CN214281590U

CN214281590U - Flat electrostatic sound box

Info

Publication number: CN214281590U
Application number: CN202023346429.6U
Authority: CN
Inventors: 刘科海; 杨方友; 张超; 杨秀华; 陈益; 王恩哥
Original assignee: Songshan Lake Materials Laboratory
Current assignee: Songshan Lake Materials Laboratory
Priority date: 2020-12-31
Filing date: 2020-12-31
Publication date: 2021-09-24
Anticipated expiration: 2030-12-31

Abstract

The application provides a dull and stereotyped static audio amplifier relates to audio amplifier technical field. Dull and stereotyped static audio amplifier includes mount, fixed subassembly and speaker, and the quantity of speaker is a plurality of, and a plurality of speakers pass through fixed subassembly installation and array in the mount. The flat electrostatic speaker is provided with a plurality of speaker arrays, and a plurality of speakers are arranged on a fixed frame through a fixed component to form stable connection. The plurality of speakers can superimpose sound on each other so that the sound field and sensitivity are improved.

Description

Flat electrostatic sound box

Technical Field

The application relates to the technical field of sound boxes, in particular to a flat electrostatic sound box.

Background

The array sound box is formed by arranging a plurality of loudspeakers according to a certain rule, and generally, all the loudspeakers have the same amplitude and phase. At present, most of common array sound boxes are composed of a plurality of moving coil loudspeaker arrays.

As for the electrostatic sound box, no matter the electrostatic flat sound box on the market is independent electrostatic or electrostatic moving coil combined, the sound field is not ideal enough.

SUMMERY OF THE UTILITY MODEL

The application aims to provide a flat electrostatic sound box, which can solve the problem that the sound field of the conventional electrostatic sound box is not ideal.

The embodiment of the application is realized as follows:

the embodiment of the application provides a dull and stereotyped static audio amplifier, including mount, fixed subassembly and speaker, the quantity of speaker is a plurality of, and is a plurality of the speaker passes through fixed subassembly installation and array in the mount.

The flat electrostatic sound box can have a higher sound field due to the adoption of a plurality of loudspeakers and the design of array distribution.

In addition, the flat electrostatic loudspeaker box provided by the embodiment of the application can also have the following additional technical characteristics:

in an alternative embodiment of the present application, a plurality of said loudspeakers are distributed in a rectangular array.

In an optional embodiment of the present application, the fixing assembly includes a fixing rear cover and a fixing member, the fixing frame includes positioning holes, and each of the speakers is disposed at the positioning holes through cooperation of the fixing rear cover and the fixing member.

The fixing frame with the positioning holes with determined quantity and positions is manufactured in advance, so that the loudspeaker can be more stably installed and meets the manufacturing requirements. For the case of a plurality of loudspeakers, the loudspeakers can be arrayed according to a given design, and the quality of products is guaranteed.

In an alternative embodiment of the present application, the speaker comprises: the array structure comprises a first PCB, a second PCB, an array hole gasket and an array film assembly;

the array type thin film assembly comprises an FPC and a plurality of thin film parts, the thin film parts are arrayed on the FPC, the array hole gasket comprises a plurality of thin film holes, one side of the array type thin film assembly is attached to the array hole gasket, each thin film part is contained in one thin film hole, the other side of the array type thin film assembly is attached to the second PCB, and one side, far away from the array type thin film assembly, of the array hole gasket is attached to the first PCB.

Because the array type film component has a plurality of film parts, the emitted sound can be superposed, and compared with the single-film electrostatic loudspeaker, the sound field and the sensitivity are improved.

In an alternative embodiment of the present application, the first PCB boards of a plurality of the speakers are connected in parallel by a wire or a metal conductor.

Specifically, a lead or a metal conductor is adopted, and can be selected according to the condition of the installation space so as to meet the production requirement or the product requirement.

In an alternative embodiment of the present application, the second PCB boards of a plurality of the speakers are connected in parallel by a wire or a metal conductor.

In an alternative embodiment of the present application, the FPCs of a plurality of the speakers are connected in parallel by a wire or a metal conductor.

In an alternative embodiment of the present application, the number of the speakers is 9, and the 9 speakers are distributed in a squared figure.

In an optional embodiment of the present application, the fixing frame is provided with a parallel groove, and the parallel groove is used for embedding a wire or a metal conductor.

The parallel connection groove can enable the lead or the metal conductor to have a determined installation position, so that the assembly is convenient, and the lead or the metal conductor is prevented from protruding to occupy unnecessary space.

In an optional embodiment of the present application, the flat panel electrostatic sound box further includes a front cover and/or a rear cover, and the front cover and/or the rear cover are mounted on the fixing frame.

By using a front cover and/or a rear cover, protection of the internal devices may be given.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.

Fig. 1 is a schematic view of a flat electrostatic loudspeaker provided in an embodiment of the present application;

FIG. 2 is an exploded view of FIG. 1;

FIG. 3 is a schematic view of FIG. 1 with the front cover hidden;

FIG. 4 is a schematic view of FIG. 3 with the first connecting conductor hidden;

FIG. 5 is a schematic view of the rear cover of FIG. 1 with the rear cover removed;

FIG. 6 is a schematic view of FIG. 5 with the second and third connecting conductors hidden;

FIG. 7 is an exploded view of the speaker and the mounting bracket and mounting assembly;

fig. 8 is an exploded view of the speaker.

Icon: 100-flat electrostatic speaker; 10-a fixing frame; 11-a positioning hole; 12-a first parallel tank; 13-a second parallel tank; 14-a third parallel tank; 30-a stationary component; 31-fixing the rear cover; 33-a fixing member; 50-a loudspeaker; 51-a first PCB board; 52-a second PCB board; 53-array well spacer; 54-an array membrane module; 541-FPC; 542-thin film portion; 61-a first connection conductor; 612-first bus arm; 614-first branch arm; 616-a first contact; 62-a second connecting conductor; 622-second bus arm; 624-second branch arm; 626-a second contact; 63-a third connecting conductor; 632-third bus arm; 634-a third branch arm; 70-a front cover; 90-rear cover.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present application, it should be noted that the terms "inside", "outside", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that the product conventionally places when used, and are only used for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.

In the description of the present application, it is also to be noted that, unless otherwise explicitly specified or limited, the terms "disposed" and "connected" are to be interpreted broadly, e.g., as being either fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

Examples

Referring to fig. 1 to 7, an embodiment of the present application provides a flat panel electrostatic speaker 100, which includes a fixing frame 10, a fixing component 30, and a plurality of speakers 50, wherein the plurality of speakers 50 are mounted on the fixing frame 10 through the fixing component 30 and are arrayed on the fixing frame.

Specifically, the plurality of speakers 50 of the present application are distributed in a rectangular array. Further, the number of the speakers 50 in this embodiment is 9, and the 9 speakers 50 are distributed in a squared figure.

Because the plurality of speakers 50 are arranged in an array, when all the speakers 50 produce sound simultaneously, the sound pressures of the plurality of speakers 50 can be superposed, and the flat panel electrostatic loudspeaker box 100 can have a higher sound field, that is, the loudness of the whole flat panel electrostatic loudspeaker box 100 is increased. For example, the speakers 50 used are all 80dB, and according to the sound pressure calculation formula:

L＝10log₁₀(10^(L1/10)+10^(L2/10)+10^(L3/10)+…+10^(Ln/10))

it can be calculated that when 9 80dB speakers 50 are simultaneously sounding, the sound pressure will increase to L10 log by superposition₁₀(9*10^(80/10))＝89.5dB。

It can be understood that, because there are a plurality of speakers 50, each speaker 50 can play audio, and when adjusting the audio, the feedback accuracy of the plurality of speakers 50 is higher than that of a single common speaker, so that the sound adjustment is more delicate, the response is more sensitive, and the sound source after the analysis can be better presented.

The number and distribution of the speakers 50 are merely examples, and it is not necessary to design the speakers in such a number and distribution.

For example, when there are 10 80dB speakers 50, the sound pressure after superposition will reach 90dB through formula calculation, and the loudness is also improved.

Specifically, in this embodiment, the flat panel electrostatic sound box 100 further includes a front cover 70 and/or a rear cover 90, and the front cover 70 and/or the rear cover 90 are mounted on the fixing frame 10. Protection for the internal components may be afforded by the use of the front cover 70 and/or the rear cover 90. That is, only the front cover 70 or only the rear cover 90 may be provided, in this embodiment, both the front cover 70 and the rear cover 90 are used, and both the front cover 70 and the rear cover 90 have meshes, so as to prevent the transmission of sound and the operation of internal devices such as the speaker 50 from being affected by the entering of foreign matters.

Specifically, referring to fig. 8, the speaker 50 of the present embodiment includes: a first PCB 51, a second PCB 52, an array hole pad 53, and an array film assembly 54;

the array type thin film assembly 54 comprises an FPC541 and a plurality of thin film portions 542, the plurality of thin film portions 542 are arrayed on the FPC541, the array hole gasket 53 comprises a plurality of thin film holes, one side of the array type thin film assembly 54 is attached to the array hole gasket 53, each thin film portion 542 is accommodated by one thin film hole, the other side of the array type thin film assembly 54 is attached to the second PCB 52, and one side of the array hole gasket 53, which is far away from the array type thin film assembly 54, is attached to the first PCB 51. Wherein, a plurality of thin film portions 542 may be covered on the FPC541 by a thin film, and then pressed into a plurality of thin film portions 542 when the array empty spacer 53 is fitted; alternatively, a plurality of small films may be directly formed on the FPC541 separately.

The number of the thin film portions 542 in this embodiment is seven, one of which is at the center position, and the remaining six thin film portions 542 are distributed in a centrosymmetric manner with reference to the thin film portion 542 at the center position. This distribution makes it possible to provide a large number of thin film portions 542 on the FPC541 to make full use of the space, and also makes it easy to superimpose the sound field when the plurality of thin film portions 542 produce sound, thereby improving the sound field and sensitivity.

The film of the film portion 542 is a nano film, and after the sound pressures of the plurality of film portions 542 are superposed, the sound pressures can meet the use requirements, and under the same or even better sound field effect, the whole area of the film portion 542 can be smaller than that of the diaphragm of a single common electrostatic speaker, and the thickness can be correspondingly reduced. Thus, the distance between the first PCB 51 and the second PCB 52 is smaller than the distance between the two side plates of the diaphragm of the conventional electrostatic speaker, so that the response sensitivity of the single speaker 50 is improved, and the improvement of the sensitivity of the entire flat electrostatic speaker 100 is also facilitated.

The first PCB 51 and the second PCB 52 each have a plurality of copper foil surfaces distributed in an array, and each copper foil surface corresponds to one thin film portion 542. The copper foil surfaces of the two PCB boards are oppositely arranged.

Since there are a plurality of thin film portions 542 of the array type thin film assembly 54, the emitted sound can be superimposed, and both the sound field and the sensitivity can be improved compared to the single thin film electrostatic speaker 50. The above formula can be referred to as the superposition formula of the sound pressure.

Referring to fig. 7, the fixing assembly 30 of the present embodiment includes a fixing rear cover 31 and a fixing member 33, the fixing frame 10 includes a positioning hole 11, and each speaker 50 is disposed at the positioning hole 11 by the cooperation of the fixing rear cover 31 and the fixing member 33. In this embodiment, the fixing members 33 are screws, screw holes are formed in four corners of the fixing rear cover 31, the fixing rear cover 31 and the fixing frame 10 can be screwed together by the screws, the fixing rear cover 31 presses the speaker 50 on the fixing frame 10, the speaker 50 is aligned to the corresponding positioning holes 11, and the positioning holes 11 are convenient for determining the installation position of the speaker 50 and do not block sound of the speaker 50.

The number of the fixed rear covers 31 in this embodiment is 9, and each of the fixed rear covers corresponds to one speaker 50. Instead of separately providing the discrete fixed back covers 31, a plurality of fixed back covers 31 may be selectively coupled to form a uniform fixed back cover, so that the speaker 50 can be fixed for each speaker, and it is possible to reduce the amount of screws used and reduce the time required to lock the screws. Of course, this is only an option, and the separate arrangement of the fixed rear cover 31 of the present embodiment can facilitate the work of performing individual repair and maintenance and the like for each speaker 50 without removing the fixed rear covers 31 of all speakers 50 at the same time.

The mounting of the speaker 50 can be made more stable and consistent with the manufacturing requirements by pre-manufacturing the fixing frame 10 with a certain number and position of positioning holes 11. In the case of a plurality of speakers 50, the plurality of speakers 50 may be arrayed according to a predetermined design, thereby ensuring the quality of the product. That is, the arrangement positions of the speakers 50 can be designed in advance, and then the corresponding positioning holes 11 and the screw holes beside the positioning holes 11 are formed, so that the speakers 50 can be conveniently installed in place by the fixed rear cover 31 and the screws in the subsequent production process according to the design, the assembly errors caused by the difference of manual installation operation are reduced, and the product quality is improved.

After the plurality of speakers 50 are mounted to the fixing frame 10 in an array form by the fixing member 30, it is further necessary to electrically connect the respective speakers 50.

In detail, the first PCB boards 51 of the plurality of speakers 50 are connected in parallel by a wire or a metal conductor. In detail, the second PCB boards 52 of the plurality of speakers 50 are connected in parallel by a wire or a metal conductor. In detail, the FPCs 541 of the plurality of speakers 50 are connected in parallel by a wire or a metal conductor.

Further, the fixing frame 10 of the present embodiment is provided with a parallel groove for embedding a wire or a metal conductor. The parallel connection groove can enable the lead or the metal conductor to have a determined installation position, so that the assembly is convenient, and the lead or the metal conductor is prevented from protruding to occupy unnecessary space. It is beneficial to avoid the disorder of the lines or the mutual interference, and it is also beneficial to reduce the thickness of the whole flat electrostatic speaker 100.

It can be understood that the plurality of speakers 50 are connected in parallel, and even if a single speaker 50 fails in a long-term use process, the whole flat electrostatic speaker 100 can continue to operate, thereby avoiding the situation that the common electrostatic speaker cannot operate or the operation effect is greatly reduced once the speaker fails.

In addition, because the parallel connection groove can be designed in advance, the wiring position can be conveniently determined by an assembler, and the wiring accuracy is guaranteed.

Referring to fig. 4 and 6, in detail, the fixing frame 10 of the present embodiment is provided with a first parallel groove 12, a second parallel groove 13 and a third parallel groove 14. Referring to fig. 2, 3 and 5, the first PCB boards 51 of the plurality of speakers 50 are connected in parallel by the first connecting conductor 61; the second PCB boards 52 of the plurality of speakers 50 are connected in parallel by the second connecting conductor 62; the FPCs 541 of the plurality of speakers 50 are connected in parallel through the third connecting conductor 63.

More specifically, the first connecting conductor 61 is fitted in the first parallel groove 12, the second connecting conductor 62 is fitted in the second parallel groove 13, and the third connecting conductor 63 is fitted in the third parallel groove 14. After the plurality of speakers 50 are installed in place, an operator only needs to directly embed each connecting conductor into the corresponding parallel groove, so that the parallel connection of the first PCB 51, the second PCB 52 and the FPC541 of the plurality of speakers 50 can be realized, the connection point positions of each speaker 50 do not need to be respectively connected, the time is saved, the labor intensity is reduced, and the assembly accuracy can be improved.

Referring to fig. 2, in addition, the first connecting conductor 61 of the present embodiment includes a first bus arm 612, a first branch arm 614 and a first contact 616, wherein the plurality of first branch arms 614 are connected to the first bus arm 612, and each first branch arm 614 is provided with the first contact 616; the second connecting conductor 62 includes a second bus arm 622, a plurality of second branch arms 624, each of which is connected to the second bus arm 622, and a second contact 626, each of the second branch arms 624 being provided with the second contact 626; the third connecting conductor 63 includes a third bus arm 632 and a third branch arm 634, and the plurality of third branch arms 634 are all connected to the third bus arm 632. Then, the first bus arm 612, and the first bus arm 612 are connected to the power supply module to form a loop, respectively.

Taking 9 speakers 50 of this embodiment as an example, 9 speakers 50 are arranged in a grid of nine squares, and every three speakers 50 are in a row, the first PCB 51 of one row corresponds to one first branch arm 614, the first branch arm 614 has three first contacts 616, which correspond to the respective first PCB 51 of three speakers 50, and then the three first branch arms 614 are all connected to the same first bus arm 612, which not only ensures accurate connection of a plurality of first PCBs 51 and avoids misconnection or misconnection, but also prevents cables from winding around each other.

Similarly, the second PCB 52 of a row corresponds to a second branch arm 624, the second branch arm 624 has three second contacts 626 corresponding to the second PCB 52 of each of the three speakers 50, and then the three second branch arms 624 are all connected to the same second bus arm 622; the FPC541 in one row has one third branch arm 634, and then the three third branch arms 634 are all connected to the same third bus arm 632, and the third branch arm 634 in this embodiment is not provided with a contact, but it should be understood that the contact cannot be provided without limitation.

In this way, in the case where the speaker 50 itself has a plurality of thin film portions 542 distributed in an array to enhance the loudness of a single speaker 50 in a superimposed manner, the flat panel electrostatic loudspeaker box 100 further arrays a plurality of speakers 50, so that the plurality of speakers 50 are superimposed, and thus, compared with a common electrostatic loudspeaker box, a sound field and sensitivity can be better. The conventional electrostatic speaker is a speaker in the form of a single diaphragm, and its loudness is inferior to the flat electrostatic speaker 100 of the present embodiment by practice.

And once the loudspeaker 50 is damaged, the whole sound box can not work continuously, which is not as practical as the flat electrostatic sound box 100 of the embodiment. The flat electrostatic speaker 100 of the present application uses the speaker 50 with the array of the plurality of thin film portions 542, so that the distance between the two PCB boards is small, the transmission stability is better, and the influence of the current of the external environment or other interference signals can be reduced. The problem that the spacing between the polar plates cannot be reduced due to the fact that a single vibrating membrane of a common sound box is too large is solved.

In summary, the flat panel electrostatic speaker 100 of the present application has a plurality of speakers 50 arrayed, and the plurality of speakers 50 are mounted to the fixing frame 10 through the fixing member 30 to form a stable connection. The plurality of speakers 50 can superimpose sounds on each other so that the sound field and sensitivity are improved.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A flat electrostatic sound box is characterized by comprising a fixing frame, a fixing component and a plurality of loudspeakers, wherein the loudspeakers are arranged on the fixing frame through the fixing component in an array mode; the loudspeakers are distributed in a rectangular array;

the speaker includes: the array structure comprises a first PCB, a second PCB, an array hole gasket and an array film assembly;

the array type thin film assembly comprises an FPC and a plurality of thin film parts, the thin films of the thin film parts are nano thin films, the thin films are arrayed on the FPC in a plurality of modes, the array hole gasket comprises a plurality of thin film holes, one side of the array type thin film assembly is attached to the array hole gasket, each thin film part is contained in one thin film hole, the other side of the array type thin film assembly is attached to the second PCB, and one side, far away from the array type thin film assembly, of the array hole gasket is attached to the first PCB.

2. The planar electrostatic speaker as claimed in claim 1, wherein the fixing member includes a fixing back cover and a fixing member, the fixing frame includes a positioning hole, and each of the speakers is disposed at the positioning hole by the cooperation of the fixing back cover and the fixing member.

3. The planar electrostatic loudspeaker of claim 1, wherein the first PCB boards of a plurality of the loudspeakers are connected in parallel by a wire or a metal conductor.

4. The planar electrostatic speaker of claim 1, wherein the second PCB boards of a plurality of the speakers are connected in parallel by a wire or a metal conductor.

5. The flat panel electrostatic speaker as claimed in claim 1, wherein the FPCs of a plurality of the speakers are connected in parallel by a wire or a metal conductor.

6. The planar electrostatic loudspeaker of claim 1, wherein the number of loudspeakers is 9, and the 9 loudspeakers are distributed in a grid pattern.

7. The planar electrostatic speaker as claimed in claim 1, wherein the fixing frame is provided with parallel grooves for embedding wires or metal conductors.

8. The planar electrostatic sound box according to claim 1, further comprising a front cover and/or a back cover, wherein the front cover and/or the back cover is mounted to the fixing frame.