CN214256989U - Electronic system - Google Patents

Abstract

The utility model discloses an electronic system contains electron device and updraft ventilator. The electronic device comprises a plate body, a heat source and a conduction structure. The heat source is arranged on the plate body and is provided with a surface far away from the plate body. The conducting structure comprises an outer side wall and an inner side wall which are oppositely arranged, and the outer side wall is in contact with the surface and defines a space together. The conduction structure is provided with at least one first through hole and a plurality of second through holes, the first through hole is located on one side, far away from the outer side wall, of the inner side wall, the second through holes are located between the inner side wall and the outer side wall respectively, and the first through hole and the second through holes are communicated with the space respectively. The air extracting device is detachably arranged on one side, away from the heat source, of the conducting structure, communicated with the first through hole and configured to extract air in the space through the first through hole.

Description

Electronic system

Technical Field

The present invention relates to an electronic system, and more particularly to an electronic system with an air extracting device.

Background

With the progress of electronic technology, the function of the smart phone is improved for one thousand miles a day. Along with the change of life modes of people, the electric games on the smart phone are becoming more and more popular. To take advantage of this new business area, various developers have also pursued more diversified and more detailed games to attract the market owners.

However, in order to deal with these more and more complex games, the amount of information to be processed by the processor inside the smart phone at every moment becomes larger and larger, so that the load of the processor becomes higher and higher, and therefore, how to improve the heat dissipation effect of the smart phone to avoid the problem of overheating of the processor and the smart phone is an important development direction in the industry.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an air can effectively take away electron device's electronic system to the produced heat energy of heat source.

The utility model provides an electronic system contains electron device and updraft ventilator. The electronic device comprises a plate body, a heat source and a conduction structure. The heat source is arranged on the plate body and is provided with a surface far away from the plate body. The conducting structure comprises an outer side wall and an inner side wall which are oppositely arranged, and the outer side wall is in contact with the surface and defines a space together. The conduction structure is provided with at least one first through hole and a plurality of second through holes, the first through hole is located on one side, far away from the outer side wall, of the inner side wall, the second through holes are located between the inner side wall and the outer side wall respectively, and the first through hole and the second through holes are communicated with the space respectively. The air extracting device is detachably arranged on one side, away from the heat source, of the conducting structure, communicated with the first through hole and configured to extract air in the space through the first through hole.

In a preferred embodiment, the extractor comprises a tube, an extractor housing, and a fan; the pipe body is provided with a first end and a second end which are opposite, and the first end is connected with the inner side wall in an assembling and disassembling way and communicated with the first through hole; the air exhaust device shell is connected with the second end and is communicated with the pipe body; the fan is rotatably disposed in the extractor housing and configured to draw air from the space through the first aperture and the tube.

In a preferred embodiment, a plurality of second perforations surround the tube.

In a preferred embodiment, the tubular body is connected to the exhaust housing along the array direction, the tubular body has a first interior width perpendicular to the array direction, and the exhaust housing has a second interior width perpendicular to the array direction, the second interior width being greater than the first interior width.

In a preferred embodiment, the electronic system further comprises a front panel and a back panel; the plate body is located between panel and the backplate, and panel, plate body and backplate are parallel to each other, and the backplate has the third and perforates, and the lateral wall is at least partly located the third and perforates, and the outer wall of lateral wall is connected to the backplate to and have the clearance between the updraft ventilator casing.

In a preferred embodiment, the electronic system further comprises a cover, wherein the cover is configured to abut the back plate to cover the third through hole when the ventilator is detached from the inner sidewall.

In a preferred embodiment, the cover is pivotally connected to the back plate.

In a preferred embodiment, the cover is slidably connected to the back plate.

In a preferred embodiment, the outer side wall is annular.

In a preferred embodiment, the electronic system further comprises a sealing element located between the outer sidewall and the surface.

The utility model discloses an electronic system moves, and electron device moves and the heat source produces heat energy for air in the space heaies up, and updraft ventilator's fan is also corresponding rotation in the updraft ventilator casing, takes away through first perforation and body the air that heaies up in the space. After the air with the temperature increased in the space leaves the space through the first through hole and the pipe body, the air pressure in the space is correspondingly reduced, and at the moment, the air outside the electronic device can be sucked into the space through the gap and the second through hole successively due to the reduced air pressure in the space. As the air enters the space through the second perforations and then flows out of the space through the first perforations, the air can effectively carry away the thermal energy generated by the heat source away from the electronic device. That is to say, updraft ventilator can effectively dispel the heat to electron device's heat source.

In addition, when the user thinks that the heat energy generated by the heat source of the electronic device is not high during operation, the user can also choose not to install the air exhaust device on the electronic device, therefore, the electronic system can provide considerable use flexibility.

Drawings

Fig. 1 is a schematic perspective view of an electronic system according to an embodiment of the present invention.

Fig. 2 is a cross-sectional view taken along line a-a of fig. 1.

Fig. 3 is a front view of the electronic device of fig. 1.

Fig. 4 is a front view of the electronic device of fig. 1, wherein the cover covers the third through hole.

Fig. 5 is a partial cross-sectional view of an electronic system according to an embodiment of the invention.

Fig. 6 is a front view of an electronic device and a cover according to another embodiment of the present invention, wherein the cover is slidably connected to the back plate and exposes the third through hole.

Fig. 7 is a front view of the electronic device and the cover of fig. 6, wherein the cover is slidably connected to the back plate and covers the third through hole.

Fig. 8 is a front view of an electronic device and a cover rotatably connected to a back plate and exposing a third through hole according to an embodiment of the invention.

Fig. 9 is a front view of the electronic device and the cover of fig. 8, wherein the cover is rotatably connected to the back plate and covers the third through hole.

Fig. 10 is a side view of an electronic device and a cover rotatably connected to a back plate and exposing a third through hole according to an embodiment of the invention.

Fig. 11 is a side view of the electronic device and the cover of fig. 10, wherein the cover is rotatably connected to the back plate and covers the third through hole.

Detailed Description

Referring to fig. 1-2, an electronic system 100 includes an electronic device 110 and an air extracting device 120. In fact, the electronic device 110 may be a smart phone, a tablet computer, or a different electronic device, but the invention is not limited thereto. Specifically, the electronic device 110 includes a board 111, a heat source 112, and a conducting structure 114, where the conducting structure 114 includes an outer sidewall 1141 and an inner sidewall 1142, and the inner sidewall 1142 is disposed opposite to the outer sidewall 1141. The heat source 112 is disposed on the plate 111. For example, the heat source 112 may be a cpu or an image processor, and the plate 111 may be a circuit board or other structural plate, but the invention is not limited thereto. When the electronic device 110 is operating, the heat source 112 generates considerable heat energy. Again, the heat source 112 has a surface 113. The outer sidewall 1141 contacts the surface 113 of the heat source 112 and defines a space SP together with the surface 113. In an embodiment, the outer sidewall 1141 is annular, the conductive structure 114 further has at least one first through hole H1 and a plurality of second through holes H2, the first through hole H1 is located on a side of the inner sidewall 1142 away from the outer sidewall 1141, the second through holes H2 are respectively located between the inner sidewall 1142 and the outer sidewall 114, and the first through hole H1 and the second through hole H2 are respectively communicated with the space SP. In other embodiments, the number of the first through holes H1 may be plural. The ventilator 120 is detachably disposed on a side of the conducting structure 114 away from the heat source 112, and the ventilator 120 is connected to the first through hole H1 and configured to pump air in the space SP through the first through hole H1.

More specifically, as shown in FIG. 2, the extractor 120 includes a tube 121, an extractor housing 124, and a fan 125. The tube 121 has a first end 122 and a second end 123 opposite to each other, and the first end 122 is detachably connected to the inner sidewall 1142 of the conducting structure 114 and communicates with the first through hole H1. In one embodiment, the first end 122 of the tube 121 and the inner sidewall 1142 can be detachably connected to each other by a snap fit, a tolerance, or a screw thread coupling, but the invention is not limited thereto. Additionally, an air extractor housing 124 is coupled to the second end 123, the air extractor housing 124 and the tubular body 121 communicating with one another. The fan 125 is rotatably disposed in the ventilator housing 124, and the fan 125 is configured to draw air in the space SP through the first through hole H1 and the tube 121. In one embodiment, the second through hole H2 surrounds the first through hole H1, i.e., the second through hole H2 surrounds the tube 121. The fan 125 may be electrically connected to an internal power source (not shown) of the electronic device 110 or other external power sources (not shown) according to the actual situation, but the invention is not limited thereto.

Further, as shown in FIG. 2, the tubular body 121 of the drafts 120 is connected to the drafts case 124 along the arrangement direction DA, the tubular body 121 has a first inner width W1 perpendicular to the arrangement direction DA, and the drafts case 124 has a second inner width W2 perpendicular to the arrangement direction DA. In this embodiment, the second interior width W2 is greater than the first interior width W1 to facilitate the fan 125 being received by the extractor housing 124. In other embodiments, the second interior width W2 is equal to the first interior width W1.

Further, the electronic system 100 further includes a front panel 130 and a back panel 140. The face plate 130 and the back plate 140 are opposite to each other, the plate body 111 is located between the face plate 130 and the back plate 140, and the face plate 130, the plate body 111 and the back plate 140 are substantially parallel to each other. Furthermore, the back plate 140 has a third through hole H3, the outer wall 1141 is at least partially located in the third through hole H3, and the back plate 140 is connected to the outer wall surface of the outer wall 1141. Structurally, the first through hole H1 and the second through hole H2 are both located within the third through hole H3. In addition, it is noted that there is a gap GP between the back panel 140 and the id casing 124, i.e., the back panel 140 and the id casing 124 are spaced apart from each other.

When electronic system 100 is in operation, electronic device 110 is operated and heat source 112 generates heat energy to heat the air in space SP, and fan 125 of extractor 120 correspondingly rotates within extractor housing 124 to draw the heated air in space SP along hot air path RH through first aperture H1 and tube 121, as shown in FIG. 2. After the heated air in the space SP leaves the space SP through the first through hole H1 and the tube 121 along the hot air path RH, the air pressure in the space SP decreases accordingly, and at this time, the cold air outside the electronic device 110 is sucked into the space SP along the cold air path RC through the gap GP and the second through hole H2 due to the decreased air pressure in the space SP, as shown in fig. 2. As the air enters the space SP through the second perforation H2 along the cool air path RC and then exits the space SP through the first perforation H1 along the hot air path RH after being heated, the air can effectively carry away the thermal energy generated by the heat source 112 away from the electronic device 110. That is, the updraft device 120 can effectively dissipate heat from the heat source 112 of the electronic device 110.

In practical applications, when the user believes that the heat generated by heat source 112 of electronic device 110 is not high enough, the user may choose not to mount ventilator 120 to electronic device 110, and thus electronic system 100 provides considerable flexibility of use.

In addition, in the present embodiment, as shown in fig. 2, the electronic system 100 further includes a sealing element 160. The sealing member 160 is located between the outer sidewall 1141 and the surface 113, so that when the pressure of the space SP is reduced, air does not leak into the space SP through the gap between the outer sidewall 1141 and the surface 113, thereby facilitating the suction of air outside the electronic device 110 into the space SP through the second penetration hole H2.

Please refer to fig. 3-4. Fig. 3 is a front view of the electronic device 110 of fig. 1. Fig. 4 is a front view of the electronic device 110 in fig. 1, wherein the cover 150 covers the third through hole H3. In this embodiment, the electronic system 100 further includes a cover 150. As shown in FIG. 3, when the user thinks that the heat energy generated by the heat source 112 (see FIG. 2) of the electronic device 110 is not high, the user can detach the ventilator 120 (see FIGS. 1-2) from the inner sidewall 1142 of the electronic device 110. At this time, as shown in fig. 4, the user may abut the cover 150 against the back plate 140 to cover the third through hole H3, so as to prevent the internal structure of the electronic device 110 from being exposed to the external environment.

Please refer to fig. 5. Fig. 5 is a partial cross-sectional view of an electronic system 100 according to an embodiment of the invention. According to practical conditions, the electronic system 100 further comprises a dust screen 170 to prevent dust from entering the space SP. In this embodiment, as shown in fig. 5, the conducting structure 114 further includes a supporting ring 1143, the supporting ring 1143 is connected to a side of the inner wall 1142 away from the outer wall 1141, and the dust screen 170 is disposed on the supporting ring 1143, such that at least a portion of the dust screen 170 is located between the pipe body 121 and the supporting ring 1143. In practical applications, the dust-proof net 170 may be other perforated plates, but the present invention is not limited thereto.

Please refer to fig. 6-7. Fig. 6 is a front view of the electronic device 110 and the cover 150 according to another embodiment of the present invention, wherein the cover 150 is slidably connected to the back plate 140 and exposes the third through hole H3. Fig. 7 is a front view of the electronic device 110 and the cover 150 of fig. 6, wherein the cover 150 is slidably connected to the back plate 140 and covers the third through hole H3. In this embodiment, the cover 150 is slidably coupled to the back plate 140. As shown in fig. 6, the cover 150 does not cover the third through hole H3 and exposes the third through hole H3. As shown in fig. 7, the cover 150 slides relative to the back plate 140 to cover the third through hole H3, so as to prevent the internal structure of the electronic device 110 from being exposed to the external environment.

Please refer to fig. 8-9. Fig. 8 is a front view of the electronic device 110 and the cover 150 according to an embodiment of the invention, wherein the cover 150 is rotatably connected to the back plate 140 and exposes the third through hole H3. Fig. 9 is a front view of the electronic device 110 and the cover 150 of fig. 8, wherein the cover 150 is rotatably connected to the back plate 140 and covers the third through hole H3. In the present embodiment, the cover 150 is rotatably connected to the back plate 140. As shown in fig. 8, the cover 150 does not cover the third through hole H3 and exposes the third through hole H3. As shown in fig. 9, the cover 150 rotates relative to the back plate 140 to cover the third through hole H3, so as to prevent the internal structure of the electronic device 110 from being exposed to the external environment. In the present embodiment, the rotation axis X of the cover 150 rotating relative to the back plate 140 is substantially perpendicular to the back plate 140.

Please refer to fig. 10-11. Fig. 10 is a side view of the electronic device 110 and the cover 150 according to an embodiment of the invention, wherein the cover 150 is rotatably connected to the back plate 140 and exposes the third through hole H3. Fig. 11 is a side view of the electronic device 110 and the cover 150 of fig. 9, wherein the cover 150 is rotatably connected to the back plate 140 and covers the third through hole H3. In the present embodiment, the cover 150 is rotatably connected to the back plate 140. As shown in fig. 10, the cover 150 does not cover the third through hole H3 and exposes the third through hole H3. As shown in fig. 11, the cover 150 rotates relative to the back plate 140 to cover the third through hole H3, so as to prevent the internal structure of the electronic device 110 from being exposed to the external environment. In the present embodiment, the rotation axis X of the cover 150 rotating relative to the back plate 140 is substantially parallel to the back plate 140.

To sum up, the utility model discloses an electronic system moves, and electron device moves and the heat source produces heat energy for air in the space heaies up, and updraft ventilator's fan also corresponding rotation in updraft ventilator casing, takes away through first perforation and body the air that heaies up in the space. After the air with the temperature increased in the space leaves the space through the first through hole and the pipe body, the air pressure in the space is correspondingly reduced, and at the moment, the air outside the electronic device can be sucked into the space through the gap and the second through hole successively due to the reduced air pressure in the space. As the air enters the space through the second perforations and then flows out of the space through the first perforations, the air can effectively carry away the thermal energy generated by the heat source away from the electronic device. That is to say, updraft ventilator can effectively dispel the heat to electron device's heat source.

In addition, when the user thinks that the heat energy generated by the heat source of the electronic device is not high during operation, the user can also choose not to install the air exhaust device on the electronic device, therefore, the electronic system can provide considerable use flexibility.

Although the present invention has been described with reference to the above embodiments, it is not intended to limit the present invention, and those skilled in the art can make modifications and variations without departing from the spirit and scope of the present invention.

Claims (10)

1. An electronic system, comprising:

an electronic device, comprising:

a plate body;

a heat source disposed on the plate body and having a surface remote from the plate body;

the conducting structure comprises an outer side wall and an inner side wall which are oppositely arranged, the outer side wall is contacted with the surface and defines a space together, the conducting structure is provided with at least one first through hole and a plurality of second through holes, the first through hole is positioned on one side of the inner side wall, which is far away from the outer side wall, the plurality of second through holes are respectively positioned between the inner side wall and the outer side wall, and the first through hole and the plurality of second through holes are respectively communicated with the space; and

and the air exhaust device is detachably arranged on one side of the conducting structure, which is far away from the heat source, is communicated with the first through hole and is configured to pump air in the space away through the first through hole.

2. The electronic system of claim 1, wherein the air extraction assembly comprises:

the pipe body is provided with a first end and a second end which are opposite, and the first end is detachably connected with the inner side wall and communicated with the first through hole;

the air exhaust device shell is connected with the second end and communicated with the pipe body; and

a fan rotatably disposed within the extractor housing and configured to draw air from the space through the first aperture and the tube.

3. The electronic system of claim 2, wherein the second plurality of perforations surround the tube.

4. The electronic system of claim 2, wherein the tube is coupled to the air extractor housing along an alignment direction, the tube having a first interior width perpendicular to the alignment direction, the air extractor housing having a second interior width perpendicular to the alignment direction, the second interior width being greater than the first interior width.

5. The electronic system of claim 2, further comprising:

a panel; and

the backplate, the plate body is located the panel with between the backplate, the panel the plate body with the backplate is parallel to each other, the backplate has the third and perforates, the lateral wall is at least partially located the third is perforated, the backplate is connected the outer wall of lateral wall, and with the clearance has between the updraft ventilator casing.

6. The electronic system of claim 5, further comprising a cover, wherein the cover is configured to abut the back panel to cover the third aperture when the air extraction assembly is detached from the interior sidewall.

7. The electronic system of claim 6, wherein the cover is pivotally coupled to the backplane.

8. The electronic system of claim 6, wherein the cover is slidingly coupled to the backplane.

9. The electronic system of claim 1, wherein the outer sidewall is annular.

10. The electronic system of claim 1, further comprising a sealing element positioned between the outer sidewall and the surface.

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