CN214254381U - Transfer system of micro light-emitting diode and micro light-emitting diode display panel - Google Patents
Transfer system of micro light-emitting diode and micro light-emitting diode display panel Download PDFInfo
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- CN214254381U CN214254381U CN202120592102.2U CN202120592102U CN214254381U CN 214254381 U CN214254381 U CN 214254381U CN 202120592102 U CN202120592102 U CN 202120592102U CN 214254381 U CN214254381 U CN 214254381U
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Abstract
The embodiment of the utility model discloses miniature emitting diode's transfer system and miniature emitting diode display panel, this transfer system includes load-bearing substrate and array substrate, and load-bearing substrate is used for bearing miniature emitting diode and shifts miniature emitting diode to array substrate, and one side that load-bearing substrate kept away from miniature emitting diode is provided with adsorption circuit; the array substrate is provided with a plurality of pixel areas, each pixel area is provided with a first bonding pad and a second bonding pad, and the first bonding pad and the second bonding pad are magnetic; the micro light-emitting diode comprises a first electrode and a second electrode, wherein the first electrode and the second electrode have magnetism; the magnetic pole at the first end of the first electrode and the magnetic pole at the second end of the first bonding pad are unlike magnetic poles, and the magnetic pole at the third end of the second electrode and the magnetic pole at the fourth end of the second bonding pad are unlike magnetic poles. The transfer system can transfer the micro light-emitting diode to the array substrate with high efficiency and high precision to obtain the micro light-emitting diode display panel.
Description
Technical Field
The embodiment of the utility model provides a relate to and show technical field, especially relate to a miniature emitting diode's transfer system and miniature emitting diode display panel.
Background
A Micro Light-Emitting Diode (Micro LED) is a micron-sized LED, and can be used as a pixel on a display panel, and the display panel manufactured by the Micro LED can be called a Micro LED display panel. In recent years, Micro LED display panels have become the focus of research in the current display technology field due to their advantages of low power consumption, high brightness, wide viewing angle, and the like.
The Micro LED display panel comprises an array substrate and a plurality of Micro LEDs arranged on the array substrate in an array mode, and each Micro LED can be regarded as one pixel. In the related art, a transfer device is generally adopted to transfer and place the Micro LEDs on the array substrate, and the Micro LEDs are soldered on the array substrate, so as to finally prepare the Micro LED display panel.
However, since the Micro LEDs are small in size and the number of pixels in the display panel is large, the problems of efficiency and alignment accuracy in the transfer process still remain to be solved.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides a miniature emitting diode's transfer system and miniature emitting diode display panel to high efficiency, high accuracy ground transfer miniature emitting diode to array substrate on, obtain miniature emitting diode display panel.
In a first aspect, embodiments of the present invention provide a micro light emitting diode transfer system, which includes a carrier substrate and an array substrate, wherein the carrier substrate is used for carrying micro light emitting diodes and transferring the micro light emitting diodes onto the array substrate,
an adsorption circuit is arranged on one side of the bearing substrate, which is far away from the micro light-emitting diode;
the array substrate is provided with a plurality of pixel areas, each pixel area is provided with a first bonding pad and a second bonding pad, the first bonding pad and the second bonding pad are provided with magnetism, each micro light-emitting diode comprises a first electrode and a second electrode, the first electrodes and the second electrodes are provided with magnetism, a magnetic pole at the first end of the first electrode and a magnetic pole at the second end of the first bonding pad are different magnetic poles, a magnetic pole at the third end of the second electrode and a magnetic pole at the fourth end of the second bonding pad are different magnetic poles, the first end of the first electrode is opposite to the second end of the first bonding pad, and the third end of the second electrode is opposite to the fourth end of the second bonding pad.
Optionally, the magnetic pole at the first end of the first electrode and the magnetic pole at the third end of the second electrode are unlike magnetic poles, and the magnetic pole at the second end of the first bonding pad and the magnetic pole at the fourth end of the second bonding pad are unlike magnetic poles.
Optionally, the plurality of pixel regions are arranged in an array of m rows × n columns; wherein m and n are positive integers;
the arrangement mode of the micro light-emitting diodes on the bearing substrate is the same as that of the pixel regions positioned in the odd-numbered rows or the even-numbered rows; alternatively, the first and second electrodes may be,
the arrangement mode of the micro light emitting diodes on the bearing substrate is the same as that of the pixel regions positioned in the odd columns or the even columns.
Optionally, the adsorption circuit is electrically connected with the controller, the adsorption circuit adsorbs the micro light emitting diode when the adsorption circuit is powered on, and releases the micro light emitting diode when the adsorption circuit is powered off.
Optionally, the carrier substrate is a flexible substrate and is rolled on the reel, and the micro light emitting diode is located on one side of the carrier substrate away from the reel.
Optionally, the adsorption circuit includes a plurality of adsorption modules, each adsorption module includes at least one electromagnet, and the plurality of adsorption modules are arranged along the spreading direction of the carrier substrate;
when the micro light-emitting diode is transferred, the controller controls the adsorption modules to be sequentially powered off along the unfolding direction of the bearing substrate.
Optionally, the electromagnets and the micro light emitting diodes are arranged in one-to-one correspondence.
Optionally, the carrier substrate is a planar substrate, and the adsorption circuit releases all the micro light emitting diodes on the carrier substrate at the same time.
Optionally, one side of the array substrate, which faces the carrier substrate, is provided with a plurality of grooves, the first pad and the second pad are both located in the grooves, and the height of the grooves is greater than the thickness of the first pad and the second pad along a direction perpendicular to a plane where the array substrate is located.
In a second aspect, the embodiment of the present invention further provides a micro light emitting diode display panel, the transfer system of the micro light emitting diode provided by the first aspect is transferred to obtain, and the micro light emitting diode display panel includes:
the array substrate is provided with a plurality of pixel areas, each pixel area is provided with a first bonding pad and a second bonding pad, and the first bonding pad and the second bonding pad are magnetic;
the micro light-emitting diodes comprise first electrodes and second electrodes, the first electrodes and the second electrodes are magnetic, magnetic poles of first ends of the first electrodes and magnetic poles of second ends of the first bonding pads are unlike magnetic poles, magnetic poles of third ends of the second electrodes and magnetic poles of fourth ends of the second bonding pads are unlike magnetic poles, the first ends of the first electrodes are opposite to the second ends of the first bonding pads, the third ends of the second electrodes are opposite to the fourth ends of the second bonding pads, the first electrodes are fixedly and electrically connected with the first bonding pads, and the second electrodes are fixedly and electrically connected with the second bonding pads.
The embodiment of the utility model provides a through set up the adsorption circuit in the one side that bearing substrate kept away from miniature emitting diode, can be through the adsorption circuit control to miniature emitting diode's adsorption affinity size to can utilize adsorption circuit to adsorb miniature emitting diode on bearing substrate before the transfer, and reduce the adsorption circuit to miniature emitting diode's adsorption affinity in the transfer process, in order to release miniature emitting diode, make it shift to the corresponding pixel district of array substrate, the transfer mode is simple high-efficient; furthermore, the embodiment of the utility model provides a first electrode and the second electrode through setting up miniature emitting diode have magnetism to and first pad and the second pad that sets up in the array substrate have magnetism, and make the magnetic pole of relative tip between electrode and the corresponding pad be the unlike magnetic pole, thereby can be at miniature emitting diode's release in-process, utilize unlike magnetic pole inter attraction, make miniature emitting diode's electrode and the pad that corresponds attract each other to both contacts, thereby can improve and shift the precision.
Drawings
Fig. 1 is a schematic structural diagram of a transfer system for micro light emitting diodes according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of another transfer system for micro light emitting diodes according to an embodiment of the present invention;
fig. 3 is a schematic diagram illustrating an arrangement of pixel regions on an array substrate in a transfer system according to an embodiment of the present invention;
FIG. 4 is a schematic view of the layout of micro light-emitting diodes on the carrier substrate corresponding to FIG. 3;
fig. 5 is a schematic structural diagram of another transfer system for micro light emitting diodes according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of a configuration of a chucking circuit on a carrier substrate in the transfer system corresponding to FIG. 5;
fig. 7 is a schematic structural diagram of a micro led display panel according to an embodiment of the present invention.
Reference numerals:
100-transfer system of micro light emitting diodes; 1-a carrier substrate; 2-an array substrate; 3-a micro light emitting diode; 31-a first electrode; 311-a first end; 32-a second electrode; 321-a third end; 4-a sorption circuit; 41-an adsorption module; 411-an electromagnet; 5-a pixel region; 51-a first pad; 511-a second end; 52-second pad; 521-a fourth end; 6-reel; 7-routing; 8-a groove; 9-soldering tin; 200-micro light emitting diode display panel.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
Fig. 1 is a schematic structural diagram of a transfer system for micro light emitting diodes according to an embodiment of the present invention, referring to fig. 1, the transfer system 100 for micro light emitting diodes includes a carrier substrate 1 and an array substrate 2, the carrier substrate 1 is used for carrying a micro light emitting diode 3 and transferring the micro light emitting diode 3 onto the array substrate 2; an adsorption circuit 4 is arranged on one side of the bearing substrate 1 far away from the micro light-emitting diode 3; the array substrate 2 has a plurality of pixel regions 5, each pixel region 5 having a first pad 51 and a second pad 52, the first pad 51 and the second pad 52 having magnetism; the micro light emitting diode 3 comprises a first electrode 31 and a second electrode 32, wherein the first electrode 31 and the second electrode 32 have magnetism; the magnetic pole at the first end 311 of the first electrode 31 and the magnetic pole at the second end 511 of the first bonding pad 51 are unlike magnetic poles, and the magnetic pole at the third end 321 of the second electrode 32 and the magnetic pole at the fourth end 521 of the second bonding pad 52 are unlike magnetic poles; the first end 311 of the first electrode 31 is opposite to the second end 511 of the first pad 51, and the third end 321 of the second electrode 32 is opposite to the fourth end 521 of the second pad 52.
Wherein, the absorption circuit 4 is used for absorbing the micro light emitting diode 3. Specifically, the adsorption force of the adsorption circuit 4 on the micro light-emitting diode 3 is adjustable, before the micro light-emitting diode 3 is transferred, the adsorption force of the adsorption circuit 4 is larger, and the micro light-emitting diode 3 is adsorbed on one side of the bearing substrate 1 by utilizing the adsorption circuit 4; in the transfer process, when the micro light-emitting diode 3 needs to be released, the adsorption force of the adsorption circuit 4 is adjusted to be zero, so that the micro light-emitting diode 3 is released, the micro light-emitting diode 3 falls to the corresponding pixel area 5, and the transfer mode is simple and efficient.
Further, in the present embodiment, the first electrode 31 and the second electrode 32 of the micro light emitting diode 3 are provided with magnetism, the first pad 51 and the second pad 52 of the pixel region 5 are provided with magnetism, the magnetic pole (S pole as shown in fig. 1) of the first end 311 of the first electrode 31 and the magnetic pole (N pole as shown in fig. 1) of the second end 511 of the first pad 51 are set to be opposite magnetic poles, and the magnetic pole (S pole as shown in fig. 1) of the third end 321 of the second electrode 32 and the magnetic pole (N pole as shown in fig. 1) of the fourth end 521 of the second pad 52 are set to be opposite magnetic poles, so that the first pad 51 and the second pad 52 attract the first electrode 31 and the second electrode 32 during the falling of the micro light emitting diode 3, and the electrodes of the micro light emitting diode 3 are accurately contacted with the pads in the corresponding pixel region 5, thereby realizing high-precision transfer.
For example, the first electrode 31 may be an anode of the micro light emitting diode 3, the second electrode 32 may be a cathode of the micro light emitting diode 3, the first pad 51 is an anode pad, the second pad 52 is a cathode pad, and both the first pad 51 and the second pad 52 are electrically connected to a pixel circuit (not shown) in the array substrate 2 to provide a light emitting control signal for the micro light emitting diode 3 after the micro light emitting diode 3 is transferred to the array substrate 2, and a person skilled in the art can design the structure of the array substrate 2 by himself or herself, which will not be described herein. Of course, in other embodiments, the first electrode 31 may be a cathode of the micro light emitting diode 3, the second electrode 32 may be an anode of the micro light emitting diode 3, the first pad 51 is a cathode pad, and the second pad 52 is an anode pad, which is not limited in this embodiment of the present invention.
Illustratively, the first electrode 31, the second electrode 32, the first pad 51 and the second pad 52 may be made of a magnetic material, or may be coated with a magnetic material to have magnetism, and a person skilled in the art may select any known manner to make the magnetic material have magnetism.
It should be noted that fig. 1 only illustrates that the array substrate 2 includes two pixel regions 5, and the carrier substrate 1 carries two micro light emitting diodes 3, and the number is not limited. The terms "first", "second", "third", and "fourth" are not intended to be used in an essential sense and are used for distinction.
The embodiment of the utility model provides a through set up the adsorption circuit in the one side that bearing substrate kept away from miniature emitting diode, can be through the adsorption circuit control to miniature emitting diode's adsorption affinity size to can utilize adsorption circuit to adsorb miniature emitting diode on bearing substrate before the transfer, and reduce the adsorption circuit to miniature emitting diode's adsorption affinity in the transfer process, in order to release miniature emitting diode, make it shift to the corresponding pixel district of array substrate, the transfer mode is simple high-efficient; furthermore, the embodiment of the utility model provides a first electrode and the second electrode through setting up miniature emitting diode have magnetism to and first pad and the second pad that sets up in the array substrate have magnetism, and make the magnetic pole of relative tip between electrode and the corresponding pad be the unlike magnetic pole, thereby can be at miniature emitting diode's release in-process, utilize unlike magnetic pole inter attraction, make miniature emitting diode's electrode and the pad that corresponds attract each other to both contacts, thereby can improve and shift the precision.
On the basis of the above embodiments, the transfer system of the micro light emitting diode can be improved as follows.
Fig. 2 is a schematic structural diagram of another transfer system for micro light emitting diodes according to an embodiment of the present invention, referring to fig. 2, optionally, the magnetic pole of the first end 311 of the first electrode 31 and the magnetic pole of the third end 321 of the second electrode 32 are different magnetic poles, and the magnetic pole of the second end 511 of the first bonding pad 51 and the magnetic pole of the fourth end 521 of the second bonding pad 52 are different magnetic poles.
In this embodiment, on the basis that the magnetic pole at the first end 311 of the first electrode 31 and the magnetic pole at the second end 511 of the first bonding pad 51 are unlike magnetic poles, the magnetic pole at the third end 321 of the second electrode 32 and the magnetic pole at the fourth end 521 of the second bonding pad 52 are unlike magnetic poles, the magnetic pole at the first end 311 of the first electrode 31 and the magnetic pole at the third end 321 of the second electrode 32 are unlike magnetic poles, and the magnetic pole at the second end 511 of the first bonding pad 51 and the magnetic pole at the fourth end 521 of the second bonding pad 52 are unlike magnetic poles, so that it can be ensured that after the micro light emitting diode 3 is transferred to the array substrate 2, the anode (e.g., the first electrode 31) is in contact with the anode bonding pad (e.g., the first bonding pad 51), and the cathode (e.g., the second electrode 32) is in contact with the cathode bonding pad (e.g., the second bonding pad 52), thereby ensuring that the micro light emitting diode display panel can normally display, and further improving the transfer precision and accuracy.
Specifically, comparing fig. 1 and fig. 2, in fig. 1, the magnetic pole at the first end 311 of the first electrode 31 and the magnetic pole at the third end 321 of the second electrode 32 are homonymous magnetic poles (both are S-poles), and the magnetic pole at the second end 511 of the first bonding pad 51 and the magnetic pole at the fourth end 521 of the second bonding pad 52 are homonymous magnetic poles (both are N-poles), at this time, if the micro light emitting diode 3 rotates at a certain angle in the falling process, a situation may occur in which the first bonding pad 51 attracts the second electrode 32, and the second bonding pad 52 attracts the first electrode 31, so that the cathode of the micro light emitting diode 3 contacts the anode bonding pad on the array substrate 2, and the anode of the micro light emitting diode 3 contacts the cathode bonding pad on the array substrate 2, so that the micro light emitting diode display panel cannot normally display.
In the embodiment, referring to fig. 2, since the magnetic pole (S pole) at the first end 311 of the first electrode 31 and the magnetic pole (N pole) at the third end 321 of the second electrode 32 are different magnetic poles, and the magnetic pole (N pole) at the second end 511 of the first bonding pad 51 and the magnetic pole (S pole) at the fourth end 521 of the second bonding pad 52 are different magnetic poles, during the dropping process of the micro light emitting diode 3, the first bonding pad 51 only attracts the first electrode 31, and the second bonding pad 52 only attracts the second electrode 32, so that the anode of the micro light emitting diode 3 is ensured to be in contact with the anode bonding pad on the array substrate 2, and the cathode of the micro light emitting diode 3 is contacted with the cathode bonding pad on the array substrate 2, thereby ensuring that the micro light emitting diode display panel can normally display.
Fig. 3 is a schematic diagram of an arrangement of pixel regions on an array substrate in a transfer system according to an embodiment of the present invention, and fig. 4 is a schematic diagram of an arrangement of micro light emitting diodes on a carrier substrate corresponding to fig. 3, referring to fig. 3 and 4, optionally, a plurality of pixel regions 5 are arranged in an m-row × n-column array; wherein m and n are positive integers; the arrangement mode of the micro light emitting diodes 3 on the bearing substrate 1 is the same as that of the pixel regions 5 positioned in the odd-numbered rows or the even-numbered rows; or, the arrangement of the micro light emitting diodes 3 on the carrier substrate 1 is the same as the arrangement of the pixel regions 5 in the odd or even columns.
For example, fig. 3 illustrates that the plurality of pixel regions 5 are arranged in an array of 8 rows × 4 columns, and the specific arrangement may be designed according to actual situations.
As mentioned above, the size of the micro light emitting diodes 3 is very small, and the number of the pixel regions 5 is large, so that if the arrangement of the micro light emitting diodes 3 on the carrier substrate 1 is completely the same as the arrangement of the pixel regions 5 on the array substrate 2, the difficulty of arranging the micro light emitting diodes 3 on the carrier substrate 1 will be increased, and the difficulty of transferring will also be increased.
In this embodiment, the arrangement mode of the micro light emitting diodes 3 on the carrier substrate 1 is the same as the arrangement mode of the pixel regions 5 in the odd rows, the even rows, the odd columns or the even columns, so that the distance between the adjacent micro light emitting diodes 3 on the carrier substrate 1 can be increased, and the arrangement difficulty of the micro light emitting diodes 3 can be reduced. Moreover, by adopting the scheme, only part of the micro light-emitting diodes 3 need to be transferred at one time, so that the transfer difficulty can be reduced by transferring the micro light-emitting diodes 3 for multiple times.
For example, fig. 4 only illustrates the arrangement of the micro light emitting diodes 3 on the carrier substrate 1 as the same as the arrangement of the pixel regions 5 in the odd-numbered rows. It can be understood that, besides the above arrangement, the arrangement of the micro light emitting diodes 3 on the carrier substrate 1 may be the same as the arrangement of the pixel regions 5 located in the odd rows and the odd columns, the even rows and the even columns, or the even rows and the even columns, which is not limited in the embodiment of the present invention.
Optionally, the adsorption circuit comprises an electromagnet, the electromagnet is electrically connected with the controller, the adsorption circuit electromagnet adsorbs the micro light-emitting diode when being electrified, and the adsorption circuit electromagnet releases the micro light-emitting diode when being powered off.
Referring to fig. 1 or fig. 2, for example, the absorption circuit 4 includes an electromagnet 411, the electromagnet 411 is electrically connected to a controller (not shown), the electromagnet 411 absorbs the micro light emitting diode 3 when being powered, and the electromagnet 411 releases the micro light emitting diode 3 when being powered off.
For example, the number of the electromagnets may be one or more, and one electromagnet may adsorb one or more micro light emitting diodes, which is not limited by the embodiments of the present invention, and those skilled in the art can design the electromagnets according to actual needs.
For example, a controller may be utilized to apply a dc signal to the electromagnetic power, the electromagnet 411 may generate a magnetic field after being powered on to attract the metal structure in the micro light emitting diode 3, and the magnetic field disappears after the electromagnet 411 is powered off, so as to release the micro light emitting diode 3.
Fig. 5 is a schematic structural diagram of another transfer system for micro light emitting diodes according to an embodiment of the present invention, referring to fig. 5, optionally, the carrier substrate 1 is a flexible substrate and is rolled on the reel 6, and the micro light emitting diode 3 is located on one side of the carrier substrate 1 away from the reel 6. With this arrangement, the number of micro light emitting diodes 3 that can be carried on the carrier substrate 1 can be increased.
Fig. 6 is a schematic structural diagram of the adsorption circuit on the carrier substrate in the transfer system corresponding to fig. 5, referring to fig. 6, further alternatively, the adsorption circuit includes a plurality of adsorption modules 41, each adsorption module 41 includes at least one electromagnet 411, and the plurality of adsorption modules 41 are arranged along the spreading direction of the carrier substrate 1; when the micro light emitting diode 3 is transferred, the controller controls the adsorption modules 41 to be sequentially powered off along the unfolding direction of the carrier substrate 1.
Referring to fig. 5 and 6, when the carrier substrate 1 is rolled on the reel 6, the micro light emitting diodes 3 need to be released line by line, and therefore, one adsorption module 41 may be disposed corresponding to one line of the micro light emitting diodes 3 to control each adsorption module 41 to be sequentially powered off when transferring the micro light emitting diodes 3, so that the micro light emitting diodes 3 are released line by line.
It should be noted that, one adsorption module 41 may include one electromagnet 411, and the electromagnet 411 may adsorb one row of micro light emitting diodes 3; in other embodiments, one adsorption module 41 may further include a plurality of electromagnets 411, and each electromagnet 411 may adsorb one or more micro light emitting diodes 3, which is not limited in the embodiments of the present invention.
With continued reference to fig. 6, further optionally, the adsorption module 41 includes a plurality of electromagnets 411, and the electromagnets 411 are disposed in one-to-one correspondence with the micro light emitting diodes 3.
Because the flexible substrate is curled on the reel 6, the electromagnet 411 is arranged to correspond to the micro light-emitting diode 3 one by one, so that the electromagnet 411 can be used for adsorbing one micro light-emitting diode 3, the adsorption force on the micro light-emitting diode 3 is improved, and the bending of the bearing substrate 1 is facilitated.
Continuing to refer to fig. 6, illustratively, a row of electromagnets 411 may be electrically connected to a controller (not shown) via a trace 7 to effect simultaneous release of a row of micro-leds.
As shown in fig. 1 or fig. 2, optionally, the carrier substrate 1 is a planar substrate, and the adsorption circuit 4 releases all the micro light emitting diodes 3 on the carrier substrate 1 at the same time.
When the carrier substrate 1 is a planar substrate, the micro light emitting diodes 3 on the carrier substrate 1 can be released simultaneously, thereby improving the transfer efficiency.
It should be noted that, when the carrier substrate 1 is a planar substrate, the adsorption circuit 4 may include an electromagnet 411 for adsorbing all the micro light emitting diodes 3, or the electromagnet 411 and the micro light emitting diodes 3 may be set to correspond to each other one by one with reference to fig. 6, which is not limited in the embodiment of the present invention. In addition, a person skilled in the art can select a structure of the carrier substrate according to a requirement, and the embodiment of the present invention is not limited thereto.
Referring to fig. 1 or fig. 2, optionally, a side of the array substrate 2 facing the carrier substrate 1 has a plurality of grooves 8, the first pads 51 and the second pads 52 are located in the grooves 8, and a height of the grooves 8 in a direction perpendicular to a plane of the array substrate 2 is greater than a thickness of the first pads 51 and the second pads 52.
With such an arrangement, the position of the first electrode 31 is limited by the groove 8 corresponding to the first pad 51, and the position of the second electrode 32 is limited by the groove 8 corresponding to the second pad 52, so as to ensure the contact area between the first electrode 31 and the first pad 51 and the contact area between the second electrode 32 and the second pad 52, thereby ensuring the quality of the micro light emitting diode 3.
Illustratively, the width of the groove 8 may be slightly larger than the width of the first electrode 31 and the second electrode 32 in a direction parallel to the plane of the array substrate 2, so as to facilitate the subsequent filling of solder to fixedly and electrically connect the electrodes and the pads.
Based on the same conception, the embodiment of the utility model provides a still provide a miniature emitting diode display panel, adopt the transfer system of the miniature emitting diode that any above-mentioned embodiment provided to shift and obtain, therefore this miniature emitting diode have higher preparation efficiency and quality.
Fig. 7 is a schematic structural diagram of a micro led display panel according to an embodiment of the present invention, referring to fig. 7, the micro led display panel 200 includes: an array substrate 2; the array substrate 2 has a plurality of pixel regions 5, each pixel region 5 having a first pad 51 and a second pad 52, the first pad 51 and the second pad 52 having magnetism; a plurality of micro light emitting diodes 3 are positioned in the pixel area 5; the micro light emitting diode 3 comprises a first electrode 31 and a second electrode 32, wherein the first electrode 31 and the second electrode 32 have magnetism; a magnetic pole at a first end of the first electrode 31 and a magnetic pole at a second end of the first bonding pad 51 are unlike magnetic poles, and a magnetic pole at a third end of the second electrode 32 and a magnetic pole at a fourth end of the second bonding pad 52 are unlike magnetic poles; a first end of the first electrode 31 is opposite to a second end of the first bonding pad 51, and a third end of the second electrode 32 is opposite to a fourth end of the second bonding pad 52; the first electrode 31 is fixedly and electrically connected to the first pad 51 (via the solder 9), and the second electrode 32 is fixedly and electrically connected to the second pad 52 (via the solder 9).
The embodiment of the utility model provides a through set up the adsorption circuit in the one side that bearing substrate kept away from miniature emitting diode, can be through the adsorption circuit control to miniature emitting diode's adsorption affinity size to can utilize adsorption circuit to adsorb miniature emitting diode on bearing substrate before the transfer, and reduce the adsorption circuit to miniature emitting diode's adsorption affinity in the transfer process, in order to release miniature emitting diode, make it shift to the corresponding pixel district of array substrate, the transfer mode is simple high-efficient; furthermore, the embodiment of the utility model provides a first electrode and the second electrode through setting up miniature emitting diode have magnetism to and first pad and the second pad that sets up in the array substrate have magnetism, and make the magnetic pole of relative tip between electrode and the corresponding pad be the unlike magnetic pole, thereby can be at miniature emitting diode's release in-process, utilize unlike magnetic pole inter attraction, make miniature emitting diode's electrode and the pad that corresponds attract each other to both contacts, thereby can improve and shift the precision.
It should be noted that the foregoing is only a preferred embodiment of the present invention and the technical principles applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail with reference to the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the scope of the present invention.
Claims (10)
1. A micro light emitting diode transfer system comprises a bearing substrate and an array substrate, wherein the bearing substrate is used for bearing the micro light emitting diode and transferring the micro light emitting diode onto the array substrate,
an adsorption circuit is arranged on one side of the bearing substrate, which is far away from the micro light-emitting diode;
the array substrate is provided with a plurality of pixel areas, each pixel area is provided with a first bonding pad and a second bonding pad, the first bonding pad and the second bonding pad are provided with magnetism, the micro light-emitting diode comprises a first electrode and a second electrode, the first electrode and the second electrode are provided with magnetism, a magnetic pole at the first end of the first electrode and a magnetic pole at the second end of the first bonding pad are different magnetic poles, a magnetic pole at the third end of the second electrode and a magnetic pole at the fourth end of the second bonding pad are different magnetic poles, the first end of the first electrode is opposite to the second end of the first bonding pad, and the third end of the second electrode is opposite to the fourth end of the second bonding pad.
2. The transfer system of claim 1, wherein the magnetic pole of the first end of the first electrode and the magnetic pole of the third end of the second electrode are synonym magnetic poles, and the magnetic pole of the second end of the first pad and the magnetic pole of the fourth end of the second pad are synonym magnetic poles.
3. The transfer system of claim 1 wherein a plurality of said pixel regions are arranged in an m row by n column array; wherein m and n are positive integers;
the arrangement mode of the micro light-emitting diodes on the bearing substrate is the same as that of the pixel regions positioned in the odd-numbered rows or the even-numbered rows; alternatively, the first and second electrodes may be,
the arrangement mode of the micro light emitting diodes on the bearing substrate is the same as that of the pixel regions positioned in the odd columns or the even columns.
4. The transfer system of claim 1, wherein the adsorption circuit is electrically connected to a controller, the adsorption circuit adsorbs the micro light emitting diode when the adsorption circuit is powered on, and releases the micro light emitting diode when the adsorption circuit is powered off.
5. The transfer system of claim 4, wherein the carrier substrate is a flexible substrate and is rolled on a reel, and the micro light emitting diode is located on a side of the carrier substrate away from the reel.
6. The transfer system of claim 5, wherein the adsorption circuit comprises a plurality of adsorption modules, each adsorption module comprising at least one electromagnet, the plurality of adsorption modules being arranged along a spreading direction of the carrier substrate;
when the micro light-emitting diode is transferred, the controller controls the adsorption modules to be sequentially powered off along the unfolding direction of the bearing substrate.
7. The transfer system of claim 6, wherein the electromagnets are arranged in one-to-one correspondence with the micro light emitting diodes.
8. The transfer system of claim 4 wherein the carrier substrate is a planar substrate and the adsorption circuit simultaneously releases all of the micro light emitting diodes on the carrier substrate.
9. The transfer system according to claim 1, wherein the array substrate has a plurality of grooves on a side thereof facing the carrier substrate, the first pads and the second pads are located in the grooves, and a height of the grooves in a direction perpendicular to a plane of the array substrate is greater than a thickness of the first pads and the second pads.
10. A micro light emitting diode display panel transferred by the micro light emitting diode transfer system according to any one of claims 1 to 9, comprising:
the array substrate is provided with a plurality of pixel areas, each pixel area is provided with a first bonding pad and a second bonding pad, and the first bonding pad and the second bonding pad are magnetic;
a plurality of miniature emitting diode, miniature emitting diode includes first electrode and second electrode, first electrode and second electrode have magnetism, the magnetic pole of the first end of first electrode with the magnetic pole of the second end of first pad is the synonym magnetic pole, the magnetic pole of the third end of second electrode with the magnetic pole of the fourth end of second pad is the synonym magnetic pole, the first end of first electrode with the second end of first pad is relative, the third end of second electrode with the fourth end of second pad is relative, first electrode with first pad fixed electrical connection, the second electrode with second pad fixed electrical connection.
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| CN202120592102.2U CN214254381U (en) | 2021-03-23 | 2021-03-23 | Transfer system of micro light-emitting diode and micro light-emitting diode display panel |
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| CN202120592102.2U CN214254381U (en) | 2021-03-23 | 2021-03-23 | Transfer system of micro light-emitting diode and micro light-emitting diode display panel |
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| CN202120592102.2U Active CN214254381U (en) | 2021-03-23 | 2021-03-23 | Transfer system of micro light-emitting diode and micro light-emitting diode display panel |
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| Country | Link |
|---|---|
| CN (1) | CN214254381U (en) |
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