CN214140597U - Fast silicon chip of inserting sucking disc mechanism - Google Patents
Fast silicon chip of inserting sucking disc mechanism Download PDFInfo
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- CN214140597U CN214140597U CN202021780795.XU CN202021780795U CN214140597U CN 214140597 U CN214140597 U CN 214140597U CN 202021780795 U CN202021780795 U CN 202021780795U CN 214140597 U CN214140597 U CN 214140597U
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Abstract
The utility model relates to a silicon chip carries technical field, relates to a insert silicon chip sucking disc mechanism soon. The utility model discloses a relative motion behind silicon chip is snatched respectively to first sucking disc subassembly and second sucking disc subassembly, because first silicon chip sucking disc staggers each other with second silicon chip sucking disc, and can not produce the interference, first sucking disc subassembly and second sucking disc subassembly can directly carry out mutual range stack combination to the silicon chip of snatching for two silicon chips can exist simultaneously with first passageway and second passageway in, effectively avoid leading to the unable superimposed condition because of the silicon chip arranges the accumulative error that stack combination produced one by one.
Description
Technical Field
The utility model relates to a silicon chip carries technical field, relates to a insert silicon chip sucking disc mechanism soon.
Background
In the processing process of the silicon wafer, the finished wafer and the semi-finished wafer are required to be conveyed orderly so as to facilitate the processing of the next procedure. If manual moving and unloading are adopted for stacking and placing, not only a large amount of labor cost is consumed, but also the silicon wafers are easily damaged.
In order to facilitate conveying the silicon wafer, the sucking disc is mostly adopted to suck the silicon wafer, but when piling up the silicon wafer, because the silicon wafer piles up the accumulative error that produces one by one and makes and pile up the silicon wafer height and surpass the standard range far away, can't place on loading the tool to piling up the silicon wafer, can not satisfy the transport demand of silicon wafer.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to provide a can directly carry out mutual range stack combination to the silicon chip that snatchs for two silicon chips can exist simultaneously with the first passageway and the second passageway in insert silicon chip sucking disc mechanism soon.
In order to solve the technical problem, the utility model provides a technical scheme that its technical problem adopted is:
a fast silicon chip inserting sucker mechanism comprises a first sucker component and a second sucker component; the first sucking disc component comprises a first fixed seat, a plurality of first silicon wafer sucking discs are uniformly arranged on the first fixed seat, and a first channel is arranged between every two adjacent first silicon wafer sucking discs; the second sucker assembly comprises a second fixed seat, a plurality of second silicon wafer suckers are uniformly arranged on the second fixed seat, and a second channel is arranged between every two adjacent second silicon wafer suckers; the adsorption surface of the first silicon wafer sucker is opposite to the adsorption surface of the second silicon wafer sucker in direction, the first sucker component and the second sucker component respectively grab the silicon wafers and then move relatively, the silicon wafers grabbed by the first sucker component penetrate through the second channel, and the silicon wafers grabbed by the second sucker component penetrate through the first channel.
Preferably, the first fixing seat is the same as the second fixing seat in structure, the first fixing seat comprises a base, a bottom plate and a plurality of pipe joints, a plurality of mounting grooves used for mounting the first silicon wafer suckers are formed in the base, the pipe joints are arranged on the bottom plate, the bottom plate is connected with the base in a sealing mode, and the pipe joints are communicated with the mounting grooves.
Preferably, the first silicon wafer sucker and the second silicon wafer sucker are both provided with limiting grooves, the base is provided with fixing grooves matched with the limiting grooves, and the fixing grooves are provided with fixing strips, so that the first silicon wafer sucker cannot be separated from the base.
Preferably, the first silicon wafer sucker comprises a first suction plate and a first sealing plate, two first auxiliary suction plates are arranged on the first suction plate, first air suction holes are formed in the first suction plate and the first auxiliary suction plates, and the first sealing plate is connected with the first suction plate in a sealing mode.
Preferably, the first suction plate is provided with a first suction port, the first suction plate is internally provided with a first vacuum cavity channel, the first suction port is communicated with the first vacuum cavity channel, the first auxiliary suction plate is provided with a first branch cavity channel, the first branch cavity channel is communicated with the first vacuum cavity channel, and the first suction port is communicated with the first vacuum cavity channel and the first branch cavity channel.
Preferably, the device also comprises a guide plate, the guide plate is connected with the first suction plate and a first auxiliary suction plate far away from the first air suction port, and guide inclined planes are arranged on two sides of the guide plate; the cross section of the guide plate is triangular or trapezoidal.
Preferably, the second silicon wafer sucker comprises a second suction plate and a second sealing plate, two second auxiliary suction plates are arranged on the second suction plate, second suction holes are formed in the second suction plate and the second auxiliary suction plates, and the second sealing plate is connected with the second suction plate in a sealing manner; the second suction plate is provided with an extension suction plate, and an extension suction hole is formed in the adsorption surface of the extension suction plate.
Preferably, the extending suction plate is provided with an extending cavity communicated with the second suction plate, and the extending suction hole is communicated with the extending cavity.
Preferably, a positioning groove is formed between the extension suction plate and the second auxiliary suction plate, the positioning groove is matched with the first auxiliary suction plate in shape, and the length of the extension suction plate is greater than or equal to the width of the first auxiliary suction plate.
Preferably, the two first auxiliary suction plates are arranged on the first suction plate in parallel, an accommodating groove is formed between the two first auxiliary suction plates, and the width of the accommodating groove is larger than or equal to that of the second auxiliary suction plate.
The utility model has the advantages that:
the utility model discloses a relative motion behind silicon chip is snatched respectively to first sucking disc subassembly and second sucking disc subassembly, because first silicon chip sucking disc staggers each other with second silicon chip sucking disc, and can not produce the interference, first sucking disc subassembly and second sucking disc subassembly can directly carry out mutual range stack combination to the silicon chip of snatching for two silicon chips can exist simultaneously with first passageway and second passageway in, effectively avoid leading to the unable superimposed condition because of the silicon chip arranges the accumulative error that stack combination produced one by one.
Drawings
Fig. 1 is a schematic structural view of a chuck mechanism for quickly inserting silicon wafers according to the present invention.
Fig. 2 is a perspective view of a first silicon wafer chuck of the present invention.
FIG. 3 is a schematic view of a first wafer chuck according to the present invention.
FIG. 4 is a schematic view of a second wafer chuck according to the present invention.
Fig. 5 is a schematic diagram of the first channel and the second channel of the present invention.
Fig. 6 is a schematic view of the combination of the first silicon wafer chuck and the second silicon wafer chuck of the present invention.
The reference numbers in the figures illustrate: 100. a first suction cup assembly; 101. a base; 102. a base plate; 103. a pipe joint; 104. a fixing strip; 200. a second chuck assembly; 300. a first silicon wafer chuck; 301. a first suction plate; 311. a limiting groove; 312. a first air intake port; 313. a guide air duct; 314. a first air-intake hole; 315. a separation block; 302. a first seal plate; 303. a first auxiliary suction plate; 331. branch to the cavity; 333. a containing groove; 304. A guide plate; 400. a second silicon wafer chuck; 401. a second suction hole; 402. a second seal plate; 403. a second auxiliary suction plate; 404. positioning a groove; 405. aligning the groove; 406. an extension suction plate; 407. a second air suction port; 500. a silicon wafer; 600. a second channel; 700. a first channel;
Detailed Description
The present invention is further described with reference to the following drawings and specific embodiments so that those skilled in the art can better understand the present invention and can implement the present invention, but the embodiments are not to be construed as limiting the present invention.
Referring to fig. 1-5, a fast silicon wafer inserting chuck mechanism comprises a first chuck assembly 100 and a second chuck assembly 200; the first chuck assembly 100 comprises a first fixed seat, a plurality of first silicon wafer chucks 300 are uniformly arranged on the first fixed seat, and a first channel 700 is arranged between every two adjacent first silicon wafer chucks 300; the second sucker assembly 200 comprises a second fixed seat, a plurality of second silicon wafer suckers 400 are uniformly arranged on the second fixed seat, and a second channel 600 is arranged between every two adjacent second silicon wafer suckers 400; the adsorption surface of the first silicon wafer sucker 300 is opposite to that of the second silicon wafer sucker 400 in direction, the first sucker component 100 and the second sucker component 200 respectively grab the silicon wafer 500 and then move relatively, so that the silicon wafer 500 grabbed by the first sucker component 100 is arranged in the second channel 600 in a penetrating manner, and the silicon wafer 500 grabbed by the second sucker component 200 is arranged in the first channel 700 in a penetrating manner.
The utility model discloses a relative motion after first sucking disc subassembly 100 and second sucking disc subassembly 200 snatch silicon chip 500 respectively, because first silicon chip sucking disc 300 staggers each other with second silicon chip sucking disc 400, and can not produce the interference, first sucking disc subassembly 100 and second sucking disc subassembly 200 can directly carry out mutual permutation stack combination to the silicon chip 500 that snatchs for two silicon chips 500 can exist simultaneously with first passageway 700 and second passageway 600 in, effectively avoid arranging the stack error that stack combination produced one by one because of silicon chip 500 and lead to the unable superimposed condition; the silicon wafer 500 is directly stacked through the first and second chuck assemblies 100 and 200, and no accumulated error is generated due to the stacking of the silicon wafer 500.
The first fixing seat and the second fixing seat are identical in structure, the first fixing seat comprises a base 101, a bottom plate 102 and a plurality of pipe joints 103, a plurality of mounting grooves used for mounting the first silicon wafer sucker 300 are formed in the base 101, the pipe joints 103 are arranged on the bottom plate 102, the bottom plate 102 is hermetically connected with the base 101, the pipe joints 103 are communicated with the mounting grooves, and the pipe joints 103 are connected with the first silicon wafer sucker 300 or the second silicon wafer sucker 400 through groove mounting and used for vacuumizing.
The first silicon wafer sucker 300 and the second silicon wafer sucker 400 are both provided with a limiting groove 311, the base 101 is provided with a fixing groove matched with the limiting groove 311, and the fixing groove is provided with a fixing strip 104, so that the first silicon wafer sucker 300 cannot be separated from the base 101.
Specifically, the limiting grooves 311 are disposed at two sides of the first suction plate 301, and the limiting grooves 311 are disposed at positions close to the suction ports.
The first silicon wafer chuck 300 comprises a first suction plate 301 and a first sealing plate 302, wherein two first auxiliary suction plates 303 are arranged on the first suction plate 301, first air suction holes 314 are formed in the first suction plate 301 and the first auxiliary suction plates 303, and the first sealing plate 302 is hermetically connected with the first suction plate 301.
The first suction plate 301 is provided with a first suction port 312, a first vacuum cavity channel is arranged in the first suction plate 301, the first suction port 312 is communicated with the first vacuum cavity channel, the first auxiliary suction plate 303 is provided with a first branch cavity channel 331, the first branch cavity channel 331 is communicated with the first vacuum cavity channel, the first suction port 314 is communicated with the first vacuum cavity channel and the first branch cavity channel 331, specifically, the first suction port 312 is used for vacuumizing, vacuum is instantly formed in the first vacuum cavity channel and the first branch cavity channel 331, and then suction is distributed on the first suction port 314 on the suction surface of the suction plate.
The air suction device further comprises a guide plate 304, the first suction plate 301 and the first auxiliary suction plate 303 far away from the first suction port 312, and guide inclined planes are arranged on two sides of the guide plate 304.
The guide plate 304 has a triangular or trapezoidal cross section.
When the guide inclined plane is used for grabbing the vertical silicon wafer 500, collision to the silicon wafer 500 is effectively avoided, and grabbing accuracy is guaranteed.
Can keep vertical state to silicon chip 500 to snatch, adsorb silicon chip 500 through main part and diaphragm, can provide sufficient adsorption affinity through first suction hole 314 and can not make vertical state's silicon chip 500 drop, effectively improve the seal of whole sucking disc to kept the sucking disc and inhaled the durability of tight silicon chip 500, main part and diaphragm can increase the area of contact with silicon chip 500, can provide sufficient holding surface and can not make silicon chip 500 vibrate in the motion.
The first vacuum cavity is provided with a plurality of separating blocks 315, the separating blocks 315 separate the first vacuum cavity into a plurality of mutually communicated guide air channels 313, and the first air suction holes 314 are arranged at the intersection positions of the plurality of guide air channels 313.
The first suction plate 301 and the two first auxiliary suction plates 303 are integrally formed.
The second silicon wafer sucker 400 comprises a second suction plate and a second sealing plate 402, wherein two second auxiliary suction plates 403 are arranged on the second suction plate, a second air suction port 407 is arranged on the second suction plate, second air suction holes 401 are formed in the second suction plate and the second auxiliary suction plates 403, and the second sealing plate 402 is connected with the second suction plate in a sealing manner; an extension suction plate 406 is arranged on the second suction plate, and an extension suction hole is arranged on the suction surface of the extension suction plate.
Specifically, the second wafer chuck 400 is identical in structure to the first wafer chuck 300, except that an extended suction plate 406 and related structures of the extended suction plate 406 are provided on the second suction plate.
The first sealing plate 302 and the second sealing plate 402 are both provided with a sealing ring, and the first sealing plate 302 and the second sealing plate 402 are connected with the first suction plate 301 and the second suction plate through the sealing rings.
The extension suction plate 406 is provided with an extension cavity communicated with the second suction plate, and the extension suction hole is communicated with the extension cavity.
A positioning groove 404 is arranged between the extension suction plate 406 and the second auxiliary suction plate 403, the shape of the positioning groove 404 is matched with that of the first auxiliary suction plate 303, and the length of the extension suction plate is greater than or equal to the width of the first auxiliary suction plate 303.
The two first auxiliary suction plates 303 are arranged on the first suction plate 301 in parallel, an accommodating groove 333 is arranged between the two first auxiliary suction plates 303, and the width of the accommodating groove 333 is greater than or equal to that of the second auxiliary suction plate 403;
two second auxiliary suction plates 403 are arranged in parallel on the second suction plates, an alignment groove 405 for matching the first auxiliary suction plate 303 is arranged between the two second auxiliary suction plates 403, and the width of the alignment groove 405 is larger than or equal to the width of the first auxiliary suction plate 303.
The two first auxiliary suction plates 303 are disposed on the first suction plate 301 such that the first suction plate 301 has an "F" shape, and the two second auxiliary suction plates 403 are disposed on the second suction plate such that the second suction plate has a "pi" shape.
In one embodiment, a positioning groove 404 is disposed between the extended suction plate 406 and the second auxiliary suction plate 403, the shape of the positioning groove 404 matches with the shape of the first auxiliary suction plate 303, and the length of the extended suction plate is greater than or equal to the width of the first auxiliary suction plate 303.
The two first auxiliary suction plates 303 are arranged on the first suction plate 301 in parallel, an accommodating groove 333 is arranged between the two first auxiliary suction plates 303, and the width of the accommodating groove 333 is greater than or equal to the width of the second auxiliary suction plate 403.
Through the matching assembly of the second auxiliary suction plate 403 and the accommodating groove 333 as well as the first auxiliary suction plate 303 and the positioning groove 404, the first silicon wafer sucker 300 in the shape of 'F' can be tightly matched with the second silicon wafer sucker 400 in the shape of 'pi', so that the two silicon wafer suckers can be assembled into a large sucker on the same plane, a single large-size silicon wafer 500 can be specially arranged, or the silicon wafers 500 on two sides of the two silicon wafer suckers can be grabbed, and the application range is greatly improved.
Sponge sealing plates are arranged on the adsorption surfaces of the second silicon wafer sucker 400 and the first silicon wafer sucker 300, and the sponge sealing plates are adhered to the adsorption surfaces, so that various gaps formed between the suckers and the silicon wafer 500 can be effectively filled, and the purpose of quickly forming vacuum between the silicon wafer 500 and the suckers is achieved. Therefore, the pole piece can be sucked, and the surface of the silicon wafer 500 cannot be damaged due to the porous scattered vacuum suction force and the certain elasticity of the bottom sponge sealing plate.
Referring to fig. 6, in another embodiment, two first auxiliary suction plates 303 are disposed on the first suction plate 301 such that the first suction plate 301 has an "E" shape, and two second auxiliary suction plates 403 are disposed on the second suction plate such that the second suction plate has an "E" shape.
A positioning groove is arranged between the extension suction plate 406 and the second auxiliary suction plate 403, the shape of the positioning groove 404 is matched with that of the first auxiliary suction plate 303, and the length of the extension suction plate is greater than or equal to the width of the first auxiliary suction plate 303.
The second auxiliary suction plate 403 is matched with the accommodating groove 333, the first auxiliary suction plate 303 is matched with the positioning groove 404, the two first silicon wafer suckers 300 in the E shape and the second silicon wafer sucker 400 are matched tightly, the rotating device drives the first silicon wafer sucker 300 and the second silicon wafer sucker 400 to rotate, when the silicon wafers are overlapped in the 45-degree angle direction, the suckers are staggered, interference cannot be generated, the two large suckers are assembled into the same plane, a single large-size silicon wafer 500 can be specially distinguished or the silicon wafers 500 positioned at two sides of the two silicon wafer suckers can be grabbed, and the application range is greatly improved
The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. Equivalent substitutes or changes made by the technical personnel in the technical field on the basis of the utility model are all within the protection scope of the utility model. The protection scope of the present invention is subject to the claims.
Claims (10)
1. A fast silicon chip inserting sucker mechanism is characterized by comprising a first sucker component and a second sucker component; the first sucking disc component comprises a first fixed seat, a plurality of first silicon wafer sucking discs are uniformly arranged on the first fixed seat, and a first channel is arranged between every two adjacent first silicon wafer sucking discs; the second sucker assembly comprises a second fixed seat, a plurality of second silicon wafer suckers are uniformly arranged on the second fixed seat, and a second channel is arranged between every two adjacent second silicon wafer suckers; the adsorption surface of the first silicon wafer sucker is opposite to the adsorption surface of the second silicon wafer sucker in direction, the first sucker component and the second sucker component respectively grab the silicon wafers and then move relatively, the silicon wafers grabbed by the first sucker component penetrate through the second channel, and the silicon wafers grabbed by the second sucker component penetrate through the first channel.
2. The quick-insertion silicon wafer chuck mechanism according to claim 1, wherein the first fixing seat and the second fixing seat have the same structure, the first fixing seat comprises a base, a bottom plate and a plurality of pipe joints, the base is provided with a plurality of mounting grooves for mounting the first silicon wafer chuck, the pipe joints are arranged on the bottom plate, the bottom plate is connected with the base in a sealing manner, and the pipe joints are communicated with the mounting grooves.
3. The mechanism as claimed in claim 2, wherein the first and second silicon wafer chucks have position-limiting grooves, the base has fixing grooves matching with the position-limiting grooves, and the fixing grooves have fixing strips, so that the first silicon wafer chuck cannot be separated from the base.
4. The mechanism of claim 1, wherein the first wafer chuck comprises a first suction plate and a first sealing plate, wherein two first auxiliary suction plates are disposed on the first suction plate, the first suction plate and the first auxiliary suction plate are both provided with first suction holes, and the first sealing plate is hermetically connected to the first suction plate.
5. The fast silicon wafer inserting suction cup mechanism according to claim 4, wherein the first suction plate is provided with a first suction port, the first suction plate is provided with a first vacuum channel, the first suction port is communicated with the first vacuum channel, the first auxiliary suction plate is provided with a first branch channel, the first branch channel is communicated with the first vacuum channel, and the first suction hole is communicated with the first vacuum channel and the first branch channel.
6. The wafer chuck mechanism according to claim 5, further comprising a guide plate connected to the first suction plate and the first auxiliary suction plate away from the first suction port, wherein guide slopes are provided on both sides of the guide plate; the cross section of the guide plate is triangular or trapezoidal.
7. The mechanism as claimed in claim 4, wherein the second wafer chuck comprises a second suction plate and a second sealing plate, the second suction plate has two second auxiliary suction plates, the second suction plate and the second auxiliary suction plate have second suction holes, and the second sealing plate is hermetically connected to the second suction plate; the second suction plate is provided with an extension suction plate, and an extension suction hole is formed in the adsorption surface of the extension suction plate.
8. The chuck mechanism according to claim 7, wherein the extended suction plate has an extended cavity communicating with the second suction plate, and the extended suction hole communicates with the extended cavity.
9. The wafer lift chuck mechanism as recited in claim 7, wherein a positioning groove is disposed between the extended suction plate and the second auxiliary suction plate, the positioning groove has a profile matching the profile of the first auxiliary suction plate, and the extended suction plate has a length greater than or equal to the width of the first auxiliary suction plate.
10. The chuck mechanism according to claim 7, wherein two first auxiliary suction plates are disposed in parallel on the first suction plate, and a receiving groove is disposed between the two first auxiliary suction plates, and the width of the receiving groove is greater than or equal to the width of the second auxiliary suction plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021780795.XU CN214140597U (en) | 2020-08-24 | 2020-08-24 | Fast silicon chip of inserting sucking disc mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021780795.XU CN214140597U (en) | 2020-08-24 | 2020-08-24 | Fast silicon chip of inserting sucking disc mechanism |
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| Publication Number | Publication Date |
|---|---|
| CN214140597U true CN214140597U (en) | 2021-09-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021780795.XU Active CN214140597U (en) | 2020-08-24 | 2020-08-24 | Fast silicon chip of inserting sucking disc mechanism |
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| CN (1) | CN214140597U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113915225A (en) * | 2021-09-16 | 2022-01-11 | 苏州诚拓智能装备有限公司 | Sucking disc inserts mechanism and sucking disc device soon |
| CN113977564A (en) * | 2021-09-16 | 2022-01-28 | 苏州诚拓智能装备有限公司 | Silicon chip pickup device |
-
2020
- 2020-08-24 CN CN202021780795.XU patent/CN214140597U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113915225A (en) * | 2021-09-16 | 2022-01-11 | 苏州诚拓智能装备有限公司 | Sucking disc inserts mechanism and sucking disc device soon |
| CN113977564A (en) * | 2021-09-16 | 2022-01-28 | 苏州诚拓智能装备有限公司 | Silicon chip pickup device |
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