CN112714371B

CN112714371B - Flat electrostatic sound box

Info

Publication number: CN112714371B
Application number: CN202011620955.9A
Authority: CN
Inventors: 刘科海; 杨方友; 张超; 杨秀华; 陈益; 王恩哥
Original assignee: Songshan Lake Materials Laboratory
Current assignee: Songshan Lake Materials Laboratory
Priority date: 2020-12-31
Filing date: 2020-12-31
Publication date: 2024-05-24
Anticipated expiration: 2040-12-31
Also published as: CN112714371A

Abstract

The application provides a flat electrostatic sound box, and relates to the technical field of sound boxes. The flat electrostatic sound box comprises a fixing frame, fixing components and a plurality of loudspeakers, wherein the loudspeakers are arranged on the fixing frame through the fixing components and are arrayed on the fixing frame. The flat electrostatic speaker box mounts a plurality of speaker arrays and a plurality of speakers to a mount through a fixing assembly to form a stable connection. The plurality of speakers can superimpose sounds on each other so that the sound field and sensitivity are improved.

Description

Flat electrostatic sound box

Technical Field

The application relates to the technical field of sound boxes, in particular to a flat electrostatic sound box.

Background

The array loudspeaker box arranges a plurality of loudspeakers according to a certain rule, and generally, each loudspeaker has the same amplitude and phase. The current common array loudspeaker box is mostly composed of a plurality of moving coil loudspeaker arrays.

However, as for the electrostatic type loudspeaker, the electrostatic type panel loudspeaker on the market is not ideal in terms of sound field, whether it is independent electrostatic type or combined type of electrostatic moving coil.

Disclosure of Invention

The application aims to provide a flat electrostatic sound box, which can solve the problem that the sound field of the traditional electrostatic sound box is not ideal.

Embodiments of the present application are implemented as follows:

the embodiment of the application provides a flat electrostatic sound box, which comprises a fixed frame, a fixed assembly and a plurality of loudspeakers, wherein the loudspeakers are arranged in number and are arranged on the fixed frame through the fixed assembly.

The flat electrostatic sound box can have higher sound field due to the adoption of a plurality of loudspeakers and the design of the loudspeakers to be distributed in an array.

In addition, the flat electrostatic sound box provided by the embodiment of the application can also have the following additional technical characteristics:

In an alternative embodiment of the application, a plurality of said loudspeakers are distributed in a rectangular array.

In an alternative embodiment of the application, the fixing assembly comprises a fixing rear cover and a fixing piece, the fixing frame comprises a positioning hole, and each loudspeaker is arranged at the positioning hole through the cooperation of the fixing rear cover and the fixing piece.

The fixing frame with the positioning holes with the determined number and the determined positions is manufactured in advance, so that the installation of the loudspeaker is more stable and meets the manufacturing requirements. In the case of a plurality of speakers, the plurality of speakers can be arrayed according to a given design, and the quality of products is guaranteed.

In an alternative embodiment of the application, a speaker comprises: the device comprises a first PCB, a second PCB, an array hole gasket and an array film assembly;

the array type film assembly comprises an FPC and a plurality of film portions, the film portions are arranged on the FPC in an array mode, the array hole gasket comprises a plurality of film holes, one side of the array type film assembly is attached to the array hole gasket, each film portion is respectively contained by one film hole, the other side of the array type film assembly is attached to the second PCB, and one side, far away from the array type film assembly, of the array hole gasket is attached to the first PCB.

Because the array type film component has a plurality of film parts, the emitted sound can be overlapped, and compared with the electrostatic loudspeaker with a single film, the sound field and the sensitivity of the array type film component are improved.

In an alternative embodiment of the application, the first PCB boards of the plurality of speakers are connected in parallel by metal conductors.

The metal conductor is adopted specifically, and the metal conductor can be selected according to the condition of the installation space so as to meet the production requirement or the product requirement.

In an alternative embodiment of the application, the second PCB boards of the plurality of speakers are connected in parallel by metal conductors.

In an alternative embodiment of the application, the FPCs of a plurality of the speakers are connected in parallel by metal conductors.

In an alternative embodiment of the application, the number of loudspeakers is 9, and the 9 loudspeakers are distributed in a nine-grid form.

In an alternative embodiment of the application, the fixing frame is provided with parallel grooves for embedding metal conductors.

The parallel grooves can enable the metal conductor to have a definite installation position, so that the assembly is convenient, and unnecessary space occupation caused by the protrusion of the metal conductor is avoided.

In an alternative embodiment of the present application, the flat electrostatic speaker further includes a front cover and/or a rear cover, and the front cover and/or the rear cover are/is mounted to the fixing frame.

By using a front cover and/or a rear cover, protection can be given to the internal components.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic diagram of a flat electrostatic speaker according to an embodiment of the present application;

FIG. 2 is an exploded view of FIG. 1;

FIG. 3 is a schematic view of the front cover of FIG. 1 with the front cover removed;

FIG. 4 is a schematic view of FIG. 3 with first connecting conductors hidden;

FIG. 5 is a schematic view of the hidden back cover of FIG. 1;

FIG. 6 is a schematic view of FIG. 5 with the second and third connecting conductors omitted;

FIG. 7 is an exploded view of a speaker and a mount, fixture assembly;

Fig. 8 is an exploded view of a speaker.

Icon: 100-a flat electrostatic sound box; 10-fixing frame; 11-positioning holes; 12-a first parallel groove; 13-a second parallel tank; 14-a third parallel groove; 30-fixing the assembly; 31-fixing the rear cover; 33-fixing piece; a 50-speaker; 51-a first PCB board; 52-a second PCB board; 53-array hole spacers; 54-array type film assembly; 541-FPC; 542-film portion; 61-a first connection conductor; 612—a first bus arm; 614-first branch arm; 616—first contact; 62-a second connection conductor; 622-second bus arm; 624-a second arm; 626-second contact; 63-a third connection conductor; 632-a third bus arm; 634-third branch arm; 70-front cover; 90-rear cover.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments of the present application. The components of the embodiments of the present application generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the application, as presented in the figures, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

In the description of the present application, it should be noted that the azimuth or positional relationship indicated by the terms "inner", "outer", etc. are based on the azimuth or positional relationship shown in the drawings, or the azimuth or positional relationship that the product is conventionally put in use, are merely for convenience of describing the present application and simplifying the description, and do not indicate or imply that the apparatus or elements to be referred to must have a specific azimuth, be configured and operated in a specific azimuth, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.

In the description of the present application, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed", "connected" and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.

Examples

Referring to fig. 1 to 7, an embodiment of the application provides a flat electrostatic speaker 100, which includes a fixing frame 10, a fixing assembly 30 and a plurality of speakers 50, wherein the plurality of speakers 50 are mounted on the fixing frame 10 through the fixing assembly 30 and are arrayed.

In particular, the plurality of speakers 50 of the present application are distributed in a rectangular array. Further, the number of speakers 50 in the present embodiment is 9, and the 9 speakers 50 are distributed in a nine-grid form.

Because the plurality of speakers 50 are adopted and are designed to be distributed in an array, when all the speakers 50 sound at the same time, the sound pressures of the plurality of speakers 50 can be overlapped, and the flat electrostatic speaker 100 can have a higher sound field, that is, the loudness of the whole flat electrostatic speaker 100 is increased. For example, the speakers 50 used are all 80dB, according to the sound pressure calculation formula:

L=10 log₁₀(10^(L1/10) +10^(L2/10)+10^(L3/10)+⋯+10^(Ln/10))

It can be calculated that when 9 speakers 50 of 80dB are simultaneously sounding, their sound pressure will increase to l=10log ₁₀ (9×10 (80/10))=89.5 dB by superposition.

It can be appreciated that, because of the plurality of speakers 50, each speaker 50 can play audio, and when adjusting audio, the feedback accuracy of the plurality of speakers 50 is higher than that of a single common speaker, so that the adjustment of sound is finer and finer, the response is more sensitive, and the analyzed sound source can be better presented.

The number and distribution of speakers 50 is merely an example, and does not indicate that the number and distribution should be designed.

If there are 10 speakers 50 with 80dB, the sound pressure after superposition will reach 90dB through formula calculation, and the loudness is also improved.

Specifically, in the present embodiment, the flat electrostatic speaker 100 further includes a front cover 70 and/or a rear cover 90, and the front cover 70 and/or the rear cover 90 are mounted on the fixing frame 10. By using front cover 70 and/or rear cover 90, protection may be given to the internal components. That is, only the front cover 70 or only the rear cover 90 may be provided, and in this embodiment, both the front cover 70 and the rear cover 90 are used, and the front cover 70 and the rear cover 90 have mesh openings, so that the transmission of sound is not affected, and the operation of internal devices such as the speaker 50 is not affected by the entry of external impurities.

Specifically, referring to fig. 8, the speaker 50 of the present embodiment includes: a first PCB 51, a second PCB 52, an array aperture pad 53 and an array membrane assembly 54;

The array film assembly 54 includes an FPC541 and a plurality of film portions 542, the plurality of film portions 542 are arrayed on the FPC541, the array hole spacer 53 includes a plurality of film holes, one side of the array film assembly 54 is attached to the array hole spacer 53, each film portion 542 is respectively accommodated by one film hole, the other side of the array film assembly 54 is attached to the second PCB 52, and the side of the array hole spacer 53 away from the array film assembly 54 is attached to the first PCB 51. Wherein, the plurality of film portions 542 may be formed by covering one film on the FPC541 and then being pressed into the plurality of film portions 542 when the array blank 53 is mated; the flexible printed circuit board may be formed by directly and individually manufacturing a plurality of small films on the FPC 541.

The number of the film portions 542 in the present embodiment is seven, one of which is located at the center position, and the remaining six film portions 542 are distributed in a center-symmetrical manner with respect to the film portion 542 at the center position. On the one hand, the distribution mode can be used for arranging more film parts 542 on the FPC541, so that space is fully utilized, and on the other hand, sound field superposition is conveniently carried out when the film parts 542 sound, and therefore sound field and sensitivity are improved.

The thin film of the thin film portion 542 is a nano thin film, after the sound pressures of the thin film portions 542 are overlapped, the sound pressure can meet the use requirement, and under the same even better sound field effect, the whole area of the thin film portion 542 is smaller than the area of the diaphragm of a single common electrostatic loudspeaker, and the thickness can be reduced correspondingly. In this way, the space between the first PCB 51 and the second PCB 52 is smaller than the space between the plates on both sides of the diaphragm of the common electrostatic speaker, which improves the response sensitivity of the single speaker 50, thereby also being beneficial to improving the sensitivity of the whole flat electrostatic speaker 100.

The first PCB 51 and the second PCB 52 each have a plurality of copper foil surfaces distributed in an array, and each copper foil surface corresponds to one film portion 542. The copper foil surfaces of the two PCB boards are arranged oppositely.

Because of the plurality of membrane portions 542 of the array membrane assembly 54, the emitted sound may be superimposed and both the sound field and sensitivity may be improved over a single membrane electrostatic speaker 50. The above formula can be referred to as a superposition formula of sound pressures.

Referring to fig. 7, the fixing assembly 30 of the present embodiment includes a fixing rear cover 31 and a fixing member 33, the fixing frame 10 includes a positioning hole 11, and each speaker 50 is disposed at the positioning hole 11 by cooperation of the fixing rear cover 31 and the fixing member 33. In this embodiment, the fixing members 33 are screws, and screw holes are formed at four corners of the fixed back cover 31, and the fixed back cover 31 and the fixing frame 10 can be screwed together by the screws, the fixed back cover 31 compresses the speaker 50 on the fixing frame 10, and the speaker 50 is aligned to the corresponding positioning hole 11, and the positioning hole 11 is not only convenient for determining the installation position of the speaker 50, but also can not block the sound production of the speaker 50.

The number of the fixed rear covers 31 in the present embodiment is 9, and each corresponds to one speaker 50. In addition to providing separate fixed back covers 31, a plurality of fixed back covers 31 may be selectively coupled to form a unified fixed back cover plate, and fixation of each speaker 50 may be achieved, and screw use may be reduced, thereby reducing screw locking time. Of course, this is only an option, and the separate arrangement of the fixed rear cover 31 of the present embodiment can facilitate the maintenance work and the like for each speaker 50 individually without removing the fixed rear cover 31 of all speakers 50 at the same time.

By pre-manufacturing the holder 10 with a certain number and position of positioning holes 11, the mounting of the loudspeaker 50 can be made more stable and meet manufacturing requirements. In the case of a plurality of speakers 50, the plurality of speakers 50 may be arrayed according to a predetermined design, thereby ensuring the quality of the product. That is, the arrangement positions of the speakers 50 can be designed in advance, and then corresponding positioning holes 11 and screw holes beside the positioning holes 11 are formed, so that the speakers 50 can be conveniently installed in place by fixing the rear cover 31 and screws in the subsequent production process, assembly errors caused by differences of manual installation operations are reduced, and the quality of products is improved.

After a plurality of speakers 50 are mounted to the mount 10 in an array form through the fixing member 30, it is further necessary to electrically connect the respective speakers 50.

In detail, the first PCB 51 of the plurality of speakers 50 is connected in parallel through metal conductors. In detail, the second PCB boards 52 of the plurality of speakers 50 are connected in parallel through metal conductors. In detail, FPCs 541 of the plurality of speakers 50 are connected in parallel by metal conductors.

Further, the fixing frame 10 of the present embodiment is provided with parallel grooves for embedding metal conductors. The parallel grooves can enable the metal conductor to have a definite installation position, so that the assembly is convenient, and unnecessary space occupation caused by the protrusion of the metal conductor is avoided. The thickness of the whole flat electrostatic speaker 100 is advantageously reduced, while avoiding line confusion or mutual interference.

It will be appreciated that the plurality of speakers 50 are in parallel connection, and even if a failure occurs in an individual speaker 50 during a long-term use, the whole flat electrostatic speaker 100 can continue to operate, so as to avoid the situation that a common electrostatic speaker cannot operate or the operation effect is greatly compromised once the speaker fails.

In addition, because the parallel grooves can be designed in advance, the wiring position can be conveniently determined by an assembler, and the wiring accuracy is ensured.

Referring to fig. 4 and 6 in detail, the fixing frame 10 of the present embodiment is provided with a first parallel slot 12, a second parallel slot 13 and a third parallel slot 14. Referring to fig. 2, 3 and 5, the first PCB 51 of the plurality of speakers 50 is connected in parallel through the first connection conductor 61; the second PCB boards 52 of the plurality of speakers 50 are connected in parallel by the second connection conductors 62; the FPCs 541 of the plurality of speakers 50 are connected in parallel through the third connection conductor 63.

In more detail, the first connection conductor 61 is embedded in the first parallel groove 12, the second connection conductor 62 is embedded in the second parallel groove 13, and the third connection conductor 63 is embedded in the third parallel groove 14. After the plurality of speakers 50 are installed in place, an operator can realize the parallel connection of the first PCB 51, the second PCB 52 and the FPC541 of the plurality of speakers 50 by only embedding each connecting conductor into the corresponding parallel groove, and the connecting points of each speaker 50 are not required to be connected respectively, so that the time is saved, the labor intensity is reduced, and the assembly accuracy is improved.

Referring to fig. 2, the first connecting conductor 61 of the present embodiment further includes a first bus arm 612, a first sub-arm 614, and a first contact 616, where a plurality of first sub-arms 614 are connected to the first bus arm 612, and each of the first sub-arms 614 is provided with the first contact 616; the second connection conductor 62 includes a second bus arm 622, second branch arms 624, and second contacts 626, the plurality of second branch arms 624 are connected to the second bus arm 622, each second branch arm 624 is provided with a second contact 626; the third connection conductor 63 includes a third bus arm 632 and a third branch arm 634, and a plurality of third branch arms 634 are connected to the third bus arm 632. Then, the first bus bar 612, and the first bus bar 612 are respectively connected with the power supply module to form a loop.

Taking 9 speakers 50 of the embodiment as an example, the 9 speakers 50 are arranged in a nine-square grid, each three speakers 50 are arranged in a row, a first branch arm 614 is corresponding to the first PCB 51 of one row, three first contacts 616 are respectively arranged on the first branch arm 614 and correspond to the respective first PCBs 51 of the three speakers 50, and then the three first branch arms 614 are connected to the same first bus arm 612, so that the accurate connection of a plurality of first PCBs 51 is ensured, the wrong connection or missing connection is avoided, and the situation that cables are mutually wound is avoided.

Similarly, a row of second PCBs 52 corresponds to a second branch arm 624, the second branch arm 624 has three second contacts 626 thereon, which correspond to the respective second PCBs 52 of the three speakers 50, and then the three second branch arms 624 are all connected to the same second bus arm 622; one row of FPCs 541 corresponds to one third sub-arm 634, and then all three third sub-arms 634 are connected to the same third bus arm 632, and the third sub-arm 634 in this embodiment is not provided with a contact, but it should be understood that the contact is not limited to being provided.

In this way, in the case that the speaker 50 itself has the plurality of thin film portions 542 distributed in an array to superimpose and raise the loudness of a single speaker 50, the flat electrostatic speaker 100 further arrays the plurality of speakers 50, so that the plurality of speakers 50 are superimposed, and better sound field and sensitivity can be obtained than the common electrostatic speaker. A common electrostatic speaker is a single-diaphragm type speaker, and the loudness of the speaker is not as high as that of the flat electrostatic speaker 100 of the present embodiment by practice.

And once the speaker 50 is damaged, the whole speaker box cannot continue to operate, which is not practical as the flat electrostatic speaker 100 of the present embodiment. The flat electrostatic speaker 100 of the present application adopts the plurality of speakers 50 with the array of the film portions 542, and the distance between the two PCBs is small, so that the stability of transmission is better, and the influence of the current or other interference signals of the external environment can be reduced. The problem that the spacing between polar plates cannot be reduced due to overlarge single vibrating diaphragm of a common sound box is solved.

In summary, the flat electrostatic speaker 100 of the present application arrays the plurality of speakers 50, and the plurality of speakers 50 are mounted to the fixing frame 10 by the fixing assembly 30 to form a stable connection. The plurality of speakers 50 can superimpose sounds on each other so that the sound field and sensitivity are improved.

The above description is only of the preferred embodiments of the present application and is not intended to limit the present application, but various modifications and variations can be made to the present application by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. The flat electrostatic sound box is characterized by comprising a fixing frame, fixing components and a plurality of loudspeakers, wherein the loudspeakers are arranged in number and are arranged on the fixing frame through the fixing components;

the loudspeakers are distributed in a rectangular array;

The speaker includes:

The device comprises a first PCB, a second PCB, an array hole gasket and an array film assembly;

The array type film assembly comprises an FPC and a plurality of film parts, the film parts are arranged on the FPC in an array mode, the array hole gasket comprises a plurality of film holes, one side of the array type film assembly is attached to the array hole gasket, each film part is respectively contained by one film hole, the other side of the array type film assembly is attached to the second PCB, and one side, far away from the array type film assembly, of the array hole gasket is attached to the first PCB;

The fixing frame is provided with parallel grooves, and the parallel grooves are used for embedding metal conductors.

2. The flat panel electrostatic speaker of claim 1, wherein the fixing assembly comprises a fixed back cover and a fixing member, the fixing frame comprises a positioning hole, and each speaker is disposed at the positioning hole by cooperation of the fixed back cover and the fixing member.

3. The flat panel electrostatic speaker of claim 1, wherein said first PCB of said plurality of speakers are connected in parallel by metal conductors.

4. The flat panel electrostatic speaker of claim 1, wherein said second PCB of said plurality of speakers are connected in parallel by metal conductors.

5. The flat panel electrostatic speaker of claim 1, wherein said FPCs of a plurality of said speakers are connected in parallel by metal conductors.

6. The flat panel electrostatic speaker of claim 1, wherein the number of speakers is 9, and 9 of the speakers are distributed in a nine-grid pattern.

7. The flat panel electrostatic speaker of claim 1, further comprising a front cover and/or a rear cover, the front cover and/or the rear cover being mounted to the mount.