CN211878244U - Lens and optical fiber integrated coupling device of semiconductor laser - Google Patents
Lens and optical fiber integrated coupling device of semiconductor laser Download PDFInfo
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- CN211878244U CN211878244U CN202020948379.XU CN202020948379U CN211878244U CN 211878244 U CN211878244 U CN 211878244U CN 202020948379 U CN202020948379 U CN 202020948379U CN 211878244 U CN211878244 U CN 211878244U
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Abstract
The utility model discloses a semiconductor laser lens and optical fiber integrated coupling device, which comprises a heat dissipation plate, wherein one side of the heat dissipation plate is provided with a substrate, the other side of the heat dissipation plate is provided with an optical fiber sleeve, and a focusing lens group is arranged between the substrate and the optical fiber sleeve; the laser device comprises a substrate, a focusing lens group and an optical fiber sleeve, wherein the substrate is provided with a laser chip, the optical fiber sleeve is internally provided with an optical fiber, the focusing lens group and the optical fiber sleeve are both arranged on a light path of the laser chip, and light emitted by the laser chip is coupled into the optical fiber after being focused by the focusing lens group. The utility model discloses pass through laser welding's mode with collimating lens, isolator and focusing lens and form a focusing lens group with the lens group base, fiber optic sleeve fixes a position optic fibre, and the light of laser instrument chip is coupled with optic fibre after focusing through focusing lens group again, can realize the coupling technology of semiconductor laser fast through using this device in the factory production; has the characteristics of convenient operation, easy implementation and high coupling production efficiency.
Description
Technical Field
The utility model belongs to the technical field of optoelectronic device, concretely relates to semiconductor laser lens optic fibre integral type coupling device.
Background
In the field of optoelectronic devices, the coupling process is a very important process in the packaging process of semiconductor lasers, and directly determines the performance of the semiconductor lasers. The common coupling technology at present adopts tools such as a collimating lens, an isolator, a focusing lens and the like to perform coupling step by step, and finally performs coupling with an optical fiber, so that the coupling operation difficulty is high, and the production efficiency is seriously influenced.
SUMMERY OF THE UTILITY MODEL
To the low and big problem of the operation degree of difficulty of current coupling mode coupling production efficiency, the utility model provides a semiconductor laser lens optic fibre integral type coupling device has solved the low and poor stability's of current semiconductor laser coupling efficiency production problem.
For solving the above technical problem, the utility model discloses the technical scheme who adopts as follows:
a semiconductor laser lens and optical fiber integrated coupling device comprises a heat dissipation plate, wherein a substrate is arranged on one side of the heat dissipation plate, an optical fiber sleeve is arranged on the other side of the heat dissipation plate, and a focusing lens group is arranged between the substrate and the optical fiber sleeve; the laser device comprises a substrate, a focusing lens group and an optical fiber sleeve, wherein the substrate is provided with a laser chip, the optical fiber sleeve is internally provided with an optical fiber, the focusing lens group and the optical fiber sleeve are both arranged on a light path of the laser chip, and light emitted by the laser chip is coupled into the optical fiber after being focused by the focusing lens group.
And a semiconductor refrigerator is arranged at the lower part of the heat dissipation plate.
The focusing lens group comprises a lens group base, the lens group base is fixedly arranged on a heat dissipation plate, a first groove, a second groove and a third groove are sequentially formed in the lens group base, a collimating lens is arranged in the first groove, an isolator is arranged in the second groove, a focusing lens is arranged in the third groove, the center lines of the collimating lens, the isolator and the focusing lens are all located on the same straight line, and light emitted by a laser chip is coupled with optical fibers after sequentially passing through the collimating lens, the isolator and the focusing lens.
The middle part of the heat dissipation plate is provided with an optical path groove, and the lens group base is fixedly arranged in the optical path groove through the lens group support.
The optical fiber sleeve is fixedly arranged on the heat dissipation plate through an optical fiber support.
The utility model has the advantages that:
the utility model discloses pass through laser welding's mode with collimating lens, isolator and focusing lens and form a focusing lens group with the lens group base, fiber optic sleeve fixes a position optic fibre, and the light of laser instrument chip is coupled with optic fibre after focusing through focusing lens group again, can realize the coupling technology of semiconductor laser fast through using this device in the factory production; the coupling production line has the characteristics of convenience in operation, easiness in implementation and high coupling production efficiency, improves the production efficiency while reducing the labor cost, is beneficial to large-scale production expansion, can remarkably improve the economic benefit, and is suitable for industrial popularization and use.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a cross-sectional view of fig. 1.
Fig. 3 is a schematic diagram of the connection between the substrate and the laser chip.
In the figure, 1 is a semiconductor refrigerator, 2 is a heat dissipation plate, 2-1 is an optical path groove, 3 is a substrate, 4 is a laser chip, 5 is a collimating lens, 6 is an isolator, 7 is a lens group base, 8 is a focusing lens, 9 is a lens group support, 10 is an optical fiber support, 11 is an optical fiber sleeve, and 12 is an optical fiber.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without any creative effort belong to the protection scope of the present invention.
A semiconductor laser lens optical fiber integrated coupling device is shown in figure 1 and comprises a heat dissipation plate 2, wherein the upper surface and the lower surface of the heat dissipation plate 2 are both planes, an optical path groove 2-1 is formed in the middle of the heat dissipation plate 2, the bottom of the optical path groove 2-1 is a plane, a substrate 3 is arranged on one side of the optical path groove 2-1, an optical fiber sleeve 11 is arranged on the other side of the optical path groove 2-1, a focusing lens group is arranged in the optical path groove 2-1, and the focusing lens group plays a focusing role in focusing light emitted by a laser chip 4; the substrate 3 is provided with a laser chip 4, the substrate 3 is used as a carrier of the laser chip 4 and plays a role of electrically isolating the heat dissipation plate 2, and the substrate 3 is a ceramic substrate so as to ensure that heat generated by the laser chip 4 can still be conducted to the heat dissipation plate 2 through the substrate 3; the lower part of the heat dissipation plate 2 is fixedly provided with a semiconductor refrigerator 1, and the semiconductor refrigerator 1 plays a role in refrigeration; the optical fiber 12 is arranged in the middle of the optical fiber sleeve 11, the optical fiber sleeve 11 and the focusing lens group are both arranged on the light path of the laser chip 4, and light emitted by the laser chip 4 is focused by the focusing lens group and then coupled into the optical fiber 12, namely the light path direction of the laser chip 4.
The focusing lens group comprises a lens group base 7, a lens group support 9 is fixedly arranged on the light path groove 2-1, a fixing groove is formed in the middle of the lens group support 9, the bottom of the fixing groove is a plane, and the lens group base 7 is fixedly arranged in the fixing groove; the focusing lens group is fixed in the optical path groove 2-1 through the lens group support 9, so that the position of the focusing lens group is prevented from moving after the lens group support 9 and the radiating plate 2 are fixed, the position of the lens group base 7 is conveniently fixed by combining the optical fiber 12 again, and the coupling precision is further improved; a first groove, a second groove and a third groove are sequentially arranged on the lens group base 7, the first groove, the second groove and the third groove are semicircular grooves, and the circle centers of the three semicircular grooves are arranged on the same straight line, so that optical devices in the three semicircular grooves can be better adjusted; a collimating lens 5 is fixedly arranged in the first groove, the collimating lens 5 can convert divergent light emitted by the laser chip 4 into collimated light to be output, an isolator 6 is fixedly arranged in the second groove, the isolator 6 is used for isolating light reflected back from a backward transmission light path, and adverse effects of the backward transmission light in the light path on the laser chip and a light path system are prevented, the isolator 6 only allows light with a wavelength within a specific range to pass through in a single direction, a focusing lens 8 is fixedly arranged in the third groove, and the focusing lens 8 can refract the collimated light on one point to be coupled into an optical fiber; the center lines of the collimating lens 5, the isolator 6 and the focusing lens 8 are all positioned on the same straight line, the laser chip 4 is positioned on the center line of the collimating lens 5 and is close to the collimating lens 5, so that light emitted by the laser chip 4 is coupled with the optical fiber 12 after sequentially passing through the collimating lens 5, the isolator 6 and the focusing lens 8; the emission angle of the laser chip 4 is smaller than the clear aperture of the collimating lens 5, so that the clear aperture of the collimating lens 5 can completely receive the laser emitted by the laser chip 4 when focusing, and the clear aperture of the focusing lens 8 is larger than those of the collimating lens 5 and the isolator 6, so as to reduce assembly errors.
The optical fiber sleeve 11 is fixedly arranged on the heat dissipation plate 2 through an optical fiber support 10, the optical fiber support 10 comprises a semi-circular ring frame, the diameter of the semi-circular ring frame is slightly larger than that of the optical fiber sleeve 11, the semi-circular ring frame is matched with the optical fiber sleeve 11, fixing plates are symmetrically arranged on two sides of the semi-circular ring frame, and the semi-circular ring frame is connected with the heat dissipation plate 2 through the fixing plates so as to fix the optical fiber sleeve 11; the optical fiber sleeve 11 is coupled at the back focal point of the focusing lens 8, and the front end face of the optical fiber is a 6-degree inclined plane mirror surface, so that the coupling efficiency and reflection can be better ensured.
In this embodiment, the heat dissipation plate 2, the optical fiber ferrule 11, the collimating lens 5, the outer frame of the isolator 6 and the focusing lens 8, the lens set base 7 and the lens set bracket 9 are all made of kovar 4J29, so that the welding is convenient, the heat conductivity is good, the thermal expansion coefficient is small, and the process stability can be ensured; the optical fiber sleeve 11 is an optical fiber gold-plated Kovar tube, and the heat dissipation plate 2 is a heat sink; the selection range of the front focal length of the collimating lens 5 is 0.1-0.5mm, the selection range of the light-passing aperture is more than 1mm, and the incident wavelength range is 1250nm-1700 nm; the back focal length of the focusing lens 8 is selected within the range of 2-3mm, the light-transmitting aperture is selected within the range of more than 1.5mm, and the incident wavelength range is 1250nm-1700 nm.
The utility model discloses a preparation method:
s1, as shown in fig. 3, the substrate 3 is preplated with solder, and then the laser chip 4 is soldered to one side of the substrate 3 by a eutectic soldering process to form an integral COC assembly.
S2, as shown in fig. 1, the COC assembly is welded to the heat radiating plate 2 by a welding process.
S3, heat radiating plate 2 is soldered to semiconductor cooler 1 by a reflow soldering process.
S4, the collimator lens 5, the spacer 6, and the focus lens 8 are welded to the first groove, the second groove, and the third groove of the lens group mount 7, respectively, by laser welding to form a focus lens group.
S5, placing the focusing lens group into the fixing groove of the lens group bracket 9, placing the lens group bracket 9 into the light path groove 2-1, combining the optical fiber 12 and finding light by moving the position of the lens group bracket 9 in the light path groove 2-1, and welding the lens group bracket 9 with the heat dissipation plate 2 by laser when the optical power is maximum; the lens package base 7 is then welded to the lens package support 9 in the same manner.
And S6, finally, laser welding the optical fiber support 10 and the heat dissipation plate 2 in sequence in the same way, and laser welding the optical fiber sleeve 11 and the optical fiber support 10, so that the integrated coupling device can be manufactured.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (5)
1. The lens and optical fiber integrated coupling device of the semiconductor laser is characterized by comprising a heat dissipation plate (2), wherein a substrate (3) is arranged on one side of the heat dissipation plate (2), an optical fiber sleeve (11) is arranged on the other side of the heat dissipation plate (2), and a focusing lens group is arranged between the substrate (3) and the optical fiber sleeve (11); the laser device is characterized in that a laser chip (4) is arranged on the substrate (3), an optical fiber (12) is arranged in the optical fiber sleeve (11), the focusing lens group and the optical fiber sleeve (11) are arranged on a light path of the laser chip (4), and light emitted by the laser chip (4) is focused through the focusing lens group and then coupled into the optical fiber (12).
2. The integrated coupling device of semiconductor laser lens and optical fiber according to claim 1, characterized in that the lower part of the heat dissipation plate (2) is provided with a semiconductor refrigerator (1).
3. The semiconductor laser lens and optical fiber integrated coupling device as claimed in claim 1 or 2, wherein the focusing lens group comprises a lens group base (7), the lens group base (7) is fixedly arranged on the heat dissipation plate (2), a first groove, a second groove and a third groove are sequentially arranged on the lens group base (7), a collimating lens (5) is arranged in the first groove, an isolator (6) is arranged in the second groove, a focusing lens (8) is arranged in the third groove, the center lines of the collimating lens (5), the isolator (6) and the focusing lens (8) are all located on the same straight line, and light emitted by the laser chip (4) sequentially passes through the collimating lens (5), the isolator (6) and the focusing lens (8) and then is coupled with the optical fiber (12).
4. The integrated coupling device of lens and optical fiber of semiconductor laser according to claim 3, wherein the heat dissipation plate (2) is provided with an optical path groove (2-1) at the middle part, and the lens group base (7) is fixedly arranged in the optical path groove (2-1) through the lens group bracket (9).
5. The integrated coupling device of lens and fiber of semiconductor laser according to claim 1 or 4, characterized in that the fiber sleeve (11) is fixedly arranged on the heat dissipation plate (2) through a fiber support (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020948379.XU CN211878244U (en) | 2020-05-29 | 2020-05-29 | Lens and optical fiber integrated coupling device of semiconductor laser |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020948379.XU CN211878244U (en) | 2020-05-29 | 2020-05-29 | Lens and optical fiber integrated coupling device of semiconductor laser |
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| CN211878244U true CN211878244U (en) | 2020-11-06 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116719123A (en) * | 2023-08-10 | 2023-09-08 | 北京世维通科技股份有限公司 | Optical amplification integrated module and assembly method thereof |
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2020
- 2020-05-29 CN CN202020948379.XU patent/CN211878244U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116719123A (en) * | 2023-08-10 | 2023-09-08 | 北京世维通科技股份有限公司 | Optical amplification integrated module and assembly method thereof |
| CN116719123B (en) * | 2023-08-10 | 2023-10-20 | 北京世维通科技股份有限公司 | Optical amplification integrated module and assembly method thereof |
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