CN214326429U - Automatic feeding mechanism for wafer cutting ring - Google Patents
Automatic feeding mechanism for wafer cutting ring Download PDFInfo
- Publication number
- CN214326429U CN214326429U CN202120003557.6U CN202120003557U CN214326429U CN 214326429 U CN214326429 U CN 214326429U CN 202120003557 U CN202120003557 U CN 202120003557U CN 214326429 U CN214326429 U CN 214326429U
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- China
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- bottom plate
- cutting ring
- wafer cutting
- material loading
- plate
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Abstract
The utility model relates to a wafer cutting ring automatic feeding mechanism, including pushing mechanism, bottom plate, accommodation portion and material loading subassembly, pushing mechanism sets up in the bottom plate side, and pushing mechanism includes push cylinder and slide, and the slide is connected with push cylinder, accommodation portion sets up on the bottom plate and is located slide the place ahead, is equipped with in the accommodation portion and holds the chamber, holds the chamber bottom and is equipped with the through-hole, the material loading subassembly sets up in the bottom plate side, and the material loading subassembly includes material loading portion and displacement subassembly, and material loading portion sets up on the displacement subassembly, and the material loading position is located the bottom plate top and sets up relatively with the slide. The utility model discloses a wafer cutting ring automatic feeding mechanism can realize wafer cutting ring automatic feeding, reduces the human cost, has effectively promoted production efficiency.
Description
Technical Field
The utility model relates to a processing equipment technical field of wafer cutting ring, in particular to wafer cutting ring automatic feeding mechanism.
Background
The wafer cutting ring is a bearing tool for the processes of pasting, cutting and adhering the semiconductor packaging film. When the wafer is pasted, the blue film and the wafer cutter are used together, which is used for fixing the outer frame during the wafer grinding and cutting, and the cutting can be finished and the product can be directly delivered. The wafer cutting ring is made of stainless steel, has the advantages of high flatness and hardness, breaking resistance, corrosion resistance, scratch resistance and the like, can be repeatedly recycled and cleaned, and is environment-friendly and economical. The existing wafer cutting ring needs to be polished, cleaned and other process steps during machining, when machining is carried out through the machining equipment, the feeding is usually carried out in a manual feeding mode, more manpower needs to be consumed during manual feeding, workers can be tired, and production efficiency is difficult to improve.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a solve prior art's problem, provide one kind and can promote degree of automation, reduce the manual work, effectively promote production efficiency's wafer cutting ring automatic feeding mechanism.
The specific technical scheme is as follows: the utility model provides a wafer cutting ring automatic feeding mechanism, includes pushing mechanism, bottom plate, accommodation portion and material loading subassembly, pushing mechanism sets up in the bottom plate side, and pushing mechanism is connected with pushing cylinder including pushing cylinder and slide, accommodation portion sets up on the bottom plate and is located slide the place ahead, is equipped with in the accommodation portion and holds the chamber, holds the chamber bottom and is equipped with the through-hole, the material loading subassembly sets up in the bottom plate side, and the material loading subassembly includes material loading portion and displacement subassembly, and material loading portion sets up on the displacement subassembly, and the material loading position is located the bottom plate top and sets up relatively with the slide.
Preferably, the end part of the bottom plate is provided with a baffle plate, and the baffle plate is vertically arranged on the bottom plate.
As the preferred scheme, the pushing cylinder is provided with a connecting plate, the connecting plate is connected with a sliding plate, and the sliding plate is horizontally arranged.
Preferably, the bottom plate is provided with a sensor, and the sensor is arranged corresponding to the connecting plate.
Preferably, the end of the sliding plate is provided with a V-shaped groove.
Preferably, the displacement assembly comprises a sliding seat, a lifting cylinder, a screw and a driving motor, the screw is connected with the driving motor, the screw penetrates through the sliding seat and is in threaded connection with the sliding seat, the lifting cylinder is arranged on the sliding seat, and the feeding part is connected with the lifting cylinder.
Preferably, the bottom plate is disposed on the support plate.
The technical effects of the utility model: the utility model discloses a wafer cutting ring automatic feeding mechanism can realize wafer cutting ring automatic feeding, reduces the human cost, has effectively promoted production efficiency.
Drawings
Fig. 1 is a schematic diagram of an automatic feeding mechanism for a wafer cutting ring according to an embodiment of the present invention.
Fig. 2 is a top view of the automatic feeding mechanism for wafer cutting rings according to an embodiment of the present invention.
Fig. 3 is a schematic diagram of a displacement assembly according to an embodiment of the present invention.
Detailed Description
The essential features and advantages of the invention will be further explained below with reference to examples, but the invention is not limited to the embodiments listed.
As shown in fig. 1 to 3, the automatic feeding mechanism for a wafer cutting ring of the present embodiment includes a pushing mechanism 1, a bottom plate 2, a receiving portion 3 and a feeding assembly 4, wherein the pushing mechanism 1 is disposed on a side surface of the bottom plate 2. The pushing mechanism 1 comprises a pushing cylinder 11 and a sliding plate 12, and the sliding plate 12 is connected with the pushing cylinder 11. The accommodating part 3 is arranged on the bottom plate 2 and is positioned in front of the sliding plate 12, an accommodating cavity 31 is arranged in the accommodating part 3, and a through hole 32 is arranged at the bottom of the accommodating cavity 31. The feeding assembly 4 is arranged on the side surface of the bottom plate 2, the feeding assembly 4 comprises a feeding portion 41 and a displacement assembly 42, the feeding portion 41 is arranged on the displacement assembly 42, and the feeding portion 41 is located above the bottom plate 2 and is arranged opposite to the sliding plate 12. In the technical scheme, the sliding plate 12 can be pushed to slide along the bottom plate 2 through the pushing cylinder 11, the wafer cutting rings are placed in the accommodating part 3, the wafer cutting rings are stacked and fall onto the bottom plate 2 through the through hole 32, the sliding plate 12 pushes the wafer cutting rings on the bottom plate to move forwards to the position below the feeding part 41 when sliding, and meanwhile, the sliding plate 12 seals the through hole; the loading part 41 is lifted and translated by the displacement assembly 42, so as to obtain the wafer cutting ring, and the wafer cutting ring is moved to the processing equipment by the displacement assembly 41. After the slide plate 12 returns to the initial position, the through hole is opened, and the wafer cutting ring falls down onto the bottom plate. Through the technical scheme, the wafer cutting rings can be conveyed below the feeding part piece by piece, feeding can be carried out through the feeding part, the feeding speed can be increased, manual operation is not needed, and labor cost is reduced.
In this embodiment, the end of the bottom plate 2 is provided with a baffle 5, and the baffle 5 is vertically arranged on the bottom plate 2, so that the wafer cutting ring can be prevented from falling off from the bottom plate. In this embodiment, the pushing cylinder 11 is provided with a connecting plate 13, the connecting plate 13 is connected with a sliding plate 12, the sliding plate 12 is horizontally arranged, and the connecting plate 13 is connected with an expansion rod 111 of the pushing cylinder 11, so as to drive the sliding plate to slide. In this embodiment, bottom plate 2 is equipped with sensor 6, and sensor 6 corresponds the setting with connecting plate 13 to can perceive the shift position of connecting plate 13 through sensor 6, thereby open through the controller control that is connected respectively with sensor 6, push cylinder 11 and stop of push cylinder, sensor 6 of this embodiment can adopt proximity sensor. In this embodiment, the end of the sliding plate 12 is provided with a V-shaped groove 121, so that the wafer cutting ring can be conveniently pushed to be positioned, and the wafer cutting ring can be prevented from shaking.
In this embodiment, the displacement assembly 42 includes a sliding seat 421, a lifting cylinder 422, a screw 423 and a driving motor 424, the screw 423 is connected to the driving motor 424, the screw 423 penetrates through the sliding seat 421 and is in threaded connection with the sliding seat, the lifting cylinder 422 is disposed on the sliding seat 421, and the feeding portion 41 is connected to the lifting cylinder 422. Through the above technical solution, the driving motor 424 can drive the screw 423 to rotate, so that the sliding seat 421 slides left and right. Through lift cylinder 422, can drive material loading portion 41 and go up and down. Through the technical scheme, the wafer cutting ring can be lifted and moved left and right. The material loading portion of this embodiment is the sucking disc, and the material loading portion also can adopt current anchor clamps such as clamping jaw cylinder. In this embodiment, the base plate 2 is disposed on the support plate 7, thereby improving the stability of the base plate.
The automatic feeding mechanism for the wafer cutting ring can achieve automatic feeding of the wafer cutting ring, reduces labor cost and effectively improves production efficiency.
It should be noted that the above-mentioned preferred embodiments are only for illustrating the technical concepts and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and to implement the present invention accordingly, and the protection scope of the present invention cannot be limited thereby. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.
Claims (7)
1. The utility model provides a wafer cutting ring automatic feeding mechanism, its characterized in that, includes pushing mechanism, bottom plate, portion of holding and material loading subassembly, pushing mechanism sets up in the bottom plate side, and pushing mechanism is including push cylinder and slide, and the slide is connected with push cylinder, the portion of holding sets up on the bottom plate and is located slide the place ahead, is equipped with in the portion of holding and holds the chamber, holds the chamber bottom and is equipped with the through-hole, the material loading subassembly sets up in the bottom plate side, and the material loading subassembly includes material loading portion and displacement subassembly, and material loading portion sets up on the displacement subassembly, and the material loading portion is located the bottom plate top and sets up relatively with the slide.
2. The automatic loading mechanism for wafer cutting ring as claimed in claim 1, wherein the end of the bottom plate is provided with a baffle plate, and the baffle plate is vertically arranged on the bottom plate.
3. The automatic loading mechanism for wafer cutting ring as claimed in claim 2, wherein the pushing cylinder is provided with a connecting plate connected with a sliding plate, and the sliding plate is horizontally arranged.
4. The automatic loading mechanism for wafer cutting ring as claimed in claim 3, wherein the bottom plate is provided with a sensor, and the sensor is arranged corresponding to the connecting plate.
5. The automatic loading mechanism for wafer cutting ring as claimed in claim 4, wherein the end of the sliding plate is provided with a V-shaped groove.
6. The automatic loading mechanism for wafer cutting ring as claimed in claim 5, wherein the displacement assembly comprises a sliding seat, a lifting cylinder, a screw rod and a driving motor, the screw rod is connected with the driving motor, the screw rod passes through the sliding seat and is in threaded connection with the sliding seat, the lifting cylinder is arranged on the sliding seat, and the loading part is connected with the lifting cylinder.
7. The automatic wafer cutting ring feeding mechanism according to claim 6, wherein the base plate is disposed on a support plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120003557.6U CN214326429U (en) | 2021-01-04 | 2021-01-04 | Automatic feeding mechanism for wafer cutting ring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120003557.6U CN214326429U (en) | 2021-01-04 | 2021-01-04 | Automatic feeding mechanism for wafer cutting ring |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214326429U true CN214326429U (en) | 2021-10-01 |
Family
ID=77904771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120003557.6U Active CN214326429U (en) | 2021-01-04 | 2021-01-04 | Automatic feeding mechanism for wafer cutting ring |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214326429U (en) |
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2021
- 2021-01-04 CN CN202120003557.6U patent/CN214326429U/en active Active
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