CN214081425U - Chip suction device - Google Patents
Chip suction device Download PDFInfo
- Publication number
- CN214081425U CN214081425U CN202022193565.XU CN202022193565U CN214081425U CN 214081425 U CN214081425 U CN 214081425U CN 202022193565 U CN202022193565 U CN 202022193565U CN 214081425 U CN214081425 U CN 214081425U
- Authority
- CN
- China
- Prior art keywords
- chip
- camera
- inhale
- suction device
- stepping motor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The embodiment of the utility model provides a chip suction device, which comprises a vision mechanism, wherein the vision mechanism is used for acquiring the position of a chip; inhale material mechanism, inhale material mechanism and include: drive assembly with inhale the material subassembly, drive assembly can drive and inhale the material subassembly and reciprocate, inhale the position that the material subassembly can carry out the position control of horizontal direction according to the chip that vision mechanism obtained to correspond with the position of chip, and absorb the chip. The embodiment of the utility model provides a chip suction means fixes a position the chip through utilizing vision mechanism, inhale the position of the chip that material mechanism acquireed according to vision mechanism angle of adjustment by oneself, make and inhale material mechanism and the coincidence of chip position, then utilize vacuum negative pressure to absorb the chip, avoided artifical clamp to get or utilize the cylinder clamp to get the risk that leads to chip surface pin to hit badly, realized vacuum negative pressure and separated the sky and absorb the chip, when guaranteeing the chip quality, also realized the automation that the chip transported, improved production efficiency.
Description
Technical Field
The utility model relates to a technical field is got to the chip clamp, especially relates to a chip suction means.
Background
With the rapid development of fiber lasers, the demand on the pump source of the core component is also increasing, wherein a COS chip (chip on subassembly) sorting process is used as a key process in the production of the pump source, and the sorting efficiency and accuracy are crucial to the production of the pump source. The existing COS chip wire-bonding and feeding process mainly adopts a manual mode that a pair of tweezers is used for clamping COS chips and transferring the COS chips to a corresponding tool clamp. The COS chip has small volume, is difficult to clamp and is easy to scratch; meanwhile, the COS chip is high in cost, and unnecessary scratches cause high loss. At present, the process is operated manually, the quality characteristic is unstable, the subsequent products are greatly influenced, the automation degree is not high, and the mass production of pump source products is seriously restricted.
The manual separation of the COS is adopted, the manual dependence is high, the B-type COS in the incoming material is separated by observing the serial number of the database with human eyes, the human eyes are fatigued after a long time, and the separation is easy to make mistakes. Adopt equipment that blindly snatched to snatch COS, this kind of mode is though can be accurate select separately in appointed magazine, because there is not vision, probably appears grabbing partially, leads to accurately grabbing COS, perhaps grabs partially, leads to the lead wire to destroy, or has overwhelmed the chip on the COS to lead to the increase of defective rate.
Secondly, adopt flexible cylinder to get the material before, COS can be crushed to this kind of mode, also can crush the suction nozzle simultaneously, leads to the suction nozzle to leak the vacuum, needs often to dismantle and trades the suction nozzle, and work load is big to influence the life of suction nozzle. Based on this, it is imperative to design a novel chip grabbing device.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides a chip suction means for COS chip clamp gets the defect that leads to COS chip quality unstable among the solution prior art.
An embodiment of the utility model provides a chip suction means, include: a vision mechanism for acquiring a position of the chip; inhale material mechanism, inhale material mechanism includes: the chip sucking device comprises a driving assembly and a sucking assembly, wherein the driving assembly can drive the sucking assembly to move up and down, and the sucking assembly can adjust the position of the chip in the horizontal direction according to the position of the chip acquired by the vision mechanism so as to correspond to the position of the chip and suck the chip.
According to the utility model discloses a chip suction means, drive assembly includes the guide rail, the slider is installed to the guide rail, the slider can be followed the guide rail reciprocates.
According to the utility model discloses a chip suction means, drive assembly still includes the slide, the slide is installed on the slider.
According to the utility model discloses a chip suction means, drive assembly still includes cam follower, cam follower installs on the slide, just cam follower can drive the slide reciprocates.
According to the utility model discloses a chip suction means, drive assembly still includes first step motor, first step motor with the cam follower electricity is connected, in order to drive the cam follower rotates.
According to the utility model discloses a chip suction means, inhale the material subassembly and include second step motor and sensor, the sensor is installed on the second step motor, the second step motor is installed on the slide, in order to drive the second step motor reciprocates.
According to the utility model discloses a chip suction means, it still includes the suction nozzle to inhale the material subassembly, the suction nozzle is installed the lower part of second step motor, in order to drive the suction nozzle is rotatory.
According to the utility model discloses a chip suction means, inhale the material subassembly still including removing the driver, remove the driver with the guide rail is connected, in order to drive the guide rail removes at the horizontal direction.
According to the utility model discloses a chip suction means, vision mechanism includes camera, light source and slide rail, the camera is installed in the slide rail, the camera with the light source sets up relatively, just the light source is located the below of camera, the camera is used for acquireing the position of chip.
According to the utility model discloses a chip suction means, the camera with the sensor is connected, the suction nozzle can remove under the drive of removal driver extremely the below of camera, with the camera locking the chip is absorb.
The embodiment of the utility model provides a chip suction means fixes a position the chip through utilizing vision mechanism, inhale the position of the chip that material mechanism acquireed according to vision mechanism angle of adjustment by oneself, make and inhale material mechanism and the coincidence of chip position, then utilize vacuum negative pressure to absorb the chip, avoided artifical clamp to get or utilize the cylinder clamp to get the risk that leads to chip surface pin to hit badly, realized vacuum negative pressure and separated the sky and absorb the chip, when guaranteeing the chip quality, also realized the automation that the chip transported, improved production efficiency.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a chip suction device according to an embodiment of the present invention.
Reference numerals:
1: a slide rail; 2: a camera; 3: a light source; 4: a second stepping motor; 5: a sensor; 6: a guide rail; 7: a cam follower; 8: a movement driver; 9: a slide plate; 10: a suction nozzle.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The chip suction device according to the embodiment of the present invention is described below with reference to fig. 1.
An embodiment of the utility model provides a chip suction means, include: vision mechanism and material suction mechanism. The vision mechanism adopts a CCD vision mechanism, and the height of the vision mechanism can be continuously adjusted so as to adjust the best focal length of a shooting product. Particularly, in an embodiment of the utility model, the size of COS chip is 4.05 x 4cm, because COS chip size is less, the required precision is high, and the area that can touch is less, through the height of adjustment vision mechanism, can make its position of clearly shooting the chip, realizes the accurate location to the chip, adopts vacuum negative pressure to separate the sky mode of getting and absorbs the chip, can avoid causing the destruction to the pin on chip surface.
Inhale the material mechanism and include drive assembly and inhale the material subassembly, drive assembly can be drive assembly such as motor or cylinder, and it drives inhales the material subassembly and carries out the ascending displacement adjustment of vertical side, inhales the position of the chip that the material subassembly response vision mechanism obtained to carry out the displacement adjustment of horizontal direction according to this position, so that the position that inhales the material subassembly is corresponding with the position of the chip that vision mechanism locked, and then absorbs this chip.
Specifically, the vision mechanism locks the position of the chip, and when the image of the chip shot by the vision mechanism is incomplete, the material sucking assembly rotates according to the image information shot by the vision mechanism, so that the position of the material sucking assembly is adjusted, and the position of the material sucking assembly corresponds to the position of the chip. Inhale the material subassembly and remove to the below of vision mechanism, the drive assembly drive inhales the material subassembly and moves down, inhales the material subassembly and utilizes the negative pressure that the evacuation produced to absorb the chip, has realized non-contact absorption, has avoided artifical clamp to get or has utilized the cylinder clamp to get and lead to the risk that chip surface pin collided badly.
The embodiment of the utility model provides a chip suction means fixes a position the chip through utilizing vision mechanism, inhale the position of the chip that material mechanism acquireed according to vision mechanism angle of adjustment by oneself, make and inhale material mechanism and the coincidence of chip position, then utilize vacuum negative pressure to absorb the chip, avoided artifical clamp to get or utilize the cylinder clamp to get the risk that leads to chip surface pin to hit badly, realized vacuum negative pressure and separated the sky and absorb the chip, when guaranteeing the chip quality, also realized the automation that the chip transported, improved production efficiency.
As shown in fig. 1, in one embodiment of the present invention, the driving assembly includes: a guide rail 6, a slide 9, a cam follower 7, and a first stepping motor (not shown). Specifically, the upper end of the guide rail 6 is fixed, and the lower end of the guide rail 6 is provided with a slide block which can move up and down along the guide rail 6. The slide 9 is mounted on a slide so that the slide 9 can also move up and down. The cam follower 7 is mounted on the slider 9, and the first stepping motor is electrically connected to the cam follower 7.
Further, the first stepping motor drives the cam follower 7 to rotate, the cam follower 7 drives the sliding plate 9 to move downwards when rotating, and the cam follower 7 drives the sliding plate 9 to move upwards when rotating in the opposite direction.
As shown in fig. 1, in one embodiment of the present invention, the suction assembly includes a second stepping motor 4, a sensor 5, a suction nozzle 10, and a movement driver 8. The sensor 5 is arranged on the second stepping motor 4, the second stepping motor 4 is arranged on the sliding plate 9, and the sliding plate 9 moves up and down to drive the second stepping motor 4 to move up and down. The suction nozzle 10 is installed at the lower portion of the second stepping motor 4, and when the second stepping motor 4 moves up and down, the adjustment of the displacement of the suction nozzle 10 in the vertical direction can be realized. Meanwhile, the second stepping motor 4 may also rotate, thereby driving the suction nozzle 10 to rotate. The movement driver 8 is connected to the guide rail 6, and can drive the guide rail 6 to drive the suction nozzle 10 to perform displacement adjustment in the horizontal direction. Further, the moving driver 8 includes a servo motor, a ball screw, and a screw nut installed on the ball screw, and the other end of the screw nut is connected with the guide rail 6. Under the drive of the servo motor, the ball screw rotates, and then the guide rail 6 is driven to perform displacement adjustment in the horizontal direction.
Specifically, after the vision mechanism shoots the position of the chip, the sensor 5 senses the position of the chip, and the second stepping motor 4 performs rotation adjustment according to the angle between the position of the chip 4 sensed by the sensor 5 and the position of the suction nozzle 10, so that the suction nozzle 10 is adjusted to a proper position, and in the process of sucking the chip, the suction nozzle 10 can be completely sucked with the chip, and the chip is stably sucked.
Further, when the suction nozzle 10 is adjusted to a proper position, the moving driver 8 drives the guide rail 6 to move in the horizontal direction so as to move above the chip locked by the vision mechanism, and the suction nozzle 10 and the chip are completely overlapped. The first stepping motor drives the cam follower 7 to rotate, drives the sliding plate 9 to move downwards, further drives the suction nozzle 10 to move downwards, and the suction nozzle 10 stably and flexibly sucks the chip by using vacuum negative pressure. The cam follower 7 rotates reversely to drive the sliding plate 9 to move upwards so as to drive the suction nozzle 10 to move upwards, the moving driver 8 drives the guide rail 6 to move to a specified position, and the suction nozzle 10 puts down the chip so as to transfer the chip to the specified position.
As shown in fig. 1, in one embodiment of the present invention, the vision mechanism includes a camera 2, a light source 3, and a slide rail 1. The camera 2 is installed on the slide rail 1 and can move up and down along the slide rail 1 to adjust the height of the camera 2, so that focusing is facilitated and the position of a chip is clearly shot. The light source 3 is arranged opposite to the camera 2, the light source 3 is positioned below the camera 2, and the light source 3 is connected with the sliding plate 9 and moves along with the guide rail 6. The camera 2 is used to photograph the position of the chip.
Specifically, the sensor 5 senses the position of the chip photographed by the camera 2, the second stepping motor 4 adjusts the position of the suction nozzle 10 according to the position of the chip, and the moving driver 8 drives the guide rail 6 to perform displacement adjustment in the horizontal direction so that the suction nozzle 10 reaches the position of the chip and completely coincides with the chip. The cam follower 7 rotates to drive the sliding plate 9 to move downwards, and further drives the suction nozzle 10 to move downwards, and the suction nozzle 10 sucks the chip stably and flexibly.
The working principle of the suction device according to the embodiment of the present invention will be described in detail below by taking the embodiment shown in fig. 1 as an example.
The camera 2 moves in the slide rail 1, adjusts the focal length of the slide rail, and shoots the chip after determining the best shooting position. The sensor 5 senses the position of the chip photographed by the camera 2, and the second stepping motor 4 rotates according to an angle between the actual position of the suction nozzle 10 and the position of the chip, thereby adjusting the position of the suction nozzle 10 to correspond to the position of the chip.
The moving driver 8 drives the guide rail 6 to move back and forth and left and right in the horizontal direction, so that the suction nozzle 10 moves to the position right above the chip. The first stepping motor drives the cam follower 7 to rotate, the cam follower 7 drives the sliding plate 9 to move downwards, and then drives the suction nozzle 10 to move downwards, and the suction nozzle 10 stably and flexibly sucks the chip by using vacuum negative pressure.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (10)
1. A chip suction device, comprising:
a vision mechanism for acquiring a position of the chip;
inhale material mechanism, inhale material mechanism includes: the chip sucking device comprises a driving assembly and a sucking assembly, wherein the driving assembly can drive the sucking assembly to move up and down, and the sucking assembly can adjust the position of the chip in the horizontal direction according to the position of the chip acquired by the vision mechanism so as to correspond to the position of the chip and suck the chip.
2. The chip suction device according to claim 1, wherein the driving assembly comprises a guide rail, the guide rail is provided with a slide block, and the slide block can move up and down along the guide rail.
3. The chip suction device according to claim 2, wherein the driving assembly further comprises a slide plate, the slide plate being mounted on the slide block.
4. The chip suction device according to claim 3, wherein the driving assembly further comprises a cam follower, the cam follower is mounted on the slide plate, and the cam follower can drive the slide plate to move up and down.
5. The chip suction device according to claim 4, wherein the driving assembly further comprises a first stepping motor electrically connected to the cam follower to drive the cam follower to rotate.
6. The chip suction device according to claim 3, wherein the suction assembly includes a second stepping motor and a sensor, the sensor is mounted on the second stepping motor, and the second stepping motor is mounted on the slide plate so that the slide plate drives the second stepping motor to move up and down.
7. The chip suction device according to claim 6, wherein the suction assembly further comprises a suction nozzle installed at a lower portion of the second stepping motor such that the second stepping motor rotates the suction nozzle.
8. The chip suction device according to claim 7, wherein the suction assembly further comprises a moving driver connected to the guide rail to drive the guide rail to move in a horizontal direction.
9. The chip suction device according to claim 8, wherein the vision mechanism comprises a camera, a light source and a slide rail, the slide rail is mounted on the guide rail, the camera is mounted in the slide rail, the camera is disposed opposite to the light source, the light source is located below the camera, and the camera is used for acquiring the position of the chip.
10. The chip suction device according to claim 9, wherein the camera is connected to the sensor, and the suction nozzle is movable to a position below the camera by the moving driver to suck the chip locked by the camera.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022193565.XU CN214081425U (en) | 2020-09-29 | 2020-09-29 | Chip suction device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022193565.XU CN214081425U (en) | 2020-09-29 | 2020-09-29 | Chip suction device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214081425U true CN214081425U (en) | 2021-08-31 |
Family
ID=77442527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022193565.XU Active CN214081425U (en) | 2020-09-29 | 2020-09-29 | Chip suction device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214081425U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113677185A (en) * | 2021-09-30 | 2021-11-19 | 深圳市特瑞吉科技有限公司 | Mounting equipment |
| CN115339905A (en) * | 2022-08-15 | 2022-11-15 | 恩纳基智能科技无锡有限公司 | Pickup Devices and Wafer Pickup Mechanisms |
| CN115973642A (en) * | 2023-01-04 | 2023-04-18 | 深圳市昇茂科技有限公司 | Intelligent storage material automatic distribution equipment |
-
2020
- 2020-09-29 CN CN202022193565.XU patent/CN214081425U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113677185A (en) * | 2021-09-30 | 2021-11-19 | 深圳市特瑞吉科技有限公司 | Mounting equipment |
| CN115339905A (en) * | 2022-08-15 | 2022-11-15 | 恩纳基智能科技无锡有限公司 | Pickup Devices and Wafer Pickup Mechanisms |
| CN115973642A (en) * | 2023-01-04 | 2023-04-18 | 深圳市昇茂科技有限公司 | Intelligent storage material automatic distribution equipment |
| CN115973642B (en) * | 2023-01-04 | 2023-08-22 | 深圳市昇茂科技有限公司 | Intelligent warehouse material automatic distribution equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN214081425U (en) | Chip suction device | |
| CN110657146B (en) | Optical lens coupling machine | |
| CN108882674B (en) | A vision-guided automatic placement machine | |
| TWI293596B (en) | Cutting device for ceramic green block and cutting method | |
| CN108820945B (en) | A film automatic feeding device | |
| CN208682378U (en) | A kind of automation marking device | |
| CN215704235U (en) | Feeding mechanism and cutting detection equipment | |
| CN110625306B (en) | Vision alignment equipment | |
| CN209280602U (en) | A kind of vision inspection apparatus | |
| CN109298556B (en) | Hard-to-hard laminating binding equipment under vacuum negative pressure state of sealing frame body | |
| CN211662371U (en) | Biconvex lens cutting device | |
| CN216669776U (en) | Strain gauge defect recognition equipment based on machine vision | |
| CN107966118B (en) | Detection method of mobile plane detection equipment | |
| CN213351451U (en) | Accurate combination device of flabellum and magnet | |
| JP5508196B2 (en) | Work centering method of centering machine | |
| CN108544864A (en) | A kind of automation marking device | |
| CN216433934U (en) | Engine cylinder lid visual detection equipment | |
| CN209182602U (en) | One kind is in the case where sealing framework vacuum negative pressure condition firmly to hard fitting bound device | |
| CN216941816U (en) | Protective film attaching sealing machine | |
| CN210848889U (en) | Vision alignment equipment | |
| CN214815760U (en) | Laser marking machine convenient to focusing | |
| CN205222066U (en) | Car mascerating machine material feeding unit | |
| CN218872928U (en) | Material flow channel with positioning and detecting functions | |
| CN212498340U (en) | Full-automatic edge turning and chamfering device | |
| CN212122328U (en) | Mobile phone accessory assembling machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |