CN214152863U

CN214152863U - Device for removing and inhibiting AMC in wafer box

Info

Publication number: CN214152863U
Application number: CN202120498322.9U
Authority: CN
Inventors: 赖国繁; 董志远; 陈成
Original assignee: Yixin Semiconductor Technology Suzhou Co ltd
Current assignee: Yixin Semiconductor Technology Suzhou Co ltd
Priority date: 2021-03-09
Filing date: 2021-03-09
Publication date: 2021-09-07
Anticipated expiration: 2031-03-09

Abstract

The utility model discloses a device for removing and inhibiting AMC in a wafer cassette, which comprises a vacuum box, a heater, a nitrogen adding device and a vacuum pump; the vacuum box is a closed container, and a heater is arranged in the vacuum box; the wall of the vacuum box is provided with a nitrogen inlet for connecting a nitrogen adding device; and the wall of the vacuum box is provided with an air exhaust port for connecting a vacuum pump. The utility model relates to a get rid of and restrain device of AMC in wafer box can be under the condition of low vacuum and infrared heating for AMC's release to take away AMC under the extraction of vacuum pump rapidly through nitrogen gas, thereby realize getting rid of and restrain the purpose of AMC in the wafer box.

Description

Device for removing and inhibiting AMC in wafer box

Technical Field

The utility model relates to a get rid of and restrain device of AMC in wafer box.

Background

AMC is an abbreviation for gaseous Molecular Contamination (Airborne Molecular Contamination) and is defined mainly by SEMI as four major sub-items: MA (acid vapor), MB (alkali vapor), MC (condensed material) and MD (doped material), the sources may be automobile exhaust, atmospheric ozone, factory exhaust, etc. outside the clean room, or chemical solvent volatilization, etching acid gas, plastic product overflow, etc. in the clean room, because the sources are very wide and the pollutant project is numerous, how to effectively control becomes a great problem to related industries.

AMC has a great influence on the yield of semiconductor process, and related manufacturers have been preventing the AMC for a long time, but only aiming at large particle substances in the past; however, as the process becomes finer, the prevention standard becomes stricter and the peak of the detection requirement is reached at 28 nm.

The cassettes are used primarily for the placement and transport of wafers in semiconductor manufacturing, and are used by chip manufacturers to handle and store wafers for ease of transport and to minimize the risk of contamination.

Therefore, in summary, the wafer cassette should ensure that the AMC in the material is removed before the wafer cassette is shipped.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a get rid of and restrain device of AMC in wafer box aims at getting rid of through this device and restrains the AMC in the wafer box.

In order to achieve the purpose, the technical scheme of the utility model is to design a device for removing and inhibiting AMC in a wafer box, which comprises a vacuum box, a heater, a nitrogen adding device and a vacuum pump; the vacuum box is a closed container, and a heater is arranged in the vacuum box; the wall of the vacuum box is provided with a nitrogen inlet for connecting a nitrogen adding device; and an air suction port for connecting a vacuum pump is arranged on the wall of the vacuum box.

Furthermore, one side of the vacuum box is connected with a vacuum box door through a hinge, and a sealing strip is arranged on the edge of the inner wall of the vacuum box door.

Furthermore, the heaters are infrared heaters, and a plurality of infrared heaters are distributed on the upper inner wall and the lower inner wall of the vacuum box.

Further, the nitrogen adding device comprises a normal-temperature nitrogen inlet connected with a nitrogen source, a nitrogen heating box for heating and a hot nitrogen conveying pipe; the normal-temperature nitrogen inlet is connected with the nitrogen heating box, the nitrogen heating box is connected with the hot nitrogen conveying pipe, and the hot nitrogen outlet of the hot nitrogen conveying pipe is connected with the nitrogen inlet on the vacuum box.

Furthermore, an air pressure monitoring device is arranged in the vacuum box.

Furthermore, a temperature monitoring device is arranged inside the vacuum box.

The utility model has the advantages and the beneficial effects that: the utility model relates to a get rid of and restrain device of AMC in wafer box can be under the condition of low vacuum and infrared heating for AMC's release to take away AMC under the extraction of vacuum pump rapidly through nitrogen gas, thereby realize getting rid of and restrain the purpose of AMC in the wafer box.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

Detailed Description

The following description will further describe embodiments of the present invention with reference to the accompanying drawings and examples. The following examples are only for illustrating the technical solutions of the present invention more clearly, and the protection scope of the present invention is not limited thereby.

Example (b):

an apparatus for removing and inhibiting AMC in a wafer cassette comprises a vacuum box 1, a heater 3, a nitrogen gas adding device and a vacuum pump; the vacuum box 1 is a closed container, and a heater 3 is arranged in the vacuum box 1; the wall of the vacuum box 1 is provided with a nitrogen inlet 8 for connecting a nitrogen adding device; and an air exhaust port 9 for connecting a vacuum pump is arranged on the wall of the vacuum box 1.

One side of the vacuum box 1 is connected with a vacuum box door 2 through a hinge, and a sealing strip is arranged on the edge of the inner wall of the vacuum box door 2.

The heaters 3 are infrared heaters, and a plurality of infrared heaters are distributed on the upper inner wall and the lower inner wall of the vacuum box 1.

The nitrogen adding device comprises a normal-temperature nitrogen inlet 5 connected with a nitrogen source, a nitrogen heating box 4 for heating and a hot nitrogen conveying pipe 6; the normal-temperature nitrogen inlet 5 is connected with the nitrogen heating box 4, the nitrogen heating box 4 is connected with the hot nitrogen conveying pipe 6, and the hot nitrogen outlet 7 of the hot nitrogen conveying pipe 6 is connected with the nitrogen inlet 8 on the vacuum box 1.

And an air pressure monitoring device is arranged in the vacuum box.

A temperature monitoring device is arranged in the vacuum box.

When the wafer box is used, firstly, the wafer box is cleaned by hot water to remove large-particle substances, and then is dried by hot air; the dried wafer cassette is placed in the vacuum chamber 1 along the direction a, the vacuum chamber door 2 is closed, and the inside of the vacuum chamber 1 is heated by the heater 3. Meanwhile, the vacuum box 1 is pumped by the vacuum pump, and hot nitrogen is filled into the vacuum box 1 by the nitrogen adding device while pumping, so that the pressure inside the vacuum box 1 is maintained at 800-1500 Pa.

In the process, the AMC can be released from the material of the wafer box more quickly under the conditions of low vacuum degree and infrared heating, and the released AMC is quickly taken away by nitrogen by using the modes of introducing nitrogen and exhausting; thereby achieving the purpose of removing and inhibiting AMC in the wafer box.

The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the technical principle of the present invention, and these improvements and decorations should also be regarded as the protection scope of the present invention.

Claims

1. An apparatus for removing and inhibiting AMC in a wafer cassette, comprising: comprises a vacuum box, a heater, a nitrogen adding device and a vacuum pump; the vacuum box is a closed container, and a heater is arranged in the vacuum box; the wall of the vacuum box is provided with a nitrogen inlet for connecting a nitrogen adding device; and an air suction port for connecting a vacuum pump is arranged on the wall of the vacuum box.

2. The apparatus of claim 1, wherein the apparatus is further configured to remove and suppress AMC in a wafer pod, the apparatus further comprising: one side of the vacuum box is connected with a vacuum box door through a hinge, and a sealing strip is arranged on the edge of the inner wall of the vacuum box door.

3. The apparatus of claim 1, wherein the apparatus is further configured to remove and suppress AMC in a wafer pod, the apparatus further comprising: the heaters are infrared heaters, and a plurality of infrared heaters are distributed on the upper inner wall and the lower inner wall of the vacuum box.

4. The apparatus of claim 1, wherein the apparatus is further configured to remove and suppress AMC in a wafer pod, the apparatus further comprising: the nitrogen adding device comprises a normal-temperature nitrogen inlet connected with a nitrogen source, a nitrogen heating box for heating and a hot nitrogen conveying pipe; the normal-temperature nitrogen inlet is connected with the nitrogen heating box, the nitrogen heating box is connected with the hot nitrogen conveying pipe, and the hot nitrogen outlet of the hot nitrogen conveying pipe is connected with the nitrogen inlet on the vacuum box.

5. The apparatus of claim 1, wherein the apparatus is further configured to remove and suppress AMC in a wafer pod, the apparatus further comprising: and an air pressure monitoring device is arranged in the vacuum box.

6. The apparatus of claim 1, wherein the apparatus is further configured to remove and suppress AMC in a wafer pod, the apparatus further comprising: a temperature monitoring device is arranged in the vacuum box.