether the soldering tin height is qualified or not, whether the tin penetration rate of the welding leg is qualified or not and whether the welding leg has multi-welding, small welding and missing welding or not.

Further, the detecting mechanism 400 includes a movable detecting component 410 and a fixed detecting component 420, wherein the movable detecting component 410 can detect at the welding station 100b and the detecting station 100 c.

When the activity detection component 410 reaches the welding station 100b, the activity detection component 410 can detect the position information of the welding foot at the welding position of the PCB product 1000 without performing welding, and feed back the required welding point to the controller, and the controller controls the execution component 320 in the welding manipulator 300 to act according to a preset mode, so as to realize intelligent and accurate welding operation.

When the movable detection component 410 reaches the detection station 100c, the movable detection component 410 and the fixed detection component 420 cooperate to detect the welding quality of the solder leg at the welding position of the PCB product 1000 where the welding has been performed, so as to ensure the welding quality of the PCB product 1000.

Referring to fig. 3 and fig. 5, in detail, the movable detection assembly 410 includes a movable sliding table 411, a sliding mounting base 412 and a first detection camera 413, wherein the movable sliding table 411 is disposed on the frame 100, the sliding mounting base 412 is disposed on the movable sliding table 411, the first detection camera 413 is disposed on the sliding mounting base 412, and during operation, a sliding direction of the movable sliding table 411 for driving the sliding mounting base 412 is parallel to a conveying direction of the PCB product 1000. That is to say, the movable sliding table 411 can drive the sliding mounting seat 412 to slide back and forth between the welding station 100b and the detection station 100c, so as to drive the first detection camera 413 to realize the shooting detection before and after the welding of the PCB product 1000.

Further, the first detecting camera 413 is mounted on the sliding mounting base 412 through the lifting cylinder 415, and the lifting cylinder 415 can drive the first detecting camera 413 to be close to or far away from the PCB product 1000, so as to improve the detecting precision.

In some embodiments, the driving power for moving the sliding table 411 may be provided by a motor and a lead screw, an electric push rod, or an air cylinder.

In other embodiments, the activity detection assembly 410 further includes a light-gathering cover 414, and the light-gathering cover 414 is disposed on the sliding mount 412 and under the first detection camera 413. The light-gathering cover 414 has two openings, wherein the large opening faces downward, the small opening faces the first detection camera 413, and the inner surface of the light-gathering cover 414 is honeycomb-shaped.

Referring to fig. 1, fig. 3 and fig. 6, the fixed inspection assembly 420 includes a fixed mounting seat 421 and a second inspection camera 422, the fixed mounting seat 421 is disposed on the frame 100, and the second inspection camera 422 is disposed on the fixed mounting seat 421.

Referring to fig. 2, fig. 3 and fig. 7, the intelligent soldering apparatus provided in this embodiment further includes a dust suction mechanism 500 disposed at the cleaning station 100a, and during operation, the dust suction mechanism 500 is used for cleaning the PCB product 1000 entering the cleaning station 100a to ensure that the welding position of the PCB product 1000 is dust-free after entering the welding station 100b, thereby improving the welding quality.

In this embodiment, the cleaning station 100a, the welding station 100b, and the detection station 100c are all provided with the jacking mechanism 600, the jacking mechanism 600 is located between the two conveying rails 210, and during operation, the jacking mechanism 600 is used for lifting the carrying tray 220, so that the carrying tray 220 is separated from the conveying rails 210. That is to say, the setting of the jacking mechanism 600 can ensure that the PCB product 1000 reaches each station, so that the PCB product 1000 is separated from the conveying guide rail 210, and further the problem of deviation caused by inaccurate positioning of the rail is avoided, so as to improve the welding quality.

Optionally, the jacking mechanism 600 includes at least three jacking cylinders, so as to improve the stability of the PCB product 1000 after jacking.

Further, in order to realize the welding quality detection of the plurality of solder feet at the welding position of the PCB product 1000 at the detection station 100c, the jacking mechanism 600 located at the detection station 100c further has a servo rotating assembly (not shown), and the servo rotating assembly drives the carrying tray 220 to rotate by a preset angle, so that all the solder feet are sequentially detected. And then realize that the welding quality of the different leg of PCB product 1000 welding department detects, improves and detects the precision.

The positioning mode for realizing the rotation of the carrying tray 220 by the preset angle is as follows: the first detection camera 413 of the movable detection assembly 410 takes a picture to acquire the position information of the solder leg at the welding position on the PCB product 1000 and feeds the position information back to the controller, and the controller controls the servo rotating assembly to rotate according to the position information to realize the visual positioning function.

Further, the controller may be selected from a PLC controller, an industrial personal computer, or an industrial computer, and in this embodiment, the controller is disposed in the electrical control cabinet 700 at the rear of the rack 100.

The intelligent soldering device provided by the embodiment can timely clean the soldered joint 330 after being soldered through the cleaning assembly 340, so that residues on the soldered joint 330 can be avoided, the soldering quality can be ensured and the soldering tin amount can be better controlled during secondary soldering. Meanwhile, the cleaning assembly 340 removes the residue on the soldering head 330 in time, so as to ensure the stable pressure between the soldering head 330 and the PCB product 1000 during soldering, thereby preventing the PCB product 1000 from being damaged due to over-pressure.

In addition, in the intelligent soldering device, the detection before and after soldering of the soldered part of the PCB product 1000 is realized through the matching of the detection mechanism 400, so that the soldering quality and the soldering amount are further improved, and the quality of the PCB product 1000 is improved.

In the description herein, reference to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations may be made to the above embodiments by those of ordinary skill in the art within the scope of the present application.

Claims

1. An intelligent soldering device is characterized by comprising a rack, a carrying mechanism, a welding manipulator, a detection mechanism and a controller;

2. The intelligent soldering device according to claim 1, wherein the carrying mechanism includes a conveying rail, a carrying tray and a driving assembly;

the driving assembly is arranged on the carrying tray.

3. The intelligent soldering device according to claim 2, wherein the carrying tray is further provided with an RFID tag.

4. The intelligent soldering device according to claim 2, wherein the cleaning station, the welding station and the detection station are provided with a jacking mechanism, and the jacking mechanism is located between the two conveying guide rails.

5. The intelligent soldering device according to claim 1 or 4, wherein the welding station is further provided with a protection plate, the protection plate is provided with a welding port, and the welding port corresponds to a welding position of the PCB product.

6. The intelligent soldering device according to claim 1, wherein the cleaning assembly comprises a cleaning table and a blowing member and a brushing member provided on the cleaning table.

7. The intelligent soldering device according to claim 1, wherein the actuator assembly comprises a wire feeder having an encoder disposed thereon.

8. The intelligent soldering device according to claim 1, wherein the detection mechanism includes a movable detection component and a fixed detection component;

9. The intelligent soldering device according to claim 8, wherein the movable detection assembly further comprises a light-gathering cover, and the light-gathering cover is disposed on the slide mount and below the first detection camera.

10. The intelligent soldering device according to claim 1, further comprising a dust suction mechanism arranged at the cleaning station, wherein the dust suction mechanism is used for sucking dust and cleaning the PCB product entering the cleaning station during operation.