CN213338624U

CN213338624U - SSD docking station with stable heat dissipation function

Info

Publication number: CN213338624U
Application number: CN202022233807.3U
Authority: CN
Inventors: 涂晶
Original assignee: Shenzhen Fanxiang Information Technology Co ltd
Current assignee: Shenzhen Fanxiang Information Technology Co ltd
Priority date: 2020-10-09
Filing date: 2020-10-09
Publication date: 2021-06-01
Anticipated expiration: 2030-10-09

Abstract

The utility model provides a pair of SSD docking station with stabilize heat dissipation function, include: the PCB is provided with an expansion interface assembly and an SSD slot, a heat dissipation copper pipe is arranged between the PCB and the outer shell, and the heat dissipation copper pipe covers the surface of the PCB and is tightly attached to the expansion interface assembly and the SSD slot; a heat dissipation fan is arranged at one end, located in the SSD slot, of the heat dissipation copper pipe, the heat dissipation fan penetrates through the pipe wall of the heat dissipation copper pipe and is communicated with the inner cavity of the heat dissipation copper pipe and the outside air, a heat dissipation port is arranged at the position, opposite to the heat dissipation fan, of the shell, and the heat dissipation port and the heat dissipation fan jointly form a heat dissipation air channel communicated with the inner cavity of the heat dissipation copper pipe; inside continuous S type bending structure through the heat dissipation copper pipe passes into heat dissipation copper pipe with electronic component' S in the docking station heat to take away the heat in the copper pipe through radiator fan, realize the whole comprehensive stable heat dissipation of docking station.

Description

SSD docking station with stable heat dissipation function

Technical Field

The utility model relates to a docking station technical field especially relates to a SSD docking station with stabilize heat dissipation function.

Background

A Docking station (Docking station), also called a Port Replicator (Port Replicator), is an external device specially designed for a notebook computer; the port of the notebook computer is copied and even expanded, so that the notebook computer can be conveniently connected with a plurality of accessories or external equipment (such as a power adapter, a network cable, a mouse, an external keyboard, a printer and an external display) in a one-stop mode; nowadays, it is common that more and more notebooks abandon various interfaces for various reasons, such as reducing USB interfaces and abandoning video interfaces. The docking station, simply a converter with multiple interfaces, can support the connection of multiple interface devices, so that the docking station becomes one of the essential accessories for many notebook users.

Present docking station on the market, because notebook computer's memory is limited, and the mode that can expand is restricted, the docking station that supports the expansion of SSD solid state dish begins to appear in succession, but, although external docking station, SSD is when working, the heat that docking station produced still is the problem that needs to regard as, operating temperature is too high can influence SSD's work efficiency and performance, present docking station that can support SSD, dispose heat abstractor in SSD male position, but produce heat not only SSD, whole docking station all can produce heat at the during operation, comprehensive heat dissipation can not be accomplished to this kind of heat dissipation mode, the urgent need a new heat dissipation mode, can be to the while of dispelling the heat of SSD, the heat of whole docking station also can be comprehensive discharge.

SUMMERY OF THE UTILITY MODEL

To the weak point that exists among the above-mentioned technique, the utility model provides a SSD docking station with stabilize heat dissipation function, the continuous S type through heat dissipation copper pipe is buckled the structure and is transfered heat dissipation copper intraductal electronic component' S heat with the docking station inside to take out the heat in the copper pipe through radiator fan, realize the holistic stable heat dissipation of docking station.

To achieve the above object, the present invention provides an SSD docking station with stable heat dissipation function, including: the PCB board is provided with an expansion interface component and an SSD slot, a heat dissipation copper pipe is arranged between the PCB board and the outer shell, and the heat dissipation copper pipe covers the surface of the PCB board and is tightly attached to the expansion interface component and the SSD slot; the heat dissipation copper pipe is characterized in that a heat dissipation fan is arranged at one end, located in the SSD slot, of the heat dissipation copper pipe, the heat dissipation fan penetrates through the pipe wall of the heat dissipation copper pipe and is communicated with the inner cavity of the heat dissipation copper pipe and the outside air, a heat dissipation opening is formed in the position, opposite to the heat dissipation fan, of the shell, and the heat dissipation opening and the heat dissipation fan jointly form a heat dissipation air channel communicated with the inner cavity of the heat dissipation copper pipe.

Preferably, the method comprises the following steps: the heat dissipation copper pipe is of a continuous S-shaped bent structure and is in close contact with the expansion interface assembly and the SSD slot.

Preferably, the method comprises the following steps: the heat dissipation copper pipe is kept away from radiator fan's one end has seted up a plurality of breather pipes, the casing still includes the center, the center with breather pipe relative position is provided with a plurality of air intakes, the breather pipe extends to air intake position and with air intake connection, form the air inlet wind channel of heat dissipation copper pipe.

Preferably, the method comprises the following steps: and the air inlet is covered with a dustproof net sheet.

Preferably, the method comprises the following steps: the pipe wall of the heat dissipation copper pipe, which is located at one end of the SSD slot, is provided with an air outlet, and the air outlet extends outwards and is connected with the heat dissipation fan to form an air draft air duct.

Preferably, the method comprises the following steps: the middle frame is provided with a connecting hole, and the expansion interface assembly is connected with the connecting hole and is connected with external equipment through the connecting hole.

Preferably, the method comprises the following steps: the expansion interface component comprises: any one or a combination of several of a Type-c interface, a USB3.0 interface, an HDMI interface, a TF card interface, an SD card interface and a PD interface.

Preferably, the method comprises the following steps: the middle frame is provided with a socket at a position opposite to the SSD card slot, one side of the socket is connected with a closing cover matched with the socket, and the closing cover is matched and connected with the socket to form a sealing structure of the socket.

Preferably, the method comprises the following steps: the cover is a rubber cover.

The utility model has the advantages that: compared with the prior art, the utility model provides a pair of SSD docking station with stabilize heat dissipation function, include: the PCB is provided with an expansion interface assembly and an SSD slot, a heat dissipation copper pipe is arranged between the PCB and the outer shell, and the heat dissipation copper pipe covers the surface of the PCB and is tightly attached to the expansion interface assembly and the SSD slot; a heat dissipation fan is arranged at one end, located in the SSD slot, of the heat dissipation copper pipe, the heat dissipation fan penetrates through the pipe wall of the heat dissipation copper pipe and is communicated with the inner cavity of the heat dissipation copper pipe and the outside air, a heat dissipation port is arranged at the position, opposite to the heat dissipation fan, of the shell, and the heat dissipation port and the heat dissipation fan jointly form a heat dissipation air channel communicated with the inner cavity of the heat dissipation copper pipe; inside continuous S type bending structure through the heat dissipation copper pipe passes into heat dissipation copper pipe with electronic component' S in the docking station heat to take away the heat in the copper pipe through radiator fan, realize the whole comprehensive stable heat dissipation of docking station.

Drawings

Fig. 1 is a first exploded view of the present invention;

fig. 2 is a second exploded view of the present invention;

fig. 3 is a cross-sectional view of the present invention.

The main element symbols are as follows:

1. a housing; 2. a PCB board; 3. an expansion interface component; 4. an SSD slot; 5. an air inlet; 6. a heat dissipation port; 7. a socket; 8. connecting holes; 9. a heat radiation fan; 10. a heat dissipation copper pipe; 11. a breather pipe; 12. and (5) a middle frame.

Detailed Description

In order to make the present invention clearer, the present invention will be further described with reference to the accompanying drawings.

Specifically, the present invention provides an SSD docking station with stable heat dissipation function, please refer to fig. 1-3, the docking station includes: the PCB 2 is provided with an expansion interface component 3 and an SSD slot 4, a heat dissipation copper pipe 10 is arranged between the PCB 2 and the outer shell 1, and the heat dissipation copper pipe 10 covers the surface of the PCB 2 and is tightly attached to the expansion interface component 3 and the SSD slot 4; a heat dissipation fan 9 is arranged at one end, located in the SSD slot 4, of the heat dissipation copper pipe 10, the heat dissipation fan 9 penetrates through the pipe wall of the heat dissipation copper pipe 10 to communicate the inner cavity of the heat dissipation copper pipe 10 with outside air, a heat dissipation port 6 is arranged at a position of the housing 1 opposite to the heat dissipation fan 9, and the heat dissipation port 6 and the heat dissipation fan 9 jointly form a heat dissipation air duct communicated with the inner cavity of the heat dissipation copper pipe 10; the heat dissipation copper pipe 10 is of a continuous S-shaped bent structure and is tightly contacted with the expansion interface component 3 and the SSD slot 4; traditional SSD docking station, mainly can produce a large amount of heats at the during operation to SSD, so mainly do more to the radiating design at SSD position, but in actual application process, the heat that other expansion interface subassemblies 3 produced also can not neglect at the during operation, and the heat that the SSD produced when working can spread all around, so only be unreasonable to the heat dissipation of SSD position, this application is through setting up the heat dissipation copper pipe 10 of continuous S type buckling structure, the copper pipe covers whole PCB board 2 simultaneously, and with expansion interface subassembly 3 and SSD slot 4 in close contact with, transmit the heat that expansion interface subassembly 3 and SSD slot 4 produced to the copper pipe inner chamber through the heat dissipation, rethread radiator fan 9 takes out and discharges, the effectual inside heat of whole device is stably discharged.

One embodiment mentions: the end, far away from the heat dissipation fan 9, of the heat dissipation copper pipe 10 is provided with a plurality of vent pipes 11, the shell 1 further comprises a middle frame 12, a plurality of air inlets 5 are arranged at the positions, opposite to the vent pipes 11, of the middle frame 12, and the vent pipes 11 extend to the positions of the air inlets 5 and are connected with the air inlets 5 to form an air inlet channel of the heat dissipation copper pipe 10; the air inlet 5 is covered with a dustproof net sheet; the air inlet 5 replaces the air with heat in the copper pipe with the outside normal temperature air through the extraction action of the cooling fan 9, and the dustproof net piece mainly isolates dust outside the net, so that the cooling copper pipe 10 is prevented from being blocked by the dust during long-time work.

One embodiment mentions: the pipe wall of the heat dissipation copper pipe 10 at one end of the SSD slot 4 is provided with an air outlet, and the air outlet extends outwards and is connected with a heat dissipation fan 9 to form an air exhaust duct; the copper pipe on the side of the SSD can be selectively set to be a wider copper pipe, so that the effect of expanding heat absorption at the SSD position can be achieved, and a better heat dissipation effect can be achieved on heat generated by the SSD.

One embodiment mentions: the middle frame 12 is provided with a connecting hole 8, the expansion interface component 3 is connected with the connecting hole 8, and is connected with external equipment through the connecting hole 8; the expansion interface component 3 includes: any one or a combination of several of a Type-c interface, a USB3.0 interface, an HDMI interface, a TF card interface, an SD card interface and a PD interface; through the arrangement of various interfaces, different interface devices are converted and connected to the notebook computer, so that the connectable range of the notebook computer with the originally limited connecting port is expanded.

One embodiment mentions: a socket 7 is arranged at the position of the middle frame 12 opposite to the SSD card slot, one side of the socket 7 is connected with a closing cover matched with the socket 7, and the closing cover is matched and connected with the socket 7 to form a sealing structure of the socket 7; wherein the cover is a rubber cover; the SSD card is inserted into the SSD card slot from the socket 7 to be matched with the SSD card slot and installed, the SSD slot 4 adopts SATA 6Gbps or NVME 32Gbps and is connected with a TYPE C host through a Type C line, an internal HUB control chip works, an extended USB channel is connected with a USB-to-SATA or NVME interface, and the SSD hard disk is connected with a corresponding interface to work; the computer end recognizes the hard disk and can normally use the hard disk.

The utility model has the advantages that:

1. inside continuous S type bending structure through the heat dissipation copper pipe passes into the heat dissipation copper pipe with electronic component' S in the docking station heat to take away the heat in the copper pipe through radiator fan, realize the holistic stable heat dissipation of docking station.

2. The air inlet is arranged for conveying normal-temperature air into the heat-dissipation copper pipe to replace air with heat, so that the heat in the copper pipe is continuously discharged and replaced, and the heat is stably dissipated.

The above disclosure is only for the specific embodiments of the present invention, but the present invention is not limited thereto, and any changes that can be made by those skilled in the art should fall within the protection scope of the present invention.

Claims

1. An SSD docking station with stabilized heat dissipation, comprising: the PCB board is provided with an expansion interface component and an SSD slot, a heat dissipation copper pipe is arranged between the PCB board and the shell, and the heat dissipation copper pipe covers the surface of the PCB board and is tightly attached to the expansion interface component and the SSD slot; the heat dissipation copper pipe is characterized in that a heat dissipation fan is arranged at one end, located in the SSD slot, of the heat dissipation copper pipe, the heat dissipation fan penetrates through the pipe wall of the heat dissipation copper pipe and is communicated with the inner cavity of the heat dissipation copper pipe and the outside air, a heat dissipation opening is formed in the position, opposite to the heat dissipation fan, of the shell, and the heat dissipation opening and the heat dissipation fan jointly form a heat dissipation air channel communicated with the inner cavity of the heat dissipation copper pipe.

2. The SSD docking station with stabilized heat dissipation of claim 1, wherein the heat dissipation copper tube is in a continuous S-shaped bent structure and is in close contact with the expansion interface assembly and the SSD slot.

3. The SSD docking station with stable heat dissipation function as claimed in claim 1, wherein a plurality of vent pipes are disposed at one end of the heat dissipation copper pipe away from the heat dissipation fan, the housing further comprises a middle frame, a plurality of air inlets are disposed at positions of the middle frame opposite to the vent pipes, and the vent pipes extend to the positions of the air inlets and are connected with the air inlets to form air inlet channels of the heat dissipation copper pipe.

4. The SSD docking station with stabilized heat dissipation function of claim 3, wherein the air intake is covered with a dust mesh.

5. The SSD docking station with the stable heat dissipation function of claim 1, wherein an air outlet is formed in a tube wall of the heat dissipation copper tube at one end of the SSD slot, and the air outlet extends outwards and is connected with the heat dissipation fan to form an air draft duct.

6. The SSD docking station with stabilized heat dissipation function of claim 3, wherein the middle frame is opened with a connection hole, and the expansion interface assembly is connected with the connection hole, and is connected with an external device through the connection hole.

7. The SSD docking station with stabilized heat dissipation function of claim 1, wherein the expansion interface assembly comprises: any one or a combination of several of a Type-c interface, a USB3.0 interface, an HDMI interface, a TF card interface, an SD card interface and a PD interface.

8. The SSD docking station with the stable heat dissipation function of claim 3, wherein a socket is formed in a position of the middle frame opposite to the SSD slot, a cover matched with the socket is connected to one side of the socket, and the cover is connected with the socket in a matched manner to form a sealing structure of the socket.

9. The SSD docking station with stabilized heat dissipation function of claim 8, wherein the cover is a rubber cover.