CN214068721U - Radiating fin with groove and radiating system - Google Patents

Abstract

The utility model relates to a take fin and cooling system of recess discloses a take fin of recess, including heat dissipation base plate and a plurality of heat dissipation dentate lamina, the heat dissipation dentate lamina is located on the cooling surface of heat dissipation base plate, the addendum of heat dissipation dentate lamina is provided with the ascending recess of a plurality of openings, the recess intercommunication two relative sides on the heat dissipation dentate lamina, a plurality of heat dissipation dentate lamina are arranged according to single queue array along the direction of perpendicular to reference surface, the reference surface is for being on a parallel with by the plane of the side of recess intercommunication on the heat dissipation dentate lamina. The utility model discloses in, the recess on the heat dissipation tine forms the torrent in microchannel structure department, has increased the heat convection degree, has promoted heat dispersion.

Description

Radiating fin with groove and radiating system

Technical Field

The utility model relates to a heat dissipation equipment technical field especially relates to a take fin and cooling system of recess.

Background

A typical liquid-cooled heat dissipation system must have the following components: the cooling device comprises cooling fins, cooling liquid, a water pump, a pipeline and a heat exchanger. The heat radiating fin is in contact with the CPU chip, absorbs the heat of the CPU chip and conducts the heat to the cooling liquid for heat exchange; the cooling liquid is a liquid, flows in a circulating pipeline under the action of the water pump, the temperature of the cooling liquid rises after absorbing heat, the high-temperature cooling liquid transfers the heat to the heat exchanger with a large surface area, the fan on the heat exchanger takes away the heat of the inflow air, the temperature of the cooling liquid is reduced, and under the driving of the water pump, the cooling liquid flows into the micro-channel formed by the radiating fin and the toothed sheet again to carry out heat exchange and then repeatedly circulate, so that the effect of cooling the chip is achieved. Therefore, it is important to improve the performance of the heat sink to improve the heat dissipation system, such as reducing the thermal resistance of the heat sink, and improving the heat absorption and conduction performance of the heat sink.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome one or more not enough of prior art, provide a take fin and cooling system of recess.

The purpose of the utility model is realized through the following technical scheme: the utility model provides a take fin of recess, includes heat dissipation base plate and a plurality of heat dissipation dentate lamella, the heat dissipation dentate lamella is located on the cooling surface of heat dissipation base plate, the addendum of heat dissipation dentate lamella is provided with the ascending recess of a plurality of openings, the recess intercommunication two relative sides on the heat dissipation dentate lamella, a plurality of heat dissipation dentate lamellae are arranged according to single queue array along the direction of perpendicular to reference surface, the reference surface is for being on a parallel with the plane of the side that is linked together by the recess on the heat dissipation dentate lamella.

Preferably, the heat dissipation surface of the heat dissipation substrate has a mounting groove formed by recessing toward the heat absorption surface, and the heat dissipation tooth piece is located in the mounting groove.

Preferably, the root of the heat dissipation tooth piece is located below the notch edge of the mounting groove, and the top of the heat dissipation tooth piece is located above the notch edge of the mounting groove.

Preferably, the thickness between the groove bottom of the mounting groove and the heat absorption surface of the heat dissipation substrate is 0.4-1.0mm, the height of the heat dissipation toothed sheet is 1-10mm, and the thickness of the heat dissipation toothed sheet is 0.05-0.3 mm.

Preferably, a process groove is arranged between the side wall of the mounting groove and the heat dissipation tooth piece.

Preferably, the bottom of the mounting groove is of a planar structure, and the root of the heat dissipation tooth piece is parallel to the heat absorption surface of the heat dissipation substrate.

Preferably, the heat dissipation substrate is a copper alloy or an aluminum alloy, and/or the heat dissipation blade is a copper alloy or an aluminum alloy.

Preferably, the distance between adjacent radiating fins is equal to the thickness of the radiating fins.

Preferably, a fool-proof structure is arranged on the heat dissipation substrate.

A heat dissipation system comprises the heat dissipation plate.

The utility model has the advantages that:

(1) the grooves on the heat dissipation tooth sheets form turbulence at the micro-channel structure, so that the convective heat transfer degree is increased, the heat dissipation performance is improved, and the temperature rise can be reduced by 2-5 ℃;

(2) the root and the top of the heat dissipation tooth piece are respectively positioned below and above the edge of the notch of the mounting groove, so that the heat dissipation area is maximized, and the heat dissipation performance is improved;

(3) the process groove is arranged, so that the processing of the radiating fin is facilitated;

(4) the fool-proof structure can play the fool-proof role during assembly.

Drawings

FIG. 1 is a perspective view of a heat sink;

FIG. 2 is a schematic top view of a heat sink;

FIG. 3 is a cross-sectional view taken at the location A-A in FIG. 2;

FIG. 4 is an enlarged view at C of FIG. 3;

FIG. 5 is a cross-sectional view taken at location B-B of FIG. 2;

FIG. 6 is a schematic view of laminar flow;

FIG. 7 is a schematic illustration of turbulence;

in the figure, 1-radiating substrate, 2-radiating tooth sheet, 3-groove, 4-assembly hole, 5-fool-proof structure and 6-process groove.

Detailed Description

The technical solution of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention.

Referring to fig. 1-7, the present embodiment provides a heat sink and a heat dissipation system with a groove:

example one

As shown in fig. 1 and 2, a heat sink with a groove includes a heat dissipating substrate 1 and a plurality of heat dissipating fins 2, wherein the heat dissipating fins 2 are located on a heat dissipating surface of the heat dissipating substrate 1. The surface of the heat dissipation substrate 1, which is connected to a device requiring heat dissipation, such as a chip, is a heat absorption surface of the heat dissipation substrate 1, for example, the bottom surface of the heat dissipation substrate 1 in fig. 3 and 4, and the surface opposite to the heat absorption surface is a heat dissipation surface of the heat dissipation substrate 1, for example, the top surface of the heat dissipation substrate 1 in fig. 3 and 4.

In some embodiments, the heat dissipation substrate 1 is provided with an assembly hole 4 and a fool-proof structure 5, the assembly hole 4 is used for realizing the assembly of the heat dissipation fin, and the fool-proof structure 5 is used for playing a fool-proof role when the heat dissipation fin is assembled.

In some embodiments, the heat-dissipating substrate 1 is integrally formed with the heat-dissipating fins 2.

In some embodiments, the heat dissipation substrate 1 is a copper alloy or an aluminum alloy, and/or the heat dissipation fins 2 are a copper alloy or an aluminum alloy. The copper alloy and the aluminum alloy have good heat-conducting property, and can conduct heat of devices such as chips and the like quickly.

As shown in fig. 5, the tooth top of the heat dissipation blade 2 is provided with a plurality of grooves 3 with upward openings, the grooves 3 are communicated with two opposite side surfaces of the heat dissipation blade 2, and the grooves are U-shaped grooves, U-shaped flat-bottom grooves, V-shaped grooves and the like. For example, in fig. 2, the groove 3 is a U-shaped groove, and the groove 3 communicates the left side surface and the right side surface of the heat dissipation blade 2; the plurality of heat dissipation fins 2 are arranged in a single-row array in a direction perpendicular to a reference plane, the reference plane is a plane parallel to the side surfaces of the heat dissipation fins 2 communicated by the grooves 3, for example, the reference plane is parallel to the left side surface and the right side surface of the heat dissipation fins 2 in fig. 2, so that the reference plane is a vertical surface, and all the heat dissipation fins 2 are sequentially arranged at equal intervals in the horizontal direction. The end of the heat dissipation tooth piece 2 connected with the heat dissipation substrate 1 is the root of the heat dissipation tooth piece 2, such as the top end of the heat dissipation tooth piece 2 in fig. 4; the end of the heat dissipation blade 2 away from the heat dissipation substrate 1 is the top of the heat dissipation blade 2, as shown in fig. 4, the bottom end of the heat dissipation blade 2.

In this embodiment, be equipped with a plurality of recesses 3 on the heat dissipation tine 2, form the torrent in microchannel structure recess 3 department, increased heat convection intensity, promoted heat transfer performance.

Brief introduction to turbulence: laminar and turbulent flow is one property of fluid flow. When a fluid flows, if the trajectory of the fluid mass point (generally speaking as a function of the initial spatial coordinates x, y, z over time t) is a regular smooth curve (in the simplest case a straight line), the flow is called laminar, as shown in fig. 6; flow without this property is called turbulence, as shown in FIG. 7.

In some embodiments, the heat dissipating surface of the heat dissipating substrate 1 has a mounting groove formed by being recessed toward the heat absorbing surface, and the heat dissipating teeth 2 are located in the mounting groove. Generally, a process groove 6 is arranged between the side wall of the mounting groove and the radiating tooth piece 2, so that the radiating fin can be conveniently processed.

The root of heat dissipation tine 2 is located the notch edge below of mounting groove, the top of heat dissipation tine 2 is located the notch edge top of mounting groove to make heat radiating area maximize. As shown in fig. 3 and 4, the root of the heat dissipation blade 2 is lower than the plane of the notch of the mounting groove, and the top of the heat dissipation blade 2 is higher than the plane of the notch of the mounting groove.

In some embodiments, the groove bottom of the mounting groove is a planar structure, and the roots of the heat dissipation fins 2 are parallel to the heat absorption surface of the heat dissipation substrate 1, that is, the distances from the roots of all the heat dissipation fins 2 to the heat absorption surface of the heat dissipation substrate 1 are the same. The groove bottom of the mounting groove is of a plane structure, so that the processing difficulty is reduced, the distances from the roots of all the radiating tooth sheets 2 to the heat absorption surface of the radiating substrate 1 are the same, the thermal resistance in the heat transfer process is reduced, and the radiating performance is improved; because the tank bottom of mounting groove is planar structure, when using, can follow all directions and intake and go out water, very convenient.

In some embodiments, as shown in fig. 4, the thickness h1 between the groove bottom of the mounting groove and the heat absorbing surface of the heat dissipating substrate 1 is 0.4-1.0mm, so that on the basis of ensuring the assembly strength, the thermal resistance in the heat transfer process is reduced to the maximum extent, and the heat dissipating performance of the heat dissipating fin is improved; the height Fh of the heat dissipation tooth sheet 2 is 1-10 mm; the thickness Ft of the heat dissipation tooth sheet 2 is 0.05-0.3 mm; in addition, Fp in fig. 4 has a value of 0.1 to 0.6mm, and Fp represents the sum of the thickness of one fin 2 and the pitch between two adjacent fins 2. In some embodiments, the spacing between adjacent cooling fins 2 is equal to the thickness of the cooling fins 2.

Example two

A heat dissipation system comprising the heat sink of the first embodiment.

The foregoing is illustrative of the preferred embodiments of the present invention, and it is to be understood that the invention is not limited to the precise forms disclosed herein, and that various other combinations, modifications, and environments may be resorted to, falling within the scope of the invention as defined by the appended claims. But that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the invention, which is to be limited only by the claims appended hereto.

Claims (10)

1. The utility model provides a take fin of recess, its characterized in that, includes heat dissipation base plate and a plurality of heat dissipation dentate lamella, the heat dissipation dentate lamella is located on the radiating surface of heat dissipation base plate, the addendum of heat dissipation dentate lamella is provided with the ascending recess of a plurality of openings, the recess intercommunication two relative sides on the heat dissipation dentate lamella, a plurality of heat dissipation dentate lamellae are arranged according to single queue array along the direction of perpendicular to reference surface, the reference surface is for being on a parallel with by the plane of the side of recess intercommunication on the heat dissipation dentate lamella.

2. The grooved heat sink as claimed in claim 1, wherein the heat-dissipating substrate has a mounting groove recessed toward the heat-absorbing surface, and the heat-dissipating fins are disposed in the mounting groove.

3. The grooved heat sink as recited in claim 2, wherein the root of the heat dissipating blade is located below the notched edge of the mounting groove and the tip of the heat dissipating blade is located above the notched edge of the mounting groove.

4. The grooved heat sink as claimed in claim 2, wherein the thickness between the bottom of the mounting groove and the heat absorbing surface of the heat dissipating substrate is 0.4-1.0mm, the height of the heat dissipating fins is 1-10mm, and the thickness of the heat dissipating fins is 0.05-0.3 mm.

5. The grooved fin according to claim 2, wherein a process groove is provided between the side wall of the mounting groove and the heat-dissipating fins.

6. The grooved heat sink as claimed in claim 2, wherein the bottom of the mounting groove is a planar structure, and the root of the heat sink blade is parallel to the heat absorbing surface of the heat sink base plate.

7. The grooved heat sink as claimed in claim 1, wherein the heat sink base is made of copper alloy or aluminum alloy, and/or the heat sink fins are made of copper alloy or aluminum alloy.

8. A grooved heat sink as claimed in claim 1, wherein the spacing between adjacent fins is equal to the thickness of the fins.

9. The heat sink with grooves according to claim 1, wherein the heat-dissipating substrate is provided with a fool-proof structure.

10. A heat dissipation system comprising the heat sink of any of claims 1-9.

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