CN214086806U - Handling device for a component carrier structure and transport device - Google Patents

Abstract

The invention relates to a handling device and a transport apparatus for a component carrier structure, the handling device (100) being intended for handling the component carrier structure (102) during transfer of the component carrier structure (102) between chambers (104, 106) having different pressure conditions, the handling device (100) comprising a shaft (108) and at least one roller (114), the shaft is split into at least one split shaft portion (110) by respective slots (112) extending into the shaft (108), and at least one roller (114) mounted on a respective one of the at least one split shaft portions (110), and at least one roller is arranged for pressing the component carrier structure (102) downwards when the component carrier structure (102) is transferred between the chambers (104, 106) having different pressure conditions under the at least one roller (114).

Description

Handling device for a component carrier structure and transport device

Technical Field

The present invention relates to a handling device for handling component-bearing structures during transfer between chambers having different pressure conditions, and to a transport apparatus for transporting component-bearing structures between chambers having different pressure conditions. Furthermore, a method for transporting a component carrier structure between chambers having different pressure conditions is provided.

Background

Product functions of component carriers equipped with one or more electronic components are increasing and the degree of miniaturization of these components is increasing and the number of components to be mounted on component carriers such as printed circuit boards is increasing, in which case more and more powerful array-like components or packages with several components are employed, which have a plurality of contacts or connections with even smaller spacings between them. The dissipation of heat generated by these components and the component carrier itself during operation becomes an increasingly more pronounced problem. At the same time, the component carrier should be mechanically robust and electrically reliable in order to be operable even under severe conditions. All these requirements are not contradictory to the continuously miniaturized parallelization of the component carriers and their components.

However, it is difficult to transport thin component carrier structures such as panels during the manufacture of component carriers such as printed circuit boards without the risk of damage.

Thus, a reliable system for transporting component carrier structures without risk of damage may be required.

SUMMERY OF THE UTILITY MODEL

According to the present invention, there is provided an handling device for handling a component carrying part structure during transfer of the component carrying part structure between chambers having different pressure conditions, wherein the handling device comprises: a shaft separated into at least one separable shaft portion by respective slots extending into the shaft; and at least one roller mounted on a respective one of the at least one split shaft portions and arranged for pressing the component carrier structure downwards when passing under the at least one roller between the chambers having different pressure conditions.

According to the present invention, a conveying apparatus for conveying a component-carrying member structure between chambers having different pressure conditions is provided, wherein the conveying apparatus comprises: a transport unit on which the component carrier structures can be transported between chambers having different pressure conditions; and a handling device with the above-mentioned features for handling the component carrier structure during transport of the component carrier structure between chambers with different pressure conditions, wherein the transport unit and the handling device are arranged such that the component carrier structure can be arranged between the transport unit of the bottom side and the handling device of the top side during transport of the component carrier structure.

Furthermore, a method of transporting component carrier structures between chambers with different pressure conditions (in particular between clean rooms with different classes) during manufacturing of the component carriers is disclosed, wherein the method comprises transporting the component carrier structures between chambers with different pressure conditions on a transport unit, arranging the component carrier structures between the transport unit on the bottom side and a handling device on the top side during transport, and pressing the component carrier structures downwards by means of at least one roller of the handling device, which is mounted on a respective one of at least one separate shaft part of the handling device.

In the context of the present application, the term "component carrier" may particularly denote any support structure capable of accommodating one or more components thereon and/or therein to provide mechanical support and/or electrical connectivity. In other words, the component carrier may be configured as a mechanical and/or electronic carrier for the component. In particular, the component carrier may be one of a printed circuit board, an organic interposer, and an IC (integrated circuit) substrate. The component carrier may also be a hybrid board combining different types of component carriers of the above-mentioned types of component carriers.

In the context of the present application, the term "component carrier structure" may particularly denote a foil which is handled and processed during manufacturing of the component carrier. For example, the component carrier structure may be a panel, an array or the component carrier itself. For example, the component carrier structure may be a laminated layer stack comprising dielectric layer structures (e.g. comprising resin and glass particles) and metal layer structures (e.g. patterned copper foil and/or copper-filled laser vias). When the component carrier (such as a printed circuit board or an integrated circuit substrate) is manufactured in a batch process or on a panel level, the integrally connected component carrier structure may be as a whole in a panel (e.g. having about 460 x 610 mm)²Or larger) for manipulation. The array (e.g. quarter panel) may be a (moulded) part of a panel having a plurality of component carriers (e.g. six or more) which may for example be arranged in a matrix, i.e. in rows and columns.

In the context of the present application, the term "chambers with different pressure conditions" may particularly denote adjacent spatial portions of a component carrier manufacturing plant, wherein different ambient pressure conditions (in particular different pressure levels) may be present in the different spatial portions. For example, in a clean room, the ambient pressure of the clean room may be different from the standard or atmospheric pressure outside the clean room. Thus, air flow may occur in the interface region between chambers of different pressure levels, which may generate a slight wind or other kind of air flow. Thus, the sheet component carrier structure may be subjected to blow-up or bending or wrinkling caused by said air flow.

According to the present invention, a handling device for use in a transfer apparatus for transporting or transferring a component carrier structure (such as a panel comprising a plurality of preforms of component carriers or integrated circuit substrates) between adjacent chambers having different ambient pressure conditions is provided, which handling device reliably prevents the component carrier structure from blowing up or bending or wrinkling while protecting the component carrier structure from the risk of scratches or other types of damage. This may be achieved by a rotatable roller which presses the component carrier structure downwards under the influence of gravity when mounted on the separate shaft. By having the shafts on which the rotatable rollers are mounted separate, any forces acting on the rollers can be attenuated or damped, so that by pressing the component carrier downwards from the top side by the rotating rollers, the component carrier structure below the rollers can be reliably protected from mechanical damage. Any tendency of the component carrier structure to move, bend or wrinkle unintentionally due to the influence of the air flow caused by the pressure difference between adjacent chambers can thus be reliably suppressed by the weight of the rollers, while at the same time scratch damage of the component carrier structure is prevented thanks to the resilient mounting of the rollers. Furthermore, the split shaft solution may make the manipulator compatible with component carrier structures having different thicknesses varying over a wide range.

Next, further exemplary embodiments of the handling device, the conveying apparatus and the method will be explained.

In one embodiment, the method comprises transporting the component carrier structure in terms of dry film lamination. During processing of a component carrier structure, such as a panel for manufacturing a printed circuit board or an integrated circuit substrate, a dry film layer may be laminated and patterned on the component carrier structure. This may involve handling the respective component carrier structures in different classes of cleanrooms, and transferring between these cleanrooms. When implementing the handling device according to the present invention, such a task can be achieved without the risk of blowing up the sheet-type component carrier structure due to air flows that may occur between different chambers at different pressure levels.

In one embodiment, the method is performed in or between chambers that are clean rooms. A clean room may represent a facility used as part of the industrial production of component carriers such as Printed Circuit Board (PCB) or Integrated Circuit (IC) substrates. Clean rooms can be specifically designed to maintain very low levels of particles, such as dust, airborne organisms, or vaporized particles. This may involve regulation of the pressure in the clean room, which may be different from the ambient atmospheric pressure.

In one embodiment, the method is performed with a flat component carrier structure having a thickness in the range of 0.1mm to 2.5 mm. Since the rollers are rotatably and flexibly mounted on separate shafts with slots, the manipulator itself may be capable of automatic adjustment over a wide range of manipulated component carrier configurations of different thicknesses.

In one embodiment, at least one slot is a through hole extending through the entire shaft. Such a through hole may be formed mechanically (e.g. milled) in, for example, a cylindrical shaft. Alternatively, the at least one slot may be formed as a blind hole in the shaft.

In an embodiment, the at least one slit extends parallel to the central axis of the shaft, but preferably does not extend through the central axis of the shaft. In other words, the plane defining the slot may be parallel to the central axis of the shaft, i.e. laterally displaced but not inclined with respect to the central axis of the shaft. This ensures the elastic properties of the shaft in the mounting area of one or more rollers, thereby facilitating the damping of the impact of the elastically mounted rotatable rollers.

In one embodiment, at least one slot divides the shaft into two portions having different cross-sectional areas. In other words, at least one slit may define an asymmetric cut line that divides the shaft in cross-sectional view into two circle segment portions having different dimensions. Such an asymmetric separation of the shafts in the mounting region of one or more rollers may allow fine tuning of the mechanical properties of the manipulator.

In an embodiment, the at least one slit forms a gap of at least 0.5mm, in particular a gap in the range of 0.5mm to 2mm, in the at least one split shaft portion. By adjusting the size of the gap, the damping or cushioning or spring action on the split shaft can be precisely adjusted to achieve a suitable compromise between robustness and resilience.

In an embodiment, the at least one roller is mounted on the respective at least one split shaft part by means of at least one fastening element, in particular at least one screw, which extends into the roller frame and into at least one (preferably only one) of the two parts of the at least one split shaft part. The roller frame may for example be an integrally formed body having an opening for mounting the roller wheel to be dispensed, the shaft to be dispensed and the at least one fastening element. The fastening elements may be inserted into corresponding recesses of the roll frame for applying a force to a shaft connecting the roll frame with the shaft.

In one embodiment, the roller frame has at least one non-circular recess, in particular at least one oval recess, for accommodating a fastening element such as a screw. When the above-mentioned recess has a non-circular cross-section and cooperates with a fastening element, for example a screw, having a substantially circular cross-section, a selectable degree of play, play or tolerance can be established between the fastening element and the roller frame. Thus, the fastening element is free to move within the recess within a limited spatial range for adjusting the distance between the component carrier structure and the roller. A plurality of (in particular two) non-circular recesses in the roller frame may allow mounting the roller on the shaft for achieving two opposite directions of movement of the component carrier structure, i.e. in one direction and in opposite directions.

In one embodiment, the roller frame may have a first shaft opening that receives the at least one split shaft portion and may have a second shaft opening that receives a rotatable axle of the rotatable wheel. The first shaft opening may be in communication with the recess for receiving the fastening element described above, such that insertion of the fastening element into the recess may allow application of a fastening force to the shaft in the first shaft opening, more specifically to one of the shaft portions of the split shaft portion.

In one embodiment, the roller frame has a straight surface portion aligned with a tangent of the rotatable wheel. In other words, the straight portion may continuously transition into the rotatable wheel. In a side view, the straight portion and the tangent of the rotatable wheel may lie on a common straight line. This alignment between the rollers and the roller frame prevents jamming of the accidentally bent component carrier structure.

Advantageously, the rollers and/or the roller frame (in particular at least a straight portion of the roller frame) may be made of a non-abrasive material and/or a non-polar material and/or a low friction material and/or a uniform and/or wear resistant material. For example, the rollers may be made of polyvinylidene fluoride (PVDF) or polyvinyl dichloride (PVD). Other exemplary or semi-crystalline polymers that may also be used are LCP (liquid crystal polymer), PTFE (polytetrafluoroethylene), PPS (polyphenylene sulfide), PPA (polyphthalamide), and PEEK (polyetheretherketone). However, the materials mentioned are merely examples of high performance polymers suitable for forming the rollers and/or roller frame. In other embodiments, other materials may be used, such as in the form of a coating coated with one or more of the above materials. The non-abrasive property prevents foreign materials from entering the manufacturing plant. The non-polar characteristic prevents wetting of the roller, thereby preventing the component carrier structure from undesirably adhering to the roller. The low friction properties of the material avoid excessive driving energy. Preferably, the downwardly facing straight surface of the roll frame features a substantially flat, corner-free, non-undulating surface, i.e. may be flat.

In one embodiment, the shaft is solid (i.e., not slotted) except for at least one split shaft portion. Although the through-holes may selectively form gaps in the region of the mounted rollers, other portions of the shaft than the rollers may be solid, i.e., there are no through-holes or slots. This may combine the robustness of the handling device with the limited flexibility of the space around the roller.

In one embodiment, the handling device comprises two opposing frame structures having in particular U-shaped recesses which accommodate opposite end portions of the shaft, in particular non-rotationally symmetrical end portions of the shaft. This may simplify the mounting of the shaft or shafts with the mounting roller or rollers on the frame structure by simply inserting the opposite end portions of the respective shaft into the (preferably U-shaped) recess. When the respective shaft is prevented from rotating during operation of the manipulator (and thus only the rollers rotate during operation), no precision bearings are required at the interface between the frame structure and the shaft, which reduces the overall complexity of the manipulator.

In one embodiment, the steering device comprises a plurality of shafts mounted in a parallel manner in the frame structure. In particular, a plurality of shafts may be arranged parallel to each other, wherein each shaft may support one or preferably a plurality of mutually spaced rollers. By such a configuration, a two-dimensional arrangement of rollers can be provided, so that a substantially two-dimensional pressure pattern is applied to the sheet-type component carrier structure to be processed between chambers of different pressures. This may reliably prevent any undesired bending, wrinkling or blowing of the component carrier structure even in the presence of an air flow between the chambers having different pressure conditions.

In one embodiment, the recesses of at least one of the frame structures are arranged in a zigzag shape. This makes it possible to reliably prevent the shaft from accidentally falling out of the frame structure of the handling device, for example by the force exerted by the moving component carrier structure on the roller.

In one embodiment, the frame structure has a mounting device for mounting the handling device on the transport unit or at any other structure of the transport apparatus. The transport unit may be a component of the apparatus that actually moves the component carrier between chambers having different pressure conditions. In order to connect the handling device with such a conveyor unit or any other structure of the conveyor apparatus, the laterally arranged frame structure may be provided with mounting means which allow mounting of the handling device on an existing conveyor unit of the conveyor apparatus or another existing structure. For example, such a mounting means may comprise an array of oblong holes into which fastening elements (such as screws) may be inserted for fastening the handling device to the conveying apparatus without any undesired effect on the levelling function of the handling device.

In one embodiment, the transport unit comprises a conveyor belt. The transport device may thus comprise a conveyor below the handling means, in particular a belt for moving the component carrier structure by means of the conveyor, in particular on the belt. Such a belt conveyor or any other type of conveyor may be configured (particularly shaped and dimensioned) for carrying dispensed component carrier structures, such as panels.

In one embodiment, the handling device is configured to apply pressure to the component carrier structure based solely on gravity. By arranging the component carrier structure to be vertically manipulated to be sandwiched between the upper side roller and the bottom side conveyor, the weight of the rotatable rollers can act directly on the component carrier structure to be flattened. Thus, no active control of the manipulator may be required, which makes the manipulator simple and fault-robust.

In an embodiment, the at least one roller is mounted on a respective one of the at least one split shaft portions such that the primary roller axis is inclined with respect to the vertical direction. For example, the tilt angle may be at least 10 °, and for example about 45 °. Such a tilting ensures a smooth but sufficiently strong mechanical impact of the roller on the component carrier structure.

In one embodiment, the actuating device is designed for autonomous operation without control, in particular without electronic control. Thus, the steering device (and in particular the rollers of the steering device, more in particular the rotating wheels of the steering device) may be constructed as a purely passive system which does not require an electric drive system or the like and may function solely on the basis of the laws of mechanical mechanics. This simplifies the handling of the handling device.

In one embodiment, the component carrier structure and/or the manufactured component carrier comprise a stack of at least one electrically insulating layer structure and at least one electrically conductive layer structure. For example, the component carrier may be a laminate of one or more of the electrically insulating layer structures and one or more of the electrically conductive layer structures mentioned, in particular formed by applying mechanical pressure and/or supplying thermal energy. The stack may provide a plate-like component carrier which is able to provide a large mounting surface for further components and which is still very thin and compact. The term "layer structure" may particularly denote a continuous layer, a patterned layer or a plurality of non-continuous islands in a common plane.

In one embodiment, the component carrier structure and/or the manufactured component carrier is shaped as a plate. This contributes to a compact design, wherein the component carrier still provides a large basis for mounting components thereon. Further, a bare chip, which is an example of an embedded electronic component in particular, can be easily embedded in a thin board such as a printed circuit board due to its small thickness.

In one embodiment, the component carrier is configured as one of the following: a printed circuit board, a substrate (in particular an IC substrate) and an interposer.

In the context of the present application, the term "printed circuit board" (PCB) may particularly denote a board-like component carrier formed by laminating several electrically conductive layer structures with several electrically insulating layer structures, for example by applying pressure and/or by supplying thermal energy. As a preferred material for PCB technology, the electrically conductive layer structure is made of copper, while the electrically insulating layer structure may comprise resin and/or glass fibres, so-called prepreg or FR4 material. The electrically conductive layer structures can be connected to each other in a desired manner by forming a through hole through the laminate, for example by laser drilling or mechanical drilling, and by filling the through hole with an electrically conductive material, in particular copper, thereby forming a via hole as a connection to the through hole. In addition to one or more components that may be embedded in a printed circuit board, printed circuit boards are typically configured to receive one or more components on one surface or both opposing surfaces of a plate-like printed circuit board. The one or more components may be attached to the respective major surfaces by welding. The dielectric portion of the PCB may include a resin with reinforcing fibers, such as glass fibers.

In the context of the present application, the term "substrate" may particularly denote a small component carrier. The substrate may be a rather small component carrier relative to the PCB, one or more components may be mounted on the small component carrier, and the substrate may serve as a connection medium between one or more chips and a further PCB. For example, the substrate may have substantially the same size as the components (particularly electronic components) to be mounted on the substrate (for example, in the case of Chip Scale Package (CSP)). More specifically, a substrate may be understood as a carrier for electrical connections or electrical networks and a component carrier comparable to a Printed Circuit Board (PCB) but with a relatively high density of laterally and/or vertically arranged connections. The transverse connectors are, for example, conductive paths, while the vertical connectors may be, for example, drilled holes. These lateral and/or vertical connections are arranged within the base plate and may be used to provide electrical, thermal and/or mechanical connection of a housed or unreceived component (such as a bare wafer), in particular an IC chip, to a printed circuit board or an intermediate printed circuit board. Thus, the term "substrate" also includes "IC substrates". The dielectric part of the substrate may comprise a resin with reinforcing particles, such as reinforcing spheres, in particular glass spheres.

The substrate or interposer may include or consist of: at least one layer of glass, silicon (Si) or a photoimageable or dry-etchable organic material such as an epoxy-based build-up material (e.g. epoxy-based build-up film) or a polymer composite such as a polyimide, polybenzoxazole or benzocyclobutene functional polymer.

In one embodiment, the at least one electrically insulating layer structure comprises at least one of: resins (such as reinforced or non-reinforced resins, for example epoxy or bismaleimide-triazine resins), cyanate esters, polyphenylene derivatives, glass (especially glass fibers, multiple layers of glass, glassy materials), pre-pregs (such as FR-4 or FR-5), polyimides, polyamides, Liquid Crystal Polymers (LCP), epoxy-based laminates, polytetrafluoroethylene (PTFE, teflon), ceramics and metal oxides. Reinforcing materials made of glass (multiple layer glass), such as meshes, fibers or spheres, for example, may also be used. Although prepreg, in particular FR4, is generally preferred for rigid PCBs, other materials may be used, in particular epoxy based build-up films or photoimageable dielectric materials. For high frequency applications, high frequency materials such as polytetrafluoroethylene, liquid crystal polymers and/or cyanate ester resins, low temperature co-fired ceramics (LTCC) or other low DK materials, very low or ultra low DK materials can be implemented as an electrically insulating layer structure in the component carrier.

In one embodiment, the at least one electronically conductive layer structure comprises at least one of: copper, aluminum, nickel, silver, gold, palladium, and tungsten. Although copper is generally preferred, other materials or other types of coatings thereof are possible, in particular electrically conductive layer structures coated with a superconducting material such as graphene.

At least one component that may be embedded in the stack and/or surface mounted in the stack may be selected from: a non-conductive inlay, a conductive inlay (e.g. a metal inlay, preferably comprising copper or aluminum), a heat transfer unit (e.g. a heat pipe), a light guiding element (e.g. a light guide or a light conductor connection), an optical element (e.g. a lens), an electronic component or a combination thereof. For example, the component may be an active electronic component, a passive electronic component, an electronic chip, a memory device (e.g., DRAM or other data storage), a filter, an integrated circuit, a signal processing component, a power management component, an optoelectronic interface element, a light emitting diode, an opto-coupler, a voltage converter (e.g., a DC/DC converter or an AC/DC converter), a cryptographic component, a transmitter and/or receiver, an electromechanical converter, a sensor, an actuator, a micro-electro-mechanical system (MEMS), a microprocessor, a capacitor, a resistor, an inductance, a battery, a switch, a camera, an antenna, a logic chip, and an energy harvesting unit. However, other components may also be embedded in the component carrier. For example, a magnetic element may be used as the component. Such magnetic elements may be permanent magnetic elements (such as ferromagnetic elements, antiferromagnetic elements, multiferromagnetic elements or ferrimagnetic elements, e.g. ferrite cores) or may be paramagnetic elements. However, the component may also be a substrate, an interposer or another component carrier, for example in a board-in-board configuration. The component may be surface mounted on the component carrier and/or may be embedded inside the component carrier. In addition, other components, in particular those which generate and emit electromagnetic radiation and/or which are sensitive to electromagnetic radiation propagating from the environment, can also be used as components.

In one embodiment, the component carrier is a laminated component carrier. In such an embodiment, the component carrier is a composite of a multilayer structure that is stacked and joined together by the application of compressive force and/or heat.

After processing the inner layer structure of the component carrier, one or both opposite main surfaces of the processed layer structure may be covered (in particular by lamination) symmetrically or asymmetrically with one or more further electrically insulating layer structures and/or electrically conductive layer structures. In other words, the accumulation may continue until the desired number of layers is obtained.

After completing the formation of the stack with the electrically insulating layer structure and the electrically conductive layer structure, the obtained layer structure or component carrier may be subjected to a surface treatment.

In particular, in the case of surface treatment, an electrically insulating solder resist can be applied to one or both of the opposite main surfaces of the layer stack or component carrier. For example, a solder resist, for example, may be formed over the entire major surface and then patterned to expose one or more electrically conductive surface portions that will be used to electrically couple the component carrier to the electronic periphery. The surface portion of the component carrier, in particular the surface portion comprising copper, which remains covered with solder resist, can be effectively protected against oxidation or corrosion.

In the case of a surface treatment, a surface finish may also be applied selectively to the exposed electrically conductive surface portions of the component carrier. Such a surface finish may be an electrically conductive covering material on exposed electrically conductive layer structures (such as pads, electrically conductive traces, etc., particularly comprising or consisting of copper) on the surface of the component carrier. If such exposed electrically conductive layer structures are not protected, the exposed electrically conductive component carrier material (particularly copper) may be oxidized, thereby reducing the reliability of the component carrier. The surface finish may then for example be formed as a joint between the surface mounted component and the component carrier. The surface finish has the function of protecting the exposed electrically conductive layer structure (in particular the copper circuit) and the joining process with one or more components is effected, for example, by soldering. Examples of suitable materials for the surface finishing section are Organic Solderability Preservative (OSP), chemical nickel immersion gold (ENIG), gold (in particular hard gold), chemical tin, nickel gold, nickel palladium, chemical nickel immersion palladium gold (ENIPIG), and the like.

The aspects defined above and further aspects of the invention are apparent from the examples of embodiment to be described hereinafter and are explained with reference to the examples of embodiment. Exemplary embodiments of the present invention will be described in more detail hereinafter with reference to examples of embodiments, but the scope of the present invention is not limited thereto.

Drawings

Fig. 1 shows a manipulator according to the invention.

Fig. 2 shows a part of a roller of the handling device of fig. 1.

Fig. 3 shows a conveying installation with the handling device of fig. 1.

Fig. 4 shows a cross section of the shaft of the handling device of fig. 1.

Fig. 5 shows a detail of the conveying device of fig. 3.

Fig. 6 shows a three-dimensional view of a conveying device according to the invention.

Fig. 7 shows a plan view of the conveyor apparatus of fig. 6.

Fig. 8 shows a side view of the conveyor apparatus of fig. 6.

Fig. 9 and 10 show different side views of the roller frame of the handling device of the conveying installation of fig. 6.

Fig. 11 and 12 show different operating states of the conveying apparatus of the invention.

Detailed Description

The illustration in the drawings is schematically.

Before describing the exemplary embodiments in more detail with reference to the drawings, some basic considerations will be summarized based on the exemplary embodiments of the present invention that have been developed.

According to the invention, one or more top-side rollers may be provided to press a component carrier structure (such as a panel for manufacturing printed circuit boards) against the bottom-side conveyor to avoid undesired upward forces acting on the component carrier structure (in particular pushing the panel upwards), which may be caused by a difference in air pressure of the chamber through which the component carrier structure is to be transferred. Thus, the present invention may utilize a (preferably passive) top roller to reliably transport a substrate, such as a component carrier structure, thereby preventing upward displacement of the substrate. Therefore, the substrate can be surely not damaged. It is therefore advantageous to design a top roller: the top roller presses the panel or any other component carrier structure down when the panel or any other component carrier structure is transferred between different levels of cleanrooms (e.g., different cleanroom levels according to ISO 14644-1).

The above concept of the present invention has the advantages: first, the described configuration may provide friction to the component carrier structure by gravity acting on the rollers, driving the panels by the conveyor for enabling transfer between chambers having different pressures. Advantageously, if there is no panel under the handling device or tool, the transfer between chambers of different pressures can be achieved without contacting the conveyor. By providing a separate shaft on which the rollers may be mounted, the handling device is able to handle component carrier structures having different thicknesses, for example panel thicknesses in the range of 0.1mm to 2.5mm are supported or allowed. Advantageously, the inventive handling device may only have a purely mechanical design, so that no external power or electrical control is required in such an embodiment. Furthermore, the handling device according to the invention can be operated without touching the panel pattern area, which further improves the protection of the component carrier structure against damage during handling. Due to the non-contact operation according to the inventive handling device, foreign objects can be prevented from entering the manufacturing system. Besides, the operating device according to the utility model is simple to install. The configuration of the manipulator according to the invention may be compatible with electrostatic discharge (ESD) requirements.

According to the present invention, a top roller can be used to balance the clean room pressure of a component carrier structure such as a panel product. In particular, contact with the conveyor can advantageously be prevented by implementing a contactless design.

In conventional approaches, where the panels are transferred between chambers, the panels (especially in thin and light cases) may show a tendency to push up due to wind caused by the air pressure difference between the chambers. Conventionally, this may result in panel transfer failures and scratches. To solve this problem, the present invention provides a handling device or tool comprising at least one top roller having a split shaft portion designed to press the panel against the conveyor in a smooth manner. Thus, the panels or other component carrier structures can be transferred smoothly between chambers of different pressures. Advantageously, the manipulation device or tool according to the present invention may be of purely mechanical design, may be easily installed and may be operated without contacting the patterned area of the component carrier structure. Thus, the handling device according to the present invention can reduce or even eliminate any panel transport problems.

In particular, the top roller of the manipulator according to the invention may be a free or driven roller, preferably without a connection between the upper and lower shafts, and without any active or motorized roller drive. Advantageously, due to the gap inside the shaft in the split shaft portion, the respective roller may move upwards in the range of, for example, 0.1mm to 2.5 mm. Each top roller may be independent of the other. In particular, each individual axis may have a tolerance of, for example, up to 2.5mm or more, to cover a wide range of different panel thicknesses. Preferably, the shaft is prevented from rotating, so that no bearing needs to be mounted on the shaft. The handling device of the present invention makes it possible in particular to avoid that the panel (or any other component carrier structure) is blown upwards due to the difference in air pressure between different cleanrooms of different grades, so that the panel or other type of component carrier structure is straight.

Fig. 1 shows a cross-sectional view of a manipulator 100 according to the present invention. Fig. 2 shows a three-dimensional view of a portion of the roller 114 of the handler 100 of fig. 1, more particularly showing the roller frame 124 of the roller 114. Fig. 3 shows a three-dimensional view of the transport device 150 with the handling device 100 of fig. 1. Fig. 4 shows a cross-sectional view of the shaft 108 of the manipulating device 100 of fig. 1 at a different position. Fig. 5 shows additional details of the delivery apparatus 150 of fig. 3.

The transport apparatus 150 of the embodiment of fig. 1 to 5 is configured for transporting the component carrier structure 102 between different clean rooms 104, 106 having different clean room grades and thus different pressure conditions. In other words, the ambient pressure in the clean room 104 may be different from another ambient pressure in the clean room 106. The sheet component carrier structure 102 is implemented herein for manufacturing a component carrier such as a Printed Circuit Board (PCB) or an Integrated Circuit (IC) substrate, which pressure difference may create an airflow that encourages unwanted upward pushing when the sheet component carrier structure 102 is transferred or transported between the clean room 104 and the clean room 106 along the direction 170 shown in fig. 3, thereby bending and/or wrinkling the component carrier structure 102. Fig. 1 to 5 show the transport apparatus 150 without the component carrier structure 102, but with reference to fig. 8 and 11. The described artifacts may interfere with the handling of the component carrier structure 102, may cause an unexpected interruption of the manufacturing process, and may even damage the component carrier structure 102. The illustrated handler 100 of the delivery apparatus 150 provides the following purely passive and therefore very simple mechanism: this mechanism keeps the component carrier structure 102 planar and flat during transfer of the component carrier structure 102 from the first clean room 104 to the second clean room 106 or in the opposite direction, even in the presence of an air flow caused by a pressure difference.

As schematically shown in fig. 3 and 5, the transport device 150 comprises a transport unit 152 on which the component carrier structures 102 can be transported between the chambers 104, 106 having different pressure conditions. The sheet-type component carrier structure 102 may be supported on its bottom side by a transport unit 152, which transport unit 152 may comprise a movable belt or other type of conveyor for moving the component carrier structure 102 from the chamber 104 to the chamber 106. Such a belt-type conveying unit 152 can be observed in fig. 8. Thus, the transport unit 152 may include a conveyor belt 164 (compare fig. 8).

In order to prevent undesired shape changes of the component carrier structure 102 caused by pressure gradients during transport from the chamber 104 to the chamber 106, the transport apparatus 150 is equipped with a handling device 100. The handling device 100 is configured for handling the component carrier structure 102 from the top side while the transport unit 152 supports the component carrier structure 102 from the bottom side during transport of the component carrier structure 102 between the chambers 104, 106 having different pressure conditions. Advantageously, the transport unit 152 and the handling device 100 may be arranged such that the component carrier arrangement 102 is sandwiched between the transport unit 152 at the bottom side and the handling device 100 at the top side during transport. From the description, the transport unit 152 bears the component carrier structure 102 at the bottom side, while the handling device 100 presses the component carrier 102 down smoothly onto the transport unit 152 for preventing an undesired blow-up of the component carrier structure 102 during its movement from the chamber 104 to the chamber 106.

For this purpose, the handling device 100 comprises a plurality of oblong shafts 108 arranged parallel to each other. Although three shafts 108 are shown in fig. 3, any other number of shafts 108 is possible. Also shown in fig. 3, a plurality of rollers 114 are rotatably mounted on each of the shafts 108. In the embodiment shown, three rollers 114 are mounted on each shaft 108. However, any other number of rollers 114 may be provided with each shaft 108.

As can be seen in fig. 1 and 4, each shaft 108 may be partially separated into respective separable shaft portions 110 by respective slits 112 extending into the shaft 108. More specifically, each of the shafts 108 may be made of a solid rod (preferably having a circular cross-section). Wherein the rod is provided with respective slits 112 only in the split shaft portion 110 corresponding to the portion of the shaft 108 on which the respective rollers 114 are mounted. Thus, the shaft 108 is solid (see left side of fig. 4) except for at least one split shaft portion 110 (see right side of fig. 4). Other portions of the shaft 108 between adjacent rollers 114 may be free of the slots 112 and, thus, may be solid. This ensures an adjustable degree of elasticity of the shafts 108 around the rollers 114 and a sufficiently high robustness of the respective shaft 108 in addition to the rollers 114.

As shown in fig. 1, any roller 114 may be mounted on a respective one of the split shaft portions 110 such that the major axis 172 of the roller 114 is oblique (in the form of a g-vector 199, shown in fig. 1) relative to the vertical direction. The corresponding acute angle of inclination (between the main axis 172 and the g-vector 199) may be greater than 10 °, in particular greater than 20 °, more in particular in the range from 25 ° to 65 °, preferably in the range from 35 ° to 55 °, for example about 45 °.

Further, the roller wheels 132 may be mounted on the respective roller frames 124 of the designated rollers 114 so as to be rotatable according to arrows 174 shown in fig. 1. In view of the configuration of the rollers 114 and the gravitational forces acting on the rollers 114 (see g-vector 199), the top rollers 114 apply a pressing force to the lower component carrier structure 102. Thus, when the component carrier structure 102 is transferred between the chambers 104, 106 of different pressure conditions by the transport apparatus 150, the rollers 114 force the component carrier structure 102 sandwiched between the rollers 114 and the transport unit 152 downwards.

As shown in fig. 1 and 4, the slot 112 is a through hole that extends completely through the shaft 108. Thus, the split shaft portion 110 acts as a locally contracted resilient mechanical buffer, thereby adjusting the manipulation device 100 to be suitable for component carrier structures 102 having different thicknesses (see the right side of fig. 4). As shown on the left side of fig. 4, the shaft 108 is solid except for the rollers 114 to provide sufficient mechanical stability to the overall manipulator 100.

Referring to fig. 3 and 4, each respective slot 112 extends parallel to the central axis 116 of the dispensing shaft 108 (and is preferably laterally displaced relative to the central axis 116 of the dispensing shaft 108). Further, each slot 112 divides the shaft 108 into two portions 118 having different cross-sectional areas a1, a 2. According to fig. 4, the cross-sectional area a1 is larger than the cross-sectional area a 2. Referring to fig. 1, the portion 118 corresponding to the smaller cross-sectional area a2 has a recess for receiving a fastening element 122, such as a screw. A fastening element 122, described in more detail below, is used to connect the dispensing roller 114 to the shaft 108. Returning to the slot 112, a gap 120 is formed by the slot 112 in the dispensed breakaway shaft portion 110. The gap 120 may have a width w of, for example, 1mm, and may separate the portion 118 into the split shaft portion 110.

As already mentioned above, each roller 114 may be mounted on the respective separation shaft portion 110 by means of assigned fastening elements 122, which assigned fastening elements 122 are embodied here as screws. Referring to fig. 1 and 2, the fastening element 122 is inserted into a recess 136 formed in the roller frame 124 and extends into the recess in the smaller portion 118 of the shaft 108. By inserting the fastening element 122 into the recess 136, the tip of the fastening element 122 may be inserted into the one of the portions 118 of the split shaft portion 110, such that a connection may be established between the roller 114 and the shaft 108. More specifically, the roller frame 124 may have an oval-shaped recess 136 for receiving the fastening element 122 to provide some tolerance or play for the fastening element 122 in the roller frame 124. It is also possible for the fastening element 122 to be accommodated in a further oval recess 196 opposite the oval recess 136. The provision of two opposite oblong recesses 136, 196 makes the same roller 114 compatible with two opposite directions of movement of the component carrier structure 102.

More specifically, as best seen in fig. 1 and 2, each roller frame 124 has a first shaft opening 126, the first shaft opening 126 receiving the assigned split shaft portion 110 of the shaft 108. The first shaft opening 126 terminates or opens outwardly in the recess 136, thereby establishing a functional engagement between the shaft 108 and the fastening element 122. Further, a second shaft opening 128 in the roller frame 124 may receive a rotatable axle 130 of a rotatable wheel 132 of the roller 114.

Referring again to fig. 2, after the roller wheel 132 is mounted to the roller frame 124, the stepped portion 195 of the roller frame 124 secures a flat outer surface of the roller 114. As best seen in fig. 1, the roller frame 124 has a straight portion 134, which straight portion 134 may be aligned with a tangent of the rotatable wheel 132. This may prevent the component carrier structure 102 from jamming even in undesirable situations.

Referring now to fig. 3 and 5, the handler 100 includes two opposing frame structures 154, 156, the frame structures 154, 156 may be implemented as rails. As shown, each frame structure 154, 156 includes a series of preferably U-shaped, e.g., equidistant, recesses 158, 160, the recesses 158, 160 receiving opposite end portions of the respective shaft 108. The U-shaped recesses 158, 160 may be inclined so as to form a saw tooth structure, thereby inhibiting any undesired removal of the respective shaft 108 from the respective recesses 158, 160 during operation. The frame structures 154, 156 are arranged parallel to each other and spaced apart such that the width of the component carrier structure 102 being transported fits between the frame structures 154, 156.

Furthermore, each of the frame structures 154, 156 has a mounting device 162 for mounting the handling device 100 on a transport unit 152 (only schematically shown in fig. 3 and 5) for transporting the component carrier structure 102. In the illustrated embodiment, the mounting device 162 is embodied as a series of oblong holes 176 formed in an angle 178, which angle 178 in turn is integrally connected with a respective one of the frame structures 154, 156. Each of the oblong holes 176 is configured to receive a respective fastening element (not shown) for connecting the handling device 100 to the delivery unit 152.

Highly advantageously, the embodiment of fig. 1 to 5 shows a handling device 100, which handling device 100 is configured for applying pressure to a component carrier structure 102 solely on the basis of gravity. Thus, the steering device 100 is configured to perform autonomous and purely passive operation without active control. In particular, any electronic control mechanism may not be necessary, so that the steering device 100 may operate in a completely passive manner. This makes the construction of the handling device 100 compact and simple, while the handling device provides a reliable protection against undesired blow-up of the component carrier structure 102 during transfer of the component carrier structure 102 between the chambers 104, 106.

In the following, further technical aspects of the embodiments of fig. 1 to 5 will be described:

the smaller portion 118 having the smaller cross-sectional area a2 may be created by making a corresponding cut from the circular shaft 108. Thus, a slit 112 may be obtained between the shaft portions 118, which slit may have a thickness of about 1 mm. In other words, it may be advantageous to create a gap 120 of approximately 1mm thickness between two portions 118 of the shaft 108 in the split shaft region 110. For example, a 1mm thick gap 120 between the two portions 118 may enable a tolerance of 2.5mm for the roller 114 to move freely up and down. Thus, adjusting the thickness of the slot 112 may allow for adjustment of the range of thicknesses of the component carrier structure 102 that may be used in conjunction with the manipulation device 100. Advantageously, adjusting the thickness of the gap 120 may allow to obtain a self-adjustment of: different panel thicknesses, different degrees of panel warping, and different pressure values for the chambers 104, 106. For example, the thickness of the gap 120 may be adjusted in the range of 0.1mm to 2.5 mm. Thus, cutting the shaft 108 into portions 118 may free the rollers 114 to move up and down within a defined range as the component carrier structure 102 moves. Thus, the rollers 114 allow for adjustment for different panel thicknesses and different levels of panel warpage.

In addition, screw holes may be drilled in the smaller portion 118 having the smaller cross-sectional area a 2. The fastening element 122, which is embodied here as a screw, can then be used to connect the smaller portion 118 (with the smaller cross-sectional area a2) with the roller frame 124.

In addition, an oval threaded hole or recess 136 may be drilled into the roller frame 124 so that the screw-type fastening element 122 may be moved within the hole or recess 136 to a limited extent. Thus, by adjusting the position of the screw-type fastening elements 122, the height between the panel-type component carrier structure 102 and the rollers 114 may be adjusted prior to operation of the handling device 100. Corresponding oval screw holes (see reference numerals 136, 196 in fig. 1 and 2) may be drilled on the opposite side of the roller frame 124, either forward or rearward (with respect to the direction of panel movement, see reference numeral 170 in fig. 3).

The tangent line of the roller 132 (see reference number 180 in fig. 1) may be configured to coincide (or substantially coincide) with the edge of the roller frame 124. Thus, when a panel (or any other kind of component carrier structure 102) enters under the rollers 114, the panel will slide smoothly and will not get caught or jammed by the rollers 114.

Referring now to detail 184 in fig. 5, the opposite end portions of the shaft 108 to be inserted into respective ones of the recesses 158, 160 of the frame structures 154, 156 may be shaped for preventing rotation of the shaft 108 during operation of the steering device 100. More specifically, for example, two, e.g., generally U-shaped, recesses at respective ends of the shaft 108 may be left open such that the shaft 108 may be caught and retained by a corresponding one of the side frame structures 154, 156, but not fully locked. The circular shape at the bottom of the saw- tooth recesses 158, 160 allows the shaft 108 to rotate a little so that the top-side roller 114 does not damage the panel-type component carrier structure 102.

Referring now to additional detail 186 in fig. 5, the oblong holes 176 in the form of rounded rectangles in the side frame structures 154, 156 make installation easier and adjustable.

Advantageously, the handler 100 may be installed on an existing conveyor-type delivery unit 152 without further modification.

Fig. 6 shows a three-dimensional view of a delivery device 150 according to the present invention. Fig. 7 shows a plan view of the conveyor apparatus 150 of fig. 6. Fig. 8 shows a side view of the transport apparatus 150 of fig. 6, and in particular the component carrier arrangement 102 above the transport unit 152 and below the rollers 114 of the handling device 100 of the transport apparatus 150. Fig. 9 and 10 show different side views of the roller frame 124 of the roller 114 of the handling device 100 of the conveying installation 150 of fig. 6.

For example, the frame structures 154, 156, the shaft 108, and the roller frame 124 may be made of a metal such as stainless steel. The rollers 132 may be made of a plastic material to obtain electrostatic discharge (ESD) compatibility and reduce wear or any material induced wear.

Fig. 11 and 12 show different operating states of the conveying device 150 of the invention.

Referring to fig. 11, a component carrier structure 102 is shown, implemented with dimensions 515 x 510mm²The panel of (1). The direction of conveyance, transfer or movement of the panels is again indicated by reference numeral 170. The conveyor side frame is shown by reference numeral 188.

Referring to fig. 12, the recess 160 is shown as a groove for mounting the roller shaft 108. The arrangement of the recesses 160 may have a saw tooth shape and may serve as a fixing means for the shaft 108. The end portion of the shaft 108 may be cut into a U-shape or the like to avoid falling out. The handling device 100 can be mounted on the conveyor side frame using screws or other fastening elements.

It should be noted that the term "comprising" does not exclude other elements or steps and the "a" or "an" does not exclude a plurality. Also elements described in association with different embodiments may be combined. It should also be noted that reference signs in the claims shall not be construed as limiting the scope of the claims. The implementation of the embodiments of the present invention is not limited to the preferred embodiments shown in the drawings and described above. On the contrary, even in the case of fundamentally different embodiments, it is possible to use many variants of the solutions and principles shown according to the embodiments of the invention.

Claims (21)

1. A handling device (100), the handling device (100) being for handling a component carrier structure (102) during transfer of the component carrier structure (102) between chambers (104, 106) having different pressure conditions, characterized in that the handling device (100) comprises: a shaft (108), the shaft (108) being split into at least one split shaft portion (110) by a respective slit (112) extending into the shaft (108); and

at least one roller (114), the at least one roller (114) being mounted on a respective one of the at least one split shaft portions (110), and the at least one roller (114) being arranged for pressing the component carrier structure (102) downwards when the component carrier structure (102) is transferred under the at least one roller (114) between the chambers (104, 106) having different pressure conditions.

2. The steering device (100) of claim 1, wherein the at least one slot (112) is a through hole extending through the shaft (108).

3. The steering device (100) according to claim 1, wherein the at least one slot (112) extends parallel to a central axis (116) of the shaft (108).

4. The steering device (100) according to claim 1, wherein the at least one slot (112) divides the shaft (108) into two portions (118) having different cross-sectional areas (a1, a 2).

5. The steering device (100) of claim 1, wherein the at least one slit (112) forms a gap (120) of at least 0.5mm in the at least one split shaft portion (110).

6. The handling device (100) according to claim 1, characterised in that the at least one roller (114) is mounted on the respective at least one split shaft portion (110) by extending at least one fastening element (122) into a roller frame (124) of the at least one roller (114) and into only one of the two portions (118) of the at least one split shaft portion (110).

7. The handling device (100) according to claim 1, wherein the at least one roller (114) comprises a roller frame (124), the roller frame (124) having a first shaft opening (126) and a second shaft opening (128), the first shaft opening (126) accommodating the at least one split shaft portion (110), the second shaft opening (128) accommodating a rotatable axle (130) of a rotatable wheel (132).

8. The handling device (100) according to claim 7, wherein the roller frame (124) has a straight portion (134) aligned with a tangent of the rotatable wheel (132).

9. The handling device (100) according to claim 7, wherein said roller frame (124) has at least one non-circular recess (136) for accommodating a fastening element (122).

10. The steering device (100) of claim 1, wherein the shaft (108) is solid except for the at least one split shaft portion (110).

11. The handling device (100) according to claim 1, wherein said handling device (100) comprises two opposite frame structures (154, 156), said two opposite frame structures (154, 156) having recesses (158, 160) receiving opposite end portions of said shaft (108).

12. Handling device (100) according to claim 11, where said handling device (100) comprises a plurality of shafts (108) mounted in a parallel manner on said frame structure (154, 156).

13. The handling device (100) according to claim 11, wherein said recess (158, 160) of at least one of said frame structures (154, 156) is arranged in a saw-tooth shape.

14. Handling device (100) according to claim 11, wherein the frame structure (154, 156) has mounting means (162), which mounting means (162) are used for mounting the handling device (100) on a transport unit (152) for transporting the component carrier structure (102).

15. The handling device (100) according to claim 1, wherein the handling device (100) is configured to apply pressure to the component carrier structure (102) based on gravity alone.

16. The handling device (100) according to claim 1, wherein the handling device (100) is configured for applying pressure to the component carrier structure (102) without control.

17. The handling device (100) according to claim 1, wherein said at least one roller (114) is mounted on a respective one of said at least one split shaft portion (110) such that a main roller axis (172) is inclined with respect to a vertical direction.

18. The handling device (100) according to claim 1, characterised in that at least a portion of said at least one roller (114) is made of a non-abrasive material or a non-polar material or a low friction material or a wear resistant material.

19. The steering device (100) of claim 3, wherein the at least one slot (112) does not extend through a central axis (116) of the shaft (108).

20. A transport apparatus (150) for transporting a component carrier structure (102) between chambers (104, 106) having different pressure conditions, characterized in that the transport apparatus (150) comprises:

a transport unit (152) on which the component carrier structure (102) can be transported between the chambers (104, 106) having different pressure conditions; and

the handling device (100) according to claim 1, the handling device (100) being for handling the component carrier structure (102) during transport of the component carrier structure (102) between the chambers (104, 106) having different pressure conditions;

wherein the transport unit (152) and the handling device (100) are arranged such that the component carrier structure (102) can be arranged between the transport unit (152) on the bottom side and the handling device (100) on the top side during transport.

21. The conveyor apparatus (150) of claim 20, wherein the conveyor unit (152) comprises a conveyor belt (164).

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