CN214154938U - Printed circuit board with stepped groove bottom as circuit - Google Patents
Printed circuit board with stepped groove bottom as circuit Download PDFInfo
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- CN214154938U CN214154938U CN202022338303.8U CN202022338303U CN214154938U CN 214154938 U CN214154938 U CN 214154938U CN 202022338303 U CN202022338303 U CN 202022338303U CN 214154938 U CN214154938 U CN 214154938U
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- circuit
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- circuit board
- dielectric material
- printed circuit
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Abstract
The utility model discloses a printed circuit board of circuit is done to ladder bottom of groove relates to circuit board technical field. This dielectric material layer including circuit board basis, inside sunken ladder groove has been seted up to dielectric material layer bottom, and the ladder inslot is formed with the circuit layer, and the circuit layer is equipped with the solder mask that sets up adjacent with the circuit layer outward, the utility model discloses a processing of ladder tank bottom circuit, make solder mask and surface protection layer simultaneously on the circuit of ladder tank bottom portion, realized radiating module's embedded assembly simultaneously, thin circuit of processing that can be better, it is thick to reduce the board, promotes printed circuit board wiring space in the at utmost, does benefit to high integration, miniaturized printed circuit board's preparation.
Description
Technical Field
The utility model relates to a circuit board technical field especially relates to a printed circuit board of circuit is done to ladder groove bottom.
Background
The technology is advancing, the economy is developing, along with the rapid development of 5G, the Internet of things, cloud computing, big data and the like, electronic products serving as carriers of the electronic products also enter the development stages of functionalization and intellectualization, and in order to meet the requirements of miniaturization and high integration of the electronic products, printed circuit boards or semiconductor integrated circuit packaging substrates are also developing towards the directions of lightness, thinness, shortness and smallness on the premise of meeting the good electrical property and thermal property of the electronic products, and other printed circuit boards with special structures are also appearing.
Along with the development of 5G, a large amount of heat can be generated in the process of high-speed signal transmission, so the circuit board has higher and higher heat dissipation requirements, meanwhile, the circuit design is lighter and thinner, the circuit design is finer and finer, the general circuit board is difficult to meet the requirements of heat dissipation while meeting the functionality, so a plurality of terminal clients can install heat dissipation modules in a high-power module area, and the heat dissipation modules are too thick, so that the thickness of the whole PCBA is too thick after assembly, even the final assembly of the whole machine is influenced, and the requirements of miniaturization and high integration are not facilitated.
Therefore, the printed circuit board with the step groove is formed, the heat dissipation module can be embedded into the step groove, the thickness of the PCBA is further reduced, and meanwhile the product functionality can be met. Due to the particularity of the stepped groove type printed circuit board, the bottom of the stepped groove of the traditional printed circuit board is generally designed to be a large copper surface, and a circuit cannot be formed at the bottom of the stepped groove.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model provides a printed circuit board of circuit is done to ladder tank bottom, including basic dielectric material layer, inside sunken ladder tank has been seted up to dielectric material layer bottom, and the ladder inslot is formed with the circuit layer, is equipped with the solder mask that sets up adjacent with the circuit layer outside the circuit layer.
The technical effects are as follows: the utility model discloses a processing of ladder tank bottom circuit makes solder mask and surface protection layer simultaneously on the circuit of ladder tank bottom, has realized the embedded assembly of heat dissipation module simultaneously, and thin circuit of processing that can be better reduces thick, promotes printed circuit board wiring space in the at utmost, does benefit to high integration level, miniaturized printed circuit board's preparation.
The utility model discloses the technical scheme who further injects is:
furthermore, a surface protection layer for covering the circuit layer is arranged outside the circuit layer, and the surface protection layer extends out of the dielectric material layer.
The printed circuit board with the stepped groove bottom as the circuit is characterized in that the inner layer circuit layer is formed inside the dielectric material layer, and the outer layer circuit layer is formed at the bottom of the dielectric material layer.
The printed circuit board with the stepped groove bottom as the circuit is characterized in that an interlayer conducting hole vertical to the horizontal plane is formed in the dielectric material layer.
In the printed circuit board with the circuit at the bottom of the stepped groove, the surface protection layer is made of nickel gold or nickel palladium gold or organic protection film OSP or silver or tin silver copper material.
In the printed circuit board with the circuit at the bottom of the stepped groove, the dielectric material layer is made of epoxy resin or hydrocarbon resin or polyimide or polymaleimide triazine resin or polyphenyl ether or polytetrafluoroethylene or FR-4 or FR-5.
The utility model has the advantages that:
(1) the utility model discloses in, be different from traditional printed circuit board, traditional circuit board does not generally have the design of ladder groove, and even design ladder groove, can not do the circuit in ladder groove bottom yet, the utility model discloses a circuit board is equipped with the ladder groove and there are circuit, solder mask and surface protection layer bottom the ladder groove, can realize the encapsulation of ladder groove bottom, can reduce the total thickness of circuit board after the assembly simultaneously, does benefit to the requirement of electronic product miniaturization, high integration degree, high thermal diffusivity;
(2) the utility model discloses in, realize heat dissipation module's embedded assembly, the thin circuit of processing that simultaneously can be better reduces thick, promotes printed circuit board wiring space in the at utmost, does benefit to high integration level, miniaturized printed circuit board's preparation.
(3) In the utility model, the circuit board can realize the bottom packaging of the stepped groove, reduce the thickness of the circuit board and facilitate the manufacturing of the miniaturization and the densification of electronic components; moreover, due to the sinking design of the stepped groove, the height difference between the component at the position and the circuit board is smaller, and the surface flatness of the integrally assembled component is convenient to control.
Drawings
FIG. 1 is a schematic cross-sectional view showing the structure of example 1;
wherein: 1. a layer of dielectric material; 2. an inner layer circuit layer; 3. an outer circuit layer; 4. a solder resist layer; 5. conducting holes between layers; 6. a stepped groove; 7. a circuit layer; 8. and (5) a surface protection layer.
Detailed Description
The printed circuit board of circuit is made to ladder groove bottom that this embodiment provided, the structure is shown in fig. 1, including basic dielectric material layer 1, inside sunken ladder groove 6 has been seted up to dielectric material layer 1 bottom, is formed with circuit layer 7 in the ladder groove 6, and circuit layer 7 is equipped with the solder mask 4 adjacent setting with circuit layer 7 outward.
As shown in fig. 1, a surface protection layer 8 covering the circuit layer 7 is disposed outside the circuit layer 7, and the surface protection layer 8 extends to the outside of the dielectric material layer 1. An inner wiring layer 72 is formed inside the dielectric material layer 1, and an outer wiring layer 73 is formed at the bottom of the dielectric material layer 1. Interlayer via holes 5 are formed in the dielectric material layer 1 and are vertical to the horizontal plane.
Thus, the embedded assembly of the heat dissipation module can be realized, fine lines can be processed better, the plate thickness is reduced, the wiring space of the printed circuit board is improved to the maximum extent, and the manufacturing of the high-integration and miniature printed circuit board is facilitated.
As shown in fig. 1, the surface protection layer 8 is made of nickel gold or nickel palladium gold or organic protective film OSP or silver or tin silver copper material. The dielectric material layer 1 is made of epoxy resin or hydrocarbon resin or polyimide or polymaleimide triazine resin or polyphenylene ether or polytetrafluoroethylene or FR-4 or FR-5.
The utility model discloses be different from traditional printed circuit board, traditional circuit board does not generally have the design of ladder groove, and even design ladder groove, can not do the circuit in ladder groove bottom yet, the utility model discloses a circuit board is equipped with ladder groove 6 and 6 bottoms in ladder groove have circuit, solder mask 4 and surface protection layer 8, can realize the encapsulation of 6 bottoms in ladder groove, can reduce the assembly back circuit board gross thickness simultaneously, does benefit to the requirement of electronic product miniaturation, high integration degree, high thermal diffusivity.
In addition to the above embodiments, the present invention may have other embodiments; all the technical solutions formed by adopting equivalent substitutions or equivalent transformations fall within the protection scope claimed by the present invention.
Claims (6)
1. The utility model provides a printed circuit board of circuit is done to ladder groove bottom which characterized in that: including dielectric material layer (1) of basis, inside sunken ladder groove (6) have been seted up to dielectric material layer (1) bottom, are formed with circuit layer (7) in ladder groove (6), and circuit layer (7) are equipped with solder mask (4) adjacent setting with circuit layer (7) outward.
2. The printed circuit board with the stepped groove bottom as the circuit of claim 1, wherein: and a surface protection layer (8) for coating the circuit layer (7) is arranged outside the circuit layer (7), and the surface protection layer (8) extends out of the dielectric material layer (1).
3. The printed circuit board with the stepped groove bottom as the circuit of claim 1, wherein: an inner-layer circuit layer (2) is formed inside the dielectric material layer (1), and an outer-layer circuit layer (3) is formed at the bottom of the dielectric material layer (1).
4. The printed circuit board with the stepped groove bottom as the circuit of claim 1, wherein: and interlayer conducting holes (5) vertical to the horizontal plane are formed in the dielectric material layer (1).
5. The printed circuit board with the stepped groove bottom as the circuit as claimed in claim 2, wherein: the surface protection layer (8) is made of nickel gold or nickel palladium gold or organic protection film OSP or silver or tin silver copper material.
6. The printed circuit board with the stepped groove bottom as the circuit of claim 1, wherein: the dielectric material layer (1) is made of epoxy resin or hydrocarbon resin or polyimide or polymaleimide triazine resin or polyphenyl ether or polytetrafluoroethylene or FR-4 or FR-5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022338303.8U CN214154938U (en) | 2020-10-20 | 2020-10-20 | Printed circuit board with stepped groove bottom as circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022338303.8U CN214154938U (en) | 2020-10-20 | 2020-10-20 | Printed circuit board with stepped groove bottom as circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214154938U true CN214154938U (en) | 2021-09-07 |
Family
ID=77559485
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022338303.8U Active CN214154938U (en) | 2020-10-20 | 2020-10-20 | Printed circuit board with stepped groove bottom as circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214154938U (en) |
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2020
- 2020-10-20 CN CN202022338303.8U patent/CN214154938U/en active Active
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