CN214068744U

CN214068744U - Processing equipment for semiconductor device

Info

Publication number: CN214068744U
Application number: CN202022844360.3U
Authority: CN
Inventors: 刘敏
Original assignee: Beijing Chaoxin High Tech Technology Co ltd
Current assignee: Beijing Chaoxin High Tech Technology Co ltd
Priority date: 2020-11-30
Filing date: 2020-11-30
Publication date: 2021-08-27
Anticipated expiration: 2030-11-30

Abstract

The utility model discloses a semiconductor device's processing equipment, its structure includes: the welding device is fixed on the support frame and is in sliding fit with the support frame, the lower part of the welding device is connected with the welding head, the fixed disc is fixedly arranged on the working platform, and the control area is positioned on the front side of the working platform; the utility model is additionally provided with the fixed disk which is convenient to place and fix, the clamping force generated by the clamping spring is matched with the placing opening, the LED is positioned and fixed for welding, and the LED is prevented from shifting during welding; and be equipped with a plurality of fixed orificess and be linear array distribution on the fixed disk, mutually support through a plurality of fixed orificess, can place and fix a plurality of emitting diode and weld and obtain the pattern and the photoelectric effect that want.

Description

Processing equipment for semiconductor device

Technical Field

The utility model relates to a semiconductor device processing field, specific is a semiconductor device's processing equipment.

Background

The most common semiconductor light-emitting diode in a semiconductor device consists of a gold wire joint part, an LED chip, a reflecting cap, a circular epoxy resin lens, a positive pin and a negative pin, and is a novel solid-state cold light source, which has the characteristics of high energy efficiency, long service life, low voltage, simple structure, small volume, light weight, high response speed, good anti-seismic performance, full-color spectrum and the like, so that the light-emitting diode is widely applied.

SUMMERY OF THE UTILITY MODEL

To the above problem, the utility model provides a semiconductor device's processing equipment.

In order to achieve the above purpose, the present invention is realized by the following technical solution: a semiconductor device processing apparatus is provided, which is structured to include: the welding device comprises supporting legs, a working platform, a supporting frame, a welder, a welding head, a fixed disc and a control area, wherein the four supporting legs are arranged at four corners below the working platform, the supporting frame is transversely fixed above the rear side of the working platform, the welder is fixed on the supporting frame and is in sliding fit with the supporting frame, the lower side of the welder is connected with the welding head, the fixed disc is fixedly arranged on the working platform, and the control area is located on the front side of the working platform.

Furthermore, the fixed disk is composed of a fixed hole, a clamping spring, a groove and a counter bore, the fixed disk is square, the fixed hole is formed in the surface of the fixed disk, the counter bore is formed in the back face of the fixed disk and communicated with the fixed hole, the groove is semicircular and formed in the side wall of the counter bore, and the clamping spring is nested in the groove in the side wall of the counter bore.

Furthermore, the clamping spring is of a W-shaped bent structure, and two ends of the clamping spring are arranged in parallel in the fixing hole.

Furthermore, the diameter of the counter bore is one centimeter larger than that of the fixing hole.

Furthermore, the fixing holes, the clamping springs, the grooves and the counter bores on the fixing disc are matched into one group, and more than two groups are arranged on the fixing disc.

Furthermore, one side of the fixing hole is a front side, and one side of the counter bore is a back side and is a welding operation surface.

Furthermore, the fixed disk is made of aluminum

Furthermore, the clamping spring is made of spring steel.

Advantageous effects

Compared with the prior art, the utility model discloses following beneficial effect has:

1. the utility model discloses having add a fixed disk convenient to place fixed emitting diode, the clamp force that utilizes the parallel production in clamping spring both ends is mutually supported with the fixed orifices, plays the fixed effect in location to emitting diode so that weld, and emitting diode takes place to shift when having avoided the welding.

2. The utility model discloses be equipped with a plurality of fixed orificess on the fixed disk and be linear array and distribute, mutually support through a plurality of fixed orifices diameters, can place and fix a plurality of emitting diode and weld pattern and photoelectric effect in order to obtain wanting.

3. The fixed disk can directly be used as a panel when needed, the light-emitting diode is fixed on the back surface of the fixed disk through welding, and the circular lens end of the light-emitting diode can emit light effect through the fixed hole.

Drawings

Fig. 1 is a schematic structural diagram of a semiconductor device processing apparatus according to the present invention.

Fig. 2 is a schematic structural view of the front surface of the fixing plate of the present invention.

Fig. 3 is a schematic structural view of the back of the fixing plate of the present invention.

Fig. 4 is a schematic structural view of the fixing plate of the present invention viewed from the back to the front.

Fig. 5 is a schematic view of a local section structure of the fixing disc of the present invention.

In the figure: the welding machine comprises a support leg-1, a working platform-2, a support frame-3, a welder-4, a welding head-5, a fixed disc-6, a control area-7, a fixed hole-61, a clamping spring-62, a groove-63 and a counter bore-64.

Detailed Description

The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some embodiments, not all embodiments, and all other embodiments obtained by a person of ordinary skill in the art without creative work belong to the protection scope of the present invention based on the embodiments of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Examples

As shown in fig. 1-5, the present invention provides a semiconductor device processing apparatus, which comprises: stabilizer blade 1, work platform 2, support frame 3, welding ware 4, soldered connection 5, fixed disk 6, control area 7, stabilizer blade 1 is equipped with four and installs the four corners in work platform 2 below, support frame 3 transversely fixes the top at work platform 2 rear side, welding ware 4 is fixed on support frame 3 and is connected with soldered connection 5 with support frame 3 sliding fit and its below, fixed disk 6 fixed mounting is on work platform 2, control area 7 is located work platform 2's front side.

The fixed disk 6 is composed of a fixed hole 61, a clamping spring 62, a groove 63 and a counter bore 64, the fixed disk 6 is square, the fixed hole 61 is arranged on the surface of the fixed disk 6, the counter bore 64 is arranged on the back surface of the fixed disk 6 and is communicated with the fixed hole 61, the groove 63 is semicircular and is arranged on the side wall of the counter bore 64, and the clamping spring 62 is nested in the groove 63 on the side wall of the counter bore 64.

The clamping spring 62 is a W-shaped bent structure, and two ends of the clamping spring are disposed in parallel in the fixing hole 61 to clamp and fix the light emitting diode.

The counterbore 64 is one centimeter larger in diameter than the fixing hole 61 to serve as a space for nesting the clamping spring 62.

The fixing holes 61, the clamping springs 62, the grooves 63 and the counter bores 64 on the fixing plate 6 are matched into a group, and more than two groups of fixing holes are arranged on the fixing plate 6 and can be matched with each other to place and fix the light emitting diodes.

One side of the fixing hole 61 is a front side, and one side of the counter bore 64 is a back side and is a welding operation surface.

The working principle of the present invention is explained as follows:

during the use, place the front of fixed disk 6 downwards on work platform 2, then fill in LED's circular lens end downwards, the circular structure of LED's circular lens end contacts with the both ends of being parallel on the clamping spring 62, thereby push open the both ends of being parallel on the clamping spring 62 to both sides and imbed in clamping spring 62 and embedding in fixed orifices 61, clamping spring 62 adopts the spring steel preparation, the parallel opening and shutting power that produces through clamping spring 62 both ends can tightly clip LED and avoid taking place the aversion when the welding, and fixed orifices 61 on the fixed disk 6 adopts linear array to set up, can place fixed a plurality of emitting diode simultaneously and weld in order to reach required photoelectric effect.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. A semiconductor device processing apparatus is provided, which is structured to include: stabilizer blade (1), work platform (2), support frame (3), welding ware (4), soldered connection (5), fixed disk (6), control area (7), its characterized in that:

the four support legs (1) are arranged at four corners and are arranged below the working platform (2), the support frame (3) is transversely fixed above the rear side of the working platform (2), the welding device (4) is fixed on the support frame (3) and is in sliding fit with the support frame (3), the lower part of the welding device is connected with the welding head (5), the fixed disc (6) is fixedly arranged on the working platform (2), and the control area (7) is positioned on the front side of the working platform (2);

fixed disk (6) comprise fixed orifices (61), clamping spring (62), recess (63) and counter bore (64), fixed disk (6) are square, and fixed orifices (61) are established on the surface of fixed disk (6), counter bore (64) are located the back of fixed disk (6) and are communicated with each other with fixed orifices (61), recess (63) are the semicircle form and locate on the lateral wall of counter bore (64), clamping spring (62) nestification is in recess (63) on counter bore (64) lateral wall.

2. The apparatus for processing a semiconductor device according to claim 1, wherein: the clamping spring (62) is of a W-shaped bending structure, and two ends of the clamping spring are arranged in the fixing hole (61) in a parallel mode.

3. The apparatus for processing a semiconductor device according to claim 1, wherein: the diameter of the counter bore (64) is one centimeter larger than the diameter of the fixing hole (61).

4. The apparatus for processing a semiconductor device according to claim 1, wherein: the fixing holes (61), the clamping springs (62), the grooves (63) and the counter bores (64) on the fixing disc (6) are matched into a group, and more than two groups are arranged on the fixing disc (6).

5. The apparatus for processing a semiconductor device according to claim 1, wherein: one side of the fixing hole (61) is a front side, and one side of the counter bore (64) is a back side and is a welding operation surface.