CN214280422U - Laser radar light source and laser radar - Google Patents
Laser radar light source and laser radar Download PDFInfo
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- CN214280422U CN214280422U CN202120216762.0U CN202120216762U CN214280422U CN 214280422 U CN214280422 U CN 214280422U CN 202120216762 U CN202120216762 U CN 202120216762U CN 214280422 U CN214280422 U CN 214280422U
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- light source
- heat sink
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- laser radar
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Abstract
The utility model provides a laser radar light source and a laser radar, which belong to the technical field of lasers and comprise a heat dissipation carrier, a drive plate, a heat sink, a light source chip and a cylindrical mirror; the driving board is arranged on the heat dissipation carrier; the heat sink is arranged on the heat dissipation carrier; the light source chip is arranged on the heat sink and electrically connected with the driving board; the cylindrical mirror is arranged on the heat sink and is positioned on the light-emitting side of the light source chip. The utility model provides a laser radar light source and laser radar has solved prior art light source chip and has set up on the drive plate, and the drive plate radiating effect is poor, causes the heat to gather easily, influences component and chip life's problem.
Description
Technical Field
The utility model belongs to the technical field of the laser instrument, more specifically say, relate to a laser radar light source and laser radar.
Background
Lidar is a system that detects and locates target information by emitting a laser beam. The working principle is to emit a detection signal (laser beam) to the target, then compare the received signal reflected from the target with the emitted signal, and after appropriate processing, the relevant information of the target can be obtained.
The laser emission light source is an important component of the laser radar, and the performance of the light source has great influence on the measurement precision, the measurement distance and the like of the laser radar. The light source is usually arranged on a driving board, the laser radar needs to increase the single pulse energy and the pulse repetition frequency in order to improve the detection distance and speed, so that a chip and a component packaged on the driving board generate a large amount of heat, the average heat conductivity of the driving board is only 6.5W/m.K, a large amount of heat can be accumulated on the driving board, the output power of the radar light source is reduced, the wavelength shifts, the temperature working range of the component and the chip is exceeded, and the service life of the radar light source is influenced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a laser radar light source and laser radar aims at solving prior art light source chip and sets up on the drive plate, and the drive plate radiating effect is poor, causes the heat to gather easily, influences component and chip life's problem.
In order to achieve the above object, the utility model adopts the following technical scheme: there is provided a lidar light source comprising:
a heat dissipation carrier;
the driving board is arranged on the heat dissipation carrier;
the heat sink is arranged on the heat dissipation carrier;
the light source chip is arranged on the heat sink and electrically connected with the driving board; and
and the cylindrical mirror is arranged on the heat sink and is positioned on the light-emitting side of the light source chip.
As another embodiment of the present application, the lidar light source further includes:
the chip anode bonding region is arranged on the driving board and is electrically connected with the light source chip; and
and the chip cathode bonding area is arranged on the driving plate and is electrically connected with the heat sink.
As another embodiment of the present application, a positioning line is disposed on the heat sink for defining a position of the light source chip.
As another embodiment of the present application, a support is further disposed on the heat sink, a positioning groove is disposed on the support, the cylindrical mirror is clamped in the positioning groove, and the support is used for limiting the position of the cylindrical mirror.
As another embodiment of the present application, a positioning block is disposed on the heat dissipation carrier, one side of the heat sink is attached to the positioning block, and the positioning block is used for limiting the position of the heat sink.
As another embodiment of the application, a positioning cavity is arranged on the heat dissipation carrier, and the bottom of the heat sink is embedded in the positioning cavity.
As another embodiment of the present application, the outer surface of the heat sink is provided with gold-tin solder, and the light source chip is fixed on the heat sink by the gold-tin solder.
As another embodiment of the present application, the driving board is connected to the heat dissipation carrier through a screw connector, or the driving board is bonded to the heat dissipation carrier.
As another embodiment of the present application, the core diameter of the cylindrical mirror is 50um-200 um.
The utility model provides a laser radar light source's beneficial effect lies in: compared with the prior art, the utility model discloses the laser radar light source passes through heat sink with the light source chip and sets up on the heat dissipation carrier. The heat dissipation efficiency of the heat dissipation carrier is superior to that of the driving board, and a large amount of heat generated when the single pulse energy and the pulse repetition frequency are increased is quickly dissipated outwards through the heat sink and the heat dissipation carrier. Meanwhile, other components are arranged on the driving board, the light source chip is arranged on the heat sink, the light source chip is not easy to generate heat transfer with other components, and the phenomenon that the service life of other components is influenced due to overhigh temperature is avoided.
The utility model also provides a laser radar, including above-mentioned arbitrary one the laser radar light source.
The utility model provides a laser radar's beneficial effect lies in: compared with the prior art, the utility model discloses laser radar has adopted foretell laser radar light source, and beneficial effect is similar with the beneficial effect of above-mentioned laser radar light source, no longer gives unnecessary details here.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a laser radar light source according to a first embodiment of the present invention;
FIG. 2 is an enlarged view of a portion A of FIG. 1;
FIG. 3 is a front view of FIG. 2;
fig. 4 is a bottom view of a portion a of a laser radar light source according to a first embodiment of the present invention;
fig. 5 is a bottom view of a portion a of a laser radar light source provided by the second embodiment of the present invention;
fig. 6 is a bottom view of a portion a of a laser radar light source provided in the third embodiment of the present invention;
fig. 7 is a front view of a portion a of a laser radar light source according to a fourth embodiment of the present invention.
In the figure: 1. a heat dissipation carrier; 2. a drive plate; 3. a heat sink; 4. a cylindrical mirror; 5. a light source chip; 6. a chip positive electrode bonding region; 7. a chip negative bonding region; 8. positioning a line; 9. a support; 10. and (5) positioning the blocks.
Detailed Description
In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1 and fig. 2 together, a laser radar light source according to the present invention will now be described. The laser radar light source comprises a heat dissipation carrier 1, a driving board 2, a heat sink 3, a light source chip 5 and a cylindrical mirror 4; the driving board 2 is arranged on the heat dissipation carrier 1; the heat sink 3 is arranged on the heat dissipation carrier 1; the light source chip 5 is arranged on the heat sink 3, and the light source chip 5 is electrically connected with the driving board 2; the cylindrical mirror 4 is arranged on the heat sink 3 and is positioned on the light-emitting side of the light source chip 5.
The utility model provides a laser radar light source, compared with the prior art, the utility model discloses laser radar light source sets up light source chip 5 on heat dissipation carrier 1 through heat sink 3. The heat dissipation efficiency of the heat dissipation carrier 1 is superior to that of the driving board 2, and a large amount of heat generated when the single pulse energy and the pulse repetition frequency are increased is rapidly dissipated through the heat sink 3 and the heat dissipation carrier 1. Meanwhile, other components are arranged on the driving board 2, the light source chip 5 is arranged on the heat sink 3, the light source chip 5 is not easy to generate heat transfer with other components, and the service life of the other components is prevented from being influenced by overhigh temperature.
Preferably, the heat sink 3 is an aluminum nitride member, and the thermal conductivity of aluminum nitride is 170W/mK-200W/mK.
Preferably, the heat dissipation carrier 1 is an oxygen-free copper member having a thermal conductivity of 398W/m · K, which is several tens times higher than that of the conventional PCB driving board 2.
Preferably, the heat sink 3 is spaced from the driving board 2 by a certain distance to prevent the heat sink 3 from contacting the driving board 2 to generate heat transfer.
Specifically, the driving board 2 is a PCB driving board.
As a specific implementation manner of the laser radar light source provided by the present invention, please refer to fig. 2 to 3, the laser radar light source further includes a chip positive bonding region 6 and a chip negative bonding region 7, the chip positive bonding region 6 is disposed on the driving board 2 and electrically connected to the light source chip 5; the chip cathode bonding area 7 is arranged on the driving plate 2 and is electrically connected with the heat sink 3.
In this embodiment, the light source chip 5 is electrically connected to the chip positive bonding area 6, and the heat sink 3 is electrically connected to the chip negative bonding area 7, so that the light source chip 5, the heat sink 3, the positive bonding area, and the chip negative bonding area 7 form a closed loop, and the light source chip 5 emits light.
Specifically, the light source chip 5 is connected with a chip anode bonding area 6 through a bonding alloy wire, the heat sink 3 is connected with a chip cathode bonding area 7 through a bonding alloy wire, and the bonding alloy wire is an inner lead material with excellent electrical, thermal and mechanical properties and chemical stability and mainly used as a semiconductor key packaging material. The LED packaging structure has the advantages that a wire is connected in the LED packaging structure, the surface electrode of the chip is connected with the support 9, and when current is conducted, the current enters the chip through the gold wire, so that the chip emits light.
As a specific implementation manner of the embodiment of the present invention, please refer to fig. 7, a positioning line 8 is disposed on the heat sink 3 for limiting the position of the light source chip 5.
Set up location line 8 on heat sink 3, light source chip 5 makes light source chip 5 fix on heat sink 3 with 8 laminating of location line, can be accurate to light source chip 5 location, take place the dislocation when avoiding light source chip 5 to fix, improved the efficiency of light source chip 5 installation. The positioning line 8 is arranged on the heat sink 3 by adopting an etching method, the etching precision can reach the level of mum or sub-mum, and the alignment precision is effectively improved.
As a specific implementation manner of the embodiment of the present invention, refer to fig. 4 and 5, a support 9 is further disposed on the heat sink 3, a positioning groove is disposed on the support 9, the cylindrical mirror 4 is clamped in the positioning groove, and the support 9 is used for limiting the position of the cylindrical mirror 4.
The bracket 9 is fixed on the heat sink 3, and when the cylindrical mirror 4 is installed, the cylindrical mirror 4 is clamped into the positioning groove and fixed by ultraviolet glue. The ultraviolet adhesive is high in curing speed, and can be cured within several seconds to dozens of seconds, so that the automatic production line is facilitated, and the labor production efficiency is improved. The outer periphery of the cylindrical mirror 4 is a cambered surface, and the positioning groove can conveniently position and clamp the cylindrical mirror 4, so that the cylindrical mirror 4 is prevented from moving.
Preferably, the positioning groove is a V-shaped groove body, the V-shaped groove body can be used for positioning the cylindrical mirrors 4 in various sizes, the universality is strong, the positioning requirements of the cylindrical mirrors 4 in different sizes can be met only by processing one type of positioning groove, and the cost is saved.
Preferably, the positioning groove is an arc-shaped groove body, the arc surface of the arc-shaped groove body is matched with the outer peripheral surface of the cylindrical mirror 4, the contact area of the arc-shaped groove body and the cylindrical mirror 4 is increased, and the stability of the cylindrical mirror 4 after installation is improved.
As a specific implementation manner of the embodiment of the present invention, please refer to fig. 3, a positioning block 10 is disposed on the heat dissipation carrier 1, one side of the heat sink 3 is attached to the positioning block 10, and the positioning block 10 is used to limit the position of the heat sink 3.
Set up locating piece 10 on heat dissipation carrier 1, when installing heat sink 3 with heat sink 3's a side and the laminating of locating piece 10, fix heat sink 3 on heat dissipation carrier 1, can be fast accurate install heat sink 3.
Specifically, locating piece 10 can set up one or more, and when locating piece 10 set up a plurality ofly, a plurality of locating pieces 10 end to end connection enclose in proper order and close the cavity that forms and hold heat sink 3, with heat sink 3 outer along the laminating in the inner wall of this cavity install can, increased the accuracy of location. Two opposite positioning blocks 10 may also be provided to limit two opposite sides of the heat sink 3.
As a specific implementation manner of the embodiment of the present invention, please refer to fig. 6, a positioning cavity is disposed on the heat dissipation carrier 1, and the bottom of the heat sink 3 is embedded in the positioning cavity.
Inlay the bottom with heat sink 3 and establish the intracavity in the location, improved the efficiency of installation, the difficult displacement that takes place of heat sink 3 has improved the stability of installation simultaneously in the use.
As a specific implementation of the embodiment of the present invention, not shown in the figure, the surface of the heat sink 3 is equipped with gold-tin solder, and the light source chip 5 is fixed on the heat sink 3 by the gold-tin solder welding.
When the light source chip 5 is installed, the gold-tin solder is heated at high temperature to melt the gold-tin solder, so that the light source chip 5 is subjected to die bonding, and then the heat sink 3 subjected to die bonding is sintered on the heat dissipation carrier 1 through the solder.
As a specific implementation manner of the embodiment of the present invention, please refer to fig. 1, the driving board 2 is connected to the heat dissipation carrier 1 through a threaded connection component, or the driving board 2 is bonded to the heat dissipation carrier 1.
The drive plate 2 and the heat dissipation carrier 1 are detachably connected through the threaded connecting piece, and the drive plate 2 is convenient to replace when the drive plate 2 is damaged. The driving plate 2 and the heat dissipation carrier 1 are fixedly connected through the adhesive, so that the operation is convenient, the driving plate 2 and the heat dissipation carrier 1 do not need to be punched, and the driving plate 2 or the heat dissipation carrier 1 is prevented from being damaged during punching. The connection mode of the driving board 2 and the heat dissipation carrier 1 can be selected according to actual needs.
As a specific implementation manner of the embodiment of the present invention, please refer to fig. 1 and fig. 2, the core diameter of the cylindrical mirror 4 is 50um-200 um.
The cylindrical lens 4 is placed at the front end of the light emitting surface of the light source chip 5, the cylindrical lens 4 is used for compressing the divergence angle of the fast axis, the core diameter of the cylindrical lens is selected from 50um to 200um, pre-shaping processing is achieved, and the volume of a rear-end shaping lens can be reduced.
The utility model also provides a laser radar ware. Referring to fig. 1, the lidar includes any one of the lidar light sources described above.
The utility model provides a laser radar has adopted above-mentioned laser radar light source, sets up light source chip 5 on heat dissipation carrier 1 through heat sink 3. The heat dissipation efficiency of the heat dissipation carrier 1 is superior to that of the driving board 2, and a large amount of heat generated when the single pulse energy and the pulse repetition frequency are increased is rapidly dissipated through the heat sink 3 and the heat dissipation carrier 1. Meanwhile, other components are arranged on the driving board 2, the light source chip 5 is arranged on the heat sink 3, the light source chip 5 is not easy to generate heat transfer with other components, and the service life of the other components is prevented from being influenced by overhigh temperature.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. Lidar light source, characterized by comprising:
a heat dissipation carrier;
the driving board is arranged on the heat dissipation carrier;
the heat sink is arranged on the heat dissipation carrier;
the light source chip is arranged on the heat sink and electrically connected with the driving board; and
and the cylindrical mirror is arranged on the heat sink and is positioned on the light-emitting side of the light source chip.
2. The lidar light source of claim 1, further comprising:
the chip anode bonding region is arranged on the driving board and is electrically connected with the light source chip; and
and the chip cathode bonding area is arranged on the driving plate and is electrically connected with the heat sink.
3. The lidar light source of claim 1, wherein the heat sink has a positioning line thereon for defining a position of the light source chip.
4. The lidar light source of claim 1, wherein the heat sink further comprises a bracket, the bracket having a positioning slot, the cylindrical mirror being snap-fitted into the positioning slot, the bracket being configured to define a position of the cylindrical mirror.
5. The lidar light source of claim 1, wherein a positioning block is disposed on the heat dissipation carrier, a side of the heat sink is attached to the positioning block, and the positioning block is used to limit the position of the heat sink.
6. The lidar light source of claim 1, wherein the heat dissipation carrier is provided with a positioning cavity, and the bottom of the heat sink is embedded in the positioning cavity.
7. The lidar light source of claim 1, wherein the heat sink has an outer surface provided with gold-tin solder, and the light source chip is fixed to the heat sink by gold-tin solder soldering.
8. The lidar light source of claim 1, wherein the driver board is coupled to the heat sink carrier via a threaded connection or the driver board is bonded to the heat sink carrier.
9. The lidar light source of claim 1, wherein the cylindrical mirror has a core diameter of 50um to 200 um.
10. Lidar characterized in that it comprises a lidar light source according to any of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120216762.0U CN214280422U (en) | 2021-01-26 | 2021-01-26 | Laser radar light source and laser radar |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120216762.0U CN214280422U (en) | 2021-01-26 | 2021-01-26 | Laser radar light source and laser radar |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214280422U true CN214280422U (en) | 2021-09-24 |
Family
ID=77768686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120216762.0U Active CN214280422U (en) | 2021-01-26 | 2021-01-26 | Laser radar light source and laser radar |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214280422U (en) |
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2021
- 2021-01-26 CN CN202120216762.0U patent/CN214280422U/en active Active
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